CN102376593A - Method for eliminating air bubbles in bottom filled rubber and bottom rubber filling machine structure - Google Patents
Method for eliminating air bubbles in bottom filled rubber and bottom rubber filling machine structure Download PDFInfo
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- CN102376593A CN102376593A CN2010102522258A CN201010252225A CN102376593A CN 102376593 A CN102376593 A CN 102376593A CN 2010102522258 A CN2010102522258 A CN 2010102522258A CN 201010252225 A CN201010252225 A CN 201010252225A CN 102376593 A CN102376593 A CN 102376593A
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Abstract
The invention discloses a method for eliminating air bubbles in bottom filled rubber. The method comprises the following steps of: arranging a rubber barrel in a reheating box, wherein the rubber barrel is connected with a pressurizing and air-conveying valve provided with an air pipe, and a rubber matrix is filled in the rubber barrel and is in a reheating and melting state; and generating an air pressure through the air supply of the pressurizing and air-conveying valve, wherein the air pressure enters the rubber barrel through the air pipe and pressure generated by the air pressure presses the rubber matrix in the rubber barrel, so that the side end of the whole rubber matrix is completely adhered to the inner wall of the rubber barrel. Under the air pressure of the pressurizing and air-conveying valve, the rubber matrix in the rubber barrel is pressed in the reheating process, so that the influence of the air bubbles generated in the bottom filled rubber on the stability of the rubber amount in the rubber coating process and the stability of the rubber coating process is avoided.
Description
Technical field
The present invention relates to a kind of bottom filler (Underfill) method and structure that is used for the crystal covering type semiconductor packages, particularly relate to and a kind ofly be used to eliminate bubble and result from the method for bottom filler and have the bottom filler machine structure of eliminating bubble.
Background technology
Crystal covering type (Flip-Chip) semiconductor packaging is a kind of advanced person's a semiconductor packaging, is through a plurality of conductive projections (Bumps) action face (Active Surface) of wafer to be electrically connected on the surface of substrate (Substrate).Then, promptly adopt bottom filler (Underfill) mode that the glue material of insulating properties is inserted between the adjacent conductive projection, can firmly connect for wafer and put at substrate.Then, and on another surface of substrate, plant a plurality of soldered balls (Solder Ball) that can be used as the I/O end, can be electrically connected to external device (ED) for wafer.Because the crystal covering type semiconductor package, it has and need not use the bonding wire that takes up space to provide wafer to electrically connect, and therefore can effectively reduce the integral thickness of encapsulating structure, thereby can meet compact encapsulation trend.
In general, bottom filler mode is by being filled with a glue material (being generally thermosetting resin) in the packing element, after heating and carrying, the glue material is lighted around wafer to insert between the conductive projection through some glue injection modules.Yet, during the process of rising again of filler, normal different with the glue material coefficient of expansion between the two in the bottom because of packing element, cause then between packing element and glue material and produce the gap, it is interior and produce bubble to cause air to enter into the glue material.Glue amount stability when the generation of bubble influences glue immediately, the also stability of influence point glue processing procedure because the factor of bubble is prone to make glue material skewness, finally becomes one of not good factor of the production yield of crystal covering type semiconductor packages.
Therefore, the inventor is thoughts on the property improved of above-mentioned disappearance, through to its concentrated observation and research, proposed a kind of reasonable in design and effectively improve the present invention of above-mentioned disappearance.
Summary of the invention
The technical problem that the present invention will solve is the defective of the stability of glue amount stability and some glue processing procedure when overcoming the aeration point glue that the bottom filler produces, provides a kind of bottom filler of can eliminating to produce the method for bubble and have the bottom filler machine structure of elimination bubble.
The present invention solves above-mentioned technical problem through following technical proposals:
A kind of eliminate bubble result from the bottom filler method, comprise the following step:
Rising again to provide in the case one is provided with packing element, and packing element is connected with tracheate pressurization gas valve.
Be filled with colloid in the packing element, and colloid is in the state of the melting of rising again.
The supply of pressurization gas valve produces has an air pressure, and air pressure gets in the packing element via tracheae, and the colloid in the pressure extrusion packing element that air pressure produces makes the whole side of colloid paste the inwall that touches in packing element fully.
Preferably, this pressurization gas valve is adjusted to the pressure in this packing element between between the 30psi to 35psi.
Preferably, this case of rising again is provided with timer, and rising again the time of this this case of rising again of timer control makes this colloid be in rising again the time between a hour.
For achieving the above object, the present invention also proposes a kind of bottom filler machine structure, comprise the case of rising again, a plurality of be arranged at this rise again in case packing element and be arranged at the pressurization gas valve of these rise again case and a plurality of tracheaes of tool, those tracheae correspondences are connected in those packing elements; Wherein, be provided with colloid in this packing element, the air pressure that this pressurization gas valve produces is got in the corresponding packing element, to push the colloid in this packing element by this tracheae.
Preferably, be provided with a holder in this case of rising again, each packing element system vertically is provided with and is combined in this holder.
Preferably, this case of rising again is provided with air gauge, and this air gauge is connected with this pressurization gas valve.
Positive progressive effect of the present invention is: the air pressure strength of utilizing the pressurization gas valve; The colloid of extruding in the packing element in the process of rising again avoids the bottom filler to produce bubble thus, and the glue amount stability during influence point glue; And the stability of influence point glue processing procedure; Via described method and structural design, then help to promote the distributing homogeneity of colloid filler time point glue, the yield when promoting electronic component production in the bottom.
Reach technology, method and the effect that set purpose is taked in order further to understand the present invention; See also following detailed description and accompanying drawing about the present invention; Believe the object of the invention, characteristic and characteristics; Can obtain one thus deeply and concrete understanding, however appended graphic only being used to reference and explanation are provided, be not to be used for the present invention is limited.
Description of drawings
Fig. 1 is a flow chart of steps of the present invention.
Fig. 2 is the sketch map of bottom of the present invention filler machine structure.
[description of reference numerals]
1 case of rising again
11 holders
2 packing elements
3 colloids
4 pressurization gas valves
41 tracheaes
5 timers
6 air gauges
Embodiment
Provide preferred embodiment of the present invention below in conjunction with accompanying drawing, to specify technical scheme of the present invention.
See also shown in Figure 1ly, and cooperate and to consult Fig. 2, the present invention proposes a kind of method that bubble results from the bottom filler of eliminating, and includes following step:
S100: one rises again provides in the case 1 and is provided with packing element 2, and packing element 2 more is connected with the pressurization gas valve 4 of a tool tracheae 41.
S200: provide in the packing element 2 and be filled with colloid 3, and colloid 3 is the states that are in the melting of rising again.
S300: 4 supplies of pressurization gas valve produce has an air pressure, and air pressure then enters into packing element 2 via tracheae 41.Therefore, the pressure that air pressure produced promptly pushes the colloid 3 in the packing element 2, makes colloid 3 whole sides paste the inwall that touches in packing element 2 fully.
By last; Provide air pressure in packing element 2 through pressurization gas valve 4; Utilize air pressure strength, extruding colloid 3 is eliminated the gap between the inwall of colloid 3 and packing element 2 by air pressure in the process of rising again; Avoiding both coefficients of expansion of when rising again colloid 3 and packing element 2 different, and cause air to enter into colloid 3 and produce bubble.
In the present invention, more can be included in the case 1 of rising again and be provided with timer 5,5 of timers are in order to the rise again time set of case 1 of control.Through the control of timer 5, preferably then may command colloid 3 is in rising again the time between about a hour.
In addition, pressurization gas valve 4 can be adjusted to the pressure in the packing element 2 between between the 30psi to 35psi, and can reach the pressure feed of preferableization, pushes colloid 3 thus.Moreover, on the case 1 of rising again, more can be provided with an air gauge 6, and be connected with pressurization gas valve 4, show the force value when looking pressurization gas valve 4 generation pressure thus, for the size of monitor pressures value.
In the present invention; More proposed a kind of bottom filler machine structure of eliminating bubble that has, it includes the above-mentioned case 1 of rising again, and in the case 1 of rising again, is provided with a plurality of packing elements 2; The case 1 of rising again more is provided with the pressurization gas valve 4 of a plurality of tracheaes 41 of a tool; Tracheae is connected with corresponding packing element 2, and air pressure is entered in the packing element 2, with the colloid 3 in the extruding packing element 2.
In addition, more be provided with a holder 11 in the case 1 of rising again, each packing element 2 vertically is provided with and is combined on the holder 11, helps the mobile usability of colloid 3.Yet, like above-mentioned explanation, more be provided with timer 5 on the case 1 of rising again, rise again the rising again the time of case 1 of control thus, and more be provided with air gauge 6 and be connected with pressurization gas valve 4, show force value thus.
Via above-mentioned explanation, the present invention utilizes the air pressure strength of pressurization gas valve 4, thereby in the process of rising again, pushes the colloid 3 in the packing element 2; Avoid the bottom filler to produce bubble; And the glue amount stability during influence point glue, and the stability of influence point glue processing procedure, via described method and structural design; Then help to promote the distributing homogeneity of colloid 3 filler time point glue, the yield when promoting electronic component production in the bottom.
Though more than described embodiment of the present invention, it will be understood by those of skill in the art that these only illustrate, protection scope of the present invention is limited appended claims.Those skilled in the art can make numerous variations or modification to these execution modes under the prerequisite that does not deviate from principle of the present invention and essence, but these changes and modification all fall into protection scope of the present invention.
Claims (6)
1. eliminate the method that bubble results from the bottom filler for one kind, it is characterized in that, comprise the following step:
Rising again to provide in the case one is provided with packing element, and this packing element is connected with tracheate pressurization gas valve;
Be filled with colloid in this packing element, and this colloid is in the state of the melting of rising again; And
This pressurization gas valve supply produces has an air pressure, and this air pressure gets in this packing element via this tracheae, and the colloid in this packing element of pressure extrusion that this air pressure produces makes the whole side of this colloid paste the inwall that touches in this packing element fully.
2. elimination bubble as claimed in claim 1 results from the method for bottom filler, it is characterized in that, this pressurization gas valve is adjusted to the pressure in this packing element between between the 30psi to 35psi.
3. elimination bubble as claimed in claim 1 results from the method for bottom filler, it is characterized in that this case of rising again is provided with timer, and rising again the time of this this case of rising again of timer control makes this colloid be in rising again the time between a hour.
4. a bottom filler machine structure is characterized in that, comprises the pressurization gas valve that the case of rising again, a plurality of packing elements and that are arranged in this case of rising again are arranged at these rise again case and a plurality of tracheaes of tool, and those tracheae correspondences are connected in those packing elements; Wherein, be provided with colloid in this packing element, the air pressure that this pressurization gas valve produces is got in the corresponding packing element, to push the colloid in this packing element by this tracheae.
5. bottom as claimed in claim 4 filler machine structure is characterized in that, is provided with a holder in this case of rising again, and each packing element system vertically is provided with and is combined in this holder.
6. bottom as claimed in claim 4 filler machine structure is characterized in that this case of rising again is provided with air gauge, and this air gauge is connected with this pressurization gas valve.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102522258A CN102376593A (en) | 2010-08-12 | 2010-08-12 | Method for eliminating air bubbles in bottom filled rubber and bottom rubber filling machine structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102522258A CN102376593A (en) | 2010-08-12 | 2010-08-12 | Method for eliminating air bubbles in bottom filled rubber and bottom rubber filling machine structure |
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| Publication Number | Publication Date |
|---|---|
| CN102376593A true CN102376593A (en) | 2012-03-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102522258A Pending CN102376593A (en) | 2010-08-12 | 2010-08-12 | Method for eliminating air bubbles in bottom filled rubber and bottom rubber filling machine structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113471645A (en) * | 2021-06-30 | 2021-10-01 | 浙江昊杨新能源科技有限公司 | Glue dipping process for battery plastic shell middle cover based on flame retardant material |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001053411A (en) * | 1999-08-16 | 2001-02-23 | Hitachi Kokusai Electric Inc | Method for fixing mounting member to printed board and fixing structure thereof |
| CN2794648Y (en) * | 2005-02-02 | 2006-07-12 | 日扬电子科技(上海)有限公司 | Multiple head spot gluing device |
| JP2007194403A (en) * | 2006-01-19 | 2007-08-02 | Sony Corp | Apparatus and method for manufacturing electronic device, and for inspecting underfill material filling state |
| CN101017787A (en) * | 2005-11-15 | 2007-08-15 | 东丽工程株式会社 | Dispensing device and mounting system |
| CN201163615Y (en) * | 2008-01-08 | 2008-12-10 | 印能科技有限公司 | Bubble-removing bake oven apparatus for semiconductor packaging and processing |
-
2010
- 2010-08-12 CN CN2010102522258A patent/CN102376593A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001053411A (en) * | 1999-08-16 | 2001-02-23 | Hitachi Kokusai Electric Inc | Method for fixing mounting member to printed board and fixing structure thereof |
| CN2794648Y (en) * | 2005-02-02 | 2006-07-12 | 日扬电子科技(上海)有限公司 | Multiple head spot gluing device |
| CN101017787A (en) * | 2005-11-15 | 2007-08-15 | 东丽工程株式会社 | Dispensing device and mounting system |
| JP2007194403A (en) * | 2006-01-19 | 2007-08-02 | Sony Corp | Apparatus and method for manufacturing electronic device, and for inspecting underfill material filling state |
| CN201163615Y (en) * | 2008-01-08 | 2008-12-10 | 印能科技有限公司 | Bubble-removing bake oven apparatus for semiconductor packaging and processing |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113471645A (en) * | 2021-06-30 | 2021-10-01 | 浙江昊杨新能源科技有限公司 | Glue dipping process for battery plastic shell middle cover based on flame retardant material |
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Application publication date: 20120314 |