CN102401507A - Novel radiating component for semiconductor refrigeration chip of vehicle-mounted refrigerator - Google Patents
Novel radiating component for semiconductor refrigeration chip of vehicle-mounted refrigerator Download PDFInfo
- Publication number
- CN102401507A CN102401507A CN2011103662293A CN201110366229A CN102401507A CN 102401507 A CN102401507 A CN 102401507A CN 2011103662293 A CN2011103662293 A CN 2011103662293A CN 201110366229 A CN201110366229 A CN 201110366229A CN 102401507 A CN102401507 A CN 102401507A
- Authority
- CN
- China
- Prior art keywords
- semiconductor refrigeration
- temperature
- refrigeration chip
- uniforming plate
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention discloses a novel radiating component for a semiconductor refrigeration chip of a vehicle-mounted refrigerator. The novel radiating component comprises a container, the semiconductor refrigeration chip, a first temperature homogenizing plate, a second temperature homogenizing plate and a radiating fin. In the novel radiating component for the semiconductor refrigeration chip of the vehicle-mounted refrigerator, a hot end and a cold end of the semiconductor refrigeration chip are provided with the temperature homogenizing plates, and the temperature homogenizing plate at the hot end can quickly diffuse heat transferred by the semiconductor refrigeration chip of the refrigerator, so that the heat is uniformly diffused and transferred to the surface of the radiating fin; the temperature homogenizing plate at the cold end increases the contact area between the refrigeration chip and the container to be cooled, so that the temperature distribution of the inner surface of the container of the refrigerator is more uniform and the temperature control is more accurate; meanwhile, the heat exchange amount at the cold end can be increased, and energy can be effectively saved.
Description
Technical field
The present invention relates to refrigerator radiating subassembly field, particularly relate to a kind of intelligent refrigerator control chip radiating subassembly.
Background technology
Be accompanied by rapid development of automobile industry, people to the pursuit of automobile consumption also in continuous lifting, wherein have a lot of consumers to the demand of car refrigerator with use also increasingly extensive.
Mostly present car refrigerator on the market is the semiconductor car refrigerator, and it is to lean on the semiconductor refrigeration chip refrigeration, and semiconductor refrigeration chip comprises two potsherds; The semi-conducting material (bismuth telluride) that N type and P type are arranged wherein; This semiconductor element is to link with the series connection form to form on circuit, and n type material has unnecessary electronics, and subzero temperature difference electromotive force is arranged; The P-type material electron deficiency has positive thermoelectric force; After in this circuit, connecting DC current, when electronics flow to P model material from the N type, the upper end temperature descended and heat absorption, becomes cold junction; Opposite lower end flows to the joint release heat of N type element by P type element, becomes the hot junction.The radiating condition in semiconductor refrigeration chip hot junction is its performance of restriction and the key in service life.
The mode of fin heat radiation is adopted in traditional refrigerator semiconductor refrigeration chip heat radiation, is about to directly fixing applying the in hot junction of fin and refrigerating chip.
When the refrigerator semiconductor refrigeration chip is worked; The heat that the cold junction absorption refrigerator semiconductor refrigeration chip work of refrigerating chip produces is delivered to the hot junction of refrigerating chip fast; Hot junction at refrigerating chip dissipates through the heat that radiating modes such as forced convertion or free convection transmit the hot junction; With the ability of the low temperature heat absorption of the cold junction that keeps refrigerating chip, thereby reach the container of refrigerator cooling purpose.
Because the refrigerator semiconductor refrigeration chip is less with respect to the area of fin; And mostly the traditional heat-dissipating sheet is the aluminium heat sink material, when the hot junction heat when fin transmits, can form bigger thermograde on radiator heat-dissipation surface; Promptly near more apart from thermal source; Its heat and temperature superelevation, far away more apart from thermal source, its heat and temperature are low more.Because spreader surface temperature and heat distribution is inhomogeneous, refrigerator semiconductor refrigeration chip refrigerating efficiency is reduced, significantly reduced the service life of automobile refrigerator semiconductor refrigeration chip.
Summary of the invention
The technical problem that the present invention mainly solves provides a kind of heat sinking assembly of car refrigerator semiconductor refrigeration chip, can effectively improve radiating efficiency.
For solving the problems of the technologies described above; The technical scheme that the present invention adopts is: the heat sinking assembly that a kind of car refrigerator semiconductor refrigeration chip is provided; Comprise: container, semiconductor refrigeration chip, first temperature-uniforming plate, second temperature-uniforming plate and fin; The one side of said first temperature-uniforming plate and the outer surface of said container are close to fixing; The another side of first temperature-uniforming plate and the cold junction of said semiconductor refrigeration chip are close to fixing, and the one side of the hot junction of said semiconductor refrigeration chip and second temperature-uniforming plate is close to fixing, and the another side of said second temperature-uniforming plate and fin are close to fixing.
In preferred embodiment of the present invention, the cold junction of said semiconductor refrigeration chip is close to fixing through heat conductive silica gel and said first temperature-uniforming plate.
In preferred embodiment of the present invention, the hot junction of said semiconductor refrigeration chip is close to fixing through the one side of the heat conductive silica gel and second temperature-uniforming plate.
In preferred embodiment of the present invention, said second temperature-uniforming plate and fin are fixing through welding.
In preferred embodiment of the present invention, said second temperature-uniforming plate and fin carry out fixing and locking through retaining element.
The invention has the beneficial effects as follows: the heat sinking assembly of car refrigerator semiconductor refrigeration chip of the present invention; Hot junction and cold junction at semiconductor refrigeration chip use temperature-uniforming plate respectively; The temperature-uniforming plate in hot junction can spread apart the heat that the refrigerator semiconductor refrigeration chip transmits rapidly, makes heat diffusion uniformly be delivered to the surface of fin; The temperature-uniforming plate of cold junction increases refrigerating chip and wants the contact area of cooled containers, thereby makes the Temperature Distribution of container of refrigerator inner surface more even, thereby makes temperature control more accurate, can increase the heat exchange amount of cold junction simultaneously, effectively energy savings.
Description of drawings
Fig. 1 is the perspective view of heat sinking assembly one preferred embodiment of car refrigerator semiconductor refrigeration chip of the present invention;
Fig. 2 is that the master of the heat sinking assembly of car refrigerator semiconductor refrigeration chip shown in Figure 1 looks sketch map;
The mark of each parts is following in the accompanying drawing: 1 is container, and 2 is first temperature-uniforming plate, and 3 is semiconductor refrigeration chip, and 4 is second temperature-uniforming plate, and 5 is fin.
The specific embodiment
Below in conjunction with accompanying drawing preferred embodiment of the present invention is set forth in detail, thereby protection scope of the present invention is made more explicit defining so that advantage of the present invention and characteristic can be easier to it will be appreciated by those skilled in the art that.
See also Fig. 1 and Fig. 2, the embodiment of the invention comprises:
A kind of heat sinking assembly of car refrigerator semiconductor refrigeration chip; Comprise: container 1, first temperature-uniforming plate 2, semiconductor refrigeration chip 3, second temperature-uniforming plate 4 and fin 5; The outer surface of the one side of first temperature-uniforming plate 2 and container 1 is close to fixing; The cold junction of the another side of first temperature-uniforming plate 2 and semiconductor refrigeration chip 3 is close to fixing, and the one side of the hot junction of semiconductor refrigeration chip 3 and second temperature-uniforming plate 4 is close to fixing, and the another side of second temperature-uniforming plate 4 and fin 5 are close to fixing.
The installation process of the heat sinking assembly of car refrigerator semiconductor refrigeration chip of the present invention is following: earlier with fin through soldering welding or sealed being fastened on second temperature-uniforming plate, and with first temperature-uniforming plate and container of refrigerator is firm fits together; After semiconductor refrigeration chip is up and down smeared heat-conducting silicone grease in the potsherd surface, afterwards the refrigerator semiconductor refrigeration chip is clung to fin welding or second temperature-uniforming plate surface that is locked together in; Refrigerator semiconductor refrigeration chip cold junction is close to first temperature-uniforming plate surface that partly tightens together with container of refrigerator; Through mode such as sealed, fastening each parts is fit together closely at last, pressure remains on (10～15kg/cm
2).
The heat sinking assembly of car refrigerator semiconductor refrigeration chip of the present invention has following advantage:
1. the single ﹑ of big (utilizing latent heat) ﹑ volume in light weight little (hollow container) ﹑ knot of (steam flow rate is fast) ﹑ heat output structure letter can be in characteristics such as agravic runnings after the match, so the use temperature-uniforming plate can satisfy the thermal diffusion and the heat conducting demand of refrigerator semiconductor refrigeration chip fast because temperature-uniforming plate has uniformity of temperature profile (thermal diffusion due to steam is mobile) the little ﹑ thermal response of ﹑ thermal resistance.The heat that can as early as possible chip be produced is taken away, and has reduced traditional structure longer time thermal balance process, is in the higher temperature state for a long time thereby reduce euthermic chip, thereby promotes chip reliability and service life.
2. use temperature-uniforming plate can the heat that the refrigerator semiconductor refrigeration chip transmits be spread apart rapidly in the hot junction, make heat diffusion uniformly be delivered to the surface of fin, thus reduce refrigerator semiconductor refrigeration chip heat source region with apart from the thermograde of chip than the territory, far field.Thereby promoted the heat exchanger effectiveness of fin greatly.
3. use temperature-uniforming plate can utilize the function of the equal gentle heat of transformation transmission of temperature-uniforming plate at cold junction, increase refrigerating chip indirectly and want the contact area of cooled containers, thereby make the Temperature Distribution of container of refrigerator inner surface more even, thereby make temperature control more accurate.Can increase simultaneously the heat exchange amount of cold junction, effectively energy savings.
4. use temperature-uniforming plate can make cold junction (low-temperature end) remain on a stable low-temperature condition.Thereby refrigerator semiconductor refrigeration chip refrigerating efficiency significantly promotes, and the service life that can effectively prolong the refrigerator semiconductor refrigeration chip simultaneously is big.
The above is merely embodiments of the invention; Be not so limit claim of the present invention; Every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to be done; Or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (5)
1. the heat sinking assembly of a car refrigerator semiconductor refrigeration chip; It is characterized in that; Comprise: container, semiconductor refrigeration chip, first temperature-uniforming plate, second temperature-uniforming plate and fin; The one side of said first temperature-uniforming plate and the outer surface of said container are close to fixing; The another side of first temperature-uniforming plate and the cold junction of said semiconductor refrigeration chip are close to fixing, and the one side of the hot junction of said semiconductor refrigeration chip and second temperature-uniforming plate is close to fixing, and the another side of said second temperature-uniforming plate and fin are close to fixing.
2. the heat sinking assembly of car refrigerator semiconductor refrigeration chip according to claim 1 is characterized in that, the cold junction of said semiconductor refrigeration chip is close to fixing through heat conductive silica gel and said first temperature-uniforming plate.
3. the heat sinking assembly of car refrigerator semiconductor refrigeration chip according to claim 1 is characterized in that, the hot junction of said semiconductor refrigeration chip is close to fixing through the one side of the heat conductive silica gel and second temperature-uniforming plate.
4. the heat sinking assembly of car refrigerator semiconductor refrigeration chip according to claim 1 is characterized in that, said second temperature-uniforming plate and fin are fixing through welding.
5. the heat sinking assembly of car refrigerator semiconductor refrigeration chip according to claim 1 is characterized in that, said second temperature-uniforming plate and fin carry out fixing and locking through retaining element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103662293A CN102401507A (en) | 2011-11-18 | 2011-11-18 | Novel radiating component for semiconductor refrigeration chip of vehicle-mounted refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103662293A CN102401507A (en) | 2011-11-18 | 2011-11-18 | Novel radiating component for semiconductor refrigeration chip of vehicle-mounted refrigerator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102401507A true CN102401507A (en) | 2012-04-04 |
Family
ID=45883966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103662293A Pending CN102401507A (en) | 2011-11-18 | 2011-11-18 | Novel radiating component for semiconductor refrigeration chip of vehicle-mounted refrigerator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102401507A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110389639A (en) * | 2019-07-01 | 2019-10-29 | 奇鋐科技股份有限公司 | Compound water cooling arranges structure |
| CN113867457A (en) * | 2021-10-10 | 2021-12-31 | 飞成技术(佛山)有限公司 | Cover body structure for intelligently regulating and controlling temperature and humidity and temperature and humidity regulation and control method |
| CN114859478A (en) * | 2021-01-20 | 2022-08-05 | 青岛海信宽带多媒体技术有限公司 | Optical module |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2227806Y (en) * | 1995-09-01 | 1996-05-22 | 李昌权 | Multipurpose cold and hot box |
| CN2498558Y (en) * | 2001-09-03 | 2002-07-03 | 平湖美嘉保温容器工业有限公司 | Environmental travlling refrigerator |
| CN101754656A (en) * | 2008-12-10 | 2010-06-23 | 富准精密工业(深圳)有限公司 | Uniform temperature plate |
| CN101936642A (en) * | 2010-09-08 | 2011-01-05 | 青岛大学 | Semiconductor refrigeration vacuum freezing dryer capable of realizing energy recovery |
| CN202393078U (en) * | 2011-11-18 | 2012-08-22 | 苏州雪林电器科技有限公司 | Novel heat radiation assembly of semiconductor refrigeration chip of vehicle-mounted refrigerator |
-
2011
- 2011-11-18 CN CN2011103662293A patent/CN102401507A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2227806Y (en) * | 1995-09-01 | 1996-05-22 | 李昌权 | Multipurpose cold and hot box |
| CN2498558Y (en) * | 2001-09-03 | 2002-07-03 | 平湖美嘉保温容器工业有限公司 | Environmental travlling refrigerator |
| CN101754656A (en) * | 2008-12-10 | 2010-06-23 | 富准精密工业(深圳)有限公司 | Uniform temperature plate |
| CN101936642A (en) * | 2010-09-08 | 2011-01-05 | 青岛大学 | Semiconductor refrigeration vacuum freezing dryer capable of realizing energy recovery |
| CN202393078U (en) * | 2011-11-18 | 2012-08-22 | 苏州雪林电器科技有限公司 | Novel heat radiation assembly of semiconductor refrigeration chip of vehicle-mounted refrigerator |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110389639A (en) * | 2019-07-01 | 2019-10-29 | 奇鋐科技股份有限公司 | Compound water cooling arranges structure |
| CN114859478A (en) * | 2021-01-20 | 2022-08-05 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN113867457A (en) * | 2021-10-10 | 2021-12-31 | 飞成技术(佛山)有限公司 | Cover body structure for intelligently regulating and controlling temperature and humidity and temperature and humidity regulation and control method |
| CN113867457B (en) * | 2021-10-10 | 2022-06-10 | 飞成技术(佛山)有限公司 | Cover body structure for intelligently regulating and controlling temperature and humidity and temperature and humidity regulation and control method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103199316B (en) | Battery pack and radiator structure thereof | |
| CN203943523U (en) | A kind of semiconductor refrigerating drinking water apparatus | |
| CN202085437U (en) | Variable-frequency air conditioner heat radiator | |
| CN207268513U (en) | A kind of air-conditioning variable frequency module radiator and air-conditioning variable frequency module component | |
| Sun et al. | Experimental study on a novel flat-heat-pipe heating system integrated with phase change material and thermoelectric unit | |
| CN105805873A (en) | Novel energy-saving semiconductor air adjusting module | |
| CN105091400A (en) | Thermoelectric cooling integrated system | |
| CN109307305A (en) | A kind of dry contact formula flat-plate heat pipe heating method by floor radiation and heating system | |
| CN102563891A (en) | Capillary tube radiation cooling type photovoltaic electricity and heat combined using device | |
| CN111336727A (en) | Air conditioner | |
| CN102401507A (en) | Novel radiating component for semiconductor refrigeration chip of vehicle-mounted refrigerator | |
| CN202350373U (en) | Thermoelectric cooler (TEC) | |
| CN201754049U (en) | Hot pipe heat radiator and high power LED lamp with hot pipe heat radiator as heat radiating device | |
| CN202393078U (en) | Novel heat radiation assembly of semiconductor refrigeration chip of vehicle-mounted refrigerator | |
| CN202393077U (en) | Car refrigerator semiconductor refrigeration chip radiating component | |
| CN102646651A (en) | Thin hot plate structure | |
| CN203464213U (en) | LED (Light Emitting Diode) projection lamp radiator | |
| CN202382514U (en) | Minitype refrigeration cup | |
| CN202142519U (en) | Thin type hot plate structure | |
| CN102445020A (en) | Vehicle-mounted refrigerator semiconductor refrigerating chip heat dissipation assembly | |
| CN203322882U (en) | Active cooling type high-power light-emitting diode (LED) street lamp | |
| CN102401506A (en) | Heat pipe and TEC (Thermoelectric Cooler) combined heat dissipation device | |
| CN205002439U (en) | Difference in temperature electric refrigeration integrated system | |
| CN215571363U (en) | Semiconductor refrigerating device and air-conditioning suit | |
| CN105466261A (en) | Heat exchange device and semiconductor refrigeration refrigerator provided with heat exchange device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120404 |