CN102480904A - Cooling module and electronic device with cooling module - Google Patents
Cooling module and electronic device with cooling module Download PDFInfo
- Publication number
- CN102480904A CN102480904A CN201010569139XA CN201010569139A CN102480904A CN 102480904 A CN102480904 A CN 102480904A CN 201010569139X A CN201010569139X A CN 201010569139XA CN 201010569139 A CN201010569139 A CN 201010569139A CN 102480904 A CN102480904 A CN 102480904A
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- heat
- pyrotoxin
- conducting strip
- radiating module
- heat pipe
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Abstract
The invention discloses a cooling module and an electronic device with the cooling module. The cooling module is applied on a heating source and comprises a heat-conducting plate and a heat pipe. The heat-conducting plate is arranged on the heating source in a covering way and is used for transferring heat generated by the heating source. The heat pipe is arranged on the side edge of the heating source, is thermally connected with the heat-conducting plate, and is used for guiding the heat away from the heat-conducting plate.
Description
Technical field
The invention relates to a kind of radiating module and use its electronic installation.
Background technology
In the various electronic equipments now; Usually have some heating modules and can produce heat; For example light-emitting diode, electronic chip, central processing unit, resistance, circuit board, battery, heating element, solar panels etc.; For making the normal operation of electronic equipment ability, the caloric requirement of these heater elements properly conducts.
For conducting these heats, normally radiating module is arranged on the heater element.In radiating module, the use of heat pipe is gradually extensive.The operation principle of heat pipe is: in sealing low pressure heat conductivility good metal housing, fill earlier an amount of hydraulic fluid, and absorb when utilizing hydraulic fluid in housing, to do the conversion of vapour-liquid two between mutually or emit great amount of heat.Hydraulic fluid is selected the liquid that heat of vaporization height, good fluidity, chemical property are stable, boiling point is lower, for example water, ethanol, acetone etc. usually for use.When heat pipe one end contacts with a pyrotoxin when absorbing heat; Hydraulic fluid in it receives thermal evaporation (vaporization) because of absorbing great amount of heat; And the gas of this vaporization quickly diffuses to the other end of heat pipe to cool off (emitting heat); Then after this gas cooling, then form liquid once more and be back to pyrotoxin along the inwall of housing, so reciprocation cycle can be sent to the heat of pyrotoxin generation the other end and distributes from an end of heat pipe.In addition,, on the inwall of housing, also be provided with many capillary structures (this capillary structure is generally tiny groove) usually, under the capillary absorption affinity effect of capillary structure, quickened the back-flow velocity of liquid greatly in order to quicken to cool off the back-flow velocity of back liquid.Because the hydraulic fluid circulation rate in the heat pipe is very fast, so also raising relatively of heat transfer efficiency, heat pipe obtains in the heat radiation field extensively and number of applications at present.
In addition, flat plate heat tube (flat heat pipe) also is developed to be applied in electronics heat and passes.Compared to rectangular column type heat pipe, though flat plate heat tube has solved the problem that contacts with the electronic chip on plane, the heat transfer efficiency of flat plate heat tube is poorer than the column type heat pipe.
Summary of the invention
For solving the problem of known techniques; The electronic installation that a purpose of the present invention is that a kind of radiating module is provided and uses it; Its side that is arranged at pyrotoxin by the heat pipe with radiating module is to reduce the thickness of shell of electronic installation; And will be originally can change into and concentrate, and then improve the heat dissipation of radiating module with the heat of the mode dissipation of thermal convection by the heat pipe heat extraction by the notion of thermal insulation.
According to an embodiment of the present invention, a kind of radiating module, it can be applicable to pyrotoxin.Radiating module comprises conducting strip and heat pipe.Conducting strip is covered on the pyrotoxin, and can be used to transmit the heat that pyrotoxin produces.Heat pipe is arranged at the side and the hot conducting strip that is connected to of pyrotoxin, so as to being used for heat diversion conducting strip.
Another execution mode according to the present invention, a kind of electronic installation, it comprises runners, pyrotoxin and radiating module.Pyrotoxin is arranged on the runners.Radiating module is arranged on the runners.Radiating module comprises conducting strip, compressing tablet and heat pipe.Conducting strip is covered on the pyrotoxin, and can be used to transmit the heat that pyrotoxin produces.Compressing tablet can be used to conducting strip is fixed to runners.Heat pipe is arranged at the side and the hot conducting strip that is connected to of pyrotoxin, so as to being used for heat diversion conducting strip.
Description of drawings
In order to let above and other objects of the present invention, characteristic, advantage and the embodiment can be more obviously understandable, the explanation of appended accompanying drawing be following:
Fig. 1 is the three-dimensional view that illustrates according to the electronic installation of an embodiment of the present invention;
Fig. 2 A is the cross section view that illustrates the electronic installation section along the line C-C among Fig. 1;
Fig. 2 B is the top view that illustrates the radiating module among Fig. 2 A.
[main description of reference numerals]
1: electronic installation 10: housing
12: motherboard 120: runners
122: pyrotoxin 2: radiating module
20: conducting strip 20a: heat insulation layer
22: heat pipe 24: compressing tablet
C-C: line segment
Embodiment
Below will disclose execution mode of the present invention with accompanying drawing, for the purpose of offering some clarification on, the details on many practices will explanation in the lump in following narration.Yet, should be appreciated that the details on these practices is not used with restriction the present invention.That is to say that in part execution mode of the present invention, the details on these practices is inessential.In addition, for the purpose of simplifying accompanying drawing, habitual structure and the element of some conventions will illustrate it with the mode of simple signal in the accompanying drawings.
The following execution mode of the present invention provides a kind of radiating module and uses its electronic installation.Particularly; The following execution mode of the present invention mainly is arranged at the thickness of shell of the side of pyrotoxin with the minimizing electronic installation with the heat pipe of radiating module; And incite somebody to action script by the notion of thermal insulation and understand heat with the mode dissipation of thermal convection; Change into and concentrate, and then improve the heat dissipation of radiating module by the heat pipe heat extraction.Below specific embodiment of the present invention will be detailed, so as to the simplicity in abundant explanation characteristic of the present invention, spirit, advantage and the enforcement.
Please with reference to Fig. 1, it is the three-dimensional view that illustrates according to the electronic installation 1 of an embodiment of the present invention.
As shown in Figure 1, the electronic installation 1 of this execution mode can be to comprise the motherboard portable computer (for example, mobile computer or laptop computer) of (figure does not show) in the housing, but not as limit.In other words; In an execution mode; Electronic installation 1 can be the electronic product that has motherboard in any housing, as long as pyrotoxin (figure does not show) is arranged on the motherboard in the housing 10, all can use the problem that housing 10 thickness that notion of the present invention solves electronic installation 1 can't effectively reduce.
Please with reference to Fig. 2 A and Fig. 2 B.Fig. 2 A is the cross section view that illustrates the 1 along the line section C-C of electronic installation among Fig. 1.Fig. 2 B is the top view that illustrates the radiating module among Fig. 2 A.
Shown in Fig. 2 A, in this execution mode, electronic installation 1 can include motherboard 12, runners 120, pyrotoxin 122 and radiating module 2 in its housing 10.Motherboard 12 is fixed in the housing 10 of electronic installation 1.Runners 120 is arranged on the motherboard 12.Pyrotoxin 122 is arranged on the runners 120.Radiating module 2 is arranged on the runners 120.Below will introduce the structural arrangements of electronic installation 1 its housing 10 inner each elements of the present invention in detail.
Shown in Fig. 2 A, radiating module 2 consists predominantly of conducting strip 20, compressing tablet 24 and heat pipe 22.The conducting strip 20 of radiating module 2 is covered on the pyrotoxin 122, and can be used to transmit the heat that pyrotoxin 122 produces.Specifically, the conducting strip 20 of radiating module 2 can from top to bottom cover pyrotoxin 122 as much as possible, and with 122 hot connections of pyrotoxin, so as to the heat diversion that as much as possible pyrotoxin 122 is produced.
In addition; Transmit in the process of heat of pyrotoxins 122 at the conducting strip of radiating module 2 20; The mode by thermal convection is emitted to the housing 10 from the surface of conducting strip 20 possibly to have heat; Make the housing 10 interior temperature of electronic installation 1 raise, and then have influence on the operational effectiveness of other strength member on the motherboard 12.
Therefore, in an execution mode, above-mentioned radiating module 2 can further comprise heat insulation layer 20a.The heat insulation layer 20a of radiating module 2 can be positioned at the surface of conducting strip 20.Further, the heat insulation layer 20a of radiating module 2 can be arranged on the surface beyond conducting strip 20 and the pyrotoxin 122 hot junctions.Whereby, the heat that above-mentioned heat insulation layer 20a promptly can be used to prevent pyrotoxin 122 is with the surperficial dissipation by conducting strip 20 of the mode of thermal convection.Particularly, above-mentioned heat insulation layer 20a can be arranged on the conducting strip 20 by modes such as coating, printing, Shen are long-pending, but not as limit.
In an execution mode; The material of the heat insulation layer 20a of radiating module 2 can be rubber (rubber), polystyrene (Polystyrene; PS), polyurethane (Polyurethane, PU), phenolic resins (Phenolic resin) or Lauxite (urea formaldehyde resin), but not as limit; So long as have the material of high thermal resistance value, all can be applied to the heat insulation layer 20a of this execution mode.
Shown in Fig. 2 A, the compressing tablet 24 of radiating module 2 can be used to conducting strip 20 is fixed to runners 120, so as to when electronic installation 1 is dropped, prevents pyrotoxin 122 plates such as Offhost such as strength member such as grade 12 and causes serious bump and damage.
In an execution mode; The pyrotoxin 122 that be fixed on the runners 120 by above-mentioned compressing tablet 24 can be central processing unit (Central Processing Unit; CPU), South Bridge chip (south bridge chip), north bridge chips (north bridge chip) or drawing chip, but not as limit.
Shown in Fig. 2 A, the heat pipe 22 of radiating module 2 is arranged at the side and the hot conducting strip 20 that is connected to of pyrotoxin 122, so as to being used for heat diversion conducting strip 20.
In an execution mode, the heat pipe 22 of above-mentioned radiating module 2 can be the column type heat pipe.If adopt heat pipe 22 with radiating module 2 to be arranged at side but not the scheme directly over the pyrotoxin 122 of pyrotoxin 122 as stated; The size that makes progress can't influence the integral thickness of the housing 10 of electronic installation 1 to heat pipe 22 in the footpath, therefore also has not been required to be the thickness of the housing 10 that cooperates electronic installation 1 and adopts the thermal discharge efficiency flat heat pipe also poorer than column type heat pipe (or flat plate heat tube).
By above detailed description for embodiment of the present invention, can find out significantly, radiating module proposed by the invention and use its electronic installation, the side that mainly heat pipe of radiating module is arranged at pyrotoxin is to reduce the thickness of shell of electronic installation.Relatively, therefore electronic installation also can adopt the thermal discharge efficiency column type heat pipe not worse than flat heat pipe.In addition, with the heat of the mode dissipation of thermal convection, change into and concentrate, more can improve the heat dissipation of radiating module of the present invention by the heat pipe heat extraction by the practice that heat insulation layer is set on fin meeting originally.
Though the present invention discloses as above with execution mode; Right its is not in order to limit the present invention; Any those of ordinary skills; Do not breaking away from the spirit and scope of the present invention, when can doing various changes and retouching, so protection scope of the present invention is as the criterion when looking the scope that the accompanying Claim book defined.
Claims (9)
1. a radiating module is applied to a pyrotoxin, it is characterized in that, this radiating module comprises:
One conducting strip is covered on this pyrotoxin, in order to transmit the heat that this pyrotoxin produces; And
One heat pipe is arranged at side and hot this conducting strip that is connected to of this pyrotoxin, in order to this this conducting strip of heat diversion.
2. radiating module according to claim 1 is characterized in that, also comprises:
One heat insulation layer is positioned at the surface of this conducting strip, in order to prevent this heat with the mode of thermal convection by this conducting strip dissipation.
3. radiating module according to claim 2 is characterized in that, the material of this heat insulation layer is selected from a colony that is made up of rubber, polystyrene, polyurethane, phenolic resins and Lauxite.
4. radiating module according to claim 1 is characterized in that, this heat pipe is a column type heat pipe.
5. an electronic installation is characterized in that, comprises:
One runners;
One pyrotoxin is arranged on this runners; And
One radiating module is arranged on this runners, and this radiating module comprises:
One conducting strip is covered on this pyrotoxin, in order to transmit the heat that this pyrotoxin produces;
One compressing tablet is in order to fix this conducting strip to this runners; And
One heat pipe is arranged at side and hot this conducting strip that is connected to of this pyrotoxin, in order to this this conducting strip of heat diversion.
6. electronic installation according to claim 5 is characterized in that, also comprises:
One heat insulation layer is positioned at the surface of this conducting strip, in order to prevent this through the heat that transmits with the mode of thermal convection by this conducting strip dissipation.
7. electronic installation according to claim 6 is characterized in that, the material of this heat insulation layer is selected from a colony that is made up of rubber, polystyrene plastics, polyurethane plastics, phenolic resins and Lauxite.
8. electronic installation according to claim 5 is characterized in that, this heat pipe is a column type heat pipe.
9. electronic installation according to claim 5 is characterized in that, this pyrotoxin is selected from a colony that is made up of a central processing unit, a South Bridge chip, a north bridge chips and a drawing chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010569139XA CN102480904A (en) | 2010-11-24 | 2010-11-24 | Cooling module and electronic device with cooling module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010569139XA CN102480904A (en) | 2010-11-24 | 2010-11-24 | Cooling module and electronic device with cooling module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102480904A true CN102480904A (en) | 2012-05-30 |
Family
ID=46093335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010569139XA Pending CN102480904A (en) | 2010-11-24 | 2010-11-24 | Cooling module and electronic device with cooling module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102480904A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107535076A (en) * | 2015-06-26 | 2018-01-02 | 松下知识产权经营株式会社 | Thermally conductive sheet and use its electronic equipment |
| CN108811432A (en) * | 2017-04-28 | 2018-11-13 | 广达电脑股份有限公司 | Electronic device and heat dissipation module thereof |
-
2010
- 2010-11-24 CN CN201010569139XA patent/CN102480904A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107535076A (en) * | 2015-06-26 | 2018-01-02 | 松下知识产权经营株式会社 | Thermally conductive sheet and use its electronic equipment |
| CN107535076B (en) * | 2015-06-26 | 2020-04-07 | 松下知识产权经营株式会社 | Thermally conductive sheet and electronic device using same |
| CN108811432A (en) * | 2017-04-28 | 2018-11-13 | 广达电脑股份有限公司 | Electronic device and heat dissipation module thereof |
| CN108811432B (en) * | 2017-04-28 | 2020-03-27 | 广达电脑股份有限公司 | Electronic device and heat dissipation module thereof |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120530 |