CN102420160A - Wafer supply system - Google Patents
Wafer supply system Download PDFInfo
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- CN102420160A CN102420160A CN201110302375XA CN201110302375A CN102420160A CN 102420160 A CN102420160 A CN 102420160A CN 201110302375X A CN201110302375X A CN 201110302375XA CN 201110302375 A CN201110302375 A CN 201110302375A CN 102420160 A CN102420160 A CN 102420160A
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- conveyor belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a wafer supply system which unloads wafers from a wafer box which provides laminated wafers for the following processes, and next delivers the wafers to a device which is used in the following processes.
Description
The application requires to enjoy the rights and interests of the korean 10-2010-0093522 that submitted on September 28th, 2010, in view of the above through the full content of quoting this patent application with its combination, just as setting forth fully at this.
Technical field
The present invention relates to a kind of wafer supply system; More specifically; Relate to a kind of like this wafer supply system; Said wafer supply system from the wafer case (wafer magazine) of range upon range of state accommodating wafer sequentially unloading wafer be used for technology subsequently, then wafer is fed to and is used for the equipment of technology subsequently.
Background technology
If wafer is fed to solar battery process or semiconductor technology, wafer should be through the test of appointment before wafer being fed to corresponding technology so.For example, whether have anyly, all can test wafer such as breaking or polluting such defective no matter whether wafer satisfies standard size or wafer.Can use various transducers or camera in designated period under identical and conventional condition, carry out this test technology through the method for the induction (sensing) or (photographing) wafer of taking a picture.
The wafer that is fed to each test technology, solar battery process or semiconductor technology should arrange (align) become to make wafer transmission at interval and orientation be suitable for corresponding technology.
Usually through the wafer case accommodating wafer, stack of wafers is on wafer case.And, the wafer that is transmitted through conveyer etc. is carried out above-mentioned test technology, solar battery process or semiconductor technology.Therefore, in order to realize corresponding technology, should the wafer that be layered on the wafer case sequentially be loaded on conveyer etc.
Can artificially carry out or automatically perform this wafer supply technology.Owing to possibly need specific orientation or transmit the interval; Rather than wafer orientation is used for simple transmission at conveyer belt from wafer case; Therefore must be accurately and apace control be transmitted the orientation between the wafer or transmit at interval so that adapt to process conditions.
Summary of the invention
Therefore, the present invention relates to the wafer supply system.
The purpose of this invention is to provide the wafer supply system; Said wafer supply system from the wafer case of range upon range of state accommodating wafer sequentially unloading wafer be used for technology subsequently so that as one man be provided with between the wafer transmission at interval and minimize wafer depart from (swerving).
Added benefit of the present invention, purpose and characteristic are illustrated part in the following description, and its part to those skilled in the art will be obvious according to consulting hereinafter, perhaps can from practice of the present invention, figure out.Structure through in the specification of being write, its claim and accompanying drawing, specifically noting can realize and obtain the object of the invention and other advantages.
In order to achieve this end with other advantages and according to the object of the invention, as this paper concrete expression and general description, the wafer supply system comprises the wafer supply, is laminated in the wafer on the wafer supply in order to supply; The wafer emptier is in order to sequentially to unload range upon range of wafer from the wafer supply; The wafer handling unit is in order to transmit the wafer through the unloading of wafer emptier along predetermined direction of transfer; Wafer arrangement machine (aligner) is in order to adjust through the interval between the wafer of wafer handling unit transmission or the arrangement position of wafer; And controller, in order to control wafer supply, wafer emptier, wafer handling unit and wafer arrangement machine.
The wafer supply can comprise wafer case, and wafer is vertically arranged with equal intervals in said wafer case, and the wafer emptier can unload the wafer of foot from wafer case.
At the wafer emptier after the wafer supply has unloaded the wafer of foot, the wafer case of the wafer supply predetermined altitude that can descend.
Wafer orientation through the unloading of wafer emptier can be vertical with the wafer orientation that transmits through the wafer handling unit.
Can be provided as right wafer supply so that the wafer inlet of wafer supply strides across the wafer handling unit against each other.
The wafer supply can predetermined space form how right.
The wafer supply system can further comprise the wafer loading bin, being loaded into the wafer handling unit from the wafer of wafer emptier unloading.
What the wafer loading bin can be scheduled to first highly is received from the wafer of wafer emptier unloading and with the second predetermined height wafer is loaded on the wafer handling unit, and said second highly is lower than said first height.
The wafer loading bin can keep first height, and wafer is delivered to the wafer loading bin from the wafer emptier simultaneously, and the reduction of wafer loading bin makes that the upper end of wafer loading bin reaches second height after wafer is sent to the wafer loading bin from emptier.
After wafer was loaded onto on the wafer handling unit, the wafer loading bin can be reduced to than second highly low the 3rd height.
The wafer loading bin can comprise a plurality of pulleys and load conveyer belt, and a plurality of pulley can be arranged on the outside differing heights place with private side of every conveyer belt upper surface, to repeat to increase and reduce the height on every loading conveyer belt.
The wafer handling unit can comprise a pair of transfer conveyor belt, and said a pair of transfer conveyor belt is along the direction setting perpendicular to every loading conveyer belt, and said a pair of transfer conveyor belt can be arranged on the top, zone that every loading conveyer belt upper surface has lower height.
Second height can be corresponding to the height of a pair of transfer conveyor belt upper surface of wafer handling unit.
The wafer arrangement machine can be provided at a pair of transfer conveyor belt below of wafer handling unit, and the wafer arrangement machine can be configured to via this transfer conveyor belt risen and descends, and comprises the lower surface of wafer spinner spare with rotation wafer while supporting wafers.
Wafer spinner spare can comprise suction disc (suction plate), and said suction disc utilizes vacuum to keep the wafer lower surface under wafer spinner spare propradation, to rotate wafer.
Suction disc can be provided with a plurality of suctions hole, and said a plurality of suctions hole is formed on the upper surface of suction disc.
The wafer arrangement machine can further comprise and moves horizontally device, moves wafer spinner spare with the direction of transfer along the wafer handling unit.
Move horizontally device and can comprise ball screw (ball screw) and ball nut (ball screw nut); Said ball screw is arranged to parallel to transfer conveyor belt with this of wafer handling unit, and said ball nut is fixed to wafer spinner spare and is installed on the ball screw.
Rail plate (slide guide) can be arranged on wafer spinner spare below, in order to moving horizontally of guiding wafer spinner spare.
This transfer rate that can be higher than or be lower than the wafer handling unit through the speed of moving horizontally that moves horizontally the wafer spinner spare that device realizes to transfer conveyor belt.
Just before the wafer of arranging through the wafer arrangement machine is located on a pair of transfer conveyor belt of wafer handling unit, can be through the speed of moving horizontally that moves horizontally the wafer spinner spare that device realizes corresponding to the transfer rate of said a pair of transfer conveyor belt.
The wafer arrangement machine can comprise at least one transducer, with wafer position or the direction of induction through the transmission of wafer handling unit.
The wafer arrangement machine can comprise wafer spinner spare; Said wafer spinner spare rises between a pair of transfer conveyor belt and descends; Cross wafer that said a pair of transfer conveyor belt the transmits lower surface of supporting wafers simultaneously with rotating tee, and said controller can come the anglec of rotation of control wafer direction of rotation according to the wafer orientation by said at least one sensor sensing.
The wafer arrangement machine can further comprise and moves horizontally device; Direction of transfer with along the wafer handling unit moves wafer spinner spare, and said controller can be according to the translational speed of coming the controlling level moving device through the transmission between the wafer of said at least one sensor sensing at interval.
The translational speed of controller controllable levels moving device is so that the unification at interval of the transmission between the wafer that a pair of transfer conveyor belt through the wafer handling unit transmits.
Transmitting at interval can be corresponding to every conveyer belt total length of test component, with the wafer of test through the supply of wafer supply system.
Can calculate with this transfer rate based on the time point that wafer passes at least one transducer and transmit at interval transfer conveyor belt.
At least one transducer can comprise front sensor, gets into the delivering position or the direction of the wafer of wafer arrangement machine with induction.
The direction setting that front sensor can be separated from each other and the edge is vertical with a pair of transfer conveyor belt of wafer handling unit.
This at least one transducer can comprise back side transducer, with the time point of induction wafer through the wafer arrangement machine.
The wafer supply system can further comprise the wafer miter guide, with the wafer two ends of guiding through the arrangement of wafer arrangement machine.
In another aspect of this invention; The wafer supply system comprises wafer case, discharge belt, transfer conveyor belt and suction disc; Stack of wafers is on said wafer case and be separated from each other; Said discharge belt sequentially unloads range upon range of wafer from wafer case; Said transfer conveyor belt transmits the wafer through the discharge belt unloading along predetermined direction of transfer, and the wafer that said suction disc keeps transmitting through transfer conveyor belt is with the rotation wafer, perhaps along the direction of transfer of transfer conveyor belt quicken or the deceleration wafer to move horizontally wafer.
At least one discharge belt and transfer conveyor belt can be provided with a plurality of suctions hole, and apply suction through said a plurality of suctions hole.
The wafer supply system can further comprise transfer conveyor belt, receive wafer and wafer is loaded into transfer conveyor belt in order to unload conveyer belt certainly, and said discharge belt can be arranged to vertical with transfer conveyor belt.
Loading conveyer belt can be arranged to parallel with discharge belt; The upper surface that loads conveyer belt can be provided with the protruding and depression that repeats to arrange; Transfer conveyor belt can be arranged on the depression top, and during wafer handling technology or wafer loading technique, loads conveyer belt and can rise and descend.
Should be appreciated that aforementioned general description of the present invention and following specific descriptions all are exemplary and illustrative, and be intended to provide further explanation like the present invention for required protection.
Description of drawings
Comprise accompanying drawing providing further understanding of the present invention, and accompanying drawing is attached among the application and constitutes the application's a part, accompanying drawing shows embodiments of the invention and is used to explain principle of the present invention with this description.Among the figure:
Fig. 1 is the plane graph according to wafer supply system of the present invention;
Fig. 2 (a) is that the figure of technology that wafer is sent to the wafer handling unit of the wafer supply system shown in Fig. 1 from the wafer emptier is shown to 2 (c);
Fig. 3 is the plane graph of the wafer arrangement machine of the supply system of wafer shown in Fig. 1;
Fig. 4 (a) and 4 (b) are the end views of the wafer arrangement machine under the supply system of wafer shown in Fig. 1 mode of operation;
Fig. 5 illustrates the figure that is layered in the technology of the wafer on the wafer supply through the wafer emptier unloading of the supply system of wafer shown in Fig. 1;
Fig. 6 is the figure that illustrates wherein the state of wafer orientation on the wafer handling unit of the wafer supply system shown in Fig. 1;
Fig. 7 illustrates the figure that arranges the technology of wafer through the wafer arrangement machine of wafer supply system as shown in fig. 1;
Fig. 8 illustrates via the wafer arrangement machine of wafer supply system as shown in fig. 1 to adjust through the wafer orientation of wafer handling unit transmission or the figure of the state before the position;
Fig. 9 is the figure that illustrates via the technology of wafer orientation or the position of the wafer arrangement machine of wafer supply system as shown in fig. 1 adjustment through the transmission of wafer handling unit; And
Figure 10 is the figure that wherein wafer is repositioned at the state on the wafer handling unit after wafer arrangement machine adjustment wafer orientation or the position that is illustrated in through wafer supply system as shown in fig. 1.
Embodiment
Now will be in detail with reference to the preferred embodiments of the present invention, the example has been shown in the accompanying drawing.But, the invention is not restricted to these embodiment but can be presented as other forms (shape).The embodiment that the hereinafter description is provided is to explain disclosed content and scope of the present invention is passed to those skilled in the art comprehensively and intactly.As long as of course, institute's drawings attached uses same reference numbers to represent same or similar parts.
Fig. 1 is the plane graph according to wafer supply system 10000 of the present invention.
Each wafer supply 1000 can comprise wafer case 1100, said wafer case 1100 laminated separated wafer w.Wafer case 1100 comprises support slot 1110 and connector 1120, and said support slot 1110 is arranged on wafer case 1100 inward flanges, and said support slot 1110 supporting wafers w edges, each the wafer w that is separated from each other with support; Said connector 1120 is arranged on the upper and lower of wafer case 1100 with broad ways connecting wafer box 1100 inside.
Therefore, under the condition of each wafer w edge, expose upper surface and the lower surface of the wafer w that is layered on the wafer case 1100 by support slot 1110 supports.Because connector 1120 broad wayss are arranged on place, wafer case 1100 upper and lowers, therefore can expose not by the bottom surface section of the foot wafer w of connector 1120 shieldings.
Can keep the wafer case 1100 of each wafer supply 1000 through height adjustment device (not shown), said height adjustment device provides separately.
Therefore, when the foot wafer in the wafer supply 1000 was unloaded by wafer emptier 2000, controller can reduce the height adjustment device to reduce the height of wafer case 1100, will describe said wafer emptier 2000 after a while.
The wafer w that is layered on the wafer case 1100 can be arranged on the wafer case 1100 along specific direction.Therefore, the arranged direction that is arranged in the wafer w of box 1100 inside is fixed with respect to the inlet of the wafer case 1100 of along continuous straight runs setting.This characteristic relation will provide specific descriptions to this after a while to the arrangement technology that realizes through wafer arrangement machine 5000.
Embodiment shown in Fig. 1 shows four wafer supply 1000a, 1000b, 1000c and 1000d.The supply rate of considering wafer w can be confirmed the quantity of wafer supply 1000.
Paired wafer supply 1000a, 1000b, 1000c and 1000d according to wafer supply system 10000 of the present invention are provided, make every pair of two supplies stride wafer handling unit 4000 against each other.In this case, wafer supply 1000a, 1000b, 1000c and 1000d can predetermined space form how right.
Can be provided as right wafer supply 1000a, 1000b, 1000c and 1000d makes every pair of two supplies stride wafer handling unit 4000 against each other; To describe this after a while, and this structure is used to make that wafer supply 1000a, 1000b, 1000c and the 1000d of wafer supply system 10000 share wafer loading bin 3000a and 3000b.
And embodiment as shown in fig. 1 prepares two couples of wafer supply 1000a, 1000b, 1000c and 1000d and makes two the wafers of the wafer case 1100a in each, 1100b, 1100c and 1100d inlet striden wafer handling unit 4000 against each other.
The first wafer supply 1000a and the 3rd wafer supply 1000c in Fig. 1 the left side against each other; The second wafer supply 1000b and the 4th wafer supply 1000d against each other, the transfer conveyor belt 4100 of wafer handling unit 4000 is arranged between the respect to one another first and the 3rd wafer supply 1000a and the 1000c and between the respect to one another second and the 4th wafer supply 1000b and the 1000d.
Each wafer w that will remain in the wafer supply 1000 through wafer emptier 2000 is unloaded to wafer case 1100 outsides, and the wafer case 1100 that said wafer emptier 2000 connects each wafer supply 1000 enters the mouth to wafer arrangement machine 5000.
Each wafer emptier 2000 all comprises discharge belt 2100, drives driving shaft, the driven shaft of conveyer belt 2100 and is installed in the pulley (not shown) on each respectively.Each wafer emptier 2000 can comprise a plurality of parallel discharge belt 2100x and 2100y, and the embodiment shown in Fig. 1 shows a pair of discharge belt 2100x and 2100y.
The discharge belt 2100 of wafer emptier 2000 is arranged on the lower face side of foot wafer on the wafer case 1100, and unloads the foot wafer by means of frictional force or suction with foot wafer lower surface.Therefore, can the height adjustment of wafer supply 1000 be become make the terminal upper surface of discharge belt 2100 of the lower surface contact wafer emptier 2000 of foot wafer on the wafer case 1100.When unloading foot wafer, the height of next foot wafer lower surface can reach the upper surface of discharge belt 2100 ends.Therefore, controller can reduce wafer case 1100 height of wafer supply 1000 in the platform (stage).
Each wafer emptier 2000 is independent of each wafer supply 1000 and is provided with.Embodiment shown in Fig. 1 shows first to fourth wafer emptier 2000a, 2000b, 2000c and 2000d.
Can comprise further that according to wafer supply system 1000 of the present invention wafer loading bin 3000 will be being loaded into wafer handling unit 4000 through the wafer of wafer emptier 2000 unloadings.
The first wafer supply 1000a and the 3rd wafer supply 1000c are against each other; The second wafer supply 1000b and the 4th wafer supply 1000d against each other, and the transfer conveyor belt 4100 of wafer handling unit 4000 is arranged between the respect to one another first and the 3rd wafer supply 1000a and the 1000c and between the respect to one another second and the 4th wafer supply 1000b and the 1000d.First to fourth wafer emptier 2000a, 2000b, 2000c and 2000d are set at respectively and are connected the entering the mouth to the position of wafer handling unit 4000 of first to fourth wafer supply 1000a, 1000b, 1000c and 1000d.
And the first and the 3rd wafer emptier 2000a and 2000c can the shared first wafer loading bin 3000a, and the second and the 4th wafer emptier 2000b and 2000d can the shared second wafer loading bin 3000b.
Because the wafer handling direction of wafer handling unit 4000 is perpendicular to one another with the wafer orientation that unloads through wafer emptier 200; As shown in fig. 1, the method edge direction vertical with the unloading wafer direction that therefore wafer is loaded on transfer conveyor belt 4100 upper surfaces of wafer handling unit 4000 transmits wafer.
In wafer supply system according to the present invention, the edge direction accommodating wafer vertical with the direction of transfer of transfer conveyor belt 4100 thus, can improve the space availability ratio of semiconductor processing equipment to transmit wafer.That is to say; For direction of transfer accommodating wafer along transfer conveyor belt 4100; Should be from a side accommodating wafer of transfer conveyor belt 4100 length directions, and limited the number of wafers that can supply simultaneously thus and increased device length, space availability ratio reduced thus.
And, should minimize departing from of wafer position in the positions wafer process.After a while will be through the concrete grammar of describing through each wafer loading bin 3000 loaded with wafers with reference to figure 2.
Wafer supply system 1000 according to the present invention can comprise wafer handling unit 4000, and wafer handling unit 4000 transmits the wafer through 200 unloadings of wafer emptier along predetermined direction.
Because can be through 5000 adjustment of wafer arrangement machine through the direction of wafer or the interval between the wafer in the technical process of transfer conveyor belt 4100 transmission wafers; Therefore this can be separated from each other transfer conveyor belt 4100 and by parallel installation, make the core of transfer conveyor belt 4100 come out downwards.
Because being mounted to, wafer supply 1000 make its wafer inlet against each other; As stated; If therefore through wafer emptier 2000 and wafer loading bin 3000 with wafer orientation on wafer handling unit 4000, to have angle be that the direction of 180 degree is poor to wafer orientation so.But, because semiconductor processing equipment is mounted to test or handles along the wafer of assigned direction supply, therefore should adjust termly through 10000 supplies of wafer supply system the wafer supplier to.
And, since in the semiconductor machining processing speed of wafer can be arranged to corresponding with the supply rate or the transfer rate of wafer, the therefore needs supply rate of control wafer termly.
Can adjust wafer supply rate through on transfer conveyor belt 4100 upper surfaces that are arranged on wafer handling the unit 4000 and interval between the wafer that transmits through 10000 supplies of wafer supply system.
Make the transmission that transmits between the wafer fix at interval even the speed of the conveyer belt 2100 of wafer emptier 2000 and wafer loading bin 3000 is adjusted into, the transmission that is positioned between the wafer on transfer conveyor belt 4100 upper surfaces of wafer handling unit 4000 at interval also can occurrence of errors.
Therefore, must adjust between the wafer that is positioned on transfer conveyor belt 4100 upper surfaces and transmits along transfer conveyor belt 4100 transmission at interval.
Therefore, wafer supply system 10000 according to the present invention also comprises wafer adjuster 5000, with the wafer interval or the direction of adjustment through 4000 transmission of wafer handling unit.
To transmit the direction between the wafer in order adjusting or to transmit the interval; Wafer arrangement machine 5000 can comprise wafer spinner spare; Said wafer spinner spare is provided at a pair of transfer conveyor belt 4100 belows of wafer handling unit 4000 and between transfer conveyor belt 4100, rises, with rotation wafer while supporting wafers lower surface.In order to adjust the transmission that transmits between the wafer at interval, wafer arrangement machine 5000 comprises also and moves horizontally device that the direction parallel with the direction of transfer of wafer handling unit 4000 with the edge moves wafer spinner spare.This device that moves horizontally can comprise ball screw 5400 and ball nut 5300; Said ball screw 5400 is arranged to parallel with the transfer conveyor belt 4100 of wafer handling unit 4000, and ball nut 5300 is fixed to wafer spinner spare and is installed on the ball screw 5400.
Although will describe after a while, can or come the control wafer rotary device at interval or move horizontally the anglec of rotation or the speed of device according to the direction between the wafer that transmits through transfer conveyor belt 4100 according to the controller of wafer supply system 10000 of the present invention.
Transmission between the wafer that transfer conveyor belt 4100 according to the translational speed of the controller controllable levels moving device of wafer supply system 10000 of the present invention so that through wafer handling unit 4000 transmits is fixing (regular's) at interval.That is to say that controller can be according to transmitting the rotary speed that changes the ball screw 5400 that moves horizontally device at interval.
If the transmission between two wafers that transmit through transfer conveyor belt 4100 at interval less than required interval (below; Be called " base interval "); The wafer that then can in the middle of two wafers, transmit after a while through raising, through move horizontally device along direction of transfer with the speed lower than the transfer rate of transfer conveyor belt 4100 move wafer, afterwards with said wafer orientation on transfer conveyor belt 4100, make that the transmission between two wafers is consistent with base interval at interval.
On the other hand; If the transmission between two wafers that transmit through transfer conveyor belt 4100 is at interval greater than base interval; Wafer that then can be through transmitting after a while in the middle of two wafers that raise, through move horizontally device along direction of transfer with move than the high speed of transfer conveyor belt 4100 transfer rates wafer and afterwards with wafer orientation on transfer conveyor belt 4100, make that the transmission between two wafers is consistent with base interval at interval.That is to say, can be higher than or be lower than the transfer rate of the transfer conveyor belt 4100 of wafer handling unit 4000 through the speed of moving horizontally that moves horizontally the wafer spinner spare that device realizes.
And the test component (not shown) that is used to test the wafer through wafer supply system 10000 supplies according to the present invention can be arranged on the back side of wafer miter guide (guider) 6000, and each test component all comprises at least one conveyer belt.
Here; In the time will transmitting the total length that is adjusted at interval corresponding to the conveyer belt of each test component; Can be with being applied in the test technology of aimed wafer to be tested unchangeably and as one man by the fixed error (fixed error) that thickness deviation produces according to the test component belt position, and can improve reliability of testing result thus.
To provide through wafer arrangement machine 5000 with reference to figure 3 and Fig. 4 after a while and carry out the specific descriptions that wafer is arranged technology.
In embodiment shown in Fig. 1, at least one transducer can comprise front sensor 5100, enters into the delivering position or the direction of the wafer of wafer arrangement machine 5000 with induction.
Two front sensors 5100 that are separated from each other can be responded to the transmission wafer of the location above or below the transmission wafer.
To provide the specific descriptions of front sensor 5100 and back transducer 5600 after a while.
Can be adjusted at direction or interval between the wafer w that transmits through wafer handling unit 4000 through wafer arrangement machine 5000.Although, can comprise further that according to wafer supply system 10000 of the present invention wafer miter guide 6000 departs from the mechanical checkout wafer orientation so if used above-mentioned arrangement process wafer direction still to depart from too much.
Can guide member 6500 be arranged to approximate parallelly, and be used for during mechanical adjustment is arranged technology and transmitted technology the wafer orientation that too much departs from being arranged with the direction of transfer of wafer handling unit 4000.
If be difficult to be discharged in immediately the wafer that does not have arrangement in the automatic transport process, then must transmit the wafer of not arranging and hinder the technology subsequently of arranging next good wafer with the wafer that prevents not arrange along initial transfer path.
Be used for subsequently the testing apparatus of technology or the inlet of equipment if the wafer that direction has taken place too much to depart from has blocked, the problem such as destroying next wafer then can take place.Therefore, through using guide member 6500, wafer miter guide 6000 can prevent not arrange wafer and depart from the wafer handling path.
Interval between the guide member 6500 can comprise the cross section that narrows along direction of transfer.This cross section is used in the technology minimize physical resistance through guide member 6500 guiding wafers.
Fig. 2 (a) is that the figure of technology that wafer is sent to the wafer handling unit 4000 of the supply system of wafer shown in Fig. 1 10000 from wafer emptier 2000 is shown to 2 (c).
As stated; Because the wafer orientation through 200 unloadings of wafer emptier is perpendicular to one another with the wafer orientation that transmits through wafer handling unit 4000; Therefore when the discharge belt 2100 through wafer emptier 2000 with the wafer simple loading during to transfer conveyor belt 4100, owing to the difference on each conveyer belt direction of transfer causes during the wafer loading technique wafer orientation too much to depart from perhaps can not loaded with wafers.
Therefore, wafer supply system 10000 according to the present invention also comprises wafer loading bin 3000, with passing through wafer emptier 2000 after wafer supply 1000 unloading wafer, wafer stably is loaded into wafer handling unit 4000.Each wafer loading bin 3000 all can comprise driving shaft, the driven shaft that loads conveyer belt 3100, driving loading conveyer belt 3100 and be installed in the pulley 3200 on each.
Embodiment shown in Fig. 2 shows wafer loading bin 3000, comprises that 8 pulleys 3200 load conveyer belt 3100 to drive.
A plurality of pulley 3200-1 to 3200-8 can be separately positioned on the outside and the inboard of loading conveyer belt 3100 upper surfaces of wafer loading bin 3000, to repeat to increase and reduce loading conveyer belt 3100 upper level.Therefore; First, the 3rd, the 4th and the 6th pulley 3200-1,3200-3,3200-4 and 3200-6 are installed in the height that is higher than second and the 5th pulley 3200-2 and 3200-5; First, the 3rd, the 4th and the 6th pulley 3200-1,3200-3,3200-4 and 3200-6 are installed on the private side that loads conveyer belt 3100, and the second and the 5th pulley 3200-2 and 3200-5 are installed on the outer side that loads conveyer belt 3100.
Through this set and the installation of pulley 3200, the upper surface that loads conveyer belt 3100 can have uneven structure, and the height of upper surface repeats to increase and reduce.
That is to say that loading conveyer belt 3100 can be arranged to parallel with discharge belt 2100, and the upper surface of loading conveyer belt 3100 provides the protruding and depression that repeats to be provided with. Transfer conveyor belt 4100x and 4100y are arranged on the depression top, and load conveyer belt 3100 and during wafer handling technology or wafer loading technique, can rise.
Therefore, when wafer loading bin 3000 rose, the loading conveyer belt 3100 of wafer loading bin 3000 can not influence transfer conveyor belt 4100x and 4100y.
The first height h1 that wafer loading bin 3000 can keep being scheduled to; Be received from the wafer that wafer emptier 2000 transmits simultaneously; And the upper surface of the transfer conveyor belt 4100 of wafer handling unit 4000 can keep the second height h2 lower than the first height h1, and wafer loading bin 3000 receives the wafer that transmits from wafer emptier 2000 simultaneously.
Shown in Fig. 2 (a); Because the upper end (i.e. the upper end of the first, the 3rd, the 4th and the 6th pulley) of wafer loading bin 3000 keeps the predetermined first height h1 corresponding with the upper level of wafer emptier 2000 discharge belts 2100; Wafer loading bin 3000 receives the wafer that transmits from wafer emptier 2000 simultaneously, so wafer loading bin 3000 can stably receive the wafer that transmits from wafer emptier 2000.Among first to the 8th pulley 3200-1～3200-8 of the loading conveyer belt 3100 of wafer loading bin 3000 one can be the drive pulley through motor driven.
And, shown in Fig. 2 (b), when having accomplished, can stop to drive the loading conveyer belt 3100 of wafer loading bin 3000 from wafer emptier 2000 transmission wafer to wafer loading bins 3000.
In this case, when having accomplished wafer handling, stop to drive the discharge belt 2100 of wafer emptier 2000.Reason is, but strides transfer conveyor belt 410 paired wafer supply 100 alternate supplies wafers respect to one another.
More specifically, when having accomplished wafer when wafer emptier 2000 is sent to wafer loading bin 3000, wafer loading bin 3000 descends, shown in Fig. 2 (c).
Here; The second height h2 can be corresponding to the upper level of the transfer conveyor belt 4100 of wafer handling unit 4000; Wafer loading bin 3000 can receive the wafer through 200 unloadings of wafer emptier at the first predetermined height h1, and wafer loading bin 3000 is loaded into wafer handling unit 4000 with the predetermined second height h2 lower than the first height h1 with wafer afterwards.More specifically; (during h2＜h1), the wafer w that is positioned on wafer loading bin 3000 upper surfaces can be loaded onto transfer conveyor belt 4100 when the upper end of wafer loading bin 3000 during the wafer loading bin 3000 decline technologies drops to corresponding with the upper level of the transfer conveyor belt 4100 predetermined second height h2.
When wafer orientation was on transfer conveyor belt 4100 upper surfaces, transfer conveyor belt 4100 can transmit along direction of transfer, slowed down perhaps to stop.
And, when dropping to the three height h3 lower than the second height h2, wafer loading bin 3000 (during h3＜h2), accomplishes that wafer is loaded on the wafer handling unit 4000.
The reason that wafer loading bin 3000 further is reduced to the 3rd height h3 is, prevented since loading conveyer belt 3100 surfaces of the wafer loading bin 3000 that friction causes to the influence of the wafer handling technology that realizes through transfer conveyor belt 4100.Therefore, the comparable second height h2 of the 3rd height h3 is low slightly.
As long as wafer loading bin 300 provides the upper end of (uneven) structure that has unevenness, thereby can rise and descend and can not influence transfer conveyor belt 4100, just can have arbitrary shape to the wafer loading bin 3000 shown in 2 (c) like Fig. 2 (a).
Fig. 3 is the plane graph of the wafer arrangement machine 5000 of the supply system of wafer shown in Fig. 1 10000, and Fig. 4 (a) and Fig. 4 (b) are the end views of the wafer arrangement machine 5000 under the mode of operation of the supply system of wafer shown in Fig. 1 10000.
As stated; Wafer arrangement machine 5000 comprises wafer spinner spare; Said wafer spinner spare is provided at a pair of transfer conveyor belt 4100 belows of wafer handling unit 4000, and wafer spinner spare rises between transfer conveyor belt 4100, with rotation wafer supporting wafers lower surface simultaneously; Wafer spinner spare can comprise suction disc 5200, thereby to keep the wafer lower surface under the condition that wafer spinner spare rises, to rotate wafer.
As shown in Figure 3, suction disc 5200 can have plate-like and be connected to the aspirator that applies vacuum pressure or negative pressure.The a plurality of suctions hole 5200h that becomes radiation-like to arrange can be formed on the upper surface of suction disc 5200.
The wafer spinner spare wafer that transmits through the wafer handling unit 400 supporting wafers lower surface simultaneously that is used to raise, and be used for when wafer upwards separates with transfer conveyor belt 4100, rotating wafer.
With reference to figure 1; Owing to the direction of the wafer w on the wafer case 1100 that is positioned at wafer supply 1000 is fixed with respect to wafer case 1100 inlets; And wafer supply 1000 is striden transfer conveyor belt 4100 against each other, so wafer w has the phase difference that angle is 180 degree.If becoming to make, technological design therefore subsequently do not rotate a wafer from the wafer w of wafer supply 1000 supplies respect to one another; So must be during transmitting technology with another wafer of angle rotation w of 180 degree; And if technological design subsequently becomes feasible along clockwise direction with the wafer of an angle of 90 degrees degree rotation from the wafer w that wafer supply 1000 respect to one another is supplied, during transmitting technology, must counterclockwise rotate another wafer w in the edge so with an angle of 90 degrees degree.To describe according to wafer supply system 10000 of the present invention based on the hypothesis that adopts the latter.
Therefore, according to based on transfer conveyor belt 4100 which wafer supply 1000 wafer being fed to, the suction disc 5200 of wafer spinner spare can be along rotating wafer with an angle of 90 degrees degree clockwise or counterclockwise.
That is to say; Wafer spinner spare can rotate from the wafer of the first and second wafer supply 1000a and 1000b supply with an angle of 90 degrees degree along counter clockwise direction, and along clockwise direction with the wafer of an angle of 90 degrees degree rotation from the third and fourth wafer supply 1000c and 1000d supply.
Certainly, clockwise direction or counterclockwise 90 degree angle maybe according at the loading technique of wafer or the wafer that produces during transmitting technology depart from and change.
That is to say that if depart from θ degree angle from the wafer of the first and second wafer supply 1000a and 1000b supply along counter clockwise direction, then wafer spinner spare can be along counterclockwise rotating wafer with 90-θ degree angle.After a while its specific descriptions will be described.
Can drive wafer spinner spare with moving horizontally device, this moves horizontally device is carried out wafer spinner spare on the wafer handling direction move (translation) with combining.
As stated; Move horizontally device and comprise ball screw 5400 and ball nut 5300; Said ball screw 5400 is arranged to parallel with the transfer conveyor belt 4100 of wafer handling unit 4000, and said ball nut 5300 is fixed to wafer spinner spare and is installed on the ball screw 5400.
Drive ball screw 5400 with swing roller screw rod 5400 through ball screw CD-ROM drive motor 5500.Can adjust the speed that moves horizontally of wafer spinner spare through the actuating speed of adjustment ball screw CD-ROM drive motor 5500.Through the rotary speed of adjustment ball screw CD-ROM drive motor 5500, as stated, can be higher than or be lower than the transfer rate of the transfer conveyor belt 4100 of wafer handling unit 400 through the speed of moving horizontally that moves horizontally the wafer spinner spare that device realizes.
Can the rail plate that move horizontally 5700 of guiding wafer spinner spare be provided at wafer spinner spare below.
Wafer spinner spare can move horizontally the actuating force that device receives along continuous straight runs certainly, and guides the horizontal slip of wafer spinner spares to move through the rail plate 5700 of separation.
And, can front sensor 5100 and back transducer 5600 be provided at the front and rear of wafer arrangement machine 5000.As stated; Front sensor 5100 can comprise the first front sensor 5100x and the second front sensor 5100y; The direction that the first front sensor 5100x and the second front sensor 5100y are can the edge vertical with the direction of transfer of transfer conveyor belt 4100 is separated from one another; And front sensor 5100 can be camera with the chadacryst picture, or laser sensor is with the light of simple induction through object transmission.
In order only to respond to the delivering position of wafer, can only use a front sensor 5100 to judge the delivering position that transmits wafer.But, in order to respond to the wafer orientation that the wafer that during the wafer loading technique, produces departs from change, at least two transducers that must use the edge direction vertical to be separated from each other with direction of transfer.If the wafer that transmits through wafer handling unit 4000 is not circular wafer but polygon solar cell wafer, then can calculate the departure degree of wafer through the time difference of a pair of front sensor 5100x and 5100y through wafer.
And; Back transducer 5600 can be judged the delivering position of the wafer that comes out from wafer handling unit 4000 in the middle of the wafer that transmits through wafer handling unit 4000; And front sensor 5100 can be responded to the wafer position that enters into wafer arrangement machine 5000, thereby judges the transmission interval between the transmission wafer.Transmission between the wafer of being responded to can be used as the control variables of controller at interval, thus serves as the control data of wafer arrangement machine 5000.
And, shown in Fig. 4 (a) and 4 (b), can pass through plate rotating band 5240 drive plate rotating shafts 5210 through plate rotating shaft 5210 rotation suction discs 5200, and can be through the plate drive pulley 5260 drive plate rotating bands 5240 that are connected to plate CD-ROM drive motor 5250.
And the suction hole that is arranged on suction disc 5200 upper surfaces is connected to suction pipe 5230, and said suction hole applies suction to wafer lower surface when through wafer spinner spare rotation wafer, thereby strengthens the wafer support state of suction disc 5200.And suction pipe 5230 can be configured to the preset distance that rises.In order to prevent to slide, can suction disc 5200 be controlled to rotation after rising through producing wafer in the process of suction disc 5200 upper surface supporting wafers.
Can carry out simultaneously through wafer spinner spare rotation wafer with through moving horizontally device and move horizontally wafer.As stated, can adjust departing from and the interval between the wafer of transmitting of the wafer that transmits simultaneously.
Fig. 5 illustrates the figure that is layered in the technology of the wafer on the wafer supply 1000 through wafer emptier 2000 unloadings of the supply system of wafer shown in Fig. 1 10000.
And, like the embodiment among Fig. 5, can prepare two couples of wafer supply 1000a, 1000b, 1000c and 1000d so that stride wafer handling unit 4000 against each other at the wafer inlet of each wafer supply 1000a of two centerings, 1000b, 1000c and 1000d.
The first wafer supply 1000a and the 3rd left side of wafer supply 1000c in Fig. 5 are against each other; The second wafer supply 1000b and the 4th wafer supply 1000d against each other, and with the transfer conveyor belt 4100x of wafer handling unit 4000 with 4100y is set in parallel between the respect to one another first and the 3rd wafer supply 1000a and the 1000c and between the respect to one another second and the 4th wafer supply 1000b and 1000d.Because the first and the 3rd wafer supply 1000a and the shared first wafer loading bin 3000a of 1000c and the second and the 4th wafer supply 1000b and the shared second wafer loading bin 3000b of 1000d, therefore wafer supply 1000a respect to one another, 1000b, 1000c and 1000d can the while accommodating wafers.
Therefore, in the middle of first to fourth wafer supply 1000a, 1000b, 1000c and 1000d, the wafer supply that only is set on the equidirectional based on transfer conveyor belt 4100 can the while accommodating wafer.
Embodiment shown in Fig. 5 shows the technology from the first and second wafer supply 1000a and 1000b unloading wafer through the first and second wafer emptier 2000a and 2000b.
When the wafer discharge rate is set regularly, can remain the transmission between the wafer after wafer being loaded on the transfer conveyor belt 4100 fixing at interval.
That is to say; Because it is fixing that the transmission between the wafer of being supplied through wafer supply system 10000 according to the present invention preferably remains during semiconductor technology or test technology subsequently at interval; Therefore if according to the required actuating speed that is arranged on the interval between the wafer supply 1000 at interval and fixedly installs the discharge belt 2100 of unloading wafer that transmits between the wafer, then can with the transmission between the wafer be arranged at interval with wafer supply 1000 between the interval identical.
Fig. 6 is the figure that illustrates the state of wafer orientation on the wafer handling unit 4000 of the supply system of wafer shown in Fig. 1 10000.
Can will be loaded on the transfer conveyor belt 4100 through the wafer w of wafer emptier 2000 unloadings through wafer loading bin 3000.
As stated, during will being loaded into the technology on the transfer conveyor belt 4100 by the wafer of wafer supply 1000 supplies respect to one another, wafer supply 1000 shared wafer loading bins 3000 respect to one another.That is to say that wafer supply 1000 respect to one another is used alternatingly a wafer loading bin 3000 during the wafer loading technique.
Therefore, the direction of rotation of the loading conveyer belt 3100 of wafer loading bin 3000 can change the wafer supply 1000 of accommodating wafer.
In the embodiment shown in Fig. 6; The first and second wafer supply 1000a and 1000b accommodating wafer, and can the direction of rotation of the loading conveyer belt 3100a of the first and second wafer loading bin 3000a and 3000b and 3100b be adjusted to identical thus with the direction of rotation of the discharge belt 2100 of the first and second wafer emptier 2000a and 2000b.
And; Like Fig. 2 (a) to shown in 2 (c); Remain in wafer loading bin 3000 upper ends under the condition of the first predetermined height h1; Wafer loading bin 3000 receives the wafer that transmits from wafer emptier 2000, and when the upper end of wafer loading bin 3000 drop to than the first height h1 low second highly during h2, wafer loading bin 3000 is loaded into wafer on the transfer conveyor belt 4100 of wafer handling unit 400.
Fig. 7 is that the wafer that wafer arrangement machine 5000 realizations of the supply system of wafer shown in Fig. 1 10000 are shown is arranged the figure of technology.
Embodiment shown in Fig. 7 shows the first wafer w1 that when departing from θ degree angle, gets into wafer arrangement machine 5000.Rotate in a counter-clockwise direction an angle of 90 degrees degree if suppose the wafer handling direction; The first wafer supply 1000a supplies the first wafer w1; As stated; Then the first wafer w1 has departed from θ degree angle in the counterclockwise direction, and the wafer spinner spare of wafer arrangement machine 500 can rotate angle that the first wafer w1 reaches 90-θ degree in the counterclockwise direction to adjust the direction of the first wafer w thus.
Therefore, respond to departing from of wafers according to the controller of wafer supply system 10000 of the present invention through the front sensor 5100 that is provided at wafer arrangement machine 5000 places, thus the anglec of rotation of the suction disc 5200 of the wafer spinner spare of accurate control wafer arrangement machine 5000.
And the time point when being provided at the back transducer 5600 induction first wafer w1 and the second wafer w2 on the wafer arrangement machine 5000 through wafer arrangement machine 5000 is also considered the speed of transfer conveyor belt 4100, adjust thus between the wafer transmission at interval.
Compare with the transfer rate of transfer conveyor belt 4100, realize adjusting the transmission interval between the wafer of transmitting through the speed of moving horizontally that increases or reduce suction disc 5200, said suction disc 5200 is through attracting to support the wafer that transmits.
The rotary speed of the ball screw that moves horizontally device 5400 that can be through adjustment wafer arrangement machine 5000 is controlled the speed that moves horizontally of suction disc 5200, as stated.
Fig. 8 illustrates through the wafer arrangement machine 5000 of the wafer supply system 10000 shown in Fig. 1 to adjust through the wafer orientation of wafer handling unit 4000 transmission or the figure of the state before the position; Fig. 9 is the figure of technology that direction and the position of the wafer that wafer arrangement machine 5000 adjustment through the supply system of wafer shown in Fig. 1 10000 transmit through wafer handling unit 4000 are shown, and Figure 10 is the figure that illustrates wherein after the direction of adjusting wafers through the wafer arrangement machine 5000 of the supply system of wafer shown in Fig. 1 10000 and position under the state that wafer is repositioned on the wafer handling unit 4000.
Transfer rate Vb with transfer conveyor belt 4100 transmits the first wafer w1 that has entered into wafer arrangement machine 5000, and also under the transfer rate Vb of transfer conveyor belt 4100, transmits the second wafer w2 through 5000 arrangements of wafer arrangement machine and process wafer arrangement machine 5000.
Embodiment shown in Figure 8 shows the transmission interval between the first wafer w1 and the second wafer w2, and the value at said interval is L '.
Be worth if desired L (L '＞L) at interval as the transmission between the wafer that transmits through wafer handling unit 4000, next central wafer of these two wafers then, promptly the first wafer w1 should move with the velocity level higher than the transfer rate Vb of transfer conveyor belt 4100.
Therefore; The device that moves horizontally as shown in Figure 9 according to wafer arrangement machine 5000 of the present invention; Support at suction disc 5200 under the condition of lower surface of the first wafer w1; Suction disc 5200 to transfer conveyor belt 4100 tops of the wafer spinner spare of rising wafer arrangement machine 5000 and mobile suction disc 5200 preset distances under than the high speed that the moves horizontally Vr of the transfer rate Vb of transfer conveyor belt 4100 afterwards.
Here, rotatable suction disc 5200 can be adjusted the wafer orientation from 1000 supplies of wafer supply thus as required.
When under than the high speed that the moves horizontally Vr of the transfer rate Vb of transfer conveyor belt 4100, moving the first wafer w1; Transmission between the first wafer w1 and the second wafer w2 becomes L at interval " (L '＞L "＞L); And when the transmission between the first wafer w1 and the second wafer w2 reaches base interval L at interval; To be loaded on the transfer conveyor belt 4100 through suction disc 5200 maintenances and the first wafer w1 that moves horizontally, base interval L will be arranged in the transmission between the first wafer w1 and the second wafer w2 at interval.
And; Each band according to wafer supply system of the present invention; For example transfer conveyor belt, discharge belt, loading conveyer belt and guide conveyor can provide respectively with on a plurality of suctions hole; And each band can apply suction via inhaling the hole, prevents at wafer handling, unloading, loading or during guiding technology that thus wafer vibration or wafer from separating from corresponding band.
As conspicuous, accurately and apace adjust wafer orientation or the interval of the transmission between the wafer through transmission such as conveyer belts according to wafer supply system of the present invention according to foregoing description.
And; During transmitting the technology of wafer from the wafer case unloading wafer with along transfer conveyor belt; According to the transmission between wafer supply system adjustment wafer orientation of the present invention or the wafer at interval; And can be during the technology that transmits wafer from the wafer case unloading wafer with along transfer conveyor belt the drives interrupts transfer conveyor belt, thereby improved the wafer efficiency of supply.
In addition, wafer supply system according to the present invention makes the error that during the technology that is loaded into from the wafer case unloading wafer with wafer on the conveyer belt, produces reduce to minimum.
In addition, according to the wafer supply system of the present invention edge direction accommodating wafer vertical, thereby improved the space availability ratio of semiconductor equipment with the processing direction of transfer conveyor belt.
And; Accurately and apace adjust wafer orientation or the interval of the transmission between the wafer according to wafer supply system of the present invention through transmission such as conveyer belts; And make the error that during the technology that is loaded into from the wafer case unloading wafer with wafer on the conveyer belt, produces reduce to minimum; So that because the process disruption that the error that during wafer supply technology, produces causes minimizes degree, thereby improved the productive rate of semiconductor technology.
It will be apparent for a person skilled in the art that and to make various modifications and variation to the present invention and can not break away from the spirit or scope of the present invention.Thus, as long as fall in the scope of appended claim and equivalent thereof, the invention is intended to cover modification of the present invention and variation.
Claims (33)
1. wafer supply system comprises:
The wafer supply is laminated in the wafer on the said wafer supply with supply;
The wafer emptier is sequentially to unload range upon range of wafer from said wafer supply;
The wafer handling unit is to transmit the wafer by said wafer emptier unloading along predetermined direction of transfer;
The wafer arrangement machine, wafer position is perhaps arranged at wafer that is transmitted through said wafer handling unit with adjustment and the interval between the wafer; And
Controller is to control said wafer supply, said wafer emptier, said wafer handling unit and said wafer arrangement machine.
2. wafer supply system as claimed in claim 1, wherein said wafer supply comprises wafer case, wafer is vertically arranged with equal intervals in said wafer case, and said wafer emptier is from said wafer case unloading foot wafer.
3. wafer supply system as claimed in claim 2, wherein at said wafer emptier after said wafer supply unloading foot wafer, the said wafer case of said wafer supply reduces predetermined altitude.
4. wafer supply system as claimed in claim 1, wherein the wafer orientation by said wafer emptier unloading is vertical with the wafer orientation that transmits through said wafer handling unit.
5. wafer supply system as claimed in claim 1 wherein provides a pair of wafer supply, so that the wafer of said wafer supply inlet is striden said wafer handling unit against each other.
6. wafer supply system as claimed in claim 5, it is how right that wherein said wafer supply forms with predetermined space.
7. wafer supply system as claimed in claim 1, said wafer supply system also comprises the wafer loading bin, being loaded on the said wafer handling unit from the wafer of said wafer emptier unloading.
8. wafer supply system as claimed in claim 7, wherein said wafer loading bin highly receives from the wafer of said wafer emptier unloading and highly wafer is loaded on the said wafer handling unit than said first highly low predetermined second with predetermined first.
9. wafer supply system as claimed in claim 8; Wherein said wafer loading bin keeps the first height while wafer to be delivered to said wafer loading bin from said wafer emptier; And said wafer loading bin descends, and makes to reach said second highly in the upper end with wafer said wafer loading bin after said wafer emptier is sent to said wafer loading bin.
10. wafer supply system as claimed in claim 9, wherein said wafer loading bin drops to than said second highly low the 3rd height after wafer is loaded onto on the said wafer handling unit.
11. wafer supply system as claimed in claim 8; Wherein said wafer loading bin comprises a plurality of pulleys and loads conveyer belt; And said a plurality of pulley is set at the differing heights place on each conveyer belt upper surface outside and the inboard, to repeat to increase and reduce the height that each loads the conveyer belt upper end.
12. wafer supply system as claimed in claim 11; Wherein said wafer handling unit comprises a pair of transfer conveyor belt; The vertical direction setting of conveyer belt is loaded with each in said a pair of transfer conveyor belt edge, and said a pair of transfer conveyor belt is arranged on the top, zone with lower height that each loads the conveyer belt upper surface.
13. wafer supply system as claimed in claim 12, wherein said second height is corresponding to the height of a pair of transfer conveyor belt upper surface of said wafer handling unit.
14. wafer supply system as claimed in claim 1; Wherein said wafer arrangement machine is provided at a pair of transfer conveyor belt below of said wafer handling unit; Said wafer arrangement machine is configured to rise and descend through said a pair of transfer conveyor belt; And said wafer arrangement machine comprises wafer spinner spare, with rotation wafer while supporting wafers lower surface.
15. wafer supply system as claimed in claim 14, wherein said wafer spinner spare comprises suction disc, and said suction disc utilizes vacuum to keep the wafer lower surface in the propradation of said wafer spinner spare, to rotate wafer.
16. wafer supply system as claimed in claim 15, wherein said suction disc provide a plurality of suctions hole, said a plurality of suctions hole is formed on the upper surface of said suction disc.
17. also comprising, wafer supply system as claimed in claim 14, wherein said wafer arrangement machine move horizontally device, with the said wafer spinner spare that moves up of the sender in said wafer handling unit.
18. wafer supply system as claimed in claim 17 wherein is higher or lower than the transfer rate of the said a pair of transfer conveyor belt of said wafer handling unit through the said speed of moving horizontally that moves horizontally the said wafer spinner spare that device realizes.
19. wafer supply system as claimed in claim 17 is wherein just corresponding with the transfer rate of said a pair of transfer conveyor belt through the said speed that moves horizontally that moves horizontally the said wafer spinner spare that device realizes before the wafer of being arranged by said wafer arrangement machine is positioned on the said a pair of transfer conveyor belt of said wafer handling unit.
20. wafer supply system as claimed in claim 1, wherein said wafer arrangement machine comprises at least one transducer, with position or the direction of induction through the wafer of said wafer handling unit transmission.
21. wafer supply system as claimed in claim 20; Wherein said wafer arrangement machine comprises wafer spinner spare; Said wafer spinner spare rises between a pair of transfer conveyor belt and descends and crosses the wafer that said a pair of transfer conveyor belt is transmitted with rotating tee; The lower surface of supporting wafers, and said controller is simultaneously controlled the anglec of rotation of said wafer spinner spare according to the wafer orientation of being responded to by said at least one transducer.
22. wafer supply system as claimed in claim 21; Wherein said wafer arrangement machine also comprises and moves horizontally device; With the said wafer spinner spare that moves up of the sender in said wafer handling unit, and controller is controlled the said translational speed that moves horizontally device at interval according to the transmission between the wafer of being responded to by said at least one transducer.
23. wafer supply system as claimed in claim 22, the said translational speed that moves horizontally device of wherein said controller control is so that wafer and the interval of the transmission between wafer unification that a pair of transfer conveyor belt through said wafer handling unit transmits.
24. wafer supply system as claimed in claim 23, wherein transmission is corresponding with every conveyer belt total length of test component at interval, with the wafer of test by said wafer supply system supply.
25. wafer supply system as claimed in claim 23 is wherein calculated said transmission at interval based on wafer through the time point of said at least one transducer and the transfer rate of said a pair of transfer conveyor belt.
26. wafer supply system as claimed in claim 20, wherein said at least one transducer comprises front sensor, gets into the delivering position or the direction of the wafer of said wafer arrangement machine with induction.
27. wafer supply system as claimed in claim 26, wherein said front sensor is separated from one another, and said front sensor is arranged on the vertical direction of a pair of transfer conveyor belt with said wafer handling unit.
28. wafer supply system as claimed in claim 20, wherein said at least one transducer comprise the back transducer, with the time point of induction wafer through said wafer arrangement machine.
29. wafer supply system as claimed in claim 1, said wafer supply system also comprises the wafer miter guide, with the wafer two ends of guiding through said wafer arrangement machine arrangement.
30. a wafer supply system comprises:
Wafer case, stack of wafers is on said wafer case;
Discharge belt is sequentially to unload range upon range of wafer from said wafer case;
Transfer conveyor belt is to transmit the wafer through the discharge belt unloading along predetermined direction of transfer; And
Suction disc, the wafer that passes through said transfer conveyor belt transmission in order to maintenance are with the rotation wafer, and perhaps the direction of transfer acceleration of the said transfer conveyor belt in edge or deceleration wafer are to move horizontally wafer.
31. wafer supply system as claimed in claim 30, at least one in wherein said discharge belt and the said transfer conveyor belt provides a plurality of suctions hole, and applies suction via said a plurality of suctions hole.
32. wafer supply system as claimed in claim 30, said wafer supply system also comprises the loading conveyer belt, receiving wafer from said discharge belt and wafer be loaded on the said transfer conveyor belt,
Wherein, said discharge belt is configured to vertical with said transfer conveyor belt.
33. wafer supply system as claimed in claim 30; Wherein said loading conveyer belt is configured to parallel with said discharge belt; The upper surface of said discharge belt provides the protruding and depression that repeats to arrange; Said transfer conveyor belt is arranged on said depression top, and said loading conveyer belt rises during wafer handling technology or wafer loading technique and descends.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020100093522A KR20120032087A (en) | 2010-09-28 | 2010-09-28 | Wafer supplying system |
| KR10-2010-0093522 | 2010-09-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102420160A true CN102420160A (en) | 2012-04-18 |
| CN102420160B CN102420160B (en) | 2015-05-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110302375.XA Expired - Fee Related CN102420160B (en) | 2010-09-28 | 2011-09-28 | Wafer supply system |
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| Country | Link |
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| KR (1) | KR20120032087A (en) |
| CN (1) | CN102420160B (en) |
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| CN102795494A (en) * | 2012-08-03 | 2012-11-28 | 立晔科技股份有限公司 | Chip feeding device |
| CN104779190A (en) * | 2014-01-15 | 2015-07-15 | 北大方正集团有限公司 | High-efficiency transporting mechanism and wafer transporting device |
| CN107946224A (en) * | 2017-11-29 | 2018-04-20 | 乐山新天源太阳能科技有限公司 | Silicon chip wet etching automatic sheet-feeding machine |
| CN110540043A (en) * | 2018-05-28 | 2019-12-06 | 亨内克***有限公司 | wafer production line and method for conveying wafers |
| CN112556385A (en) * | 2020-11-24 | 2021-03-26 | 马鞍山天哲环保科技有限公司 | Environment-friendly drying device and method for organic silicon production |
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| KR102471189B1 (en) * | 2016-03-03 | 2022-11-25 | 세메스 주식회사 | Apparatus for transferring substrates |
| KR101973146B1 (en) * | 2017-07-26 | 2019-08-16 | 주식회사 에스제이이노테크 | Wafer aligning apparatus |
| KR102098086B1 (en) * | 2019-01-29 | 2020-04-07 | (주)가온코리아 | wafer alignment apparatus |
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| JPH07137804A (en) * | 1993-11-11 | 1995-05-30 | Dainippon Screen Mfg Co Ltd | Semiconductor wafer cassette reference position determining method |
| US5848868A (en) * | 1996-04-22 | 1998-12-15 | Kabushiki Kaisha Shinkawa | Wafer conveying apparatus |
| CN101792065A (en) * | 2010-02-10 | 2010-08-04 | 无锡先导自动化设备有限公司 | Sucker type silicon slice taking mechanism |
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| CN102795494A (en) * | 2012-08-03 | 2012-11-28 | 立晔科技股份有限公司 | Chip feeding device |
| CN104779190A (en) * | 2014-01-15 | 2015-07-15 | 北大方正集团有限公司 | High-efficiency transporting mechanism and wafer transporting device |
| CN107946224A (en) * | 2017-11-29 | 2018-04-20 | 乐山新天源太阳能科技有限公司 | Silicon chip wet etching automatic sheet-feeding machine |
| CN110540043A (en) * | 2018-05-28 | 2019-12-06 | 亨内克***有限公司 | wafer production line and method for conveying wafers |
| CN110540043B (en) * | 2018-05-28 | 2021-06-22 | 亨内克***有限公司 | Wafer production line and method for conveying wafers |
| CN112556385A (en) * | 2020-11-24 | 2021-03-26 | 马鞍山天哲环保科技有限公司 | Environment-friendly drying device and method for organic silicon production |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102420160B (en) | 2015-05-13 |
| KR20120032087A (en) | 2012-04-05 |
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