CN106392368A - High-temperature Zn-based soft solder for soldering aluminum and copper and welding method - Google Patents
High-temperature Zn-based soft solder for soldering aluminum and copper and welding method Download PDFInfo
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- CN106392368A CN106392368A CN201611064149.1A CN201611064149A CN106392368A CN 106392368 A CN106392368 A CN 106392368A CN 201611064149 A CN201611064149 A CN 201611064149A CN 106392368 A CN106392368 A CN 106392368A
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
- B23K35/282—Zn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/206—Cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
Abstract
The invention discloses high-temperature Zn-based soft solder for soldering aluminum and copper and a welding method. The solder comprises, by weight, 0.5%-3.0% of Ni, 0.1%-4.0% of Cu, 0.5%-5.0% of Ga, 0.5%-4.0% of In, 0.05%-0.5% of Sm, 0.1%-0.5% of Ce, and the balance Zn. The solder is good in fluidity, good in base metal wettability, capable of being bonded with aluminum and copper excellently, high in strength and capable of effectively reducing residual stress generated in the soldering process; the soldering temperature of the solder is 380-420 DEG C, the solder melting temperature is low compared with prior hard solder, the soldering temperature is greatly decreased, and the solder is melted evenly; and particularly, since the rare earth elements Sm and Ce are added, the wetting area is remarkably enlarged, the interface metallurgical reaction is controlled, and the mechanical property of a joint is remarkably improved.
Description
Technical field
The present invention relates to the high temperature Zn base soft solder for brazed aluminum and copper and preparation and welding method, belong to soldering neck
Domain.
Background technology
Some properties of copper aluminum and purposes are very close to such as their electric conductivity, heat conductivity, corrosion resistance are all preferable, therefore
Have very strong substituting between copper aluminum, they are mainly used in the industries such as building, traffic, electric power, a lot originally using the neck of copper
Domain, replaces copper with aluminum portions, can meet the needs of performance, but because of copper aluminum price between greatest differences, not only reduced cost but also slow
The present situation of Xie Liao China copper resource shortage.Aluminum replaces copper component for copper technology is most for aluminum portions simultaneously, therefore, in copper aluminum structure
Just copper-aluminium joint is created between part.Look forward to the future, joint of aluminium and copper will be widely used in the fields such as generating, refrigeration, energy, chemical industry, national defence.
Aluminium surface is also easy to produce one layer of firm oxide-film, and this is that copper aluminum connects major obstacle, and the resistivity of oxide-film is very
Greatly, it is at work and unreliable after aluminum is mechanically connected with copper to result in.Frequently with argon tungsten-arc welding, electron beam in aluminum bronze welding
The conventional soldering method such as weldering, gas metal-arc welding, Laser Welding welding copper and aluminum.Process based prediction model two due to aluminum bronze
The difference of aspect is all very big, and (its coefficient of expansion differs nearly 40%), and when result in fusion welding copper and aluminum, weldability is very poor, and postwelding connects
Head fragility is larger and is also easy to produce crackle, and strength of joint is relatively low.Cold welding welding copper aluminum easily makes welding joint softened, complex process.Copper aluminum
Friction welding (FW) is also easy to produce brittle thing, can reduce strength of joint.For this reason, frequently with method for welding to improve the usability of copper-aluminium joint
Energy.
Meng northern Shandong et al. adopts vacuum diffusion welding method welding copper and aluminum, when taking suitable welding procedure, substantially may be used
Connected with realizing the diffusion of joint preferable copper aluminum, but interface still has intermetallic compound and generates, intensity is not high, and brazing temperature
Height, energy resource consumption is more.Yan Fei et al. is welded copper and aluminum and has been prepared copper aluminium welding joint using the welding method of diffusion welding (DW),
But still there is the appearance of oxide-film, time-consuming for experiment.Ma Shitao et al. Zn-Al-Cu solder cooperation rare earth element nd, La soldering
Aluminum and copper, this method for welding has properly increased corrosion resisting property, but solder wetting is less desirable.Bright et al. the research of bang
The impact to Sn-Ag-Cu solder structure property for the rare-earth Sm, soldering joint strength strengthens, but content is more wherein for silver, produces
High cost, economic serviceability is low.
Content of the invention
Goal of the invention：In order to overcome the deficiencies in the prior art, the present invention provide a kind of for brazed aluminum and copper
High temperature Zn base soft solder and preparation and welding method, the good fluidity of this solder, good to mother metal wettability, and the knot with aluminum and copper
Close excellent performance, tensile strength is higher, can effectively reduce the residual stress producing during soldering.
Technical scheme：For achieving the above object, the high temperature Zn base soft solder for brazed aluminum and copper of the present invention, described pricker
Material elemental composition by weight percentage includes：Ni0.5%～3.0%, Cu0.1%～4.0%, Ga0.5%～5.0%,
In0.5%～4.0%, Sm0.05%～0.5%, Ce0.1%～0.5%, balance of Zn.
Preferably, described solder elemental composition by weight percentage includes：Ni1.0%～2.0%, Cu0.5%
～3.0%, Ga1.0%～4.0%, In1.0%～3.0%, Sm0.1%～0.3%, Ce0.15%～0.3%, balance of
Zn.
Preferably, described solder elemental composition by weight percentage includes：Ni1.0%, Cu2.0%,
Ga2.5%, In2.0%, Sm0.1%, Ce0.2%, balance of Zn.
Preferably, described solder is paillon foil banding, thickness is 50～80 μm.
A kind of preparation method of the above-mentioned high temperature Zn base soft solder for brazed aluminum and copper, comprises the following steps：
1) highly purified Ga granule, In granule, Cu piece, Ni piece, Rare-Earth Ce, the prepared mixing of Sm are weighed by mass percentage
Thing, puts in the container added with acetone, carries out being cleaned by ultrasonic 15～20min at a temperature of 20 ± 3 DEG C；
2) by step 1) be cleaned by ultrasonic after mixture dries at a temperature of 30～50 DEG C, obtain dry mixture；
3) by step 2) mixture and Zn adopt vacuum induction melting method prepared composition uniform solder foundry alloy,
After the foundry alloy prepared is pulverized, load in the quartz glass tube of high vacuum single roller strip machine；
4) quartz glass tube is installed in and gets rid of in the electrical induction circle with machine, and its nozzle to copper roller surface spacing is adjusted
Whole is 180～200 μm；
5) close fire door, be evacuated to 1.5 × 10 using mechanical pump-3Pa, then adopts molecular pump pumping high vacuum, fine vacuum
Degree is not less than 9 × 10-5Pa, then cavity is full of high-purity Ar gas to 200～230mbar；
6) open motor, make, in the range of copper roller rotating speed 30～33m/s, to be then turned on high frequency electric source, by quartz glass tube
Foundry alloy high-frequency induction heating to complete molten homogeneous, be incubated superheated melt 70s～80s；
7) by Ar gas air pressure modulation P=50KPa, with high pressure argon gas, the superheated melt in quartz glass is continuously sprayed
To the cooling copper roller surface of high-speed rotation, thus obtaining solder.
Preferably, described step 3) in quartz ampoule nozzle be rectangle, its length is 8～10mm, width is 0.8～
1.2mm.
Preferably, described step 6) in copper roller diameter be 250mm, copper roller width is 50mm.
A kind of method for welding of the above-mentioned high temperature Zn base soft solder for brazed aluminum and copper it is characterised in that include with
Lower step：
(1) preparatory stage：Aluminum to be brazed and copper sample end face are cleared up, remove the impurity on surface, greasy dirt and
Oxide-film, is ground smooth with abrasive paper for metallograph, and aluminum is placed in acetone together with copper and solder paillon foil, using ultrasound wave cleaning
15～20min, and carry out drying and processing；
(2) assembling stage：Solder paillon foil after cleaning is placed between copper sheet and aluminium flake welding surface, and is close to be assemblied in
It is ensured that the precision connecting in special brazing jig, the pressure head of nominal-mass is placed on fixture, produce 0.04～0.06MPa's
Constant perpendicular pressure；
(3) the soldering connection stage：The fixture assembling is integrally placed at vacuum and is not less than 1.5 × 10-3The soldering of Pa sets
In standby, with the ramp of 6～10 DEG C/min to 380～420 DEG C, it is incubated 15～20min, cools to room temperature with the furnace, blow-on takes
Go out by weldering connector.
Present invention addition element Ni in brazing material, is obviously improved the heat-resisting of joint and corrosion resistance, overcomes crisp to P compound
Property, improve wettability, strengthen its joint performance.Addition element Ga, can make solder homogenization of composition, thinning microstructure, effectively press down
The growth of intermetallic compound processed, suitable Ga can reduce solid-liquid phase line, improves wettability.Addition element In can significantly improve
Solder spreading property and strength of joint, but its content need to strictly control.Addition element Cu and rare earth element Sm, Cu are female in itself
Material composition, Sm can play rotten and crystal grain thinning effect, improves mechanicalness and the processability of copper.Add rare earth element ce
Improve the life-span of creep rupture of soldered fitting, refinement solder tissue.
Beneficial effect：Compared to existing technology, the present invention has advantages below：
(1) remarkable advantage of the present invention is the good fluidity of this solder, good to mother metal wettability, and the combination with aluminum and copper
Excellent performance, tensile strength is higher, can effectively reduce the residual stress producing during soldering；The brazing temperature of solder of the present invention exists
380～420 DEG C, brazing filler metal melts temperature relatively before hard solder, brazing temperature substantially reduces, and brazing filler metal melts are uniform；Especially plus
Enter rare earth element Sm, Ce, significantly improve wetting areas, controlling interface metallurgical reaction, significantly improve joint mechanical property.
(2) adopt the solder Joining Technology of the present invention reliable and stable, connected using vacuum brazing, component is in heating process
It is in vacuum state, whole component no deforms, no microfissure, pore and the defect such as be mingled with, its moistened surface is sprawled preferably, pricker
Material and matrix mother metal are sufficiently formed solid solution metallurgical reaction, tissue particle, are sufficient filling with brazed seam, improve the bulk strength of joint,
And have good plastic deformation ability, thus more stable reliable jointing can be obtained.
(3) the solder preparation method that the present invention obtains and soldering processes are simple, easy to implement quick, the preparation of solder and
Soldering processes repeat and reproduce, and Process of Vacuum Brazing need not add brazing flux and protective measure, be easy to widely promote and apply.
Specific embodiment
Embodiment 1
The composition of solder and mass percent proportioning are：Ni2.0%, Cu3.0%, Ga1.0%, In1.0%,
Sm0.05%, Ce0.1%, balance of Zn.
A kind of preparation method of above-mentioned high temperature Zn base soft solder for brazed aluminum and copper,
Comprise the following steps：
1) highly purified Ga granule, In granule, Cu piece, Ni piece, Rare-Earth Ce, the prepared mixing of Sm are weighed by mass percentage
Thing, puts in the container added with acetone, carries out being cleaned by ultrasonic 15～20min at a temperature of 17 DEG C；
2) mixture after being cleaned by ultrasonic step 1 is dried at a temperature of 30～50 DEG C, obtains the mixture of drying；
3) mixture and Zn are adopted the method prepared composition uniform solder foundry alloy of vacuum induction melting, will prepare
Foundry alloy pulverize after, load high vacuum single roller strip machine quartz glass tube in；
4) quartz glass tube is installed in and gets rid of in the electrical induction circle with machine, and its nozzle to copper roller surface spacing is adjusted
Whole is 180～200 μm；
5) close fire door, be evacuated to 1.5 × 10 using mechanical pump-3Pa, then adopts molecular pump pumping high vacuum, fine vacuum
Degree is not less than 9 × 10-5Pa, then cavity is full of high-purity Ar gas to 200～230mbar；
6) open motor, make, in the range of copper roller rotating speed 30～33m/s, to be then turned on high frequency electric source, by quartz glass tube
Foundry alloy high-frequency induction heating to complete molten homogeneous, be incubated superheated melt 70s～80s；
7) by Ar gas air pressure modulation P=50KPa, with high pressure argon gas, the superheated melt in quartz glass is continuously sprayed
To the cooling copper roller surface of high-speed rotation, liquid metal is formed foil shape by chilling, thus obtaining solder foil strip, thickness is
50～80 μm.
A kind of soldering processes of the high temperature Zn base soft solder for brazed aluminum and copper, comprise the following steps：
(1) preparatory stage：Aluminum to be brazed and copper sample end face are cleared up, remove the impurity on surface, greasy dirt and
Oxide-film, is ground smooth with abrasive paper for metallograph, and aluminum is placed in acetone together with copper and solder paillon foil, using ultrasound wave cleaning
15～20min, and carry out drying and processing；
(2) assembling stage：Solder paillon foil after cleaning is placed between copper sheet and aluminium flake welding surface, and is close to be assemblied in
It is ensured that the precision connecting in special brazing jig, the pressure head of nominal-mass is placed on fixture, produce 0.04～0.06MPa's
Constant perpendicular pressure；
(3) the soldering connection stage：The fixture assembling is integrally placed at vacuum and is not less than 1.5 × 10-3The soldering of Pa sets
In standby, with the ramp of 6～10 DEG C/min to 380～420 DEG C, it is incubated 15～20min, cools to room temperature with the furnace, blow-on takes
Go out by weldering connector.
Result：The jointing that soldering obtains forms well, and metallographic observation finds that brazing area forms the interface cohesion of densification,
Alloying component is evenly distributed, and room temperature tensile intensity is 306MPa.
Embodiment 2
The composition of solder and mass percent proportioning are：Ni1.5%, Cu4.0%, Ga3.0%, In2.5%, Sm0.1%,
Ce0.15%, balance of Zn.
A kind of preparation method of above-mentioned high temperature Zn base soft solder for brazed aluminum and copper,
Comprise the following steps：
1) highly purified Ga granule, In granule, Cu piece, Ni piece, Rare-Earth Ce, the prepared mixing of Sm are weighed by mass percentage
Thing, puts in the container added with acetone, carries out being cleaned by ultrasonic 15～20min at a temperature of 20 DEG C about；
2) mixture after being cleaned by ultrasonic step 1 is dried at a temperature of 30～50 DEG C, obtains the mixture of drying；
3) mixture and Zn are adopted the method prepared composition uniform solder foundry alloy of vacuum induction melting, will prepare
Foundry alloy pulverize after, load high vacuum single roller strip machine quartz glass tube in；
4) quartz glass tube is installed in and gets rid of in the electrical induction circle with machine, and its nozzle to copper roller surface spacing is adjusted
Whole is 180～200 μm；
5) close fire door, be evacuated to 1.5 × 10 using mechanical pump-3Pa, then adopts molecular pump pumping high vacuum, fine vacuum
Degree is not less than 9 × 10-5Pa, then cavity is full of high-purity Ar gas to 200～230mbar；
6) open motor, make, in the range of copper roller rotating speed 30～33m/s, to be then turned on high frequency electric source, by quartz glass tube
Foundry alloy high-frequency induction heating to complete molten homogeneous, be incubated superheated melt 70s～80s；
7) by Ar gas air pressure modulation P=50KPa, with high pressure argon gas, the superheated melt in quartz glass is continuously sprayed
To the cooling copper roller surface of high-speed rotation, liquid metal is formed foil shape by chilling, thus obtaining solder foil strip, thickness is
50～80 μm.
A kind of soldering processes of the high temperature Zn base soft solder for brazed aluminum and copper, comprise the following steps：
(1) preparatory stage：Aluminum to be brazed and copper sample end face are cleared up, remove the impurity on surface, greasy dirt and
Oxide-film, is ground smooth with abrasive paper for metallograph, and aluminum is placed in acetone together with copper and solder paillon foil, using ultrasound wave cleaning
15～20min, and carry out drying and processing；
(2) assembling stage：Solder paillon foil after cleaning is placed between copper sheet and aluminium flake welding surface, and is close to be assemblied in
It is ensured that the precision connecting in special brazing jig, the pressure head of nominal-mass is placed on fixture, produce 0.04～0.06MPa's
Constant perpendicular pressure；
(3) the soldering connection stage：The fixture assembling is integrally placed at vacuum and is not less than 1.5 × 10-3The soldering of Pa sets
In standby, with the ramp of 6～10 DEG C/min to 380～420 DEG C, it is incubated 15～20min, cools to room temperature with the furnace, blow-on takes
Go out by weldering connector.
Result：The jointing that soldering obtains forms well, and metallographic observation finds that brazing area forms the interface cohesion of densification,
Alloying component is evenly distributed, and room temperature tensile intensity is 322MPa.
Embodiment 3
The composition of solder and mass percent proportioning are：Ni1.0%, Cu2.0%, Ga2.5%, In2.0%, Sm0.1%,
Ce0.2%, balance of Zn.
A kind of preparation method of above-mentioned high temperature Zn base soft solder for brazed aluminum and copper,
Comprise the following steps：
1) highly purified Ga granule, In granule, Cu piece, Ni piece, Rare-Earth Ce, the prepared mixing of Sm are weighed by mass percentage
Thing, puts in the container added with acetone, carries out being cleaned by ultrasonic 15～20min at a temperature of 20 DEG C about；
2) mixture after being cleaned by ultrasonic step 1 is dried at a temperature of 30～50 DEG C, obtains the mixture of drying；
3) mixture and Zn are adopted the method prepared composition uniform solder foundry alloy of vacuum induction melting, will prepare
Foundry alloy pulverize after, load high vacuum single roller strip machine quartz glass tube in；
4) quartz glass tube is installed in and gets rid of in the electrical induction circle with machine, and its nozzle to copper roller surface spacing is adjusted
Whole is 180～200 μm；
5) close fire door, be evacuated to 1.5 × 10 using mechanical pump-3Pa, then adopts molecular pump pumping high vacuum, fine vacuum
Degree is not less than 9 × 10-5Pa, then cavity is full of high-purity Ar gas to 200～230mbar；
6) open motor, make, in the range of copper roller rotating speed 30～33m/s, to be then turned on high frequency electric source, by quartz glass tube
Foundry alloy high-frequency induction heating to complete molten homogeneous, be incubated superheated melt 70s～80s；
7) by Ar gas air pressure modulation P=50KPa, with high pressure argon gas, the superheated melt in quartz glass is continuously sprayed
To the cooling copper roller surface of high-speed rotation, liquid metal is formed foil shape by chilling, thus obtaining solder foil strip, thickness is
50～80 μm.
A kind of soldering processes of the high temperature Zn base soft solder for brazed aluminum and copper, comprise the following steps：
(1) preparatory stage：Aluminum to be brazed and copper sample end face are cleared up, remove the impurity on surface, greasy dirt and
Oxide-film, is ground smooth with abrasive paper for metallograph, and aluminum is placed in acetone together with copper and solder paillon foil, using ultrasound wave cleaning
15～20min, and carry out drying and processing；
(2) assembling stage：Solder paillon foil after cleaning is placed between copper sheet and aluminium flake welding surface, and is close to be assemblied in
It is ensured that the precision connecting in special brazing jig, the pressure head of nominal-mass is placed on fixture, produce 0.04～0.06MPa's
Constant perpendicular pressure；
(3) the soldering connection stage：The fixture assembling is integrally placed at vacuum and is not less than 1.5 × 10-3The soldering of Pa sets
In standby, with the ramp of 6～10 DEG C/min to 380～420 DEG C, it is incubated 15～20min, cools to room temperature with the furnace, blow-on takes
Go out by weldering connector.
Result：The jointing that soldering obtains forms well, and metallographic observation finds that brazing area forms the interface cohesion of densification,
Alloying component is evenly distributed, and room temperature tensile intensity is 330MPa.
Embodiment 4
The composition of solder and mass percent proportioning are：Ni0.5%, Cu0.1%, Ga0.5%, In0.5%, Sm0.5%,
Ce0.4%, balance of Zn.
A kind of preparation method of above-mentioned high temperature Zn base soft solder for brazed aluminum and copper,
Comprise the following steps：
1) highly purified Ga granule, In granule, Cu piece, Ni piece, Rare-Earth Ce, the prepared mixing of Sm are weighed by mass percentage
Thing, puts in the container added with acetone, carries out being cleaned by ultrasonic 15～20min at a temperature of 20 DEG C；
2) mixture after being cleaned by ultrasonic step 1 is dried at a temperature of 30～50 DEG C, obtains the mixture of drying；
3) mixture and Zn are adopted the method prepared composition uniform solder foundry alloy of vacuum induction melting, will prepare
Foundry alloy pulverize after, load high vacuum single roller strip machine quartz glass tube in；
4) quartz glass tube is installed in and gets rid of in the electrical induction circle with machine, and its nozzle to copper roller surface spacing is adjusted
Whole is 180～200 μm；
5) close fire door, be evacuated to 1.5 × 10 using mechanical pump-3Pa, then adopts molecular pump pumping high vacuum, fine vacuum
Degree is not less than 9 × 10-5Pa, then cavity is full of high-purity Ar gas to 200～230mbar；
6) open motor, make, in the range of copper roller rotating speed 30～33m/s, to be then turned on high frequency electric source, by quartz glass tube
Foundry alloy high-frequency induction heating to complete molten homogeneous, be incubated superheated melt 70s～80s；
7) by Ar gas air pressure modulation P=50KPa, with high pressure argon gas, the superheated melt in quartz glass is continuously sprayed
To the cooling copper roller surface of high-speed rotation, liquid metal is formed foil shape by chilling, thus obtaining solder foil strip, thickness is
50～80 μm.
A kind of soldering processes of the high temperature Zn base soft solder for brazed aluminum and copper, comprise the following steps：
(1) preparatory stage：Aluminum to be brazed and copper sample end face are cleared up, remove the impurity on surface, greasy dirt and
Oxide-film, is ground smooth with abrasive paper for metallograph, and aluminum is placed in acetone together with copper and solder paillon foil, using ultrasound wave cleaning
15～20min, and carry out drying and processing；
(2) assembling stage：Solder paillon foil after cleaning is placed between copper sheet and aluminium flake welding surface, and is close to be assemblied in
It is ensured that the precision connecting in special brazing jig, the pressure head of nominal-mass is placed on fixture, produce 0.04～0.06MPa's
Constant perpendicular pressure；
(3) the soldering connection stage：The fixture assembling is integrally placed at vacuum and is not less than 1.5 × 10-3The soldering of Pa sets
In standby, with the ramp of 6～10 DEG C/min to 380～420 DEG C, it is incubated 15～20min, cools to room temperature with the furnace, blow-on takes
Go out by weldering connector.
Result：The jointing that soldering obtains forms well, and metallographic observation finds that brazing area forms the interface cohesion of densification,
Alloying component is evenly distributed, and room temperature tensile intensity is 320MPa.
Embodiment 5
The composition of solder and mass percent proportioning are：Ni3.0%, Cu0.5%, Ga4.0%, In3.0%, Sm0.3%,
Ce0.3%, balance of Zn.
A kind of preparation method of above-mentioned high temperature Zn base soft solder for brazed aluminum and copper,
Comprise the following steps：
1) highly purified Ga granule, In granule, Cu piece, Ni piece, Rare-Earth Ce, the prepared mixing of Sm are weighed by mass percentage
Thing, puts in the container added with acetone, carries out being cleaned by ultrasonic 15～20min at a temperature of 21 DEG C；
2) mixture after being cleaned by ultrasonic step 1 is dried at a temperature of 30～50 DEG C, obtains the mixture of drying；
3) mixture and Zn are adopted the method prepared composition uniform solder foundry alloy of vacuum induction melting, will prepare
Foundry alloy pulverize after, load high vacuum single roller strip machine quartz glass tube in；
4) quartz glass tube is installed in and gets rid of in the electrical induction circle with machine, and its nozzle to copper roller surface spacing is adjusted
Whole is 180～200 μm；
5) close fire door, be evacuated to 1.5 × 10 using mechanical pump-3Pa, then adopts molecular pump pumping high vacuum, fine vacuum
Degree is not less than 9 × 10-5Pa, then cavity is full of high-purity Ar gas to 200～230mbar；
6) open motor, make, in the range of copper roller rotating speed 30～33m/s, to be then turned on high frequency electric source, by quartz glass tube
Foundry alloy high-frequency induction heating to complete molten homogeneous, be incubated superheated melt 70s～80s；
7) by Ar gas air pressure modulation P=50KPa, with high pressure argon gas, the superheated melt in quartz glass is continuously sprayed
To the cooling copper roller surface of high-speed rotation, liquid metal is formed foil shape by chilling, thus obtaining solder foil strip, thickness is
50～80 μm.
A kind of soldering processes of the high temperature Zn base soft solder for brazed aluminum and copper, comprise the following steps：
(1) preparatory stage：Aluminum to be brazed and copper sample end face are cleared up, remove the impurity on surface, greasy dirt and
Oxide-film, is ground smooth with abrasive paper for metallograph, and aluminum is placed in acetone together with copper and solder paillon foil, using ultrasound wave cleaning
15～20min, and carry out drying and processing；
(2) assembling stage：Solder paillon foil after cleaning is placed between copper sheet and aluminium flake welding surface, and is close to be assemblied in
It is ensured that the precision connecting in special brazing jig, the pressure head of nominal-mass is placed on fixture, produce 0.04～0.06MPa's
Constant perpendicular pressure；
(3) the soldering connection stage：The fixture assembling is integrally placed at vacuum and is not less than 1.5 × 10-3The soldering of Pa sets
In standby, with the ramp of 6～10 DEG C/min to 380～420 DEG C, it is incubated 15～20min, cools to room temperature with the furnace, blow-on takes
Go out by weldering connector.
Result：The jointing that soldering obtains forms well, and metallographic observation finds that brazing area forms the interface cohesion of densification,
Alloying component is evenly distributed, and room temperature tensile intensity is 318MPa.
Embodiment 6
The composition of solder and mass percent proportioning are：Ni2.5%, Cu1.0%, Ga5.0%, In4.0%, Sm0.2%,
Ce0.5%, balance of Zn.
A kind of preparation method of above-mentioned high temperature Zn base soft solder for brazed aluminum and copper,
Comprise the following steps：
1) highly purified Ga granule, In granule, Cu piece, Ni piece, Rare-Earth Ce, the prepared mixing of Sm are weighed by mass percentage
Thing, puts in the container added with acetone, carries out being cleaned by ultrasonic 15～20min at a temperature of 23 DEG C；
2) mixture after being cleaned by ultrasonic step 1 is dried at a temperature of 30～50 DEG C, obtains the mixture of drying；
3) mixture and Zn are adopted the method prepared composition uniform solder foundry alloy of vacuum induction melting, will prepare
Foundry alloy pulverize after, load high vacuum single roller strip machine quartz glass tube in；
4) quartz glass tube is installed in and gets rid of in the electrical induction circle with machine, and its nozzle to copper roller surface spacing is adjusted
Whole is 180～200 μm；
5) close fire door, be evacuated to 1.5 × 10 using mechanical pump-3Pa, then adopts molecular pump pumping high vacuum, fine vacuum
Degree is not less than 9 × 10-5Pa, then cavity is full of high-purity Ar gas to 200～230mbar；
6) open motor, make, in the range of copper roller rotating speed 30～33m/s, to be then turned on high frequency electric source, by quartz glass tube
Foundry alloy high-frequency induction heating to complete molten homogeneous, be incubated superheated melt 70s～80s；
7) by Ar gas air pressure modulation P=50KPa, with high pressure argon gas, the superheated melt in quartz glass is continuously sprayed
To the cooling copper roller surface of high-speed rotation, liquid metal is formed foil shape by chilling, thus obtaining solder foil strip, thickness is
50～80 μm.
A kind of soldering processes of the high temperature Zn base soft solder for brazed aluminum and copper, comprise the following steps：
(1) preparatory stage：Aluminum to be brazed and copper sample end face are cleared up, remove the impurity on surface, greasy dirt and
Oxide-film, is ground smooth with abrasive paper for metallograph, and aluminum is placed in acetone together with copper and solder paillon foil, using ultrasound wave cleaning
15～20min, and carry out drying and processing；
(2) assembling stage：Solder paillon foil after cleaning is placed between copper sheet and aluminium flake welding surface, and is close to be assemblied in
It is ensured that the precision connecting in special brazing jig, the pressure head of nominal-mass is placed on fixture, produce 0.04～0.06MPa's
Constant perpendicular pressure；
(3) the soldering connection stage：The fixture assembling is integrally placed at vacuum and is not less than 1.5 × 10-3The soldering of Pa sets
In standby, with the ramp of 6～10 DEG C/min to 380～420 DEG C, it is incubated 15～20min, cools to room temperature with the furnace, blow-on takes
Go out by weldering connector.
Result：The jointing that soldering obtains forms well, and metallographic observation finds that brazing area forms the interface cohesion of densification,
Alloying component is evenly distributed, and room temperature tensile intensity is 324MPa.
Embodiment 7
Design 3 groups of comparative examples, basic step is same as Example 3, difference is that material content is different, specially：
The constituent content of comparative example 1：Ni1.0%, Cu2.0%, Ga2.5%, In2.0%, Sm0%, Ce0.2%, surplus
For Zn.
The constituent content of comparative example 2：Ni1.0%, Cu2.0%, Ga2.5%, In2.0%, Sm0.1%, Ce0%, surplus
For Zn.
The constituent content of comparative example 3：Ni1.0%, Cu2.0%, Ga2.5%, In2.0%, Sm0.3%, Ce0.3%, remaining
Measure as Zn.
Embodiment 1-3 and 7 welding points being obtained are carried out performance detection, the result of the test of acquisition is as shown in table 1.
The performance synopsis of the welding point that table 1 is obtained
As shown in Table 1, the soldered fitting dense micro-structure that embodiment 1-3 is obtained, is uniformly distributed, and linkage interface is obvious,
Tensile strength is between 306～330MPa, it can thus be appreciated that the present invention is used for aluminum and the brazing material of copper possesses good adhesive force
And wettability, and soldered fitting bond strength is high.Comparative example 1～3 is carried out on the basis of optimal design embodiment 3,
Comparative example 1 and 2 illustrates that rare-earth Sm and lacking of Rare-Earth Ce substantially reduce joint performance, because appropriate rare earth element is conducive to carefully
Change tissue, improve performance.Comparative example 3 explanation rare earth element is too high, rare earth brittlement phase easily, causes solder wetting and connects
The reduction of rigidity of the nape degree.
The above be only the preferred embodiment of the present invention it should be pointed out that：Ordinary skill people for the art
For member, under the premise without departing from the principles of the invention, some improvements and modifications can also be made, these improvements and modifications also should
It is considered as protection scope of the present invention.
Claims (8)
1. a kind of high temperature Zn base soft solder for brazed aluminum and copper it is characterised in that：Described solder is by weight percentage
Elemental composition includes：Ni0.5%～3.0%, Cu0.1%～4.0%, Ga0.5%～5.0%, In0.5%～4.0%,
Sm0.05%～0.5%, Ce0.1%～0.5%, balance of Zn.
2. the high temperature Zn base soft solder for brazed aluminum and copper according to claim 1 it is characterised in that：Described solder with
The elemental composition of percentage by weight meter includes：Ni1.0%～2.0%, Cu0.5%～3.0%, Ga1.0%～4.0%,
In1.0%～3.0%, Sm0.1%～0.3%, Ce0.15%～0.3%, balance of Zn.
3. the high temperature Zn base soft solder for brazed aluminum and copper according to claim 2 it is characterised in that：Described solder with
The elemental composition of percentage by weight meter includes：Ni1.0%, Cu2.0%, Ga2.5%, In2.0%, Sm0.1%, Ce0.2%, remaining
Measure as Zn.
4. the high temperature Zn base soft solder for brazed aluminum and copper according to claim 1 it is characterised in that：Described solder is
Paillon foil banding, thickness is 50～80 μm.
5. the preparation method of the high temperature Zn base soft solder for brazed aluminum and copper as described in a kind of any one as Claims 1-4,
It is characterized in that, comprise the following steps：
1) weigh highly purified Ga granule, In granule, Cu piece, Ni piece, Rare-Earth Ce, the prepared mixture of Sm by mass percentage, put
Enter in the container added with acetone, carry out being cleaned by ultrasonic 15～20min at a temperature of 20 ± 3 DEG C；
2) by step 1) be cleaned by ultrasonic after mixture dries at a temperature of 30～50 DEG C, obtain dry mixture；
3) by step 2) mixture and Zn adopt vacuum induction melting method prepared composition uniform solder foundry alloy, will make
After pulverizing for the foundry alloy going out, load in the quartz glass tube of high vacuum single roller strip machine；
4) quartz glass tube is installed in and gets rid of in the electrical induction circle with machine, and its nozzle is adjusted to copper roller surface spacing
180～200 μm；
5) close fire door, be evacuated to 1.5 × 10 using mechanical pump-3Pa, then adopts molecular pump pumping high vacuum, condition of high vacuum degree is not
Less than 9 × 10-5Pa, then cavity is full of high-purity Ar gas to 200～230mbar；
6) open motor, make, in the range of copper roller rotating speed 30～33m/s, to be then turned on high frequency electric source, by the mother in quartz glass tube
Alloy high-frequency induction heating, to complete molten homogeneous, is incubated superheated melt 70s～80s；
7) by Ar gas air pressure modulation P=50KPa, with high pressure argon gas, the superheated melt in quartz glass is continuously ejected into height
The cooling copper roller surface of speed rotation, thus obtain solder.
6. the high temperature Zn base soft solder for brazed aluminum and copper according to claim 5 preparation method it is characterised in that：
Described step 3) in quartz ampoule nozzle be rectangle, its length be 8～10mm, width be 0.8～1.2mm.
7. the high temperature Zn base soft solder for brazed aluminum and copper according to claim 5 preparation method it is characterised in that：
Described step 6) in copper roller diameter be 250mm, copper roller width be 50mm.
8. the method for welding of the high temperature Zn base soft solder for brazed aluminum and copper as described in a kind of any one as claim 1-4,
It is characterized in that, comprise the following steps：
(1) preparatory stage：Aluminum to be brazed and copper sample end face are cleared up, removes impurity, greasy dirt and the oxidation on surface
Film, is ground smooth with abrasive paper for metallograph, and aluminum is placed in acetone together with copper and solder paillon foil, using ultrasound wave cleaning 15～
20min, and carry out drying and processing；
(2) assembling stage：Solder paillon foil after cleaning is placed between copper sheet and aluminium flake welding surface, and is close to be assemblied in special
It is ensured that the precision connecting in brazing jig, the pressure head of nominal-mass is placed on fixture, produce the constant of 0.04～0.06MPa
Pressure at right angle；
(3) the soldering connection stage：The fixture assembling is integrally placed at vacuum and is not less than 1.5 × 10-3In the brazing equipment of Pa,
With the ramp of 6～10 DEG C/min to 380～420 DEG C, it is incubated 15～20min, cools to room temperature with the furnace, blow-on is taken out and welded
Connector.
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| CN107127474A (en) * | 2017-05-24 | 2017-09-05 | 苏州南尔材料科技有限公司 | A kind of welding method of carbon doping composite brazing material |
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| CN109604758A (en) * | 2019-01-14 | 2019-04-12 | 中国电子科技集团公司第三十八研究所 | A kind of soldering processes of Copper-Aluminum compound liquid cooled module |
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Application publication date: 20170215 |