CN102347304A - 具有改进的可安装性的无引线芯片载体 - Google Patents

具有改进的可安装性的无引线芯片载体 Download PDF

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Publication number
CN102347304A
CN102347304A CN2011102136322A CN201110213632A CN102347304A CN 102347304 A CN102347304 A CN 102347304A CN 2011102136322 A CN2011102136322 A CN 2011102136322A CN 201110213632 A CN201110213632 A CN 201110213632A CN 102347304 A CN102347304 A CN 102347304A
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Prior art keywords
contact
encapsulation
installation surface
lead frame
bonding
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CN2011102136322A
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Inventor
洛尔夫·安科约科伯·格罗恩休斯
马库斯·比约恩·埃里克·诺仁
王飞莹
萧喜铭
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Koninklijke Philips NV
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Koninklijke Philips Electronics NV
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Publication of CN102347304A publication Critical patent/CN102347304A/zh
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Abstract

根据示例实施例，公开了一种用于半导体器件的可表面安装的无引线芯片载体。所述器件包括第一触点；相对于第一触点的第二触点，所述第二触点中具有裂口，用于提供相对于彼此设置的第二触点的第一和第二部分，以减轻焊接情况时的倾斜，所述焊接情况包括将晶片载体的附着到印制电路板(PCB)上。

Description

具有改进的可安装性的无引线芯片载体
技术领域
本发明的实施例涉及半导体器件封装，更具体地涉及改进的封装，所述改进的封装提高了产品的可制造性和产品质量。
背景技术
电子工业仍然依靠半导体技术的进步来实现更加紧凑面积上的高级功能器件。对于许多应用，实现高级功能器件要求将大量电子器件集成到单独的硅晶片上。随着给定面积的硅晶片上的电子器件数量的增加，制造工艺变得更加困难。
已经制造了各种半导体器件应用于多种学科。这些硅基半导体器件通常包括金属氧化物半导体场效应晶体管(MOSFET)，诸如p-沟道MOS(PMOS)晶体管、n-沟道(NMOS)晶体管以及互补MOS(CMOS)晶体管、双极晶体管，BiCMOS晶体管。这些MOSFET器件包括在导电栅极和硅样衬底之间的绝缘材料；因此这些器件一般称作IGFET(绝缘栅FET)。
这些半导体器件的每一个通常包括其上形成多个有源器件的半导体衬底。给定的有源器件的具体结构可以根据器件类型的不同而变化。例如，在MOS晶体管中，有源器件通常包括源极区和漏极区以及栅电极，所述栅电极调制源极区和漏极区之间的电流。
此外，这些器件可以是在多种晶片制造工艺中生产的数字或模拟器件，例如CMOS、BiCMOS、双极型等等。衬底可以是硅、砷化镓(GaAs)或者适合在其上面构建微电子电路的其他衬底。
IC器件的封装在器件的最终性能方面起着日益重要的作用。具体封装构造上的缺陷可能会影响安装工艺。例如，将IC部件放置于印制电路板(PCB)上并焊接于其上。焊接工艺或封装可能会引起封装不能光滑均匀地位于PCB上，安装后的封装实质上倾斜。此外，焊接质量不能在最终的PCB成品中可见。在不确保焊接牢固(不能清晰可见)的情况下将PCB放置于现场中会造成很大风险。值得特别关注的是IC器件在诸如自动化或军事应用之类的艰苦环境下，在所述艰苦环境中极端温度、湿度和机械应力是常态。焊接接头的现场故障是不可接受的。
现在需要具有更好的可制造性并对于倾斜不敏感的封装。
发明内容
在将无引线芯片载体焊接在印制电路板上时，需要在封装端处可以观察到焊接的质量，并且需要载体平放地足够平整。本公开解决了这些问题。
在示例实施例中，提出了一种用于半导体器件的可表面安装的无引线的芯片载体。所述器件包括第一触点。第二触点与第一触点相对；第二触点中具有裂口，用于提供第二触点的相对于彼此设置的第一和第二部分，以减轻焊接时的倾斜状态，所述焊接情况包括将芯片载体附着到印制电路板(PCB)上。
在另一个示例实施例中，提出了一种小轮廓二极管(SOD)封装，用于表面安装于印制电路板(PCB)上。所述封装包括：第一长度和宽度的第一触点，具有键合表面、底部安装表面和侧面安装表面，所述键合表面具有附着二极管管芯的区域；第二长度和宽度的第二触点，所述第二触点与所述第一触点相对，所述第二触点具有键合表面、底部安装表面和侧面安装表面，所述键合表面具有用于附着键合引线的区域，所述键合引线将二极管管芯电连接至第二触点。所述第二触点中具有裂口，用于提供第二触点的相对于彼此设置的第一和第二部分，以减轻焊接情况时的倾斜，所述焊接情况包括将芯片载体附着到PCB上。模塑料的封装包封第一触点和第二触点，所述第一触点和第二触点的侧面安装表面保持暴露，所述侧面安装表面提供焊接情况的可视表示。
在另一个示例实施例中，按照小轮廓二极管(SOD)封装对半导体二极管器件进行了封装。所述器件包括：在管芯位置的阵列中设置的引线框，每一个管芯位置具有：第一长度和宽度的第一触点，具有键合表面、底部安装表面和侧面安装表面，所述键合表面具有附着二极管管芯的区域；第二长度和宽度的第二触点，所述第二触点与所述第一触点相对，所述第二触点具有键合表面、底部安装表面和侧面安装表面，所述键合表面具有用于附着键合引线的区域，所述键合引线将二极管管芯电连接至第二触点；所述第二触点中具有裂口，用于提供第二触点的相对于彼此设置的第一和第二部分，以减轻焊接情况时的倾斜，所述焊接情况包括将芯片载体的附着到PCB上。模塑料的封装包封了二极管管芯位置的阵列。沿第一方向在每一个管芯位置之间锯切引线框，暴露出第一触点上的侧面安装表面和第二触点上的侧面安装表面，所述第二触点的侧面安装表面中具有相应的裂口，所述侧面安装表面与所述封装齐平。另外，用锡电镀所述引线框。沿第二方向锯切所述引线框，从而将二极管管芯位置的阵列分离为分立的二极管器件。在安装到PCB上的期间，所述分立的二极管器件的侧面安装表面提供焊接情况的表示。
在另一个示例实施例中，提出了一种制造小轮廓二极管(SOD)封装的方法，所述SOD封装具有引线框，所述引线框包括第一触点和与第一触点相对的第二触点，所述第二触点中具有裂口，用于提供第二触点的相对于彼此设置的第一和第二部分，以减轻焊接情况时的倾斜，所述焊接情况包括将芯片载体附着到印刷电路板PCB上。所述方法包括：提供多个产品管芯，所述产品管芯具有衬底连接和引线键合连接；提供多个引线框；将衬底连接处的产品管芯键合到每一个引线框的第一触点上，并且将产品管芯从引线键合连接引线键合到第二触点；将所述多个产品管芯和多个引线框包封在模塑料中；部分地切割每一个已包封产品管芯之间的所述多个引线框；对每一个产品管芯的每一个引线框的暴露金属电镀锡；将每一个已包封的产品管芯彼此分离；以及测试每一个产品管芯。
本公开的上述发明内容并非易于表示本发明的每一个实施例或者本发明的每一个方面。在后续附图和详细描述中提供了其他方面和示例实施例。
附图说明
结合附图、考虑本发明的各种实施例的以下详细描述，可以更加全面地理解本发明，其中：
图1(现有技术)示出了安装后的实质上倾斜的几种封装；
图2是根据本公开的封装的示例实施例的线条画；
图3A至3D示出了图2的封装应用；
图4A至4D示出了图2封装中的以黑模塑料包封的示例部件；以及
图5示出了根据本公开实施例的无引线封装的示例装配工艺的流程图；以及
图6A至6C示出了经历图5所概括的装配工艺时的示例引线框的锯切。
尽管本发明可以修改为各种变体和替代形式，在附图中作为示例已经示出了其细节，并且将详细描述。然而应该理解的是该目的并非将本发明局限于这里描述的具体实施例。相反，其意欲覆盖落在由所附权利要求所限定的本发明的精神和范围之内的所有修改、等价物和替代。
具体实施方式
已经发现所公开的实施例在将无引线芯片载体表面安装到印制电路板(PCB)方面有益。在表面安装期间，需要的是将部件平置于PCB上，而且芯片载体和PCB组合在一定高度的剖面上。然而，焊接时浸水缺陷可能会引起无引线芯片载体倾斜，导致剖面过高。针对图1，组100中的四个器件110焊接到印制电路板120上，导致所述器件的焊接剖面130倾斜而形成不平坦的剖面。
在焊料回流工艺期间，当焊料熔化时，所述焊料如图1所示堆积在封装下面，部件倾斜至一侧，并且焊料凝固后导致倾斜。在一个实施例中，通过双引线(一条引线拥有两个分离的焊盘)防止了倾斜的可能性。在该实施例中，将焊料拉向边缘，减小了元件下面的焊料的量。拉力提高了在侧面触点的抗倾斜效果。剩余的焊料在底部在两个焊盘之间划分。两边的表面张力防止部件沿一个方向滑动。
参考图2，在缩放的附图中展示了根据本公开实施例的封装200。在封装的下部是第一触点215和第二触点225，所述第二触点在安装到印刷电路板上的侧面上分为第一部分225a和第二部分225b。在反面，第一部分225a和第二部分225b电学连接。在这一反面，提供了用于引线键合的附着区域。获得了小于0.4mm封装高度的边界205(表示封装)。从侧视图来看，触点225a和225b是彼此分离的并且是可见的。在附着到印制电路板上期间，焊料会从触点225a’和225b’的底部通过毛细作用流至侧面；同理焊料会从触点215的底部吸通过毛细作用流至侧面。因此，可以轻而易举的通过单纯的肉眼观测到焊接结合点的质量。要注意的是在示例生产工艺中，封装200将是引线框的形式，而在量化的时候布置为“带子和卷轴”。在装配期间，突出物240将触点215和225保持在将半导体管芯粘贴到第一触点215上的附着区域上位置。半导体管芯从管芯上的管芯焊盘区引线键合并且连接至触点225的附着区域。装配后的管芯进行包封。包封之后，引线框在突出物240和空间245处分离(如图虚线部分所示)。这些都示出了在触点215’和225’处的已封装管芯上。
参考图3A-3D。在根据本发明公开的示例实施例，将小轮廓二极管(SOD)封装300在四个透视图中进行描述。图3A示出了SOD的透视图。第一触点325和第二触点315将二极管管芯330与键合引线335电学相连，并且通过二极管管芯310下侧的直接连接(在所定义的区域330处)。在模塑料的封装305之内，封装了所安装的二极管管芯310和触点325、315。参考图3B，注意将第二触点310分为两个部分320’。这种特征减小了当将SOD器件焊接到印刷电路板上时倾斜的可能性。另外注意的是，第二触点325和第二触点320具有凸缘，所述凸缘允许模塑料在其周围流动，以便增加封装305的机械强度。这些SOD封装设置为用于保持多于8000个器件的引线框阵列中，划分为四个区域(即“模制覆盖物”)。因此在封装期间，将8000个器件同时封装在模塑料中。
参考图3C。从封装300的第一短边观看的第一触点315从封装300的底部在所述边上部分地朝上延伸，与封装305齐平。同样地在图3D中，从第二短边观看的第二触点325部分地朝上延伸并且也与封装305齐平。注意在虚线340处，第二触点具有第一部分325a和第二部分325b。
为了提供可焊接的表面，将触点用锡或者其他合适的金属电镀。当将SOD封装焊接到PCB时，在检查期间，人们可以容易地看出焊接质量是否足够。其中从侧面不可见触点的现有封装将要求昂贵的X射线扫描来评估焊接。
在二极管管芯310的安装和封装期间第一触点和第二触点将是按照带子和卷轴形式提供给用户的引线框组件的一部分。阴极位于二极管管芯310的下侧，阳极位于二极管管芯310的顶侧。每一个引线框组件将在具有在先结合的触点315’和325’的抽头处与另一个相结合。在管芯安装和封装之后，将“单一化”所述引线框组件，将其分离成分立的SOD产品。
在根据本发明的示例实施例中，已经将二极管管芯装配到SOD封装中。参考图4A-4D，图4A的长边视图示出了区域415’和425’，其中包括引线框(如参考图2所述)和触点415和触点部分425a。图4B的下侧视图描述了触点415和触点425a和425b。图4C和图4D的短边视图分别示出了触点415和触点425a和425b。这些触点朝上延伸所述封装405的完成垂直部分的一部分。另外，这些触点与封装405齐平。
在根据本发明的制造实施例中，可以参考图5描述示例工艺。所述工艺通常开始于准备材料库存，例如引线框(例如参考图2所述的那些引线框)、用于管芯附着的环氧胶、用于引线键合的金引线以及用于封装的模塑料。利用多种现代制造工艺，检查这些材料以看出它们是否满足卖主/制造商同意的质量标准。在示例工艺中，将引线框作为每一条具有四个框的条带进行递送。在每一个框内，存在多于800个位置用于安装二极管。依赖于工艺规范，可以对所述条带进行组合以实现具有多个框的带子和卷轴。
产品管芯的晶片，例如二极管由制造线接收。晶片经历切割510，在切割时将功能管芯从无用物(dud)上分离出来。将二极管块管芯键合520至引线框。附带地，所述引线框可以按照带子和卷轴形式递送，这种形式保持了成千上万个单独的引线框(即，与运动图片电影的单一的帧类似)。所述引线框由合适的金属构成。例如，通常使用铜，但是具体的应用可以使用其他金属和合金。可以使用导电环氧键合化合物，但是其不局限于这种具体类型的附着方式。在其他工艺中，可以使用共熔管芯附着。在管芯键合520之后，固化环氧胶。在固化之后，在等离子体中清洁所述组件。从二极管管芯的限定键合焊盘(键合二极管阳极)到引线框的限定键合焊盘(键合二极管阳极)，将管芯引线键合530至引线框。在引线键合530之后，再次在等离子体中清洁所述组件。在已经将所述管芯附着到引线上并且进行了引线键合，将所述组件封装在模塑料540中。封装的触点一侧(下侧)上的带子保持所述模塑料流到触点上。因此，引线在底部处与模塑料齐平。所述模塑料经历了固化工艺。
在示例工艺中，在模制540之后，在引线框的条带上存在多个器件。参考图6A-6C。为了在处理期间维持引线框的可靠性，在封装的顶侧上进行封装620之后，将支持带640应用于所述多个器件。在电镀锡之前，在“特定的切割”工艺545中准备所述多个器件。在每一个器件之间，爪630在边界进行切割，沿第一方向分离与附加的引线框相邻的第一引线框610。所述爪完全地切割通过触点，并且只是略微地切割到模塑料620中。在锯切之后，分离闪光工艺从引线框上去除了金属碎片等。将第一和第二触点的下侧表面和垂直表面暴露出来用锡或其他合适的金属进行电镀650，锡或者合适的金属具有更适用于与裸铜的焊接特性。所封装组件的引线用锡电镀550。因为只进行了一次切割，所述器件仍然沿其他方向与邻居器件和整个引线框电学相连，因此电镀锡是可能的。另外，保持了引线框的结构完整性，使得在电镀之前可以去除支撑带。
在已经电镀了引线之后，沿两个方向对器件进行最后的引线切割555，第二次切割以完整所述部分切割，然后是沿与第一和第二切割垂直方向的第三次切割，如图6C所示。然后在单一化工艺560中将这些块分离。利用第二次切割635完成了之前施加给多个器件的部分切割，所述第二次切割完全地穿过了器件的封装，并且部分地进入支撑带640。将单一化的器件直观地分类，以精选出在分离期间损坏的器件。所装配的器件的电学测试和标记570确保了将器件装货为终端用户功能。
在不脱离所附权利要求所限定的本发明的精神和范围的情况下，本发明的多个其他实施例对于本领域普通技术人员而言将是清楚明白的。

Claims (16)

1.一种可表面安装的无引线的芯片载体，用于半导体器件，包括：
第一触点；以及
与第一触点相对的第二触点，所述第二触点中具有裂口，用于提供第二触点的相对于彼此设置的第一和第二部分，以减轻焊接情况时的倾斜，所述焊接情况包括将芯片载体附着到印制电路板PCB上。
2.根据权利要求1所述的芯片载体，其中将所述第一触点和所述第二触点包封在模塑料中，所述模塑料形成为与第一触点和第二触点相接的实质上矩形的形状；
其中所述第一触点具有在所述模塑料上暴露的垂直表面；以及
其中所述第二触点具有在所述模塑料上暴露的垂直表面，所述第二触点的垂直表面中具有相应的裂口。
3.根据权利要求1所述的芯片载体，其中将第二触点的第一和第二部分相分离的所述裂口提供所述第一和第二部分的相对的垂直表面区域。
4.根据权利要求3所述的芯片载体，其中将相对的垂直表面区域间隔开，以在将芯片载体附着到印刷电路板PCB的工艺期间，从第一和第二触点下面通过毛细作用带走过多的焊料。
5.根据权利要求3所述的芯片载体，其中所述第一和第二部分的相对的垂直表面区域的表面张力实质上相等。
6.根据权利要求4所述的芯片载体，其中在将芯片载体附着到PCB之后，所述第一触点和所述第二触点的垂直表面提供焊接情况的可视表示。
7.一种小轮廓二极管SOD封装，用于表面安装到印刷电路板PCB上，包括：
第一长度和宽度的第一触点，具有键合表面、底部安装表面和侧面安装表面，所述键合表面具有附着二极管管芯的区域；
第二长度和宽度的第二触点，所述第二触点与所述第一触点相对，所述第二触点具有键合表面、底部安装表面和侧面安装表面，所述键合表面具有用于附着键合引线的区域，所述键合引线将二极管管芯电连接至第二触点；
所述第二触点中具有裂口，用于提供第二触点的相对于彼此设置的第一和第二部分，以减轻焊接情况时的倾斜，所述焊接情况包括将芯片载体附着到PCB上；以及
包封第一触点和第二触点的模塑料的封装，所述第一触点和第二触点的侧面安装表面保持暴露，所述侧面安装表面提供焊接情况的可视表示。
8.根据权利要求7所述的SOD封装，其中将所述第二触点的第一和第二部分相分离的裂口提供第一和第二部分的相对的侧面安装表面区域。
9.根据权利要求8所述的SOD封装，其中将相对的侧面安装表面区域间隔开，以在将SOD封装附着到印刷电路板PCB的工艺期间，从第一和第二触点下面通过毛细作用带走过多的焊料。
10.根据权利要求8所述的SOD封装，其中所述第一和第二部分的相对的侧面安装表面区域的表面张力实质上相等。
11.根据权利要求7所述的SOD封装，其中对所述第一触点和所述第二触点电镀锡。
12.一种按照小轮廓二极管SOD封装进行封装的半导体二极管器件，所述器件包括：
在管芯位置的阵列中设置的引线框，每一个管芯位置具有：
第一长度和宽度的第一触点，具有键合表面、底部安装表面和侧面安装表面，所述键合表面具有附着二极管管芯的区域；
第二长度和宽度的第二触点，所述第二触点与所述第一触点相对，所述第二触点具有键合表面、底部安装表面和侧面安装表面，所述键合表面具有用于附着键合引线的区域，所述键合引线将二极管管芯电连接至第二触点；所述第二触点中具有裂口，用于提供第二触点的相对于彼此设置的第一和第二部分，以减轻焊接情况时的倾斜，所述焊接情况包括将芯片载体的附着到PCB上；以及包封二极管管芯位置的阵列的模塑料的封装，
其中沿第一方向在每一个管芯位置之间锯切引线框，暴露出第一触点上的侧面安装表面和第二触点上的侧面安装表面，所述第二触点的侧面安装表面中具有相应的裂口，所述侧面安装表面与所述封装齐平，
其中用锡电镀所述引线框；
其中沿第二方向锯切所述引线框，从而将二极管管芯位置的阵列分离为分立的二极管器件；以及
其中在安装到PCB上期间，所述分立的二极管器件的侧面安装表面提供焊接情况的表示。
13.根据权利要求12所述的半导体器件，其中所述引线框设置到4象限框中，每一个象限具有500个位置。
14.根据权利要求12所述的半导体器件，其中所述引线框是NiPdAu合金的。
15.根据权利要求12所述的半导体器件，其中所述引线框配置为多个框。
16.一种制造小轮廓二极管SOD封装的方法，所述SOD封装具有引线框，所述引线框包括第一触点和与第一触点相对的第二触点，所述第二触点中具有裂口，用于提供第二触点的相对于彼此设置的第一和第二部分，以减轻焊接情况时的倾斜，所述焊接情况包括将芯片载体附着到印刷电路板PCB上，所述方法包括：
提供多个产品管芯，所述产品管芯具有衬底连接和引线键合连接；
提供多个引线框；
将衬底连接处的产品管芯键合到每一个引线框的第一触点上，并且将产品管芯从引线键合连接引线键合到第二触点；
将所述多个产品管芯和多个引线框包封在模塑料中；
部分地切割每一个已包封产品管芯之间的所述多个引线框；
对每一个产品管芯的每一个引线框的暴露金属电镀锡；
将每一个已包封的产品管芯彼此分离；以及
测试每一个产品管芯。
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