CN102324289B - Thick-film resistor board and manufacturing method thereof - Google Patents
Thick-film resistor board and manufacturing method thereof Download PDFInfo
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- CN102324289B CN102324289B CN201110143084.0A CN201110143084A CN102324289B CN 102324289 B CN102324289 B CN 102324289B CN 201110143084 A CN201110143084 A CN 201110143084A CN 102324289 B CN102324289 B CN 102324289B
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Abstract
The invention discloses a thick-film resistor board comprising a substrate, electrodes, a conduction band and at least one resistor film layer and can also comprise a protective layer covering on the conduction band; and the substrate is a flexible substrate. The invention also discloses a manufacturing method of the thick-film resistor board, comprising the step of arranging a plurality of thick-film resistor board units in matrix arrangement on the flexible substrate. The thick-film resistor board provided by the invention can be warped and bent and has the characteristics of strong wear resistance, good linearity, long service life and the like; and the manufacturing method of the thick-film resistor board in the invention is suitable for large-scale industrial production.
Description
Technical field
The present invention relates to the manufacture method of a kind of resistance board and resistance board, relate in particular to a kind of thick-film resistor board of apply to Section automobile air valve position transducer and the manufacture method of thick-film resistor board.
Background technology
In recent years, the fast development of auto industry has driven the update of vapour, motorcycle electric technology.Automobile environment-protection, power-saving technology obtain the extensive attention of industry day by day, and at present, straight spray (EFI) epoch of internal vapor, motorcycle engine fuel system arrive.Throttle position sensor is an important sensor of engine fuel electric injection system, it is one of transducer for detecting in real time vehicle engine operating condition, mainly for detection of the open angle of engine air throttle valve body, position is also arrived electric injection system ECU by this angle (position) signal with curtage transfer of data, calculate and regulate fuel injector and air valve by ECU according to these data, make both reach suitable ratio state, thereby the mixed proportion that guarantees fuel oil and pure air can remain at the optimum state of completing combustion, thereby make engine reach in the course of the work capable of saving fuel oil, reduce the requirement of environmental pollution.Resistance board product is as the key components and parts of throttle position sensor, the open angle of throttle valve body, position can be converted to output voltage (stream) signal in specific linear resistance mode, make the mechanical location of throttle valve body be converted to analog signal, realized electric control function.
In the prior art, there is the thick-film resistor board that adopts advanced thick film microelectronic technique to prepare.At the Chinese invention patent of already having announced, application number: 200810029184.9, announce one based on ceramic substrate, material is made as 96%AL
2o
3thick-film resistor board, a kind of typical throttle position sensor thick-film resistor board is provided.This resistance board adopts the AL of hard
2o
3(aluminium oxide) pottery is as basis material.As everyone knows, aluminium oxide material belongs to rigid matrix material, therefore, the finished product forming have cannot bend, the feature of warped, so, this series products can only be used in the throttle position sensor system with plane function, cannot apply for the throttle system with bent axle face or linear compensation function.Therefore, the scope of application of this series products based on alumina substrate is more limited, cannot fully meet the multiple demand that domestic automobile fuel oil direct-injection system specification is many, kind is assorted.
In addition, in above-mentioned Chinese patent, the production technology of thick-film resistor board has adopted advanced thick film microelectronic technique, and ceramic substrate is divided into paddle-tumble in length and breadth or the line with specific settings feature with laser or other cutting modes in advance.Although this kind of mode obtained good product and cut apart characteristic in blocks, is conducive to industrial processes.But laser scribing is with high costs, efficiency is not high, has further limited the use of product.Further, the present inventor notices, adopts thick film ceramic technique to need higher technological temperature, and product process energy resource consumption is larger, is unfavorable for improving product competitiveness.Further again, the resistance printing material adopting due to above-mentioned thick-film resistor board is fixed carbon resister slurry, and the main component of this kind of material is the Low Temperature Thermal thermosetting resin of one pack system or many components.In process practice, due to the mismatch of the material coefficient of expansion, be conventionally easy to produce AL
2o
3substrate and carbon membrane paste material produce the possibility that adhesion is not strong in LOTES process, and therefore the adhesion property of product is bad, further affects the resistance to wear of sensor electrical baffle-wall.Moreover aluminium oxide ceramics surface is in fact rough, further specifically, the surface smoothness of aluminium oxide ceramics affects uniformity and the adhesive force of rete, thereby further affects the linearity of sensor electrical baffle-wall.In a word, above-mentioned resistance board of the prior art, one side has limited the range of application of thick film ceramic panel products.On the other hand, immature due in prior art, the reliability of product quality also cannot meet the technical requirement of auto industry harshness.
Summary of the invention
Technical problem to be solved by this invention is for above-mentioned the deficiencies in the prior art, and a kind of manufacture method with flexibility and the consistent thick-film resistor board of each storeroom thermal coefficient of expansion, the long band of thick-film resistor board and described thick-film resistor board is provided.This thick-film resistor board can bend and warped, has expanded the scope of application; Also there is the higher linearity, improved resistance to wear and the life-span of product.The long band of this thick-film resistor board is applicable to large-scale industrial production manufacture, and production efficiency is provided.
For solving the problems of the technologies described above, with regard to thick-film resistor board, the technical scheme that thick-film resistor board of the present invention is taked is: a kind of thick-film resistor board, comprise substrate, at least one resistive layer, at least one left electrode rete and at least one right electrode rete, described resistive layer, left electrode and right electrode are arranged on substrate, the left end of described resistive layer contacts with left electrode rete, and the right-hand member of resistive layer contacts with right electrode rete, and described substrate is flexible substrate.Adopt flexible substrate, the present invention has been obtained can warped, the feature of bending, is conducive to Product Assembly, further expands the scope of application of product.
As further improved technical scheme of the present invention, described left electrode rete and (or) right electrode rete are made up of the electrode welding plate connecting in turn, electrode conduction band and contact electrode, contact electrode and resistive layer joint.The shape that electrode welding plate, electrode conduction band and contact electrode can arrange electrode rete and thick-film resistor board is flexibly set, to be applicable to various practical matter.
Also comprise protective layer as further improved technical scheme of the present invention, described protective layer covers above electrode conduction band.Protective layer used in guard electrode conduction band, avoid the wearing and tearing of electrode conduction band and put the situation of loss or short circuit and short circuit.
As further improved technical scheme of the present invention, described flexible substrate is macromolecule polyimide film material; Described left electrode rete and right electrode rete are conductive polymer elargol, Low Temperature Thermal thermosetting resin elargol or splash-proofing sputtering metal alloy; Described resistive layer is nano-scale carbon film resin material.Flexible substrate is selected resistant to elevated temperatures flexible polyimide film conventionally, and therefore this thick-film resistor board can warped and bending point, is conducive to Product Assembly, has further expanded the scope of application of product.Conductive polymer silver angle easily obtains consistent with flexible polyimide film with Low Temperature Thermal thermosetting resin elargol on thermal coefficient of expansion, thereby, in technique, more easily obtain good adhesion of slurry and the smooth characteristic of printing, resistance to wear and the life-span of product are further improved, the linearity of product has also obtained good raising simultaneously, and quality level and the reliability of product significantly improve.
With regard to the manufacture method of above-mentioned thick-film resistor board, the technical scheme that the present invention takes is: a kind of method of manufacturing above-mentioned thick-film resistor board, comprises the following steps:
A: preparation has the substrate of flexible structure, and some matrix structures are set on substrate;
B: in flexible substrate, adopt at least two pairs of thick film screen printing method printings to be in right left electrode rete and right electrode rete, left electrode rete and right electrode rete be reserve for the position of resistive layer is set, then insert in low-temperature setting stove and to solidify;
C: adopt at least two of thick film screen printing method printings to set the resistive layer of shape in flexible substrate, resistive layer is arranged in the reserved position of step B and resistive layer two ends contact with left electrode rete and right electrode rete respectively, the left electrode rete at each resistive layer and two ends thereof and right electrode rete are a thick-film resistor board unit, each thick-film resistor board unit is parallel to each other and forms matrix form setting, thereby form the long band of thick-film resistor board, then long thick-film resistor board band is inserted in low-temperature setting stove and solidified;
Or, in flexible substrate, adopt mask evaporation or at least two pairs of lithographic method settings to be in right left electrode rete (3) and right electrode rete, between left electrode rete and right electrode rete for reserved for the position of resistive layer is set;
D: above-mentioned thick-film resistor board unit is brought and cut down from thick-film resistor board length, form independently thick-film resistor board.
The present invention arranges multiple resistive layers on a substrate, each resistive layer two ends arrange left electrode rete and right electrode rete, each resistive layer and each left electrode rete and right electrode rete are a thick-film resistor board unit, multiple thick-film resistor boards are the regularly arranged of matrix form between unit, can produce this product in enormous quantities, thereby production efficiency has obtained enough assurances, can meet the need of industrialized mass manufacture.
As further improved technical scheme of the present invention, between step C and step D, the surface that is also included in the long band of described thick-film resistor board arranges protective layer and the thick-film resistor board arranging after protective layer is inserted to step curing in low-temperature setting stove.Protective layer used in guard electrode conduction band, avoid the wearing and tearing of electrode conduction band and put the situation of loss or short circuit and short circuit.
As further improved technical scheme of the present invention, the periphery of each thick-film resistor board unit is provided with line of cut.Line of cut can conveniently cut resistance board, has improved operating efficiency.
As further improved technical scheme of the present invention, in step D, adopt the method for punching press, cross cutting or aritificial cut-off that thick-film resistor board unit is brought and cut down from thick-film resistor board length.
As further improved technical scheme of the present invention, in step B, preferably adopt 200 ℃ of Low Temperature Thermal thermosetting resin silver to starch the rete that prints electrode, or, also can adopt mask evaporation or lithographic method that electrode rete is set; Described flexible substrate is macromolecule polyimide film material; In step 2, adopt nanoscale carbon film slurry printed resistor rete.Flexible substrate is selected resistant to elevated temperatures flexible polyimide film conventionally, and therefore this thick-film resistor board can warped and bending point. and be conducive to Product Assembly, further expanded the scope of application of product.Conductive polymer silver angle easily obtains consistent with flexible polyimide film with Low Temperature Thermal thermosetting resin elargol on thermal coefficient of expansion, thereby, in technique, more easily obtain good adhesion of slurry and the smooth characteristic of printing, resistance to wear and the life-span of product are further improved, the linearity of product has also obtained good raising simultaneously, and quality level and the reliability of product significantly improve.
The conductive polymer elargol that the present invention adopts easily obtains consistent with flexible polyimide film with Low Temperature Thermal thermosetting resin elargol on thermal coefficient of expansion, thereby, in technique, more easily obtain good adhesion of slurry and the smooth characteristic of printing, resistance to wear and the life-span of product are further improved, the linearity of product has also obtained good raising simultaneously, and quality level and the reliability of product significantly improve.The manufacture method of thick-film resistor board of the present invention, adopts consistent flexible substrate and the Low Temperature Thermal thermosetting resin elargol of the coefficient of expansion, makes this thick-film resistor board have better printing planarization, also makes the electrode rete on thick-film resistor board obtain better adhesive force; What each thick-film resistor board unit was matrix form is regularly arranged, therefore can produce in enormous quantities, has improved production efficiency.
Accompanying drawing explanation:
Fig. 1 is the structural representation of thick film circuit board of the present invention.
Fig. 2 is the substrate schematic diagram of thick film circuit board of the present invention.
Fig. 3 is the structural representation of the long band of thick-film resistor board in the embodiment of the present invention 2.
Embodiment
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described further.
Embodiment 1
Referring to Fig. 1 and Fig. 2, this thick-film resistor board, comprise substrate, at least one resistive layer, at least one left electrode rete and at least one right electrode rete, described resistive layer, left electrode and right electrode are arranged on substrate, the left end of described resistive layer contacts with left electrode rete, the right-hand member of resistive layer contacts with right electrode rete, and described substrate is flexible substrate.It between the left end of resistive layer and left electrode rete, can be the mode joint of the formula covering that partly overlaps, also can be in the contact of the non-coincidence formula in termination, a kind of way of contact before adopting in the present embodiment, and the degree coinciding between the left end of resistive layer and left electrode rete can be adjusted according to actual needs, in like manner, it between the right-hand member of resistive layer and right electrode rete, can be the mode joint of the formula covering that partly overlaps, also can be in the contact of the non-coincidence formula in termination, a kind of way of contact before the present embodiment adopts, and the degree coinciding between the right-hand member of resistive layer and right electrode rete can be adjusted according to actual needs.Described substrate adopts flexible substrate, and described flexible substrate is selected resistant to elevated temperatures thickness flexible polyimide film between 0.05～0.50mm conventionally, and the thickness that the present embodiment adopts is 0.15～0.20mm.Making like this present invention obtain can warped, the feature of bending, is conducive to Product Assembly, further expands the scope of application of product.Described resistive layer is two, does accordingly electrode rete and right electrode rete is also respectively two.
Described left electrode rete and/or right electrode rete are made up of the electrode welding plate connecting in turn, electrode conduction band and contact electrode, contact electrode and resistive layer joint.By electrode conduction band connecting electrode welding plate and contact electrode, electrode conduction band can be made as like this to various shape, the shape that electrode welding plate, electrode conduction band and contact electrode can arrange electrode rete and thick-film resistor board is flexibly set, to be applicable to various practical matter.The present embodiment adopts shape as shown in Figure 1.Also comprise protective layer, described protective layer covers above electrode conduction band.Protective layer used in guard electrode conduction band, avoid the wearing and tearing of electrode conduction band and put the situation of loss or short circuit and short circuit.
Described left electrode rete and right electrode rete are conductive polymer elargol or Low Temperature Thermal thermosetting resin elargol; Described resistive layer is nano-scale carbon film resin material.Flexible substrate is selected resistant to elevated temperatures flexible polyimide film conventionally, and therefore this thick-film resistor board can warped and bending point, is conducive to Product Assembly, has further expanded the scope of application of product.Conductive polymer silver angle easily obtains consistent with flexible polyimide film with Low Temperature Thermal thermosetting resin elargol on thermal coefficient of expansion, thereby, in technique, more easily obtain good adhesion of slurry and the smooth characteristic of printing, resistance to wear and the life-span of product are further improved, the linearity of product has also obtained good raising simultaneously, and quality level and the reliability of product significantly improve.Further, Product Identifying can also be set on substrate, Product Identifying also can not arrange separately certainly, and can arrange at substrate blank position in the time that surface electrode is set simultaneously, and the present embodiment adopts the latter.
This flexible thick-film resistor board, can also comprise protective layer or mark.The structure of flexible thick-film resistor board can be regarded as by the superimposed rear product structure obtaining of difference in functionality layer.Described surface electrode comprises wire and pad, is arranged at the upper surface of flexible substrate, is to be ground floor structure.Resistive element is function band, is arranged on the fixed position of surface electrode, is to be second layer structure.Described protective layer, is arranged at the wire position of surface electrode, in order to protect the conductor part of surface electrode, is to be three-decker.Preferably, in flexible substrate of the present invention, can also print additional mark, to facilitate identification product.The shape of mark can be word or pattern, preferably adopts words identification, can be arranged on same structure layer with surface electrode.
Referring to Fig. 1, Fig. 2 and Fig. 3, the method that this manufactures above-mentioned thick-film resistor board, comprises the following steps:
(1) in flexible substrate, adopting 200 ℃ of Low Temperature Thermal thermosetting resin silver to starch the rete that prints electrode uses at least two pairs of thick film screen printing method printings to be in right left electrode rete and right electrode rete, left electrode rete and right electrode rete be reserve for the position of resistive layer is set, then insert in low-temperature setting stove and to solidify;
(2) in flexible substrate, adopt at least two of thick film screen printing method printings to set the resistive layer of shape, resistive layer is arranged in the reserved position of step (1) and resistive layer two ends contact with left electrode rete and right electrode rete respectively, the left electrode rete at each resistive layer and two ends thereof and right electrode rete are a thick-film resistor board unit, each thick-film resistor board unit is parallel to each other and forms matrix form setting, thereby form the long band of thick-film resistor board, then long thick-film resistor board band is inserted in low-temperature setting stove and solidified; Then protective layer is set on the surface of the long band of thick-film resistor board and solidifies in inserting low-temperature setting stove thick-film resistor board after protective layer is set.
(3) above-mentioned thick-film resistor board unit is brought and cut down from thick-film resistor board length, form independently thick-film resistor board.
In the present embodiment, the method thick-film resistor board unit that can adopt punching press, cross cutting or artificial scissors to cut is brought and is cut down from thick-film resistor board length, and as a kind of preferred version, the present embodiment adopts the method cutting of punching press.As the preferred technical scheme of the present invention, in step 1, adopt 200 ℃ of Low Temperature Thermal thermosetting resin silver to starch the rete that prints electrode, described flexible substrate is macromolecule polyimide film material; In step 2, adopt nanoscale carbon film slurry printed resistor rete.Flexible substrate is selected resistant to elevated temperatures flexible polyimide film.Thick-film resistor board unit can be two, three, four, five, six or more, is five in the present embodiment.
This thick-film resistor board can warped and bending point, is conducive to Product Assembly, has further expanded the scope of application of product.Conductive polymer silver angle easily obtains consistent with flexible polyimide film with Low Temperature Thermal thermosetting resin elargol on thermal coefficient of expansion, thereby, in technique, more easily obtain good adhesion of slurry and the smooth characteristic of printing, resistance to wear and the life-span of product are further improved, the linearity of product has also obtained good raising simultaneously, and quality level and the reliability of product significantly improve.The present embodiment arranges multiple resistive layers on a substrate in addition, each resistive layer two ends arrange left electrode rete and right electrode rete, each resistive layer and each left electrode rete and right electrode rete are a thick-film resistor board unit, multiple thick-film resistor boards are the regularly arranged of matrix form between unit, can produce this product in enormous quantities, thereby production efficiency has obtained enough assurances, can meet the need of industrialized mass manufacture.
Above the thick-film resistor board with flexible structure provided by the present invention is described in detail, applied specific case herein principle of the present invention and execution mode are set forth, the explanation of above embodiment is just for helping to understand method of the present invention and core concept thereof; , for one of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention meanwhile.
Claims (5)
1. a manufacture method for thick-film resistor board, comprises the following steps:
A: make the substrate (1) with flexible structure, some matrix structures are set on substrate;
B: be in right left electrode rete (3) and right electrode rete (4) at least two pairs of the upper employing of flexible substrate (9) thick film screen printing method printings, between left electrode rete (3) and right electrode rete (4) for reserved for the position (12) of resistive layer (2) is set, then insert in 300 degree or following low-temperature setting stove and solidify;
Or, adopt mask evaporation or at least two pairs of lithographic method settings to be in right left electrode rete (3) and right electrode rete (4) flexible substrate (9) is upper, between left electrode rete (3) and right electrode rete (4), be reserve for the position (12) of resistive layer (2) is set;
C: at the upper resistive layer (2) that adopts thick film screen printing method to print at least one setting shape of flexible substrate (9), resistive layer (2) is arranged in the reserved position of step B (12) and resistive layer (2) two ends contact with left electrode rete (3) and right electrode rete (4) respectively, the left electrode rete (3) at each resistive layer (2) and two ends thereof and right electrode rete (4) are a thick-film resistor board unit (10), each thick-film resistor board unit (10) is parallel to each other and forms matrix form arrangement, thereby form the long band of thick-film resistor board (11), then the long band of thick-film resistor board (11) is inserted in low-temperature setting stove and solidified,
D: above-mentioned thick-film resistor board unit (10) is cut down from the long band of thick-film resistor board (11), form independently thick-film resistor board.
2. the manufacture method of thick-film resistor board according to claim 1, it is characterized in that: between step C and step D, the surface that is also included in the long band of described thick-film resistor board (11) arranges protective layer (8) and the thick-film resistor board arranging after protective layer (8) is inserted to step curing in low-temperature setting stove;
3. the manufacture method of thick-film resistor board according to claim 1, is characterized in that: each thick-film resistor board unit
(10) periphery is provided with line of cut (13).
4. the manufacture method of thick-film resistor board according to claim 1, it is characterized in that: in step D, adopt punching press, cross cutting or aritificial cut-off method that thick-film resistor board unit (10) are cut down from the long band of thick-film resistor board (11).
5. according to the manufacture method of the thick-film resistor board described in claim 2 or 3 or 4, it is characterized in that: in step B, adopt 200 ℃ of left electrode retes of Low Temperature Thermal thermosetting resin silver slurry printing (3) and right electrode retes (4); In step C, adopt nanoscale carbon film slurry printed resistor rete (2).
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|---|---|---|---|
| CN201110143084.0A CN102324289B (en) | 2011-05-31 | 2011-05-31 | Thick-film resistor board and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110143084.0A CN102324289B (en) | 2011-05-31 | 2011-05-31 | Thick-film resistor board and manufacturing method thereof |
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| CN102324289A CN102324289A (en) | 2012-01-18 |
| CN102324289B true CN102324289B (en) | 2014-05-14 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1695209A (en) * | 2002-09-30 | 2005-11-09 | 通用电气公司 | Techniques for fabricating a resistor on a flexible base material |
| CN101315824A (en) * | 2008-06-30 | 2008-12-03 | 广东风华高新科技股份有限公司 | Production method of ceramic substrate resistor plate, and resistor plate acquired by this |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070030111A1 (en) * | 2005-08-02 | 2007-02-08 | Beck David B | Humidity sensor |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1695209A (en) * | 2002-09-30 | 2005-11-09 | 通用电气公司 | Techniques for fabricating a resistor on a flexible base material |
| CN101315824A (en) * | 2008-06-30 | 2008-12-03 | 广东风华高新科技股份有限公司 | Production method of ceramic substrate resistor plate, and resistor plate acquired by this |
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| CN102324289A (en) | 2012-01-18 |
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