CN102308384B - 对于led组合的改进的封装 - Google Patents
对于led组合的改进的封装 Download PDFInfo
- Publication number
- CN102308384B CN102308384B CN201080006746.3A CN201080006746A CN102308384B CN 102308384 B CN102308384 B CN 102308384B CN 201080006746 A CN201080006746 A CN 201080006746A CN 102308384 B CN102308384 B CN 102308384B
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- China
- Prior art keywords
- emitting diode
- light
- integrated circuit
- heat
- multiple light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004806 packaging method and process Methods 0.000 title abstract 3
- 238000000034 method Methods 0.000 claims abstract description 15
- 238000009434 installation Methods 0.000 claims description 43
- 239000004020 conductor Substances 0.000 claims description 9
- 230000017525 heat dissipation Effects 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 5
- 238000012546 transfer Methods 0.000 claims description 5
- 238000004590 computer program Methods 0.000 abstract description 12
- 238000005538 encapsulation Methods 0.000 description 17
- 238000013461 design Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 5
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 230000006872 improvement Effects 0.000 description 4
- 238000000197 pyrolysis Methods 0.000 description 4
- 238000005457 optimization Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- YUZILKLGVPUFOT-YHPRVSEPSA-L disodium;5-[(6-anilino-4-oxo-1h-1,3,5-triazin-2-yl)amino]-2-[(e)-2-[4-[(6-anilino-4-oxo-1h-1,3,5-triazin-2-yl)amino]-2-sulfonatophenyl]ethenyl]benzenesulfonate Chemical compound [Na+].[Na+].C=1C=C(\C=C\C=2C(=CC(NC=3NC(NC=4C=CC=CC=4)=NC(=O)N=3)=CC=2)S([O-])(=O)=O)C(S(=O)(=O)[O-])=CC=1NC(N1)=NC(=O)N=C1NC1=CC=CC=C1 YUZILKLGVPUFOT-YHPRVSEPSA-L 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (12)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP09152100 | 2009-02-05 | ||
EP09152100.5 | 2009-02-05 | ||
PCT/IB2010/050441 WO2010089696A2 (en) | 2009-02-05 | 2010-02-02 | Improved packaging for led combinations |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102308384A CN102308384A (zh) | 2012-01-04 |
CN102308384B true CN102308384B (zh) | 2015-06-17 |
Family
ID=42290145
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201080006746.3A Active CN102308384B (zh) | 2009-02-05 | 2010-02-02 | 对于led组合的改进的封装 |
Country Status (10)
Country | Link |
---|---|
US (1) | US20110291124A1 (zh) |
EP (1) | EP2394300B1 (zh) |
JP (1) | JP5840953B2 (zh) |
KR (1) | KR101689312B1 (zh) |
CN (1) | CN102308384B (zh) |
BR (1) | BRPI1005425B1 (zh) |
PL (1) | PL2394300T3 (zh) |
RU (1) | RU2528611C2 (zh) |
TR (1) | TR201815475T4 (zh) |
WO (1) | WO2010089696A2 (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8696159B2 (en) | 2010-09-20 | 2014-04-15 | Cree, Inc. | Multi-chip LED devices |
RU2583901C2 (ru) | 2011-01-14 | 2016-05-10 | Конинклейке Филипс Электроникс Н.В. | Осветительное устройство |
TWI495056B (zh) * | 2012-04-24 | 2015-08-01 | Genesis Photonics Inc | 基板結構 |
DE102016122237A1 (de) * | 2016-11-18 | 2018-05-24 | Osram Opto Semiconductors Gmbh | Multipixel-LED-Bauteil und Verfahren zum Betreiben eines Multipixel-LED-Bauteils |
JP6794498B1 (ja) * | 2019-06-04 | 2020-12-02 | 浜松ホトニクス株式会社 | 発光装置、及び発光装置の製造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1906773A (zh) * | 2004-01-29 | 2007-01-31 | Acol技术公司 | 具有整体散热装置的发光二极管 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5785418A (en) * | 1996-06-27 | 1998-07-28 | Hochstein; Peter A. | Thermally protected LED array |
JP3882266B2 (ja) * | 1997-05-19 | 2007-02-14 | 日亜化学工業株式会社 | 半導体装置 |
US6608642B1 (en) * | 1998-11-27 | 2003-08-19 | Sanyo Electric Co., Ltd. | Driver IC and optical print head |
JP2002033426A (ja) * | 2000-07-18 | 2002-01-31 | Ricoh Co Ltd | ステムおよび光ピックアップ |
JP3782325B2 (ja) * | 2001-07-27 | 2006-06-07 | 株式会社日立製作所 | ディスク駆動装置 |
US20070001177A1 (en) * | 2003-05-08 | 2007-01-04 | Koninklijke Philips Electronics N.V. | Integrated light-emitting diode system |
US7198387B1 (en) * | 2003-12-18 | 2007-04-03 | B/E Aerospace, Inc. | Light fixture for an LED-based aircraft lighting system |
US20070257901A1 (en) * | 2004-04-19 | 2007-11-08 | Matsushita Electric Industrial Co., Ltd. | Semiconductor chip for driving light emitting element, light emitting device, and lighting device |
WO2005104249A1 (ja) * | 2004-04-21 | 2005-11-03 | Matsushita Electric Industrial Co., Ltd. | 発光素子駆動用半導体チップ、発光装置、及び照明装置 |
JP4555026B2 (ja) * | 2004-08-27 | 2010-09-29 | 日本特殊陶業株式会社 | 光電変換モジュール、積層基板接合体 |
JP2006054312A (ja) * | 2004-08-11 | 2006-02-23 | Sanyo Electric Co Ltd | 発光素子 |
JP4757477B2 (ja) * | 2004-11-04 | 2011-08-24 | 株式会社 日立ディスプレイズ | 光源ユニット、それを用いた照明装置及びそれを用いた表示装置 |
US7208738B2 (en) * | 2005-02-28 | 2007-04-24 | Sundar Natarajan Yoganandan | Light source utilizing an infrared sensor to maintain brightness and color of an LED device |
US7952112B2 (en) * | 2005-04-29 | 2011-05-31 | Philips Lumileds Lighting Company Llc | RGB thermal isolation substrate |
US7269008B2 (en) * | 2005-06-29 | 2007-09-11 | Intel Corporation | Cooling apparatus and method |
JP4935004B2 (ja) * | 2005-07-01 | 2012-05-23 | ソニー株式会社 | 表示装置 |
US7230222B2 (en) * | 2005-08-15 | 2007-06-12 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Calibrated LED light module |
JP5103875B2 (ja) * | 2006-02-17 | 2012-12-19 | 日亜化学工業株式会社 | 発光装置 |
US8183574B2 (en) * | 2006-04-20 | 2012-05-22 | Nxp B.V. | Thermal isolation of electronic devices in submount used for LEDs lighting applications |
US20080217633A1 (en) * | 2007-03-01 | 2008-09-11 | Wu Yin Chang | Light emitting diode structure |
WO2008156020A1 (ja) * | 2007-06-19 | 2008-12-24 | Sharp Kabushiki Kaisha | 基板及び照明装置 |
US8421093B2 (en) * | 2007-07-13 | 2013-04-16 | Rohm Co., Ltd. | LED module and LED dot matrix display |
US20090140271A1 (en) * | 2007-11-30 | 2009-06-04 | Wen-Jyh Sah | Light emitting unit |
RU74869U1 (ru) * | 2008-02-20 | 2008-07-20 | Закрытое акционерное общество "Научно-производственный центр "Научно-исследовательский институт Микроприборов" | Устройство освещения пассажирского салона авиатранспортного средства |
-
2010
- 2010-02-02 KR KR1020117020656A patent/KR101689312B1/ko active IP Right Grant
- 2010-02-02 BR BRPI1005425-1A patent/BRPI1005425B1/pt not_active IP Right Cessation
- 2010-02-02 EP EP10703518.0A patent/EP2394300B1/en active Active
- 2010-02-02 RU RU2011136638/28A patent/RU2528611C2/ru active
- 2010-02-02 TR TR2018/15475T patent/TR201815475T4/tr unknown
- 2010-02-02 CN CN201080006746.3A patent/CN102308384B/zh active Active
- 2010-02-02 WO PCT/IB2010/050441 patent/WO2010089696A2/en active Application Filing
- 2010-02-02 JP JP2011548822A patent/JP5840953B2/ja active Active
- 2010-02-02 US US13/147,602 patent/US20110291124A1/en not_active Abandoned
- 2010-02-02 PL PL10703518T patent/PL2394300T3/pl unknown
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1906773A (zh) * | 2004-01-29 | 2007-01-31 | Acol技术公司 | 具有整体散热装置的发光二极管 |
Also Published As
Publication number | Publication date |
---|---|
BRPI1005425A2 (pt) | 2017-12-12 |
CN102308384A (zh) | 2012-01-04 |
BRPI1005425B1 (pt) | 2019-11-05 |
KR101689312B1 (ko) | 2016-12-23 |
US20110291124A1 (en) | 2011-12-01 |
RU2528611C2 (ru) | 2014-09-20 |
TR201815475T4 (tr) | 2018-11-21 |
EP2394300A2 (en) | 2011-12-14 |
KR20110121697A (ko) | 2011-11-08 |
JP5840953B2 (ja) | 2016-01-06 |
WO2010089696A3 (en) | 2010-09-30 |
JP2012517115A (ja) | 2012-07-26 |
PL2394300T3 (pl) | 2019-01-31 |
EP2394300B1 (en) | 2018-08-15 |
RU2011136638A (ru) | 2013-03-10 |
WO2010089696A2 (en) | 2010-08-12 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Eindhoven Patentee after: KONINKLIJKE PHILIPS N.V. Address before: Eindhoven Patentee before: Koninklijke Philips Electronics N.V. Address after: Holland Ian Deho Finn Patentee after: KONINKLIJKE PHILIPS N.V. Address before: Holland Ian Deho Finn Patentee before: Koninklijke Philips Electronics N.V. |
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TR01 | Transfer of patent right |
Effective date of registration: 20170310 Address after: Eindhoven Patentee after: KONINKLIJKE PHILIPS N.V. Address before: Eindhoven Patentee before: KONINKLIJKE PHILIPS N.V. |
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CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Eindhoven Patentee after: Signify Holdings Ltd. Address before: Eindhoven Patentee before: KONINKLIJKE PHILIPS N.V. |