CN102443136B - 感光性树脂、固化性树脂组合物、干膜以及印刷电路板 - Google Patents
感光性树脂、固化性树脂组合物、干膜以及印刷电路板 Download PDFInfo
- Publication number
- CN102443136B CN102443136B CN201110273150.6A CN201110273150A CN102443136B CN 102443136 B CN102443136 B CN 102443136B CN 201110273150 A CN201110273150 A CN 201110273150A CN 102443136 B CN102443136 B CN 102443136B
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- resin composition
- curable resin
- acid
- integer
- film
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/28—Chemically modified polycondensates
- C08G8/30—Chemically modified polycondensates by unsaturated compounds, e.g. terpenes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/28—Chemically modified polycondensates
- C08G8/32—Chemically modified polycondensates by organic acids or derivatives thereof, e.g. fatty oils
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
- C08L61/14—Modified phenol-aldehyde condensates
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials For Photolithography (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Epoxy Resins (AREA)
- Phenolic Resins Or Amino Resins (AREA)
Abstract
Description
Claims (5)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010-205680 | 2010-09-14 | ||
JP2010205680A JP5238777B2 (ja) | 2010-09-14 | 2010-09-14 | 感光性樹脂、それを含有する硬化性樹脂組成物及びそのドライフィルム並びにそれらを用いたプリント配線板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102443136A CN102443136A (zh) | 2012-05-09 |
CN102443136B true CN102443136B (zh) | 2014-08-06 |
Family
ID=45805555
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110273150.6A Active CN102443136B (zh) | 2010-09-14 | 2011-09-14 | 感光性树脂、固化性树脂组合物、干膜以及印刷电路板 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8642234B2 (zh) |
JP (1) | JP5238777B2 (zh) |
KR (1) | KR101321616B1 (zh) |
CN (1) | CN102443136B (zh) |
TW (1) | TWI445738B (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI547759B (zh) * | 2011-09-30 | 2016-09-01 | Taiyo Ink Mfg Co Ltd | A photosensitive resin composition, a hardened film thereof, and a printed wiring board |
US9596754B2 (en) * | 2011-12-22 | 2017-03-14 | Taiyo Ink Mfg. Co., Ltd. | Dry film, printed wiring board using same, method for producing printed wiring board, and flip chip mounting substrate |
TWI586230B (zh) * | 2012-07-18 | 2017-06-01 | 鐘化股份有限公司 | 補強板一體型軟性印刷基板 |
TWI627875B (zh) | 2012-07-18 | 2018-06-21 | 鐘化股份有限公司 | 導電層一體型軟性印刷基板 |
BR112017008018A2 (pt) * | 2014-10-21 | 2018-02-20 | Si Group Inc | processos para estabilizar uma resina fenólica e para aumentar a solubilidade de uma mistura de resina fenólica linear/calixareno, e, composição demulsificante. |
CN110521290B (zh) * | 2017-03-30 | 2022-04-05 | 日立化成株式会社 | 感光性树脂组合物、使用了其的干式膜、印刷布线板及印刷布线板的制造方法 |
CN110999554B (zh) * | 2017-08-09 | 2021-05-18 | 互应化学工业株式会社 | 多层印刷配线板的制造方法和多层印刷配线板 |
WO2023190393A1 (ja) * | 2022-03-28 | 2023-10-05 | 太陽ホールディングス株式会社 | 硬化物およびプリント配線板 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6379862B1 (en) * | 1998-10-20 | 2002-04-30 | Clariant Finance (Bvi) Limited | Radiation-sensitive resin composition |
US20030215746A1 (en) * | 2000-09-20 | 2003-11-20 | Noboru Kohiyama | Carboxyl group-containing photosensitive resin, alkali-developable, photocurable and thermosetting composition containing the same, and cured products thereof |
US20070299163A1 (en) * | 2006-06-21 | 2007-12-27 | Chang Chun Plastics Co., Ltd. | Novel phenolic resin, its preparation and use thereof |
CN101421672A (zh) * | 2006-04-13 | 2009-04-29 | 太阳油墨制造株式会社 | 碱显影型阻焊剂及其固化物以及使用其得到的印刷线路板 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61138614A (ja) * | 1984-12-10 | 1986-06-26 | Matsushita Electric Works Ltd | フエノ−ルノボラツクの製造方法 |
JPS61243869A (ja) | 1985-04-19 | 1986-10-30 | Taiyo Ink Seizo Kk | レジストインキ組成物 |
JPH0371137A (ja) | 1989-08-11 | 1991-03-26 | Tamura Kaken Kk | 感光性樹脂組成物 |
JP2862313B2 (ja) | 1990-02-28 | 1999-03-03 | 山栄化学株式会社 | ソルダーレジストインキ組成物及びその硬化物 |
JP2802801B2 (ja) | 1990-03-02 | 1998-09-24 | 株式会社アサヒ化学研究所 | 感光性熱硬化性樹脂組成物及びソルダーレジストパターン形成方法 |
JP3190251B2 (ja) | 1995-06-06 | 2001-07-23 | 太陽インキ製造株式会社 | アルカリ現像型のフレキシブルプリント配線板用光硬化性・熱硬化性樹脂組成物 |
JP3659825B2 (ja) | 1997-12-19 | 2005-06-15 | 太陽インキ製造株式会社 | アルカリ現像可能な光硬化性・熱硬化性組成物及びそれから得られる硬化皮膜 |
JP3953854B2 (ja) * | 2002-03-22 | 2007-08-08 | 太陽インキ製造株式会社 | 光硬化性・熱硬化性樹脂組成物 |
-
2010
- 2010-09-14 JP JP2010205680A patent/JP5238777B2/ja active Active
-
2011
- 2011-09-09 KR KR1020110091710A patent/KR101321616B1/ko active IP Right Grant
- 2011-09-13 US US13/231,498 patent/US8642234B2/en active Active
- 2011-09-13 TW TW100132866A patent/TWI445738B/zh active
- 2011-09-14 CN CN201110273150.6A patent/CN102443136B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6379862B1 (en) * | 1998-10-20 | 2002-04-30 | Clariant Finance (Bvi) Limited | Radiation-sensitive resin composition |
US20030215746A1 (en) * | 2000-09-20 | 2003-11-20 | Noboru Kohiyama | Carboxyl group-containing photosensitive resin, alkali-developable, photocurable and thermosetting composition containing the same, and cured products thereof |
CN101421672A (zh) * | 2006-04-13 | 2009-04-29 | 太阳油墨制造株式会社 | 碱显影型阻焊剂及其固化物以及使用其得到的印刷线路板 |
US20070299163A1 (en) * | 2006-06-21 | 2007-12-27 | Chang Chun Plastics Co., Ltd. | Novel phenolic resin, its preparation and use thereof |
Also Published As
Publication number | Publication date |
---|---|
TWI445738B (zh) | 2014-07-21 |
JP2012062358A (ja) | 2012-03-29 |
CN102443136A (zh) | 2012-05-09 |
TW201237072A (en) | 2012-09-16 |
JP5238777B2 (ja) | 2013-07-17 |
KR101321616B1 (ko) | 2013-10-22 |
US20120061128A1 (en) | 2012-03-15 |
KR20120028261A (ko) | 2012-03-22 |
US8642234B2 (en) | 2014-02-04 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: Saitama Prefecture, Japan Patentee after: TAIYO HOLDINGS Co.,Ltd. Patentee after: Lishennoco Co.,Ltd. Address before: Saitama Prefecture, Japan Patentee before: TAIYO HOLDINGS Co.,Ltd. Patentee before: Showa electrical materials Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
TR01 | Transfer of patent right |
Effective date of registration: 20230714 Address after: Saitama Prefecture, Japan Patentee after: TAIYO HOLDINGS Co.,Ltd. Patentee after: Showa electrical materials Co.,Ltd. Address before: Tokyo, Japan Patentee before: TAIYO HOLDINGS Co.,Ltd. Patentee before: SHOWA DENKO Kabushiki Kaisha |
|
TR01 | Transfer of patent right |