CN102448241B - 布线构造体及包括其的接线盒 - Google Patents
布线构造体及包括其的接线盒 Download PDFInfo
- Publication number
- CN102448241B CN102448241B CN201110265537.7A CN201110265537A CN102448241B CN 102448241 B CN102448241 B CN 102448241B CN 201110265537 A CN201110265537 A CN 201110265537A CN 102448241 B CN102448241 B CN 102448241B
- Authority
- CN
- China
- Prior art keywords
- pin terminals
- circuit board
- substrate
- patchhole
- wiring structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 claims abstract description 138
- 239000002184 metal Substances 0.000 claims abstract description 78
- 229910052751 metal Inorganic materials 0.000 claims abstract description 78
- 238000005304 joining Methods 0.000 claims abstract description 46
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 18
- 238000009434 installation Methods 0.000 claims description 19
- 239000004925 Acrylic resin Substances 0.000 claims description 4
- 229920000178 Acrylic resin Polymers 0.000 claims description 4
- 230000002265 prevention Effects 0.000 abstract 1
- 238000003780 insertion Methods 0.000 description 51
- 230000037431 insertion Effects 0.000 description 51
- 229920005989 resin Polymers 0.000 description 15
- 239000011347 resin Substances 0.000 description 15
- 238000005755 formation reaction Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 10
- 229920005992 thermoplastic resin Polymers 0.000 description 10
- 229920001187 thermosetting polymer Polymers 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 2
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 235000012222 talc Nutrition 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09581—Applying an insulating coating on the walls of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0969—Apertured conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
- H05K2201/10303—Pin-in-hole mounted pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10818—Flat leads
- H05K2201/10833—Flat leads having a curved or folded cross-section
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Connection Or Junction Boxes (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
Claims (14)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010218632A JP5610285B2 (ja) | 2010-09-29 | 2010-09-29 | 配線構造体及びそれを備えたジョイントボックス |
JP2010-218632 | 2010-09-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102448241A CN102448241A (zh) | 2012-05-09 |
CN102448241B true CN102448241B (zh) | 2016-03-30 |
Family
ID=45871090
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110265537.7A Active CN102448241B (zh) | 2010-09-29 | 2011-09-08 | 布线构造体及包括其的接线盒 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8366457B2 (zh) |
JP (1) | JP5610285B2 (zh) |
CN (1) | CN102448241B (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011006392A1 (de) * | 2011-03-30 | 2012-10-04 | Robert Bosch Gmbh | Anschlusselement und Verfahren zur Herstellung eines Anschlusselements |
JP6630190B2 (ja) * | 2016-03-02 | 2020-01-15 | 矢崎総業株式会社 | コネクタ付きケースおよびコネクタ付きケースの製造方法 |
KR20180068017A (ko) * | 2016-12-13 | 2018-06-21 | 현대자동차주식회사 | 전력 변환장치 |
WO2018114687A1 (en) * | 2016-12-19 | 2018-06-28 | Abb Schweiz Ag | Method of manufacturing a multi-phase busbar and arrangement for arrangement for carrying out the method |
US10608356B2 (en) * | 2018-08-30 | 2020-03-31 | L-3 Technologies, Inc. | Multiple node bus bar contacts for high-power electronic assemblies |
JP7248453B2 (ja) * | 2019-02-28 | 2023-03-29 | 矢崎総業株式会社 | ジョイントコネクタ |
JP2021064738A (ja) * | 2019-10-16 | 2021-04-22 | 株式会社ディスコ | 配線基板 |
TWI834116B (zh) * | 2021-03-09 | 2024-03-01 | 陳松佑 | 導電端子組件與導電端子 |
JP2023548447A (ja) | 2021-06-11 | 2023-11-17 | デュップリッコ ディー. オー. オー. | 積層電気回路の自動化された組立て又は分解のために使用されるキット |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1870259A (zh) * | 2002-09-17 | 2006-11-29 | 恩益禧电子股份有限公司 | 多层布线基片 |
CN1939101A (zh) * | 2004-03-31 | 2007-03-28 | 三菱电线工业株式会社 | 电路基板及其制造方法和采用该电路基板的接线箱 |
CN101032191A (zh) * | 2005-07-15 | 2007-09-05 | 松下电器产业株式会社 | 布线基板、布线材料、覆铜层压板以及布线基板的制造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3162500A (en) * | 1962-04-16 | 1964-12-22 | Ind Electric Hardware Corp | Multiple-circuit pin for multilayer circuitry |
JPH0660923A (ja) * | 1992-08-07 | 1994-03-04 | Fujitsu Ltd | 金属ベースプリント板のリード端子実装構造 |
JPH0870187A (ja) * | 1994-08-30 | 1996-03-12 | Furukawa Electric Co Ltd:The | 高耐圧大電流配線板 |
JP3808665B2 (ja) * | 1999-07-01 | 2006-08-16 | 住友電装株式会社 | 電気接続箱 |
JP4120198B2 (ja) * | 2001-10-24 | 2008-07-16 | モレックス インコーポレーテッド | 基板用コネクタ |
JP4385058B2 (ja) * | 2007-05-07 | 2009-12-16 | 三菱電機株式会社 | 電子制御装置 |
TWM383837U (en) * | 2009-09-10 | 2010-07-01 | D & C Technology Co Ltd | Laser device for manufacturing process of acoustooptic modulation curve of panel conductive film |
-
2010
- 2010-09-29 JP JP2010218632A patent/JP5610285B2/ja active Active
-
2011
- 2011-09-08 CN CN201110265537.7A patent/CN102448241B/zh active Active
- 2011-09-15 US US13/233,160 patent/US8366457B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1870259A (zh) * | 2002-09-17 | 2006-11-29 | 恩益禧电子股份有限公司 | 多层布线基片 |
CN1939101A (zh) * | 2004-03-31 | 2007-03-28 | 三菱电线工业株式会社 | 电路基板及其制造方法和采用该电路基板的接线箱 |
CN101032191A (zh) * | 2005-07-15 | 2007-09-05 | 松下电器产业株式会社 | 布线基板、布线材料、覆铜层压板以及布线基板的制造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2012074563A (ja) | 2012-04-12 |
US20120077359A1 (en) | 2012-03-29 |
US8366457B2 (en) | 2013-02-05 |
CN102448241A (zh) | 2012-05-09 |
JP5610285B2 (ja) | 2014-10-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102448241B (zh) | 布线构造体及包括其的接线盒 | |
CN103443961B (zh) | 配线模块 | |
CN102754178B (zh) | 熔丝单元 | |
EP1675220B1 (en) | Electric distribution block and method of assembling the same | |
CN100585961C (zh) | 电连接器及其制造方法 | |
JP5080134B2 (ja) | 端子の取付構造 | |
US9825394B2 (en) | Wire harness and manufacturing method of the wire harness | |
US10707628B2 (en) | Noise filter and noise reduction unit | |
US20110312213A1 (en) | Flat Cable Wiring Structure | |
WO2011065461A1 (ja) | 回路構成体及び電気接続箱 | |
CN100566062C (zh) | 电接线盒 | |
JP5147614B2 (ja) | バッテリー端子取付用ヒューズユニット | |
WO2021075165A1 (ja) | 配線モジュール | |
JP5737049B2 (ja) | 電気接続部材 | |
JP5622051B2 (ja) | 基板用端子およびそれを用いた基板用コネクタ | |
CN2891330Y (zh) | 模组连接器 | |
US6890209B2 (en) | Pressure welding terminal for plate connector | |
JP2018093092A (ja) | プリント基板を用いた回路構成体 | |
JP2002281643A (ja) | バスバー構造体 | |
JP4470989B2 (ja) | ジャンクションボックス | |
JP7516890B2 (ja) | 配線モジュール | |
JP2019040825A (ja) | バスバー、電気接続箱、及び、ワイヤハーネス | |
JP5049648B2 (ja) | 電気接続箱 | |
WO2023210373A1 (ja) | 配線モジュール | |
JP3506101B2 (ja) | ジャンクションボックスの内部回路とリレーの接続構造 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
ASS | Succession or assignment of patent right |
Owner name: FURUKAWA AS CO., LTD. Free format text: FORMER OWNER: MITSUBISHI MATERIALS CORP. MITSUBISHI CABLE INDUSTRIES, LTD. Effective date: 20130823 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20130823 Address after: Tokyo, Japan, Japan Applicant after: Honda Motor Co., Ltd. Applicant after: Furukawa AS Co., Ltd. Address before: Tokyo, Japan, Japan Applicant before: Honda Motor Co., Ltd. Applicant before: Mitsubishi Materials Corp. Applicant before: Mitsubishi Cable Industries, Ltd. |
|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170605 Address after: Tokyo, Japan, Japan Patentee after: Honda Motor Co., Ltd. Address before: Tokyo, Japan, Japan Co-patentee before: Furukawa AS Co., Ltd. Patentee before: Honda Motor Co., Ltd. |