CN102412446B - Method for connecting copper clad aluminum composite wire - Google Patents
Method for connecting copper clad aluminum composite wire Download PDFInfo
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- CN102412446B CN102412446B CN2011103586923A CN201110358692A CN102412446B CN 102412446 B CN102412446 B CN 102412446B CN 2011103586923 A CN2011103586923 A CN 2011103586923A CN 201110358692 A CN201110358692 A CN 201110358692A CN 102412446 B CN102412446 B CN 102412446B
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- copper
- alloy
- coated aluminum
- aluminum complex
- complex lead
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Abstract
The invention relates to a copper clad aluminum composite material and especially relates to a method for connecting a copper clad aluminum composite wire. The method is characterized by: using a hot dipping plating method to plate a pure copper belt with a thickness of 0.02-0.2 mm to be a double-sided Zn-Al alloy-plated copper belt in the liquid-state Zn-Al alloy; then blanking the zinc coating alloy copper belt into a disk with a needed diameter; polishing flatly an end face to be connected of the copper clad aluminum composite wire; through low-temperature instant liquid state diffusion connection, realizing the connection of the copper clad aluminum composite wire under the protection of an inert gas. The method has a strong adaptability. The copper clad aluminum wire with different wire diameters can be connected. An operation is simple and safe. Environmental protection can be achieved. Costs are low. During an operation process, a temperature is low and energy consumption is small.
Description
Technical field
The present invention relates to copper-coated aluminium composite material, particularly for relating to a kind of method of connecting copper clad aluminum composite wire.
Background technology
Copper and aluminium have good conduction, heat conductivility, be widely used in the industries such as electric power, electrical equipment, electronics, heat transfer, information, in the world resource storage, bauxite resource is abundanter, and copper resource relative shortage, therefore, with aluminium, for copper, be the Critical policies of saving copper resource, yet, the welding of aluminium, arc extinguishing, the poor-performing such as wear-resisting, directly very difficult for copper with aluminium in a lot of occasions, copper aluminum composite material can be realized this function; In recent years, Chinese scholars has been carried out more research to the production technology of copper aluminum composite material, and copper-coated aluminum complex lead, copper-aluminum compound conductive bar etc. has obtained the industry application.
In copper-coated aluminum complex lead production and use procedure, often run into connectivity problem, the connection of copper-coated aluminum complex lead need to solve the not combination of metal of the same race, not only will avoid the chemical reaction at copper-aluminium interface, and convenient, fast, connected mode commonly used is cold welding at present, that the termination of two wires is clamped in respectively in the left and right pincers of cold press welder, in the situation that do not heat, by means of the axial compressive force progressively applied, make metal produce plastic deformation, the oxide-film of joint surface and other impurity are constantly extruded to outside, clean metal is combined under pressure, form joint, during cold welding, the metal of joint is extruding mutually under responsive to axial force, in the joint surrounding, forms a circle overlap, and by after flash removal, the aluminium that the copper layer that can see the wound joint surface has width to be about 0.2 ~ 0. 5 mm is extruded cuts off, and forms and reveals the aluminium phenomenon, for hard state copper-coated aluminum complex lead, because the plasticity of wire rod is very poor, flow of metal difficulty during cold welding, thereby the joint metallurgical binding is poor, during tension test, often in joint, rupture, strength of joint is lower than wire rod itself, for soft state copper-coated aluminum complex lead, pipe end annealing portion length is not how, always there is long or short softened zone, the hardness of this softened zone is lower, to become a hidden danger on whole copper-clad aluminum conductor, affect wire rod and use safety, in addition, the circle produced in the cold welding joint of copper-coated aluminum complex lead reveals aluminium, although width very little (being about 0.2 ~ 0.5mm), but because the electrode potential of copper and two kinds of metals of aluminium differs greatly, also form and contain CO in being exposed to moist atmosphere
2or SO
2electrolyte solution the time, just by electrochemical action, aluminium is corroded, therefore, in the urgent need to seeking the method for attachment of a kind of novel cuprum-cladding-aluminium compound wire.
Transient liquid phase (TLP) diffusion connects, by between two mother metal to be connected surfaces, putting into the intermediate layer alloy, when workpiece is incubated at the connection temperature, reduce the fusing point element in intermediate layer and be diffused rapidly in base metals, make the melting point depression of mother metal end face microcell and transient melting occurs; Simultaneously the high-melting-point element in mother metal, to spreading in the intermediate layer for liquid phase, makes the Melting point elevation of intermediate layer alloy, subsequently isothermal solidification occurs and completes connection procedure, and it can form the welding point close with mechanical property with the mother metal tissue; In the TLP connection procedure, liquid phase forms by two kinds of modes, and the one, the fusing in intermediate layer self, now liquid phase plays a part similar solder; The 2nd, intermediate layer and mother metal generation eutectic reaction, due to the participation of liquid phase, make TLP connect the initial pressure needed very little, and even 0.07MPa gets final product.
In the transient liquid phase bonding process, the principal element that affects the TLP jointing has: intermediate layer, connection temperature, temperature retention time and Bonding pressure, more be similar to the joint of mother metal in order to obtain composition and performance, usually the composition of intermediate layer material is to add appropriate reduction fusing point element on the basis of mother metal composition, the intermediate layer of transient liquid phase bonding has following characteristics usually: 1. should be lower than the fusing point of mother metal; Do not produce harmful intermetallic compound while 2. connecting; 3. good with the mother metal wetability; 4. homogenization of composition is fast; 5. isothermal solidification is fast, and powder and paillon foil are the common shapes in intermediate layer, but the intermediate layer quality of connection of foil-like is better than pulverous.Connecting temperature is that diffusion connects most important connection parameter, connects the small variation of temperature and all can make diffusion velocity produce larger variation.When the connection temperature is low, can make the joint Elements Diffusion insufficient; And the connection excess Temperature can cause element excessive dissolution in mother metal, cause the fragility such as intermetallic compound in weld seam to separate out and increase mutually.Research shows, the heating-up temperature of transient liquid phase bonding (T) can be chosen as T=T
i+ 50～200 ℃, T wherein
ifor the fusing point in intermediate layer, the time kept at the connection temperature when TLP diffusion connects is temperature retention time.Within this time, must make diffusion process complete, make the TLP jointing reach required bond strength, if temperature retention time is too short, can make the TLP jointing not reach required bond strength.But, temperature retention time is long, can make to connect on the contrary the coarse grains of mother metal, in reality connects, temperature retention time can change in a wider scope, a few minutes can be incubated during connection, it can be also several hours, in actual production, under the condition that guarantees the joint bond strength, should reduce temperature retention time as far as possible, generally, Bonding pressure more is beneficial to more greatly the connection that obtains better interface, but in the diffusion connection procedure, Bonding pressure has a critical value, when the Bonding pressure used in the TLP connection procedure has been greater than this critical value, increase come what may force value, the performance of jointing can not increase, in addition, from actual processing conditions and economic aspect, consider, should select a suitable force value in the TLP connection procedure, it should comprehensively connect temperature, temperature retention time, the roughness on mother metal surface, the factors such as the diffusivity in intermediate layer determine, in a word, select best Bonding pressure to extruding the fragility phase, broken oxide-film, shorten the connect hours, the compactness that improves joint is useful, in order to eliminate the oxidation defect of TLP jointing, generally under vacuum or inert gas shielding, carry out transient liquid phase bonding.
Adopt Transient liquid phase diffusion technique connecting copper clad aluminum composite wire, the target that need to reach is to avoid copper-aluminium interfacial chemical reaction, and convenient, fast, and the subject matter run into is to select suitable intermediate layer alloy.This alloy-layer needs both with copper, to form good being connected, and can form good being connected with Al again, and can avoid preferably the interfacial chemical reaction between Cu-Al in connection procedure.The Zn-Al alloy fusing point is low, be a kind of more satisfactory intermediate layer alloy material, but it is more difficult directly to make the Zn-Al alloy strip, also there is no in the market this type of business strip supply.
Summary of the invention
The objective of the invention is to adopt transient liquid phase bonding to realize effective connection of copper-coated aluminum complex lead, its principle is: the Zn-Al alloy by hot dip coating method in thin copper belt two coating surface one deck low melting points, then take this copper strips carries out transient liquid phase bonding as intermediate layer to copper-coated aluminum complex lead, copper part and the Zn-Al alloy of copper-coated aluminum complex lead form Cu-Zn-Al and are combined, aluminum portions forms the combination of Al-Zn-Al with Zn-Al alloy, copper-coated aluminum complex lead links together the most at last.
The present invention proposes a kind of transient liquid phase bonding technology of utilizing and realizes the method that copper-coated aluminum complex lead effectively connects; it is characterized in that: first adopt hot dip coating method plating in liquid Zn-Al alloy to become the copper strips of two-sided plating Zn-Al alloy the pure copper strips of thickness 0.02 ~ 0.2mm; then will plate the disk that Zn-Al alloy copper strips stamping-out becomes required diameter; and copper-coated aluminum complex lead end face to be connected is polished flat, connect by low temperature moment liquid state diffusion the connection that realizes copper-coated aluminum complex lead under inert gas shielding.
Describedly adopt hot dip coating method plating in liquid Zn-Al alloy to become the copper strips of two-sided plating Zn-Al alloy pure copper strips, refer to that copper strips all forms two-sided the plating Zn-Al alloy layer that 10 ~ 30 μ m are thick by hot-dip, in Zn-Al alloy, the content of Al is 4 ~ 6wt%.
Related will plate the disk that Zn-Al alloy copper strips stamping-out becomes required diameter, refer to the diameter according to copper-coated aluminum complex lead to be connected, and two-sided plating Zn-Al alloy copper strips stamping-out is become to stand-by with the disk of copper-coated aluminum complex lead equal diameters to be connected.
Related polishes flat copper-coated aluminum complex lead end face to be connected, refers to and adopts mechanical means to be polished to the end face to be connected of copper-coated aluminum complex lead to be connected, to keep buffed surface smooth, vertical with the copper-coated aluminum complex lead length direction.
Related inert gas shielding, refer to that copper-coated aluminum complex lead to be connected is put into to the confined space of being convenient to folding to be vacuumized, vacuum degree 1 ~ 1.5 * 10
-2pa, then applying argon gas or nitrogen are protected.
Related low temperature moment liquid state diffusion connects, and refers to the localized heating that realizes part to be connected by induction heating method, connects 410 ~ 450 ℃ of temperature, moulding pressure 0.5 ~ 5MPa during connection, retention time 3 ~ 10min.
The invention has the advantages that:
1) strong adaptability; Can the copper-coated aluminum complex lead of different wire diameters be connected, be combined between copper, aluminium, owing to connecting, temperature is low, does not have obvious interfacial brittle to form mutually.
2) easy and simple to handle; Broken string polishing, connection etc. integrate, and facilitate on-line operation, only need simple effects on surface polishing after copper-coated aluminum complex lead connects.
3) safety and environmental protection; There is no other pollutant except forming a small amount of copper, aluminium that is very easy to reclaim considering to be worth doing in the attended operation process.
4) with low cost; After a feeding device, in operating process, temperature is low, and energy consumption is little.
The accompanying drawing explanation
The schematic diagram of confined space used when Fig. 1 is the copper-coated aluminum complex lead connection, wherein 1 is inert gas import, and 2 is airtight cavity, and 3 is the induction heating unit, and 4 is copper-coated aluminum complex lead to be connected, and 5 for connecing vacuum pump pipeline, and 6 is temperature thermocouple;
The schematic diagram that Fig. 2 is the copper-coated aluminum complex lead jointing (a) be connected after outward appearance photo (b), wherein 1 is copper-coated aluminum complex lead to be connected, 2 is the zinc-aluminium-alloy copper strips;
The microscopic structure that Fig. 3 is jointing place copper-aluminium transition interface.
Embodiment
The present invention can implement according to following instance, but is not limited to following instance; The term that used in the present invention, unless other explanation arranged, generally have the implication that those of ordinary skills understand usually; Should be understood that these embodiment just in order to demonstrate the invention, but not limit the scope of the invention by any way, in following embodiment, various processes and the method do not described in detail are conventional methods as known in the art.
The diameter of copper-coated aluminum complex lead to be connected is 2mm, adopt hot dip coating method plating in liquid zn-4wt%Al alloy to become the copper strips of the two-sided plating Zn-Al alloy of thick 30 μ m the pure copper strips of thickness 0.2mm, then galvanized alloy copper strips stamping-out is become to the disk of diameter 2mm, and adopt mechanical means that copper-coated aluminum complex lead end face to be connected is polished flat and vertical with the copper-coated aluminum complex lead length direction, connect by low temperature moment liquid state diffusion the connection that realizes copper-coated aluminum complex lead under the protection of inert gas; When low temperature moment liquid state diffusion connects, the confined space that copper-coated aluminum complex lead to be welded is put into as shown in Figure 1 vacuumizes, vacuum degree 1 * 10
-2pa, then applying argon gas protected, and realizes the localized heating of part to be connected by induction heating method, connects 450 ℃ of temperature, moulding pressure 5MPa during connection, retention time 3min.
Confined space in Fig. 1, can facilitate copper-coated aluminum complex lead to pick and place along copper-coated aluminum complex lead length direction folding in figure, and this space is sealed by conventional sealing strip when closed, to guarantee the sufficiently high vacuum degree of acquisition and effectively to realize inert gas shielding.
The schematic diagram of Fig. 2 copper-coated aluminum complex lead jointing and the outward appearance photo of copper-coated aluminum complex lead, the microscopic structure that Fig. 3 is jointing place copper-aluminium transition interface, as can be seen from Figure 3, jointing is in conjunction with good.
Detection shows, the copper-coated aluminum complex lead resistivity that contains a jointing is 2.43 * 10
-2Ω mm
2m
-1, the hard state mechanical properties of wire is 260MPa, the hard state copper-coated aluminum complex lead that is 2mm with diameter is suitable.
The diameter of copper-coated aluminum complex lead to be connected is 0.5mm, adopt hot dip coating method plating in liquid zn-4wt%Al alloy to become the copper strips of the two-sided plating Zn-Al alloy of thick 20 μ m the pure copper strips of thickness 0.06mm, then galvanized alloy copper strips stamping-out is become to the disk of diameter 0.5mm, and adopt mechanical means that copper-coated aluminum complex lead end face to be connected is polished flat and vertical with the copper-coated aluminum complex lead length direction, under the protection of inert gas, connect the connection that realizes copper-coated aluminum complex lead by low temperature moment liquid state diffusion, when low temperature moment liquid state diffusion connects, copper-coated aluminum complex lead to be welded is put into to confined space to be vacuumized, vacuum degree 1.2 * 10
-2pa, then inflated with nitrogen is protected, and realizes the localized heating of part to be connected by induction heating method, connects 430 ℃ of temperature, moulding pressure 2MPa during connection, retention time 6min.
The test demonstration, jointing is in conjunction with good; Detection shows, the copper-coated aluminum complex lead resistivity that contains a jointing is 2.49 * 10
-2Ω mm
2m
-1, the mechanical properties of the soft state in joint is 205MPa, the soft state copper-coated aluminum complex lead that is 0.5mm with diameter is suitable.
The diameter of copper-coated aluminum complex lead to be connected is 0.2mm, adopt hot dip coating method plating in liquid zn-5wt%Al alloy to become the copper strips of the two-sided plating Zn-Al alloy of thick 10 μ m the pure copper strips of thickness 0.02mm, then galvanized alloy copper strips stamping-out is become to the disk of diameter 0.2mm, and adopt mechanical means that copper-coated aluminum complex lead end face to be connected is polished flat and vertical with the copper-coated aluminum complex lead length direction, under the protection of inert gas, connect the connection that realizes compound copper-aluminium wire by low temperature moment liquid state diffusion, when low temperature moment liquid state diffusion connects, copper-coated aluminum complex lead to be welded is put into to confined space to be vacuumized, vacuum degree 1.5 * 10
-2pa, then applying argon gas is protected, and realizes the localized heating of part to be connected by induction heating method, connects 410 ℃ of temperature, moulding pressure 0.5MPa during connection, retention time 10min.
The analysis showed that, the jointing combination is good, detection display, and the copper-coated aluminum complex lead resistivity that contains a jointing is 2.53 * 10
-2Ω mm
2m
-1, the mechanical properties of the hard state in joint is 285MPa, the hard state copper-coated aluminum complex lead that is 0.2mm with diameter is suitable.
Claims (6)
1. the method for a connecting copper clad aluminum composite wire; it is characterized in that: first adopt hot dip coating method plating in liquid Zn-Al alloy to become the copper strips of two-sided plating Zn-Al alloy the pure copper strips of thickness 0.02 ~ 0.2mm; then will plate the disk that Zn-Al alloy copper strips stamping-out becomes required diameter; and copper-coated aluminum complex lead end face to be connected is polished flat, connect by low temperature moment liquid state diffusion the connection that realizes copper-coated aluminum complex lead under inert gas shielding.
2. the method for a kind of connecting copper clad aluminum composite wire as claimed in claim 1, it is characterized in that: describedly adopt hot dip coating method plating in liquid Zn-Al alloy to become the copper strips of two-sided plating Zn-Al alloy pure copper strips, refer to that copper strips all forms two-sided the plating Zn-Al alloy layer that 10 ~ 30 μ m are thick by hot-dip, in Zn-Al alloy, the content of Al is 4 ~ 6wt%.
3. the method for a kind of connecting copper clad aluminum composite wire as claimed in claim 1, it is characterized in that: describedly will plate the disk that Zn-Al alloy copper strips stamping-out becomes required diameter, refer to the diameter according to copper-coated aluminum complex lead to be connected, two-sided plating Zn-Al alloy copper strips stamping-out is become to stand-by with the disk of copper-coated aluminum complex lead equal diameters to be connected.
4. the method for a kind of connecting copper clad aluminum composite wire as claimed in claim 1, it is characterized in that: described copper-coated aluminum complex lead end face to be connected is polished flat, refer to and adopt mechanical means to be polished to the end face to be connected of copper-coated aluminum complex lead to be connected, to keep buffed surface smooth, vertical with the copper-coated aluminum complex lead length direction.
5. the method for a kind of connecting copper clad aluminum composite wire as claimed in claim 1, it is characterized in that: described inert gas shielding refers to that copper-coated aluminum complex lead to be connected is put into to the confined space of being convenient to folding to be vacuumized, vacuum degree 1 ~ 1.5 * 10
-2pa, then applying argon gas or nitrogen are protected.
6. the method for a kind of connecting copper clad aluminum composite wire as claimed in claim 1, it is characterized in that: described low temperature moment liquid state diffusion connects, refer to the localized heating that realizes part to be connected by induction heating method, connect 410 ~ 450 ℃ of temperature, moulding pressure 0.5 ~ 5MPa during connection, retention time 3 ~ 10min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103586923A CN102412446B (en) | 2011-11-14 | 2011-11-14 | Method for connecting copper clad aluminum composite wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103586923A CN102412446B (en) | 2011-11-14 | 2011-11-14 | Method for connecting copper clad aluminum composite wire |
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| Publication Number | Publication Date |
|---|---|
| CN102412446A CN102412446A (en) | 2012-04-11 |
| CN102412446B true CN102412446B (en) | 2013-12-11 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5220911A (en) * | 1990-09-11 | 1993-06-22 | Kabushiki Kaisha Toshiba | Articulated pipe with shape memory joint pin |
| US5849408A (en) * | 1993-12-27 | 1998-12-15 | Nippon Mining & Metals Co., Ltd. | Hot-dip zinc plating product |
| CN101185991A (en) * | 2006-11-21 | 2008-05-28 | 株式会社日立制作所 | Jointing material, method for manufacturing jointing material and semiconductor device |
| CN101253280A (en) * | 2005-09-01 | 2008-08-27 | 新日本制铁株式会社 | Dip coating Zn-Al series alloy steel products with excellent bending working quality and manufacturing method thereof |
| WO2009131124A1 (en) * | 2008-04-21 | 2009-10-29 | 本田技研工業株式会社 | Joining method for and jointed structure of metal members, and brazing filler metal |
| WO2010087275A1 (en) * | 2009-01-27 | 2010-08-05 | 株式会社クボタ | Pipe joint |
-
2011
- 2011-11-14 CN CN2011103586923A patent/CN102412446B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5220911A (en) * | 1990-09-11 | 1993-06-22 | Kabushiki Kaisha Toshiba | Articulated pipe with shape memory joint pin |
| US5849408A (en) * | 1993-12-27 | 1998-12-15 | Nippon Mining & Metals Co., Ltd. | Hot-dip zinc plating product |
| CN101253280A (en) * | 2005-09-01 | 2008-08-27 | 新日本制铁株式会社 | Dip coating Zn-Al series alloy steel products with excellent bending working quality and manufacturing method thereof |
| CN101185991A (en) * | 2006-11-21 | 2008-05-28 | 株式会社日立制作所 | Jointing material, method for manufacturing jointing material and semiconductor device |
| WO2009131124A1 (en) * | 2008-04-21 | 2009-10-29 | 本田技研工業株式会社 | Joining method for and jointed structure of metal members, and brazing filler metal |
| WO2010087275A1 (en) * | 2009-01-27 | 2010-08-05 | 株式会社クボタ | Pipe joint |
Non-Patent Citations (2)
| Title |
|---|
| "Ultrasonic dissolution of brazing of 55% SiCp/A356 composites";ZHANG Yang et al.;《Transactions of Nonferrous Metals Society of China》;20100531;第20卷(第5期);746-750 * |
| ZHANG Yang et al.."Ultrasonic dissolution of brazing of 55% SiCp/A356 composites".《Transactions of Nonferrous Metals Society of China》.2010,第20卷(第5期),746-750. |
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| CN102412446A (en) | 2012-04-11 |
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