CN102373406A - Film plating method - Google Patents
Film plating method Download PDFInfo
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- CN102373406A CN102373406A CN2010102529897A CN201010252989A CN102373406A CN 102373406 A CN102373406 A CN 102373406A CN 2010102529897 A CN2010102529897 A CN 2010102529897A CN 201010252989 A CN201010252989 A CN 201010252989A CN 102373406 A CN102373406 A CN 102373406A
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- plated film
- printing ink
- substrate
- compression zone
- film district
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Abstract
The invention relates to a film plating method. A substrate and a pressing mold are provided. The substrate has an outer surface comprising a plating area and a non-plating area. The pressing mold comprises an elastic compression zone provided with a recess. The recess and the non-plating area are both coupled with the shape and the dimension of a pattern requiring producing. The recess is filled with printing ink; the substrate is placed on the elastic compression zone, and the non-plating area is aligned with the recess; the elastic compression zone is pressed, such that the printing ink is adhered on the non-plating area, and the non-plating area is completely covered by the printing ink; the printing ink in the non-plating area is cured; the plating area is plated; and the printing ink is removed. With the method provided by the invention, production precision of the pattern can be improved.
Description
Technical field
The present invention relates to the plated film field, relate in particular to a kind of film coating method.
Background technology
Coating technique has been widely used in producing electronic product casing, as producing phone housing.From design demand, need to reserve non-plated film district so that follow-up brand identity pattern or other decorative pattern of processing with this non-coating film area shape and size match in substrate surface.Corresponding to coating process, often adopt baffle plate to be fixed in this substrate instantly and block prospective region, carry out plated film again, throw off baffle plate at last, promptly form the non-plated film district corresponding with this prospective region shape and size.The border in this non-plated film district is often fuzzyyer, is prone to cause the pattern contour of follow-up formation incomplete, and precision is difficult to reach customer requirement.
In view of this, it is real in necessary to provide a kind of film coating method to improve the design producing precision.
Summary of the invention
A kind of film coating method comprises: substrate and pressing mold are provided; This substrate has an outside surface, and this outside surface comprises plated film district and non-plated film district, and this pressing mold comprises the elasticity compression zone; This elasticity compression zone is provided with groove, this groove and this non-plated film district all with the shape of treating pattern and size match; In this groove, fill up printing ink; This substrate is placed this elasticity compression zone, and make this non-plated film district and this notch aligns; Push this elasticity compression zone, so that this printing ink is attached to this non-plated film district and hides this non-plated film district fully; Solidify the printing ink in this non-plated film district; In this plated film district plated film; And remove this printing ink.
Collaborative this non-plated film district of this groove provides printing ink to fill the space, is beneficial to printing ink and when this elasticity compression zone pressurized, is attached to this non-plated film district and obtains the profile consistent with this groove.So, the printing ink profile after sharpening solidifies, thus improve the precision of the follow-up pattern that makes.
Description of drawings
The substrate that the film coating method that Fig. 1 provides for present technique scheme one embodiment uses and the synoptic diagram of pressing mold.
Fig. 2 fills up the synoptic diagram of printing ink for the annular recesses of this pressing mold.
Fig. 3 is a synoptic diagram of pushing this pressing mold.
Fig. 4 is the synoptic diagram of the printing ink in the non-plated film of this substrate of curing district.
Fig. 5 is the synoptic diagram of the plated film district plated film of this substrate.
Fig. 6 is the synoptic diagram that removes the substrate behind the printing ink.
The main element nomenclature
Pressing mold 10
Fixed part 12
Fixed face 121
Outside surface 21
Non-plated film district 221
Embodiment
Specify the film coating method that the present technique scheme provides below in conjunction with accompanying drawing and embodiment.
Those of ordinary skills can be by following step embodiment of the present invention.
The first step referring to Fig. 1, provides pressing mold 10 and substrate 20.
Pressing mold 10 comprises compression zone 11 and fixed part 12.Compression zone 11 is rectangular-shaped, has impression face 111, and in impression face 111, is provided with annular recesses 112.The shape of annular recesses 112 and size and treat the shape and the consistent size of pattern.Elastic deformation can take place in compression zone 11 under the external force effect, and after cancelling this external force, can recover its natural shape.Compression zone 11 is processed by resilient material, like shape memory alloy (shape memory alloy) or shape memory polymer material (shape memory polymer).For example, the shape memory alloy for titanium-nickel alloy, titanium-nickel alloy, titanium, nickel-aluminum-zinc alloy, titanium, zinc, copper and nickel-aluminum alloy, zinc alloy, copper-zinc-calcium alloy, copper and nickel alloys, copper and aluminum B Sintered alloys, copper-zinc-silicon alloy, or other conventional shape memory alloy, the shape memory polymer may be a commercially available polyvinyl alcohol-based shape memory polymer material or a polyurethane based shape memory polymer material.Fixed part 12 has fixed face 121, and in fixed face 121, is provided with pickup groove 122.Fixed part 12 is hinged with one side of compression zone 11.Under the effect of external force, fixed part 12 can be towards 11 motions of impression face, until being laminated in this compression zone 11.
In second step,, in this annular recesses 112, fill up printing ink 30 through ink jet method, silk screen print method or injection referring to Fig. 1 and Fig. 2.This printing ink 30 is selected from commercially available any uV curable printing ink, is prone to and substrate 20 isolating printing ink after the preferred consolidation.
In the 3rd step, referring to Fig. 1 to Fig. 4, this fixed part 12 that overturns is to this compression zone 11.To align with this annular recesses 112 in this non-plated film district 221.Evenly push this fixed part 12 downwards.Be appreciated that compression zone 11 will shrink along pressure direction generation elastic deformation vertically downward everywhere.Printing ink 30 in the annular recesses 112 shortens with the spacing of substrate 20, and part printing ink 30a will be attached to this non-plated film district 221 and hide this non-plated film district 221 fully because of having flowability under the restriction of this annular recesses 112.
The 4th step, referring to Fig. 1 and Fig. 4, remove this fixed part 12 and substrate 20 from this compression zone 11 rapidly, solidify the printing ink 30a in this non-plated film district 211.After being appreciated that printing ink 30a curing molding, have shape and the size identical with annular recesses 112, printing ink 30a overlaps with this non-plated film district 211 in the projection of substrate 20 fully.
In the 5th step,, form rete 40 in these plated film district 211 plated films referring to Fig. 1 and Fig. 5.This coating process can adopt modes such as physical vapor deposition, cvd, laser boosting vapor deposition and plasma polymerization deposition.
The 6th step referring to Fig. 1,5 and 6, removed this printing ink 30a, in this non-plated film district 221, formed the mellow and full pattern 60 of profile thus.Printing ink 30 can directly tear off, or removes with the appropriate solvent dissolving.
Shape and size that this film coating method utilizes pressing mold 10 to provide to treat pattern are beneficial to and printing ink 30 full annular recessess 112 are obtained the profile consistent with annular recesses 112.So, the printing ink profile after sharpening solidifies improves the precision of the follow-up pattern that makes.In addition, the compression zone 11 of this pressing mold 10 is hinged with this fixed part 12, and it is accurate to be beneficial to the two contraposition.
And pressing mold 10 is not limited thereto structure, and this fixed part 12 can save, and can the contraposition reference point being set respectively in this substrate 20 and compression zone 11, to reach the two contraposition accurate.
It is understandable that those skilled in the art also can do other variation etc. and be used for design of the present invention in spirit of the present invention, as long as it does not depart from technique effect of the present invention and all can.These all should be included in the present invention's scope required for protection according to the variation that the present invention's spirit is done.
Claims (2)
1. film coating method comprises:
Substrate and pressing mold are provided, and this substrate has an outside surface, and this outside surface comprises plated film district and non-plated film district, and this pressing mold comprises the elasticity compression zone, and this elasticity compression zone is provided with groove, this groove and this non-plated film district all with the shape of treating pattern and size match;
In this groove, fill up printing ink;
This substrate is placed this elasticity compression zone, and make this non-plated film district and this notch aligns;
Push this elasticity compression zone, so that this printing ink is attached to this non-plated film district and hides this non-plated film district fully;
Solidify the printing ink in this non-plated film district;
In this plated film district plated film; And
Remove this printing ink.
2. film coating method as claimed in claim 1 is characterized in that, this pressing mold also comprises the fixed part hinged with this elasticity compression zone, and this film coating method also comprises this substrate is fixed in this fixed part, and rotates this fixed part and make this non-plated film district and this notch aligns.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2010102529897A CN102373406A (en) | 2010-08-13 | 2010-08-13 | Film plating method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN2010102529897A CN102373406A (en) | 2010-08-13 | 2010-08-13 | Film plating method |
Publications (1)
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CN102373406A true CN102373406A (en) | 2012-03-14 |
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CN2010102529897A Pending CN102373406A (en) | 2010-08-13 | 2010-08-13 | Film plating method |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104754081A (en) * | 2013-12-30 | 2015-07-01 | 比亚迪股份有限公司 | Cellphone housing and manufacturing method thereof |
CN108998755A (en) * | 2017-06-07 | 2018-12-14 | 深圳市鑫承诺环保产业股份有限公司 | A kind of accurate masking protection technique in 3D glass curve part |
CN112779522A (en) * | 2020-12-28 | 2021-05-11 | 芯思杰技术(深圳)股份有限公司 | Film coating device and film coating method |
Citations (5)
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CN1597333A (en) * | 2003-09-19 | 2005-03-23 | 希毕克斯影像有限公司 | Process for forming a patterned thin film structure for in-mold decoration |
CN1719338A (en) * | 2005-08-01 | 2006-01-11 | 西安交通大学 | Ultraviolet ray solidification cation type etching glue for nano embessing |
WO2006135258A1 (en) * | 2005-06-13 | 2006-12-21 | Advanced Nano Imaging Limited | Moulding |
CN101147239A (en) * | 2003-12-19 | 2008-03-19 | 北卡罗来纳大学查珀尔希尔分校 | Methods for fabricating isolated micro- and nano- structures using soft or imprint lithography |
CN101445903A (en) * | 2008-12-15 | 2009-06-03 | 宸阳光电科技(厦门)有限公司 | Pattern molding method in vacuuming metalling |
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2010
- 2010-08-13 CN CN2010102529897A patent/CN102373406A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1597333A (en) * | 2003-09-19 | 2005-03-23 | 希毕克斯影像有限公司 | Process for forming a patterned thin film structure for in-mold decoration |
CN101147239A (en) * | 2003-12-19 | 2008-03-19 | 北卡罗来纳大学查珀尔希尔分校 | Methods for fabricating isolated micro- and nano- structures using soft or imprint lithography |
WO2006135258A1 (en) * | 2005-06-13 | 2006-12-21 | Advanced Nano Imaging Limited | Moulding |
CN1719338A (en) * | 2005-08-01 | 2006-01-11 | 西安交通大学 | Ultraviolet ray solidification cation type etching glue for nano embessing |
CN101445903A (en) * | 2008-12-15 | 2009-06-03 | 宸阳光电科技(厦门)有限公司 | Pattern molding method in vacuuming metalling |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104754081A (en) * | 2013-12-30 | 2015-07-01 | 比亚迪股份有限公司 | Cellphone housing and manufacturing method thereof |
CN104754081B (en) * | 2013-12-30 | 2019-01-11 | 比亚迪股份有限公司 | Phone housing and preparation method thereof |
CN108998755A (en) * | 2017-06-07 | 2018-12-14 | 深圳市鑫承诺环保产业股份有限公司 | A kind of accurate masking protection technique in 3D glass curve part |
CN112779522A (en) * | 2020-12-28 | 2021-05-11 | 芯思杰技术(深圳)股份有限公司 | Film coating device and film coating method |
CN112779522B (en) * | 2020-12-28 | 2023-11-28 | 芯思杰技术(深圳)股份有限公司 | Coating device and coating method |
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Application publication date: 20120314 |