CN201374874Y

CN201374874Y - Printed circuit board

Info

Publication number: CN201374874Y
Application number: CN200920144973U
Authority: CN
Inventors: 冯映明
Original assignee: SHENZHEN BOMINXING ELECTRONICS CO Ltd
Current assignee: SHENZHEN BOMINXING ELECTRONICS CO Ltd
Priority date: 2009-03-06
Filing date: 2009-03-06
Publication date: 2009-12-30
Anticipated expiration: 2019-03-06

Abstract

The utility model relates to a printed circuit board which is multilayered printed circuit board. The multilayered printed circuit board comprises at least two pieces of single-sheet circuit boards laminated and pressed to a whole; the single-sheet circuit board comprises insulating substrate and conductive pattern layers printed on the upper surface and the lower surface of the insulating substrate; the areas of the upper surface and the lower surface of the insulating substrate except the conductive pattern layers are printed with insulating resin ink layer with a thickness the same with the conductive pattern layer. In the utility model, the non-circuit locations of the single-sheet printed circuit board are printed with the insulating resin ink layer with the same thickness with the circuit therefore the circuit part and the non-circuit part of the whole single-sheet circuit board have the substantially the same thickness; then layers of single-sheet circuit board are laminated and pressed to the circuit board thereby avoiding the board sliding and dislocation of the inner layers during pressing and the problem that the thickness tolerance of the finished circuit board is not stable after pressing caused by the large difference between the thickness of the circuit part and the thickness of the non-circuit part of the high copper-thickness circuit board effectively.

Description

Multilayer printed circuit board

Technical field

The utility model relates to a kind of printed substrate, particularly relates to a kind of multilayer printed circuit board.

Background technology

Conventional multilayer printed circuit board is the monolithic wiring board that multilayer makes to be carried out superimposed pressing plate form, yet when adopting this manufacturing process to make the thick wiring board that surpasses more than the 2OZ of copper, because it is too big that the thickness of circuit pack exceeds the dielectric layer of logicalnot circuit part, when carrying out pressing, cause problems such as the dislocation of slide plate internal layer, pressing rear board finished product thickness tolerance instability easily, dielectric layer is thinner because circuit is too thick in addition, and the risk that dielectric layer causes micro-short circuit is worn on the circuit top when also having pressing.

The utility model content

Technical problem to be solved in the utility model is the easy slide plate dislocation of internal layer when solving the multilayer printed circuit board pressing, the problem that dielectric layer causes the micro-short circuit risk is worn on the circuit top when having pressing.

In order to solve the problems of the technologies described above, the technical scheme that the utility model adopted provides a kind of multilayer printed circuit board, comprise the monolithic wiring board that at least two mutual stacked pressings are one, described monolithic wiring board comprises insulating substrate and is printed on the upper and lower lip-deep conductive pattern layer of described insulating substrate, zone on the upper and lower surface of described insulating substrate beyond the conductive pattern layer is printed with the insulating resin ink lay, and the thickness of described insulating resin ink lay equates with the thickness of described conductive pattern layer.

In the such scheme, the thickness of described conductive pattern layer is 0.175mm.

Described insulating substrate is the semi-solid preparation glass fabric.

The quantity of described monolithic wiring board is 7.

The utility model, after the printed substrate of monolithic is finished circuit etching and is shown one's color, printing insulating resin ink lay is filled on the logicalnot circuit position of circuit attachment insulating substrate, thickness equates with the thickness of circuit, thereby make the thickness basically identical of whole monolithic wiring board circuit pack and logicalnot circuit part, and then each layer monolithic carried out superimposed pressing plate.Problems such as slide plate, internal layer dislocation, pressing rear board finished product thickness tolerance instability when this manufacture method can effectively avoid the thick wiring board of high-copper to cause pressing too greatly because of circuit pack and logicalnot circuit segment thickness difference, thus the wiring board quality of production and stability improved.

Description of drawings

Fig. 1 is a structural representation of the present utility model;

Fig. 2 is the utility model monolithic circuit board structure schematic diagram.

Embodiment

Below in conjunction with accompanying drawing the utility model is made detailed explanation.

As shown in Figure 1, the utility model comprises the monolithic wiring board 1 that 7 mutual stacked pressings are one.Again referring to Fig. 2, described monolithic wiring board 1 comprises insulating substrate 11 and is printed on described insulating substrate 11 upper and lower lip-deep conductive pattern layers 12, insulating substrate 11 is the semi-solid preparation glass fabric, the thickness of conductive pattern layer 12 is 5OZ (0.175mm), zone on the insulating substrate 11 upper and lower surfaces beyond the conductive pattern layer 12 is printed with insulating resin ink lay 13, and the thickness of insulating resin ink lay 13 equates with the thickness of conductive pattern layer 12.

The utility model is not limited to above-mentioned preferred forms; anyone should learn the structural change of making under enlightenment of the present utility model; the for example variation of the multilayer circuit board number of plies; every with the utlity model has identical or close technical scheme, all fall within the protection range of the present utility model.

Claims

1, multilayer printed circuit board, comprise the monolithic wiring board that at least two mutual stacked pressings are one, described monolithic wiring board comprises insulating substrate and is printed on the upper and lower lip-deep conductive pattern layer of described insulating substrate, it is characterized in that the zone beyond the conductive pattern layer is printed with the insulating resin ink lay on the upper and lower surface of described insulating substrate, the thickness of described insulating resin ink lay equates with the thickness of described conductive pattern layer.

2, multilayer printed circuit board as claimed in claim 1, the thickness that it is characterized in that described conductive pattern layer is 0.175mm.

3, multilayer printed circuit board as claimed in claim 1 or 2 is characterized in that described insulating substrate is the semi-solid preparation glass fabric.

4, multilayer printed circuit board as claimed in claim 3, the quantity that it is characterized in that described monolithic wiring board is 7.