CN102367164A - One-dimensional microstructural array and preparation method thereof - Google Patents

One-dimensional microstructural array and preparation method thereof Download PDF

Info

Publication number
CN102367164A
CN102367164A CN201110330909XA CN201110330909A CN102367164A CN 102367164 A CN102367164 A CN 102367164A CN 201110330909X A CN201110330909X A CN 201110330909XA CN 201110330909 A CN201110330909 A CN 201110330909A CN 102367164 A CN102367164 A CN 102367164A
Authority
CN
China
Prior art keywords
substrate
dimension micro
structure array
preparation
micro structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201110330909XA
Other languages
Chinese (zh)
Inventor
陈延峰
葛海雄
袁长胜
卢明辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuxi Imprint Nano Technology Co Ltd
Original Assignee
Wuxi Imprint Nano Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuxi Imprint Nano Technology Co Ltd filed Critical Wuxi Imprint Nano Technology Co Ltd
Priority to CN201110330909XA priority Critical patent/CN102367164A/en
Publication of CN102367164A publication Critical patent/CN102367164A/en
Pending legal-status Critical Current

Links

Images

Abstract

The invention discloses a one-dimensional microstructural array and a preparation method thereof. The one-dimensional microstructural array is linear, spiral or needle-shaped, combing parts of the one-dimensional microstructural array and substrates are vertical to the substrates. The preparation method comprises the following steps of: 1, placing one layer of mutually non-contact nanometer or micrometer particles on the surfaces of the substrates; 2, clamping the upper substrate and the lower substrate together and carrying out proper processing to ensure that the particles are adhered and attached on the surface of the lower substrate; and 3, separating the upper substrate from the lower substrate under the proper condition to obtain the one-dimensional microstructural array on the surfaces of the substrates. The one-dimensional microstructural array has the advantages of novel structure and simple preparation, and can be widely applied to the fields such as optics, photoelectricity, information and the like.

Description

One dimension micro structure array and preparation method thereof
Technical field
The present invention relates to a kind of one dimension micro structure array and preparation method thereof, belong to material microstructure and preparing technical field thereof.
Background technology
One dimension micro structure array perpendicular to substrate surface has obtained to pay close attention to widely with its potential application.For example, the orthotropic one-dimensional nano line array in silicon chip substrate surface can be used for preparing novel solar cell, field emission effect that zinc oxide nano-wire array can obtain to strengthen or the like.The gas evaporation liquid-solid or gas-solid method growth of condensation is then adopted in the preparation of 1-dimention nano micro structure array commonly used at present usually, perhaps adopts the chemical solution method growth.But receive preparation method's restriction, the one dimension micro structure array of a lot of materials is difficult to preparation, therefore, needs new technology of preparing and method to obtain novel one dimension fine structure material and structure.
Summary of the invention
The purpose of this invention is to provide a kind of one dimension micro structure array, make this fine structure material can obtain extensive use in fields such as optics, photoelectricity, information.Another object of the present invention provides the preparation method of this fine structure material.
In order to realize the foregoing invention purpose, technical scheme of the present invention is following:
The one dimension micro structure array is positioned on the substrate, and this one dimension micro-structural is linear, spirality or aciculiform, and its part that combines with substrate is perpendicular to substrate.
In addition, the present invention prepares the method for said one dimension micro structure array, may further comprise the steps:
(1) descending substrate surface to place the particle of mutually non-touching nanometer of one deck or micron-scale;
(2) will go up substrate and following substrate and clip together and carry out suitable processing, and make particle stick to the surface of upper and lower substrate;
(3) under appropriate condition,, get final product to such an extent that be attached to the one dimension micro-structural of substrate surface with two substrate separation up and down of step (2).
The method of wherein placing particle at described substrate surface in the step (1) is spin coating, dip-coating, drip and be coated with, brush, spray, or above method combination in any; Suitable processing method described in the step (2) is that heating, the solvent vapo(u)r under air or protection gas condition handled, or above method combination in any; Appropriate condition described in the step (3) is natural environmental condition, control uniform temperature and time, solvent vapo(u)r and time control, or the combination of above method.
The present invention compared with prior art, its remarkable advantage is: (1) can obtain the one dimension micro-structural of the material that other physics or chemical method be difficult to grow.(2) obtained the novel one dimension micro-structural of some materials.(3) with low cost, technology is simple.
Description of drawings
Fig. 1 is an one dimension micro structure array preparation method's of the present invention flow chart of steps.
Fig. 2 is the ESEM picture that is attached to the surperficial borate glass one-dimensional nano line micro-structural of silicon chip substrate that the embodiment of the invention obtains.
The specific embodiment
Embodiment 1: silicon chip surface is obtained the mutually non-touching borate glass microballoon of one deck through dripping the method that is coated with; Then another wafer chuck being heated to its softening point temperature together in air makes microballoon stick to substrate surface up and down; Under the softening point temperature constant temperature, incite somebody to action two substrate separation up and down, promptly get the one-dimensional nano line micro structure array of silicon chip surface rapidly after the cooling.
Embodiment 2: with the method acquisition one deck mutually non-touching granules of polystyrene of quartz plate surface through spin coating; Then another quartz plate being clipped together in chloroform steam, to handle makes microballoon stick to substrate surface up and down; Under natural environmental condition, incite somebody to action two substrate separation up and down, promptly get the one-dimensional nano line micro structure array on quartz plate surface.
Embodiment 3: will polish the method acquisition one deck mutually non-touching normal silicate glass microsphere particle of smooth iron plate surface through dip-coating; Clip together with another iron plate then and under the argon shield condition, be heated to its softening point temperature processing; Make microballoon stick to substrate surface up and down; Under the softening point temperature constant temperature, incite somebody to action two substrate separation up and down, promptly get the one-dimensional nano line micro structure array on iron plate surface.
Embodiment 4: the quartz plate surface is obtained the mutually non-touching tin microballoon of one deck through the method for brushing; Then another quartz plate is clipped together and in air, be heated to its fusing point and make microballoon stick to up and down substrate surface; Two substrate separation up and down under the fusing point constant temperature promptly get the surperficial 1-dimention nano acicular microstructure array of quartz plate rapidly after the cooling.
Embodiment 5: with the method acquisition one deck mutually non-touching granules of polystyrene of the dull and stereotyped surface of polyethylene through spraying; Then another flat polyethylene plate holder being handled in chloroform steam together makes particle stick to substrate surface up and down; Under natural environmental condition, keep 10 minutes dryings; To two substrate separation up and down then, promptly get the 1-dimention nano helix micro structure array on quartz plate surface.
Embodiment 6: the alumina substrate surface is obtained the mutually non-touching E glass microsphere of one deck particle through dripping the method that is coated with; Clip together with other alumina substrate then and be heated to its softening point temperature processing; Make microballoon stick to substrate surface up and down; Under constant temperature, incite somebody to action two substrate separation up and down, promptly get the one-dimensional nano line micro structure array on alumina substrate surface.
Embodiment 7: with the method acquisition one deck mutually non-touching borate glass microballoon of silicon chip surface through spin coating; Then another wafer chuck being heated to its softening point temperature together in air makes microballoon stick to substrate surface up and down; Under the constant temperature that is lower than 20 ℃ of softening point temperatures, incite somebody to action two substrate separation up and down, promptly get the 1-dimention nano pin micro structure array of silicon chip surface after the cooling.

Claims (6)

1. the one dimension micro structure array is positioned on the substrate, it is characterized in that said one dimension micro-structural is linear, spirality or aciculiform, and its part that combines with substrate is perpendicular to substrate.
2. one dimension micro structure array according to claim 1, the material that it is characterized in that said one dimension micro-structural is organic and inorganic or metal material, its backing material is organic and inorganic or metal material.
3. one kind prepares the method for one dimension micro structure array according to claim 1, it is characterized in that may further comprise the steps:
(1) descending substrate surface to place the particle of mutually non-touching nanometer of one deck or micron-scale;
(2) will go up substrate and following substrate and clip together and carry out suitable processing, and make particle stick to the surface of upper and lower substrate;
(3) under appropriate condition,, get final product to such an extent that be attached to the one dimension micro-structural of substrate surface with two substrate separation up and down of step (2).
4. the preparation method of one dimension micro structure array according to claim 3 is characterized in that, the method for placing particle at described down substrate surface in the step (1) is: spin coating, dip-coating, drip and be coated with, brush, spray, or above method combination in any.
5. the preparation method of one dimension micro structure array according to claim 3 is characterized in that, the suitable processing method described in the step (2) is: heating under air or protection gas condition, solvent vapo(u)r are handled, or above method combination in any.
6. the preparation method of one dimension micro structure array according to claim 3 is characterized in that, the appropriate condition described in the step (3) is: natural environmental condition, control uniform temperature and time, solvent vapo(u)r and time control, or the combination of above method.
CN201110330909XA 2011-10-27 2011-10-27 One-dimensional microstructural array and preparation method thereof Pending CN102367164A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201110330909XA CN102367164A (en) 2011-10-27 2011-10-27 One-dimensional microstructural array and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201110330909XA CN102367164A (en) 2011-10-27 2011-10-27 One-dimensional microstructural array and preparation method thereof

Publications (1)

Publication Number Publication Date
CN102367164A true CN102367164A (en) 2012-03-07

Family

ID=45759764

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201110330909XA Pending CN102367164A (en) 2011-10-27 2011-10-27 One-dimensional microstructural array and preparation method thereof

Country Status (1)

Country Link
CN (1) CN102367164A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108892100A (en) * 2018-06-25 2018-11-27 武汉大学 A kind of preparation method of metal nano needle tip array

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101143705A (en) * 2007-11-01 2008-03-19 南京大学 Method for preparing micrometer and submicron probe arrays
CN101172573A (en) * 2006-11-01 2008-05-07 国家纳米技术与工程研究院 Silver nano-grain array mould plate and preparation method thereof
US20080170982A1 (en) * 2004-11-09 2008-07-17 Board Of Regents, The University Of Texas System Fabrication and Application of Nanofiber Ribbons and Sheets and Twisted and Non-Twisted Nanofiber Yarns
CN101384505A (en) * 2006-02-20 2009-03-11 马克斯-普朗科技发展研究院 Patterning method and device with a patterned surface
CN101818345A (en) * 2009-11-13 2010-09-01 襄樊学院 Preparation process for growing zinc oxide nanorod arrays by two-step method
CN101899726A (en) * 2010-08-17 2010-12-01 西南交通大学 Method for preparing nano-carbon fibers

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080170982A1 (en) * 2004-11-09 2008-07-17 Board Of Regents, The University Of Texas System Fabrication and Application of Nanofiber Ribbons and Sheets and Twisted and Non-Twisted Nanofiber Yarns
CN101384505A (en) * 2006-02-20 2009-03-11 马克斯-普朗科技发展研究院 Patterning method and device with a patterned surface
CN101172573A (en) * 2006-11-01 2008-05-07 国家纳米技术与工程研究院 Silver nano-grain array mould plate and preparation method thereof
CN101143705A (en) * 2007-11-01 2008-03-19 南京大学 Method for preparing micrometer and submicron probe arrays
CN101818345A (en) * 2009-11-13 2010-09-01 襄樊学院 Preparation process for growing zinc oxide nanorod arrays by two-step method
CN101899726A (en) * 2010-08-17 2010-12-01 西南交通大学 Method for preparing nano-carbon fibers

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108892100A (en) * 2018-06-25 2018-11-27 武汉大学 A kind of preparation method of metal nano needle tip array

Similar Documents

Publication Publication Date Title
Li et al. Zinc oxide films prepared by sol–gel method
CN111874896B (en) Method for accurately transferring two-dimensional material and application thereof
Yang et al. Aligned SiC porous nanowire arrays with excellent field emission properties converted from Si nanowires on silicon wafer
Jiang et al. mediated controlled densification and low temperature transfer of carbon nanotube forests for electronic interconnect application
CN104960286B (en) A kind of controlled two-dimensional material flexibility transfer method
CN102942178A (en) Compound base of precious metal nanometer array and single layer graphene and preparation method thereof
Bachan et al. A comparative investigation on the structural, optical and electrical properties of SiO 2–Fe 3 O 4 core–shell nanostructures with their single components
Nguyẽn et al. Thermionic emission via a nanofluid for direct electrification from low-grade heat energy
CN101559939B (en) Preparation method of carbon nano tube
CN103964507A (en) Single-layer transition metal sulfur compound thin film and preparation method thereof
CN106248573A (en) The method of testing of adhesion between material and lunar dust under vacuum environment
CN105142803B (en) Using particle alignment coating method and thus made of particle coating substrate
CN104528664B (en) The preparation method of two dimension telluride gallium material
CN102367164A (en) One-dimensional microstructural array and preparation method thereof
CN104477995B (en) A kind of MoO2the preparation method of nanometer sheet and MoO2nanometer sheet
Wang et al. Tunable Contacts of Bi2O2Se Nanosheets MSM Photodetectors by Metal‐Assisted Transfer Approach for Self‐Powered Near‐Infrared Photodetection
US8029869B2 (en) Structure fabrication using nanoparticles
CN105097989A (en) Method for preparing zinc sulfide photoelectric film
CN107974730A (en) The preparation method of zinc oxide nano fiber
Sharma et al. Spin-coated ZnO thin films using ZnO nano-colloid
RU2009141597A (en) METHOD FOR PRODUCING PAINTED GRINDED MATERIAL
CN107344730A (en) A kind of preparation method of zinc-oxide nano column array
CN106270534A (en) The preparation method of metal nano/micron ring in order
US10707076B2 (en) Nanostructure composite material and manufacturing method thereof
CN102867859B (en) The preparation method of Dual band IR detecting material and system

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C12 Rejection of a patent application after its publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20120307