CN102464954A - Composite adhesive sheet, film comprising same and manufacturing method of film - Google Patents
Composite adhesive sheet, film comprising same and manufacturing method of film Download PDFInfo
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- CN102464954A CN102464954A CN2010105526373A CN201010552637A CN102464954A CN 102464954 A CN102464954 A CN 102464954A CN 2010105526373 A CN2010105526373 A CN 2010105526373A CN 201010552637 A CN201010552637 A CN 201010552637A CN 102464954 A CN102464954 A CN 102464954A
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Abstract
The invention relates to a composite adhesive sheet, which is provided with a first contact surface contacted with an object to be stuck. The composite adhesive sheet comprises a resin substrate, a plurality of heat conducting particles and a plurality of carbon fibers, wherein the carbon fibers are basically vertical to the first contact surface; the average length of the carbon fibers is 80-110 percent of the thickness of the composite adhesive sheet; the heat conducting particles are positioned among the carbon fibers; the average particle size of the heat conducting particles is 70-90 percent of the thickness of the composite adhesive sheet; the resin substrate is distributed among the heat conducting particles and among the carbon fibers; and the viscosity of the resin substrate is 8,000-18,000 mPa.s. In the technical scheme, the composite adhesive sheet has excellent heat conducting performance and heat conducting efficiency. The technical scheme further provides a film comprising the composite adhesive sheet and a manufacturing method of the film.
Description
Technical field
The present invention relates to bonding technique, relate in particular to a kind of composite gum bonding die with preferable heat conductivility, comprise the making method of the film and the film of this composite gum bonding die.
Background technology
Along with progress of science and technology, the application widely that printed substrate obtains at electronic applications.Application about circuit card sees also document Takahashi, A.O oki, N.Nagai, A.Akahoshi; H.Mukoh, A.Wajima, M.Res.Lab; High densitymultilayer printed circuit board for HITAC M-880, IEEE Trans.onComponents, Packaging; And Manufacturing Technology, 1992,15 (4): 418-425.
Along with the integrated level increase of circuit card, circuit board product tends to emit great amount of heat when real work, and heat will influence circuit board signal and transmit if can not in time derive.A kind of method of accelerating circuit board product heat radiation is on circuit card, to install or during integrated electronic component, use the heat conduction film with heat conductivility.The heat-transfer rate of heat conduction film commonly used is rapid inadequately at present, and heat conductivility is also even inadequately.
Therefore, be necessary to provide a kind of making method that has composite gum bonding die, comprises the film and the film of this composite gum bonding die than excellent heat conductivity performance and heat-transfer rate.
Summary of the invention
Below will a kind of composite gum bonding die be described, comprise the making method of the film and the film of this composite gum bonding die with embodiment.
A kind of composite gum bonding die has and is used for first surface in contact that contacts with object to be pasted.Said composite gum bonding die comprises resin matrix, a plurality of heat conduction particle and many thomels.Said many thomels all are basically perpendicular to first surface in contact, and the mean length of many thomels is 80% to 110% of a said composite gum bonding die thickness.Said a plurality of heat conduction particle is between many thomels, and the median size of a plurality of heat conduction particles is 70% to 90% of a said composite gum bonding die thickness.Said resin matrix be distributed between a plurality of heat conduction particles and many thomels between, the viscosity of resin matrix is 8000 centipoise to 18000 centipoises.
A kind of film comprises the first release base material and composite gum bonding die.The said first release base material has first release surface, and said composite gum bonding die is formed at first release surface.Said composite gum bonding die comprises resin matrix, a plurality of heat conduction particle and many thomels.Said many thomels all are basically perpendicular to first release surface, and the mean length of many thomels is 80% to 110% of a said composite gum bonding die thickness.Said a plurality of heat conduction particle is between many thomels, and the median size of a plurality of heat conduction particles is 70% to 90% of a said composite gum bonding die thickness.Said resin matrix be connected between a plurality of heat conduction particles and many thomels between, the viscosity of resin matrix is 8000 centipoise to 18000 centipoises.
A kind of method of manufacture of film comprises step:
Compound adhesive material is provided; Said compound adhesive material comprises resin matrix, a plurality of heat conduction particle and many thomels; Said a plurality of heat conduction particle between many thomels, said resin matrix be connected between a plurality of heat conduction particles and many thomels between;
The first release base material is provided, and the said first release base material has first release surface;
Said compound adhesive material is coated first release surface, make said compound adhesive material at the coating thickness of first release surface be many thomels mean length 91% to 125%, and be a plurality of heat conduction particles median size 111% to 143%; And
Release base material stretches; And the compound adhesive material of first release surface is coated in heating; Thomel in the compound adhesive material of first release surface is all basic to be extended along the direction perpendicular to first release surface so that coat; And to make resin matrix be cured to viscosity be 8000 centipoise to 18000 centipoises, thereby form the composite gum bonding die.
Be dispersed with a plurality of heat conduction particles and many thomels in the composite gum bonding die that the present technique scheme provides.Because thomel has good thermal conductivity, its thermal conductivity is generally 300～500W/k, thereby can promote the heat conductivility and the heat transfer efficiency of film.And the mean length of many thomels is 80% to 110% of a composite gum bonding die thickness, and basic all arranged verticals, thereby when pasting at circuit board surface or other thermal source element surface, can conduct the heat that thermal source distributes as early as possible.Further, also be distributed with a plurality of heat conduction particles between the many thomels, the median size of a plurality of heat conduction particles is 70% to 90% of a said composite gum bonding die thickness, conducts the heat that thermal source distributes thereby can assist.And resin matrix also has good tackiness, thereby can be attached to the thermal source surface preferably.The film that the present technique scheme provides has good heat-conducting and heat transfer efficiency.The film that has excellent heat conductivity performance and heat transfer efficiency more than the making method of the film that the present technique scheme provides can prepare.
Description of drawings
Fig. 1 is the cross-sectional schematic of the film that comprises the composite gum bonding die that provides of present technique scheme implementation mode.
Fig. 2 is the schema of the making method of the film that provides of present technique scheme implementation mode.The main element nomenclature
The first release base material 11
Composite gum bonding die 12
First surface in contact 1201
Second surface in contact 1202
Thomel 122
The first release base material 13
Embodiment
The composite gum bonding die that the present technique scheme is provided below in conjunction with accompanying drawing and embodiment, film and preparation method thereof further specify.
See also Fig. 1, the present technique scheme provides a kind of film 10, and it comprises the first release base material 11, composite gum bonding die 12 and the second release base material 13 that stacks gradually.
The said first release base material 11 is used to carry composite gum bonding die 12.The first release base material 11 is meant the flaky material with at least one release surface, and release surface is meant the surface with low surface energy, both can adhere to other material, is easy to separate adhesion material on it again.The first release base material 11 can be the PET dicing film; Be that its base material is PET; On at least one surface of base material, be coated with materials such as silicone oil and form the flaky material of release surface; Thereby can cling composite gum bonding die 12 formed thereon, but be easy to make the first release base material 11 to separate with composite gum bonding die 12.In the present embodiment, the first release base material 11 adopts single face PET dicing film, and it has first release surface 110 that contacts with composite gum bonding die 12.The PET dicing film that the material of the first release base material 11 is not limited to provide in the present embodiment, it also can have the material of release surface for other, like separate-type paper etc.Said separate-type paper can be silicone oil paper or leaching membrane paper.
The said second release base material 13 is used to protect composite gum bonding die 12.When the film of producing 10 need not transport or preserve for a long time, film 10 also can not comprise the second release base material 13.The material of the second release base material 13 can be identical with the material of the first release base material 11, and promptly it can be the PET dicing film, and it also can have the material of release surface for other, like various separate-type paper etc.The second release base material 13 has second release surface 130 that contacts with composite gum bonding die 12.Second release surface 130 is substantially parallel with first release surface 110, and the spacing of second release surface 130 and first release surface 110 is the thickness of composite gum bonding die 12.
In transportation and storage process, the first release base material 11 and the second release base material 13 can prevent composite gum the bonding die 12 contaminated or moisture absorptions so that composite gum bonding die 12 is isolated from the outside.Transport or storage process in, when multifilm 10 piled up each other, the first release base material 11 and the second release base material 13 can also be isolated adjacent film 10 to avoid film 10 inter-adhesive.
Said composite gum bonding die 12 is used to bond to the surface of thermal source element, plays the effect of the heat that bonding other element and conduction heat sources element distribute.The thickness of composite gum bonding die 12 can be set according to actual needs.In the present embodiment, the thickness of composite gum bonding die 12 is about 50 microns.Composite gum bonding die 12 is arranged between second release surface 130 of first release surface 110 and the second release base material 13 of the first release base material 11.Composite gum bonding die 12 has the first relative surface in contact 1201 and second surface in contact 1202.Said second surface in contact 1202 contacts with the first release base material 11, is used for treating bonding element and contacting with treating bonding element with being covered on after the first release base material 11 separates.Said first surface in contact 1201 contacts with the second release base material 13, is used for treating bonding element and contacting with treating bonding element with being covered on after the second release base material 13 separates.The spacing of first surface in contact 1201 and second surface in contact 1202 is the thickness of composite gum bonding die 12, promptly is about 50 microns.Said composite gum bonding die 12 is made up of compound adhesive material.Said compound adhesive material comprises resin matrix, many thomels 122 and a plurality of heat conduction particle 124 at least, can also comprise other material, for example can also comprise stiffening agent, catalyzer, solvent, toughner, additive and skimmer.Said many thomels 122 are basic uniform distribution in compound adhesive material, and said a plurality of heat conduction particles 124 are also basic uniform distribution in compound adhesive material.And said many thomels 122 and a plurality of heat conduction particle 124 mutual dopant profiles that is to say that many thomels 122 are between a plurality of heat conduction particles 124, and a plurality of heat conduction particles 124 are between many thomels 122.Said resin matrix is used to be connected with other material, bonding many thomels 122 and a plurality of heat conduction particle 124.
Said resin matrix can be solid state or semi-cured state, and its viscosity is that 8000mPas (milli handkerchief second) to 18000mPas, is 8000 centipoise to 18000 centipoises, is preferably 11000mPas (milli handkerchief second) to 14000mPas.Resin matrix can be epoxy resin; Also can be other resin, for example polyimide (Polyimide, PI), polyethylene terephthalate glycol (Polyethylene Terephthalate; PET), PEN (Polyethylene naphthalate, PEN) etc.In the present embodiment, said resin matrix is commercially available Tao Shi 331 liquid-state epoxy resins, and it is the liquid product that epoxy chloropropane and two kinds of substance reactions of dihydroxyphenyl propane generate, and its epoxy equivalent (weight) is 182 to 192, is preferably about 188.Certainly; Resin matrix also can be the epoxy resin of other modification; It for example is the product behind epoxy resin and the end carboxyl polymer generation copolymerization; That is, the carboxyl of the end of epoxy group(ing) that epoxy resin is terminal and end carboxyl polymer reacts and generates an ester group, thereby obtains comprising the polymkeric substance of the alternative epoxy resin repeating unit and the repeating unit of end carboxyl polymer.The quality percentage composition of epoxy resin in compound adhesive material is about 10% to 18%, preferably is about 14.03%.
Said many thomels 122 all are basically perpendicular to first surface in contact 1201, all extend to second surface in contact 1202 or near second surface in contact, 1202 places from first surface in contact 1201 or near first surface in contact 1201 basically.The mean length of many thomels 122 be composite gum bonding die 12 thickness 80% to 110%.In the present embodiment, the mean length of many thomels 122 equals the thickness of composite gum bonding die 12 basically, is about 50 microns.In the many thomels 122, part thomel 122 is exposed to first surface in contact 1201 at least, and also having at least, part thomel 122 is exposed to second surface in contact 1202.Perhaps we can say in the many thomels 122, have part thomel 122 both to be exposed to first surface in contact 1201, be exposed to second surface in contact 1202 again; There is part thomel 122 neither to be exposed to first surface in contact 1201, is not exposed to second surface in contact 1202 again; There is the part thomel only to be exposed to first surface in contact 1201, and is not exposed to second surface in contact 1202; Also have the part thomel only to be exposed to second surface in contact 1202, and be not exposed to first surface in contact 1201.Thomel 122 can for organic fibre through the micro crystal graphite material that carbonization and graphitization processing obtain, also can be one dimension carbon materials such as carbon nanotube, carbon nano wire, carbon nano-cluster, Graphene.In the present embodiment, the quality percentage composition of thomel 122 in compound adhesive material is about 8% to 12%, preferably is about 9.82%.
Said a plurality of heat conduction particle 124 can be for sphere, elliposoidal, be similar to sphere, be similar to elliposoidal or be other shape.The median size of a plurality of heat conduction particles 124 be composite gum bonding die 12 thickness 70% to 90%.Perhaps, also can be 70% to 90% of the mean length of many thomels 122.Preferably, the median size of a plurality of heat conduction particles 124 be composite gum bonding die 12 thickness about 80%.Median size is meant that cumulative distribution is the equivalent diameter of 50% o'clock largest particle in the size distribution curve.In the present embodiment, the median size of heat conduction particle 124 is about 40 microns, has the particle diameter of 50% heat conduction particle 124 to be less than or equal to 40 microns approximately, and the particle diameter of 5% heat conduction particle 124 is about 50 microns.In the present embodiment, said heat conduction particle 124 adopts SP 1 (BN) particle.Certainly, said heat conduction particle 124 also can adopt aluminum oxide, silver or the higher material of other thermal conductivity.Heat conduction particle 124 shared quality percentage composition in compound adhesive material is 35% to 55%, preferably is about 44.91%.
Said stiffening agent is used for compound adhesive material is played sclerization.In the present embodiment, the stiffening agent of employing is Dyhard RU 100 (Dicyandiamine), and said stiffening agent shared quality percentage composition in compound adhesive material is 1.0% to 2.0%, preferably is about 1.57%.In compound adhesive material, the active hydrogen total amount of stiffening agent can be suitable with the epoxy total amount of epoxy resin.
Said catalyzer is 2-phenylimidazole (2-Phenylimidazole), and the content of catalyzer is corresponding each other with the content of epoxy resin.Catalyzer shared quality percentage composition in compound adhesive material is about 0.16%.
Said solvent is diethylene glycol ether acetate alone (Diethylene glycolmonoethyl ether acetate), and the content of said solvent in compound adhesive material is 10% to 30%, preferably is about 21.05%.This solvent is used to dissolve above-mentioned other component, to form uniform liquid dispersed system.
Said toughner is that (Poly-hydroxylether ofBisphenol A, PKHH), the content of said toughner in compound adhesive material is 2.0% to 6.5% to the bisphenol A-type polyhydroxy ether, preferably is about 4.21%.The content of this toughner is corresponding with the content of said solvent.Toughner is about 0.1 to 0.3 to 1 with the mass ratio of solvent, is preferably 0.2 to 1.
Said additive is used to alleviate the wire drawing phenomenon that produces when said toughner is dissolved in solvent.Said additive is γ-glycidyl ether oxygen propyl trimethoxy silicane (γ-Glycidoxypropy tri-methoxy silane), and the content of said additive in compound adhesive material is about 0.74%.
Said skimmer is used for eliminating the foam of compound adhesive material, and the quality percentage composition of said skimmer in compound adhesive material is about 2% to 5%.Be preferably 3.51%.Said skimmer can be 1211 skimmers of the pure political affairs in commercially available Taiwan company production, and it can also play the effect of levelling in compound adhesive material.
In the film of the preferred embodiment that the present technique scheme provides; Be used for forming the compound adhesive material of composite gum bonding die 12; The quality percentage composition of epoxy resin is about 14.03%; The quality percentage composition of many thomels 122 is about 9.82%, and the quality percentage composition of a plurality of heat conduction particles 124 is about 44.91%, and the quality percentage composition of Dyhard RU 100 is about 1.57%, the quality percentage composition of 2-phenylimidazole is about 0.16%; The quality percentage composition of diethylene glycol ether acetate alone is about 21.05%; The quality percentage composition of bisphenol A-type polyhydroxy ether is about 4.21%, and the quality percentage composition of γ-glycidyl ether oxygen propyl trimethoxy silicane is about 0.74%, and the quality percentage composition of skimmer is about 3.51%.
Certainly; It will be appreciated by those skilled in the art that; Be used for forming the compound adhesive material of composite gum bonding die 12, except that resin matrix, many thomels 122 and a plurality of heat conduction particle 124, other stiffening agent, catalyzer, solvent, toughner, additive and skimmer are not to be essential features; Can only contain wherein one or more, also can comprise other material.For example, compound adhesive material can comprise resin matrix, many thomels 122 and a plurality of heat conduction particle 124 and solvent.
When the film 10 that uses the present technique scheme to provide is covered on circuit board surface or other thermal source surface; Can remove the second release base material 13 earlier; Thereby expose first surface in contact 1201 of composite gum bonding die 12; Thereby first surface in contact 1201 is pasted and be adhered to circuit board surface or other thermal source surface with circuit board surface or surperficial contact of other thermal source with composite gum bonding die 12, can second surface in contact 1202 of the first release base material 11 from composite gum bonding die 12 be removed subsequently.So, can composite gum bonding die 12 be pasted and be adhered to circuit board surface or other thermal source surface, play bonding and effect heat conduction.
After being covered on circuit board surface or other thermal source surface, composite gum bonding die 12 basic grays have tack, solvent resistance and resistance to acids and bases preferably.Particularly, composite gum bonding die 12 is soaked in 17 hours no peeling phenomenons in the acetone soln after being covered on circuit board surface or other thermal source surface, and being soaked in concentration and being in 10% sodium hydroxide or the hydrochloric acid soln half hour does not all have a bit peeling phenomenon.
Please consult Fig. 1 and Fig. 2 in the lump, the present technique scheme also provides the making method of said film 10, and this making method comprises the steps:
The first step provides compound adhesive material.Said compound adhesive material comprises resin matrix, many thomels 122 and a plurality of heat conduction particle 124 at least.Said many thomels 122 are between a plurality of heat conduction particles 124, and said a plurality of heat conduction particles 124 are between many thomels 122, and said resin matrix can be epoxy resin, be connected between a plurality of heat conduction particles 124 and many thomels 122 between.The median size of a plurality of heat conduction particles 124 can the mean length of many thomels 122 70% to 90% between.In the present embodiment, the mean length of many thomels 122 is about 50 microns, and the median size of a plurality of heat conduction particles 124 is about 40 microns.
Said compound adhesive material can also comprise other material.In the present embodiment, compound adhesive material also comprises stiffening agent, catalyzer, solvent, toughner, additive and skimmer.These materials all can be and use foregoing material.For example, said solvent can be foregoing diethylene glycol ether acetate alone, and the content of said solvent in compound adhesive material can be 10% to 30%.
Second step provided the first release base material 11, and the said first release base material 11 has first release surface 110.The first release base material 11 can be the PET dicing film.
The 3rd step; Said compound adhesive material is coated first release surface 110; Said compound adhesive material at the coating thickness of first release surface 110 be many thomels 122 mean length 91% to 125%, and be a plurality of heat conduction particles 124 median size 111% to 143%.Thereby make that the mean length of many thomels 122 is 80% to 110% of a coating thickness, and make that the median size of a plurality of heat conduction particles is 70% to 90% of a coating thickness.In the present embodiment, said compound adhesive material is about 50 microns at the coating thickness of first release surface 110.
In the present embodiment, adopt slit type coater that the compound adhesive material of liquid state is coated the first surface 111 of insulated base material layer 110, on one side with control coating thickness and coating evenly.
The 4th step; The first release base material 11 stretches; And the compound adhesive material of first release surface 110 is coated in heating; Many thomels 122 in the compound adhesive material of first release surface 110 are all basic to be extended along the direction perpendicular to first release surface 110 so that coat, and to make resin matrix be cured to viscosity be 8000 centipoise to 18000 centipoises, thereby forms composite gum bonding die 12.Composite gum bonding die 12 has the first relative surface in contact 1201 and second surface in contact 1202, and first release 110 of said second surface in contact 1202 and the first release base material 11 contacts.
In the present embodiment, the first release base material 11 that stretches, and heat the compound adhesive material of coating first release surface 110, can may further comprise the steps to form composite gum bonding die 12:
At first, the first release base material 11 that stretches, and coat about compound adhesive material 2-4 minute of first release surface 110 with the baking of the temperature of 80-120 deg.c.In the present embodiment, at tensile simultaneously, the compound adhesive material of coating first release surface 110 with the temperature baking of 100 deg.c is about 3 minutes.Because the force-to-stretch of the first release base material 11 and polarity of solvent will make many thomels 122 normal stands in the compound adhesive material in first release surface 110.That is to say that many thomels 122 basically will be perpendicular to first release surface 110.
Secondly, the first release base material 11 that stops to stretch, and coat about compound adhesive material 4-8 minute of first release surface 110 with the temperature baking of 60-80 deg.c.In the present embodiment, the compound adhesive material of coating first release surface 110 with the baking of the temperature of 70 deg.c is about 5 minutes.At this moment, further cured resin matrix, solvent and other material, making resin matrix be cured to viscosity is 8000 centipoise to 18000 centipoises.
The condition that it will be understood by those skilled in the art that tensile condition and heating can be decided according to the component in the compound adhesive material and thickness.In the actually operating, can formulate the parameter that stretches and heat according to actual conditions.
The 5th step, on the surface of composite gum bonding die 12 away from the first release base material 11, that is, and the second release base material 13 of fitting on first surface in contact 1201.The said second release base material 13 has second release surface 130, and said composite gum bonding die 12 fits between second release surface 130 of first release surface 110 and the second release base material 13 of the first release base material 11.The second release base material 13 can be release PET film, and it can be various separate-type paper.
When the film 10 of making formation directly is used for circuit board making, the second release base material 13 of on the composite gum bonding die, also can not fitting.
After the 4th step or the 5th step, can also further cut film 10, film 10 is made into the shape that needs, use with convenient.When the film 10 that making forms is not directly used, can film 10 be positioned over storage under the low temperature environment, the temperature of storage can be approximately 5 degrees centigrade.
In the film 10 that the present technique scheme provides, composite gum bonding die 12 homodisperse have a plurality of heat conduction particles 124 and many thomels 122.Because thomel has good thermal conductivity, its thermal conductivity is generally 300～500W/k, thereby can promote the heat conductivility and the heat transfer efficiency of film 10.And the mean length of many thomels 122 is 80% to 110% of composite gum bonding die 12 thickness, and basic all arranged verticals, thereby when pasting at circuit board surface or other thermal source element surface, can conduct the heat that thermal source distributes as early as possible.Further, also be distributed with a plurality of heat conduction particles 124 between the many thomels 122, the median size of a plurality of heat conduction particles 124 is 70% to 90% of said composite gum bonding die 12 thickness, conducts the heat that thermal source distributes thereby can assist.And resin matrix also has good tackiness, thereby can be attached to the thermal source surface preferably.That is to say that composite gum bonding die 12 can be stablized and is attached to thermal source surface and has radiating efficiency faster.The film 10 that has excellent heat conductivity performance and heat transfer efficiency more than the film production method that the present technique scheme provides can prepare.
It is understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change the protection domain that all should belong to claim of the present invention with distortion.
Claims (12)
1. composite gum bonding die; Have and be used for first surface in contact that contacts with object to be pasted; Said composite gum bonding die comprises resin matrix, a plurality of heat conduction particle and many thomels, and said many thomels all are basically perpendicular to first surface in contact, and the mean length of many thomels is 80% to 110% of a said composite gum bonding die thickness; Said a plurality of heat conduction particle is between many thomels; The median size of a plurality of heat conduction particles is 70% to 90% of a said composite gum bonding die thickness, said resin matrix be distributed between a plurality of heat conduction particles and many thomels between, the viscosity of resin matrix is 8000 centipoise to 18000 centipoises.
2. composite gum bonding die as claimed in claim 1 is characterized in that, in the said many thomels, the part thomel is exposed to first surface in contact at least.
3. composite gum bonding die as claimed in claim 1 is characterized in that, said resin matrix is that epoxy equivalent (weight) is 182 to 192 epoxy resin, and the viscosity of said epoxy resin is 11000 centipoise to 14000 centipoises.
4. composite gum bonding die as claimed in claim 1 is characterized in that, the material of said a plurality of heat conduction particles is a SP 1.
5. composite gum bonding die as claimed in claim 1 is characterized in that, said composite gum bonding die also comprises stiffening agent, catalyzer, solvent, toughner, additive and skimmer.
6. composite gum bonding die as claimed in claim 5; It is characterized in that; Said stiffening agent is a Dyhard RU 100, and said stiffening agent shared quality percentage composition in the composite gum bonding die is 1.0% to 2.0%, and said catalyzer is the 2-phenylimidazole; Said solvent is a diethylene glycol ether acetate alone; The quality percentage composition of said solvent in compound adhesive material is 10% to 30%, and said toughner is the bisphenol A-type polyhydroxy ether, and the quality percentage composition of said toughner in compound adhesive material is 2.0% to 6.5%; Said additive is γ-glycidyl ether oxygen propyl trimethoxy silicane, and the quality percentage composition of said skimmer in compound adhesive material is 2% to 5%.
7. composite gum bonding die as claimed in claim 1; It is characterized in that; The quality percentage composition of said resin matrix in the composite gum bonding die is 10% to 18%; The quality percentage composition of said many thomels in the composite gum bonding die is 8% to 12%, and the quality percentage composition of said a plurality of heat conduction particles in the composite gum bonding die is 35% to 55%.
8. film; Comprise the first release base material and like each described composite gum bonding die of claim 1 to 7; The said first release base material has first release surface; Said composite gum bonding die also has second surface in contact relative with first surface in contact, and said second surface in contact contacts with said first release surface.
9. film as claimed in claim 8 is characterized in that, said film also comprises the second release base material, and the said second release base material has second release surface, and said first surface in contact contacts with said second release surface.
10. film as claimed in claim 8 is characterized in that, in the said many thomels, an end of part thomel is exposed to first surface in contact, and the other end is exposed to second surface in contact.
11. the method for manufacture of a film comprises step:
Compound adhesive material is provided; Said compound adhesive material comprises epoxy resin-base, a plurality of heat conduction particle and many thomels; Said a plurality of heat conduction particle between many thomels, said epoxy resin-base be connected between a plurality of heat conduction particles and many thomels between; The first release base material is provided, and the said first release base material has first release surface;
Said compound adhesive material is coated first release surface, make said compound adhesive material at the coating thickness of first release surface be many thomels mean length 91% to 125%, and be a plurality of heat conduction particles median size 111% to 143%; And
The first release base material stretches; And the compound adhesive material of first release surface is coated in heating; Thomel in the compound adhesive material of first release surface is all basic to be extended along the direction perpendicular to first release surface so that coat; And to make resin matrix be cured to viscosity be 8000 centipoise to 18000 centipoises, thereby form the composite gum bonding die.
12. the method for manufacture of film as claimed in claim 11 is characterized in that, forms the composite gum bonding die and comprises step:
The first release base material that stretches, and continue the very first time with the compound adhesive material that first release surface is coated in the baking of first temperature; And
The first release base material that stops to stretch, and continued for second time with the compound adhesive material that first release surface is coated in the baking of second temperature, said first temperature is higher than second temperature, and said second time is longer than the very first time.
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| CN103945675A (en) * | 2013-01-18 | 2014-07-23 | Lg电子株式会社 | Heat discharging sheet and display device including the same |
| WO2019000285A1 (en) * | 2017-06-28 | 2019-01-03 | 陈鸿文 | Heat conductive adhesive film |
| CN115516570A (en) * | 2019-07-30 | 2022-12-23 | 快帽***公司 | Thermal interface material |
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| CN1841713A (en) * | 2005-03-31 | 2006-10-04 | 清华大学 | Thermal interface material and its making method |
| CN101518171A (en) * | 2006-09-29 | 2009-08-26 | 电气化学工业株式会社 | Highly thermally conductive acrylic adhesive sheet |
| CN1962799A (en) * | 2006-11-09 | 2007-05-16 | 上海大学 | Low-viscosity heat-conductive adhesive and process for preparing same |
| JP2008189818A (en) * | 2007-02-05 | 2008-08-21 | Nitto Denko Corp | Heat-conductive resin composition, heat-conductive sheet and method for producing the same |
| WO2010021167A1 (en) * | 2008-08-18 | 2010-02-25 | 積水化学工業株式会社 | Insulating sheet and laminated structure |
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| CN103945675A (en) * | 2013-01-18 | 2014-07-23 | Lg电子株式会社 | Heat discharging sheet and display device including the same |
| WO2019000285A1 (en) * | 2017-06-28 | 2019-01-03 | 陈鸿文 | Heat conductive adhesive film |
| CN115516570A (en) * | 2019-07-30 | 2022-12-23 | 快帽***公司 | Thermal interface material |
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