CN102393604A - 感光性树脂组合物、感光性元件、抗蚀图的形成方法及印刷电路板的制造方法 - Google Patents
感光性树脂组合物、感光性元件、抗蚀图的形成方法及印刷电路板的制造方法 Download PDFInfo
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- CN102393604A CN102393604A CN2011103494599A CN201110349459A CN102393604A CN 102393604 A CN102393604 A CN 102393604A CN 2011103494599 A CN2011103494599 A CN 2011103494599A CN 201110349459 A CN201110349459 A CN 201110349459A CN 102393604 A CN102393604 A CN 102393604A
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- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
- C08F290/061—Polyesters; Polycarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
- C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
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- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Polymerisation Methods In General (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
实施例1 | 实施例2 | 实施例3 | 实施例4 | 比较例1 | 比较例2 | |
光感度(mJ/cm2) | 62 | 65 | 64 | 67 | 62 | 75 |
分辨率(μm) | 27 | 30 | 30 | 32 | 27 | 30 |
异形***破碎率(%) | 20 | 20 | 15 | 18 | 42 | 50 |
强度(N) | 5.0 | 5.1 | 5.3 | 5.3 | 4.3 | 4.0 |
伸长量(mm) | 1.2 | 1.2 | 1.5 | 1.4 | 0.9 | 0.9 |
Claims (6)
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JP2006-247966 | 2006-09-13 | ||
JP2006247966 | 2006-09-13 | ||
JP2007165303 | 2007-06-22 | ||
JP2007-165303 | 2007-06-22 |
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CN2007800327986A Division CN101512437B (zh) | 2006-09-13 | 2007-09-10 | 感光性树脂组合物、感光性元件、抗蚀图的形成方法及印刷电路板的制造方法 |
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CN2007800327986A Active CN101512437B (zh) | 2006-09-13 | 2007-09-10 | 感光性树脂组合物、感光性元件、抗蚀图的形成方法及印刷电路板的制造方法 |
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EP (1) | EP2063318A4 (zh) |
JP (1) | JP4569700B2 (zh) |
KR (1) | KR100994311B1 (zh) |
CN (2) | CN102393604B (zh) |
TW (1) | TW200837497A (zh) |
WO (1) | WO2008032674A1 (zh) |
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CN102754032B (zh) * | 2010-03-19 | 2015-07-15 | 日立化成株式会社 | 感光性树脂组合物以及使用其的感光性元件、抗蚀图形的形成方法和印刷线路板的制造方法 |
CN103076717A (zh) * | 2011-10-26 | 2013-05-01 | 日立化成工业株式会社 | 感光性树脂组合物、感光性元件、抗蚀图案的形成方法及印刷配线板的制造方法 |
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US4610951A (en) * | 1983-06-06 | 1986-09-09 | Dynachem Corporation | Process of using a flexible, fast processing photopolymerizable composition |
JPS63184744A (ja) * | 1986-09-09 | 1988-07-30 | Asahi Chem Ind Co Ltd | 光重合性積層体 |
JP2000010278A (ja) * | 1998-06-19 | 2000-01-14 | Hitachi Chem Co Ltd | 感光性樹脂組成物及びこれを用いた感光性エレメント |
WO2000052529A1 (fr) * | 1999-03-03 | 2000-09-08 | Hitachi Chemical Company, Ltd. | Composition de resine photosensible, element photosensible contenant cette derniere, procede de fabrication d'un motif de resine et procede de fabrication de cartes de circuits imprimes |
JP2002162737A (ja) * | 2001-09-10 | 2002-06-07 | Hitachi Chem Co Ltd | 感光性樹脂組成物及びこれを用いた感光性エレメント |
CN1432141A (zh) * | 2000-05-29 | 2003-07-23 | 日立化成工业株式会社 | 感光性树脂组合物、感光性元件、保护层图形的制造方法和印刷电路布线板的制造方法 |
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US4539286A (en) * | 1983-06-06 | 1985-09-03 | Dynachem Corporation | Flexible, fast processing, photopolymerizable composition |
JP3251446B2 (ja) | 1994-12-21 | 2002-01-28 | 日立化成工業株式会社 | 感光性樹脂組成物及び感光性エレメント |
JP3199600B2 (ja) | 1995-04-19 | 2001-08-20 | 日立化成工業株式会社 | 感光性樹脂組成物及びこれを用いた感光性エレメント |
JP2000214583A (ja) | 1999-01-22 | 2000-08-04 | Hitachi Chem Co Ltd | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパタ―ンの製造法及びプリント配線板の製造法 |
TWI258634B (en) * | 1999-10-22 | 2006-07-21 | Hitachi Chemical Co Ltd | Photosensitive resin composition, photosensitive element using the same, a process for producing resist pattern and resist pattern laminate |
US7078151B2 (en) | 2000-09-20 | 2006-07-18 | Hitachi Chemical Co., Ltd. | Photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board |
JP3855998B2 (ja) * | 2002-02-28 | 2006-12-13 | 日立化成工業株式会社 | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
JP2005031639A (ja) | 2003-06-16 | 2005-02-03 | Hitachi Chem Co Ltd | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法、プリント配線板の製造法、並びにプリント配線板、及びそれを用いた電子部品 |
JP2005221743A (ja) * | 2004-02-05 | 2005-08-18 | Hitachi Chem Co Ltd | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法 |
-
2007
- 2007-09-10 WO PCT/JP2007/067591 patent/WO2008032674A1/ja active Application Filing
- 2007-09-10 CN CN2011103494599A patent/CN102393604B/zh active Active
- 2007-09-10 KR KR1020097002118A patent/KR100994311B1/ko active IP Right Grant
- 2007-09-10 EP EP07807001A patent/EP2063318A4/en not_active Withdrawn
- 2007-09-10 JP JP2008534328A patent/JP4569700B2/ja active Active
- 2007-09-10 CN CN2007800327986A patent/CN101512437B/zh active Active
- 2007-09-12 TW TW096134106A patent/TW200837497A/zh unknown
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US4610951A (en) * | 1983-06-06 | 1986-09-09 | Dynachem Corporation | Process of using a flexible, fast processing photopolymerizable composition |
JPS63184744A (ja) * | 1986-09-09 | 1988-07-30 | Asahi Chem Ind Co Ltd | 光重合性積層体 |
JP2000010278A (ja) * | 1998-06-19 | 2000-01-14 | Hitachi Chem Co Ltd | 感光性樹脂組成物及びこれを用いた感光性エレメント |
WO2000052529A1 (fr) * | 1999-03-03 | 2000-09-08 | Hitachi Chemical Company, Ltd. | Composition de resine photosensible, element photosensible contenant cette derniere, procede de fabrication d'un motif de resine et procede de fabrication de cartes de circuits imprimes |
CN1432141A (zh) * | 2000-05-29 | 2003-07-23 | 日立化成工业株式会社 | 感光性树脂组合物、感光性元件、保护层图形的制造方法和印刷电路布线板的制造方法 |
JP2002162737A (ja) * | 2001-09-10 | 2002-06-07 | Hitachi Chem Co Ltd | 感光性樹脂組成物及びこれを用いた感光性エレメント |
Also Published As
Publication number | Publication date |
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JPWO2008032674A1 (ja) | 2010-01-28 |
CN101512437B (zh) | 2011-12-14 |
EP2063318A4 (en) | 2010-06-23 |
WO2008032674A1 (fr) | 2008-03-20 |
EP2063318A1 (en) | 2009-05-27 |
KR20090016639A (ko) | 2009-02-16 |
CN102393604B (zh) | 2013-06-12 |
CN101512437A (zh) | 2009-08-19 |
KR100994311B1 (ko) | 2010-11-12 |
TW200837497A (en) | 2008-09-16 |
JP4569700B2 (ja) | 2010-10-27 |
TWI347494B (zh) | 2011-08-21 |
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