CN102301192B - Semiconductor mist-type air-conditioning equipment - Google Patents
Semiconductor mist-type air-conditioning equipment Download PDFInfo
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- CN102301192B CN102301192B CN200980155731.0A CN200980155731A CN102301192B CN 102301192 B CN102301192 B CN 102301192B CN 200980155731 A CN200980155731 A CN 200980155731A CN 102301192 B CN102301192 B CN 102301192B
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- mist
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F6/00—Air-humidification, e.g. cooling by humidification
- F24F6/02—Air-humidification, e.g. cooling by humidification by evaporation of water in the air
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
- F24F5/0042—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
Abstract
Semiconductor mist-type air-conditioning equipment is provided. The air conditioning includes a housing (A3) whose interior is divided into a refrigeration room (A), a heat dissipation room (A1) and a water atomization tank (A2). In the refrigeration room (A), a semiconductor refrigerating chip (4) is arranged and the cold side of the semiconductor refrigerating chip (4) is adjacent to a heatsink (1) so as to enlarge the refrigerating area of the semiconductor refrigerating chip (4). Besides, a first fan (3) is adjacent to the heatsink (1) in order to blowing the processed air. In the heat dissipation room (A1), another heatsink (5) is adjacent to the heat side of the semiconductor refrigerating chip (4), and a second fan (31) is used to dissipate the heat from the heatsink (5).In the water atomization tank (A2), an electronic chip (72) is arranged to atomizate the water stored in the tank into mist, and the mist is guided into the refrigeration room (A) so as to humidify the processed air. The semiconductor mist-type air- conditioning equipment can work at cooling, heating, humidifying or dehumidifying modes.
Description
Technical field
The present invention especially refers to a kind of device of regulating that forms for indoor temperature about a kind of semiconductor Mist-type Air-conditioning Equipment.
Background technology
General air-conditioning equipment, mainly refer to air-cooling system, and running structure and the drive manner of cold air, normally see through the gas coolant that compressor is compressed into refrigerant high pressure-temperature, being sent to condenser cools off refrigerant, after refrigerant is cooled off by the high pressure-temperature heat release, become the liquid refrigerants of high pressure low temperature, hold bottle via refrigerant again and store unnecessary refrigerant, other refrigerant reduces pressure into low-pressure low-temperature at the expansion valve place, flows to evaporimeter again, see through the gaseous coolant of the low-pressure low-temperature temperature in can absorption chamber, and after seeing through the heat absorption of low temperature refrigerant, blow to the interior space by power, cause cold house's effect.Yet; prior art has serious drawback; contain CFCs (CFCs) mainly due to cold coal, in the Nature, be not easy to decompose, and the content of its accumulation and characteristic can consume the ozone in the stratosphere; so that ozone content day by day reduces; form the scarce hole of earth protection, and ultraviolet ray is at the expedite situation direct irradiation earth, except the mankind and biology are caused various pathologies easily; and for ecological environment, also can produce the unbalance serious consequence of climatic variation and Ecological regulation.
Summary of the invention
Because the serious problems that prior art uses refrigerant to produce as the raw material of air-conditioning, the present inventor thinks should a kind of structure that can improve drawback, the present invention is about a kind of semiconductor Mist-type Air-conditioning Equipment, main purpose is by semiconductor electronic refrigeration (above and following refrigeration, be pyrogenicity relatively, below unification claims with refrigeration) or electrothermal tube low-temperature receiver that pyrogenicity is produced and thermal source, amplification refrigeration area done via refrigerating sheet.Recycle the formed atomized water particulate of electronic atomized wafer as the cold or hot medium (its principle is that the atomized water particulate pyroconductivity of 1 μ m ~ 3 μ m is better than general air) of conduction, the atomized water particulate drives through the refrigerating sheet group under heat exchange and heat conducting effect through the first fan, reaches the purpose that produces cold air or hot gas.
And for reaching aforementioned purpose, technological means used in the present invention, main structure comprises a refrigerator compartment, this refrigerator compartment inside is provided with the cold side of semiconductor refrigerating sheet; One refrigerating sheet group, the cold side of refrigerating sheet group and conductor refrigeration sheet is adjacent; One electrothermal tube, electrothermal tube are also adjacent with the refrigerating sheet group; But refrigerating sheet group amplification semiconductor refrigerating sheet and electrothermal tube refrigeration area; One atomized water particulate air inlet, plural number enters the refrigerator compartment entrance for better as the atomized water particulate; One first fan is adjacent to the refrigerating sheet group, forms blowing of cold (heat) air and drives; One condensed water water-collecting tray, as collecting the condensed water that produces in the refrigerating sheet group in the refrigeration processes, atomized water particulate air inlet is installed on above the condensed water water-collecting tray bottom; But the refrigerator compartment internal layer adopts bright heat reflection and is that the compound composition of heat-resisting and heat insulation material and other formation are isolated.Semiconductor refrigerating sheet heat dissipation chamber, this conductor refrigeration sheet heat dissipation chamber is provided with a groups of fins, and groups of fins is adjacent to the hot side of conductor refrigeration sheet; One second fan forms heat radiation with groups of fins.One atomizing water tank is provided with an electronic atomized wafer, the atomized water particulate that electronic atomized wafer forms in this atomizing water tank; One atomized water particulate gas outlet, plural number is for better, atomized water particulate gas outlet is located on the atomizing water tank, and be connected to fog particulate Guan Yiduan, the atomized water particulate pipe other end is connected to the atomized water particulate air inlet on the interior condensed water water-collecting tray of refrigerator compartment, water produces the atomized water particulate through electronic atomized wafer, and the atomized water particulate leads to refrigerator compartment through atomized water particulate pipe; One air inlet, plural number are for better, and this air inlet is located on the atomizing water tank, as balance atomizing water tank Air pressure; One water inlet, water inlet are located on the atomizing water tank, as atomizing water tank water filling port.
Water in the atomizing water tank produces the atomized water particulate through electronic atomized wafer, the atomized water particulate sucks the driving effect at the first fan, enter refrigerator compartment through atomized water particulate pipe, conductor refrigeration sheet in the refrigerator compartment or electrothermal tube produce cold or hot, amplify the refrigeration area through the refrigerating sheet group, the atomized water particulate drives through the refrigerating sheet group in the suction of the first fan, under the effect of heat exchange, reaches the purpose that produces cold air or hot gas.
And the conductor refrigeration sheet need to be discharged semiconductor Mist-type Air-conditioning Equipment in the heat that refrigeration processes produces, so at hot side device one groups of fins and one second fan of conductor refrigeration sheet, form the hot type that heat radiation will generation and go out semiconductor Mist-type Air-conditioning Equipment.
The present invention's time purpose is to control ambient humidity namely has humidification and dehumidifying to air function, because the present invention is producing cold air or hot gas process, it is take the atomized water particulate as the medium of conduction low-temperature receiver and thermal source but not general air, and the atomized water particulate can increase air humidity, so the present invention also is the air wetting machine when general generation cold air or hot gas process, this part is different from traditional air-conditioning can cause the excessively low disadvantage of ambient humidity when work; When this device active electron atomizing wafer not in refrigeration processes, namely with general air as conduction low-temperature receiver medium, can produce cold dry air and condensed water this moment, namely when with this pattern refrigeration, damp-heat air in the process in the environment is sucked into refrigerator compartment in the first fans drive, damp-heat air is when contact refrigerating sheet group under the effect in heat exchange, except reducing air themperature and can producing condensed water in the refrigerating sheet group, blow at the first fan and to drive the lower cold air that namely produces and also can reduce humidity in the surrounding air, and after the condensed water that produces can concentrate by the condensed water water-collecting tray on the device, and by atomized water particulate air inlet inflow atomizing water tank, be that an air conditioner also is a dehumidifier so the present invention removes at this mode operating; Two kinds of operating modes of mat of the present invention are switched the humidity in can controling environment.
Another purpose of the present invention is to utilize control circuit, the height of control temperature and humidity and the size of wind-force, it is capable of regulating conductor refrigeration sheet cryogenic temperature or electrothermal tube pyrogenicity temperature that mat sees through circuit control panel control wafer adjustment size of current, with the first fan wind-force size, the second fan open and close, and electronic atomized wafer activates or closes, and also can see through the control wafer and set the activation of air-conditioning with the humiture sensing component and close.
Another purpose of the present invention is refrigerating sheet group mechanism design, increase heat exchanger effectiveness with atomized water particulate or air as amplification semiconductor refrigerating sheet and electrothermal tube refrigeration (area), its mechanism consists of two groups of groups of fins and the refrigerating sheet group thermal conducting tube phase take several solid or hollow thread materials as aluminium bar or red metal rod connects; Two groups of groups of fins, one group is plural mountain type fin formula fin, the cold side of this each mountain type fin formula fin and conductor refrigeration sheet is adjacent, its material is aluminum or aluminum alloy or copper, fin thickness on this various fin formula fin is 1 ㎜～2 ㎜, alternate 2 ㎜～4 ㎜ that are divided into of two fin and fin; One group is plural plate type heat radiating piece, its material is aluminum or aluminum alloy or copper, this each plate type heat radiating piece with the aluminium frame as support frame, tens of rectangle strips of parallel welding fin in the middle of the support frame, this each fin material is aluminium flake or aluminum alloy sheet or copper sheet, rectangle strip fin thickness is 0.5 ㎜～1 ㎜, and two rectangle strip fin parallel interval are 2 ㎜～4 ㎜.
Another purpose of the present invention is the groups of fins mechanism design, groups of fins is the heat that produces as discharging conductor refrigeration sheet refrigeration processes, it is aluminum or aluminum alloy or copper and a plate type heat radiating piece group that its mechanism consists of a radiating block material, both also connect with the groups of fins thermal conducting tube phases of several solid or hollow threads, material is aluminium bar, copper rod or red metal rod, and the hot side of radiating block and conductor refrigeration sheet is adjacent; Its material of plate type heat radiating piece group is aluminum or aluminum alloy or copper, the plate type heat radiating piece group with the aluminium frame as support frame, support tens of strip fin of the middle parallel welding of aluminium frame, the fin material is aluminium flake or aluminum alloy sheet or copper sheet, strip fin thickness is 0.5 ㎜～1 ㎜, and two rectangle strip fin parallel interval are 2 ㎜～4 ㎜.
Another purpose of the present invention is the mechanism design of the adjacent waterproof of cold side of refrigerating sheet group and conductor refrigeration sheet, because as heat conducting medium atomization water particulate, can cause the conductor refrigeration sheet to damage, so design takes to use the mountain type fin formula fin greater than conductor refrigeration sheet area, and at bottom and the adjacent place of the refrigerator compartment device water proof rubber bar of mountain type fin formula fin, form not loss conductor refrigeration sheet freezing capacity water-proof sealing contact-making surface.
Another purpose of the present invention is the material design of refrigerator compartment internal layer institute coating, because refrigerator compartment need be avoided heat loss and thermal-radiating concentrating and heat-resisting heat-insulating problem in refrigeration and pyrogenicity process, so but the refrigerator compartment internal layer adopts bright heat reflection and is the compound composition of heat-resisting and heat insulation material, but bright heat reflection and can be aluminium foil or aluminium flake for heat-resisting material, heat insulation material can be the low temperature insulation materials such as PUR foam or PE foam.
Another purpose of the present invention is that the first fan and the second fan select design to can be straight fan or straight barrel type fan, utilize multi-form fan to select design, can make semiconductor Mist-type Air-conditioning Equipment produce different external forms and so can be useful in different occasions and space.
Another purpose of the present invention is that semiconductor Mist-type Air-conditioning Equipment can be vertical type and scheme design, by the refrigerator compartment position grouping different from conductor refrigeration sheet heat dissipation chamber and atomizing water tank, can make semiconductor Mist-type Air-conditioning Equipment produce different external forms so can be applicable in different occasions and space.
Another purpose of the present invention is that atomized water particulate gas outlet and the air inlet of device atomizing water tank have the mechanism design that anti-sealing overflows, for overflowing by atomized water particulate gas outlet and air inlet, the water in the water tank of avoiding atomizing undermines other electrical mechanism assembly, so take unidirectional design, namely only allow atomized water particulate and air to pass in and out, the water in the atomizing water tank can't overflow from atomized water particulate gas outlet and air inlet.
Another purpose of the present invention is to be installed on the water inlet mechanism design of atomizing water tank, for overflowing by water inlet, the water in the water tank of avoiding atomizing undermines other electrical mechanism assembly, so take unidirectional design, namely only allow water to enter, the water in the atomizing water tank can't overflow from water inlet; Electronic atomized wafer is in the atomized water particulate process transforming water in addition, need reservation air and space to be converted into the atomized water particulate as water, so the atomizing water tank can not be filled with water in the injecting process, reserve atomized water particle conversion space at the design of intake of the present invention by the water inlet installation site, and the ball float full-water level water check valve design in the cooperation water inlet, the water tank water filling overfill of avoiding atomizing is converted into water without the space problem of atomized water particulate.
Another object of the present invention is to atomize in the water tank, and electronic atomized wafer stops the action design automatically when low water level, if because electronic atomized wafer is having the danger of burning without continuing action under the aqueous condition, so in the design atomizing water tank when low water level electronic atomized wafer automatically stop action, the danger of avoiding electronic atomized wafer to burn.
Still a further object of the present invention is to atomize and can adds essence oil from plant in the water tank and make semiconductor Mist-type Air-conditioning Equipment become air cleaner and air fragrant machine, because electronic atomized wafer is to utilize 1,600,000 vibrations that water is changed into the atomized water particulate, can produce a large amount of anions in the conversion process, thereby the adsorbable airborne dust of water particulate that carries anion reaches the purpose of peace and quiet air; During in action, also essence oil from plant can be changed into the aerial particulate molecule of floatability at electronic atomized wafer if add essence oil from plant in the water tank, drive and reach the purpose that room air reaches fragrance with blowing of the first fan.
Description of drawings
Fig. 1 is planar structure schematic diagram of the present invention;
Fig. 2 is refrigerating/heating sheet group three-view diagram of the present invention;
Fig. 3 is refrigerating/heating sheet group of the present invention and the straight fan of the first fan;
Fig. 4 is refrigerating/heating sheet group of the present invention and the first fan straight barrel type fan;
Fig. 5 is water-collecting tray three-view diagram of the present invention and stereogram;
Fig. 6 is refrigerating/heating of the present invention chamber frame wall profile;
Fig. 7 is water proof rubber bar installation site figure of the present invention;
Fig. 8 is atomized water particulate pipe profile of the present invention;
Fig. 9 is groups of fins three-view diagram of the present invention;
Figure 10 is the straight fan three-view diagram of groups of fins of the present invention and the second fan;
Figure 11 is groups of fins of the present invention and the second fan straight barrel type fan;
Figure 12 is water tank three-view diagram of the present invention and stereogram;
Figure 13 is electronic atomized wafer of the present invention and water level switch circuit diagram;
Figure 14 is for being water inlet profile of the present invention;
Figure 15 is air inlet profile of the present invention;
Figure 16 is the framework floor map of control circuit of the present invention;
Figure 17 is various textural association legend one of the present invention;
Figure 18 is various textural association legend two of the present invention;
Figure 19 is various textural association legend three of the present invention.
Wherein
A. refrigerator compartment A1. conductor refrigeration sheet heat dissipation chamber
A2. water tank A3. frame wall atomizes
But A4. bright heat reflection of water proof rubber bar A5. and be heat-resisting and heat insulation material
But bright heat insulation material of heat reflection material A5B. A5A.
1. refrigerating sheet group 11. mountain type fin formula fin
12. plate type heat radiating piece 12A. supports the aluminium frame
12B. strip fin 13. refrigerating sheet group heat pipes
2. electrothermal tube 3. first fans
3A. the first fan (straight barrel type fan) 31. second fans
31A. the second fan (straight barrel type fan) is the conductor refrigeration sheet 4.
5. groups of fins 51. radiating blocks
52. groups of fins heat pipe 53. plate type heat radiating piece groups
54. support aluminium frame 55. strip fin
6. condensed water water-collecting tray 7. circuit control panels
71. water level switch 72. electronic atomized wafers
73. control wafer 74. temperature sensing components
75. humidity assembly 76. power supplys
8. atomized water particulate air inlet 81. air inlets
81A. hollow base 81B. solid rubber ball
82. atomized water particulate pipe 83. atomized water particulate gas outlets
84. solid rubber ball 9. water inlets
91. hollow rubber ball 92. hollow bases
93. water inlet lid
The specific embodiment
Below by graphic explanation structure of the present invention, characteristics and embodiment, understand in order to do your audit crew is had further for the present invention.
See also Fig. 1 and shown in Figure 16, the present invention relates generally to a kind of semiconductor Mist-type Air-conditioning Equipment, is that outside summary frame encloses by a frame wall A3, and is defined as a refrigerator compartment A and the semiconductor refrigerating sheet A1 of heat dissipation chamber and an atomizing water tank A2 with frame wall A3 separation.
This refrigerator compartment A inside includes cold side, a refrigerating sheet group 1, an electrothermal tube 2, plural atomized water particulate air inlet 8, one first fan 3, a condensed water water-collecting tray 6 of semiconductor refrigerating sheet 4.
This conductor refrigeration sheet A1 of heat dissipation chamber then comprises, the hot side of a groups of fins 5, one second fan 31, semiconductor refrigerating sheet 4.
This atomizing water tank A2 includes an electronic atomized wafer 72, plural atomized water particulate gas outlet 83, plural air inlet 81, a water inlet 9.Atomized water particulate gas outlet 83 connects atomized water particulate pipe 82 in addition, is connected to the atomized water particulate air inlet 8 on the condensed water water-collecting tray 6 in the refrigerator compartment A.
But refrigerator compartment A internal layer spreads take bright heat reflection and as heat-resisting and heat insulation material A5 in addition, to intercept the heat that hot side was produced of semiconductor chilling plate 4, avoids reducing refrigerator compartment A cooling effect.
Include as for the inner basic member of refrigerator compartment A:
The cold side of semiconductor refrigerating sheet 4:
Please cooperate shown in Figure 16ly, the cold side of this conductor refrigeration sheet 4 and power supply 76 consists of and is electrically connected, and drives refrigeration by power supply 76 power supplies.
One refrigerating sheet group 1:
Please cooperate shown in Figure 2ly, be adjacent to cold side and the electrothermal tube 2 of conductor refrigeration sheet 4, but the refrigerating/heating area of amplification semiconductor cooling piece 4 and electrothermal tube 2; Refrigerating sheet group 1 its mechanism consists of two groups of groups of fins and the refrigerating sheet group heat pipe take several solid or hollow thread materials as aluminium bar or red metal rod 13 connects; Two groups of groups of fins, one group is plural mountain type fin formula fin 11, the cold side of these each type fin formula fin 11 bottoms, mountain and conductor refrigeration sheet 4 is adjacent, its material is aluminum or aluminum alloy or copper, fin thickness on this each mountain type fin formula fin 11 is 1 ㎜～2 ㎜, alternate 2 ㎜～4 ㎜ that are divided into of two fin and fin; One group is plural plate type heat radiating piece 12, this plural number plate type heat radiating piece and electrothermal tube 2 are adjacent, its material is aluminum or aluminum alloy or copper, this each plate type heat radiating piece 12 with the aluminium frame as support frame, tens of strip fin of parallel welding 12B in the middle of the support frame 12A, the fin material is aluminium flake or aluminum alloy sheet or copper sheet, and strip fin 12B thickness is 0.5 ㎜～1 ㎜, and two rectangle strip fin parallel interval are 2 ㎜～4 ㎜.
One first fan 3:
See also Fig. 3 and shown in Figure 4, be adjacent to the plate type heat radiating piece group 13 in the refrigerating sheet group 1, form blowing of air with refrigerating sheet group 1 and drive, can be straight first fan 3 or be the first fan 3A of straight barrel type; Utilize multi-form fan to select design, can make semiconductor Mist-type Air-conditioning Equipment produce different external forms and so can be useful in different occasions and space.
One electrothermal tube 2:
Be adjacent to the plate type heat radiating piece group 13 in the refrigerating sheet group 1, consist of electric connection with power supply 76, and drive pyrogenicity by power supply 76 power supplies.
One condensed water water-collecting tray 6:
See also Fig. 1 and shown in Figure 5, its location means is in refrigerator compartment A bottom, as collecting the condensed water that produces in refrigerating sheet group 1 in the refrigeration processes; Above condensed water water-collecting tray 6 bottoms, install plural atomized water particulate air inlet 8 again; The condensed water that refrigerating sheet group 1 produces because condensed water water-collecting tray 6 is adopted inclined design so the condensed water of collecting is concentrated in condensed water water-collecting tray 6 bottoms, and flows into the water tank A2 that atomizes by atomized water particulate air inlet 8.
Please consult simultaneously Fig. 1 and shown in Figure 6, but the frame wall A3 internal layer of refrigerator compartment A adopt bright heat reflection and be the compound composition of heat-resisting and heat insulation material A5, isolated with other formation; The compound composition of heat-resisting and heat insulation material A5, but the heat insulation material A5B by outer field bright heat reflection material A5A and internal layer is consisted of respectively, but bright heat reflection and can be aluminium foil or aluminium flake for heat-resisting material A6, heat insulation material A7 can be the low temperature insulation materials such as PUR foam or PE foam.But the frame wall A3 internal layer of refrigerator compartment A adopts bright heat reflection and is the design of heat-resisting and heat insulation material, its objective is at conductor refrigeration sheet 4 refrigeration processes and avoid affecting freezing capacity because low-temperature receiver leaks, perhaps can concentrate heat radiation at electrothermal tube 2 in the pyrogenicity process, increase the pyrogenicity effect.
See also shown in Figure 7, during in addition refrigerating sheet group 1 consists of these each mountain type fin formula fin 11 bottom areas need greater than conductor refrigeration sheet 4 refrigeration face areas, and bottom and the device water proof rubber bar A4 of the adjacent place of refrigerator compartment A at this each mountain type fin formula fin 11 form the water-proof sealing contact-making surface of not loss conductor refrigeration sheet freezing capacity with this; Its purpose is to prevent heat conducting medium atomization water particulate, causes the conductor refrigeration sheet to damage.
Please consult simultaneously Fig. 1 and Fig. 5 and shown in Figure 8, the condensed water water-collecting tray 6 in refrigerator compartment A bottom installs plural atomized water particulate air inlet 8, enters the entrance of refrigerator compartment A as the atomized water particulate; Atomized water particulate air inlet 8 connects atomized water particulate pipe 82, and atomized water particulate pipe 82 is connected to the atomized water particulate gas outlet 83 on the atomizing water tank A2; Atomized water particulate pipe 82 its mechanisms are connected to form by the big-inch pipe of a long small-diameter pipe and a weak point, small-diameter pipe is connected to atomized water particulate air inlet 8, big-inch pipe is connected to atomized water particulate gas outlet 83, and a solid rubber ball 84 is arranged in the big-inch pipe; Solid rubber ball 84 diameters are greater than the small-diameter pipe in the mechanism, but less than atomized water particulate gas outlet 83, come off to prevent solid rubber ball 84; Can normally lead to refrigerator compartment A at general normal condition atomized water particulate, solid rubber ball 84 just can block atomized water particulate air inlet 8 when semiconductor Mist-type Air-conditioning Equipment is toppled over, and the water of the water tank A2 that avoids atomizing is overflowed by water particulate air inlet 8 and undermines other electrical assembly of semiconductor Mist-type Air-conditioning Equipment.
The inner basic member of the conductor refrigeration sheet A1 of heat dissipation chamber includes:
One groups of fins 5:
See also shown in Figure 9ly, be adjacent to the hot side of conductor refrigeration sheet 4, form heat radiation with the second fan 31; Its mechanism consists of a radiating block 51 and a plate type heat radiating piece group 53, and wherein radiating block 51 materials are aluminum or aluminum alloy or copper, and both also are connected with several groups of fins heat pipes 52 solid or hollow thread, and material is aluminium bar or copper rod or red metal rod; Plate type heat radiating piece group 53 its materials are aluminum or aluminum alloy or copper, plate type heat radiating piece group 53 with the aluminium frame as support frame, support tens of strip fin 55 of aluminium frame 54 middle parallel welding, the fin material is aluminium flake or aluminum alloy sheet or copper sheet, strip fin 55 thickness are 0.5 ㎜～1 ㎜, and two rectangle strip fin parallel interval are 2 ㎜～4 ㎜.
One second fan 31:
See also Figure 10 and shown in Figure 11, this second fan 31 is adjacent to the plate type heat radiating piece group 53 in the groups of fins 5, forms heat radiation with groups of fins 5, can be straight second fan 31 or is the second fan 31A of straight barrel type; Utilize multi-form fan to select design, can make semiconductor Mist-type Air-conditioning Equipment produce different external forms and so can be useful in different occasions and space.
The inner basic member of atomizing water tank A2 includes:
One electronic atomized wafer 72:
See also Fig. 1 and shown in Figure 12, this electronic atomized wafer 72 is installed on atomizing water tank A2 inner bottom part, forms with water level switch 71 to be electrically connected, and is driven by power supply 76 power supplies; Electronic atomized wafer 72 can stop action automatically when low when the water level of atomizing water tank A2 inside is crossed, and avoids electronic atomized wafer 72 to burn with this, and electronic atomized wafer 72 sees also shown in Figure 13 with water level switch 71 circuit diagrams.
One water inlet 9:
It is shown in Figure 14 to see also Figure 12, and this water inlet 9 is installed on the atomizing water tank A2, is the water filling entrance of atomizing water tank A2; Because electronic atomized wafer 72 is in the atomized water particulate process transforming water, need reservation air and space to be converted into the atomized water particulate as water, so atomizing water tank A2 can not fill with water, reserve atomizing " water " particle conversion space in water inlet 9 designs of the present invention by water inlet 9 installation sites in the injecting process; Water inlet 9 mechanisms composition is linked by two sections hollow tubes of size diameter, one hollow rubber ball 91 is arranged in the large diameter pipe, the large diameter pipe bottom has a hollow base 92 to come off to prevent hollow rubber ball 91, hollow rubber ball 91 diameters are greater than the minor diameter hollow tube but less than the diameter hollow pipe, and minor diameter hollow pipe end is established a water inlet lid 93; When water is injected into when estimating water level, hollow rubber ball 91 just blocks water inlet 9 because of the water buoyancy force firmly allows unnecessary water reinject, and the water tank A2 water filling overfill of avoiding by this atomizing is converted into water without the space problem of atomized water particulate.
It is shown in Figure 15 to see also Figure 12, and the water tank A2 that atomizes in addition is provided with plural air inlet 81, as balance atomizing water tank A2 Air pressure; Its mechanism's composition is linked by two sections hollow tubes of size diameter, one solid rubber ball 81B is arranged in the large diameter pipe, the large diameter pipe bottom has a hollow base 81A to come off to prevent solid rubber ball 81B, and solid rubber ball 81B diameter is greater than the minor diameter hollow tube but less than the diameter hollow pipe; Can normally lead to atomizing water tank A2 at general normal condition air, solid rubber ball 81B just can block air inlet 81 when semiconductor Mist-type Air-conditioning Equipment is toppled over, and the water of the water tank A2 that avoids atomizing is overflowed by air inlet 81 and undermines other electrical assembly of semiconductor Mist-type Air-conditioning Equipment.
Consult shown in Figure 8ly, other the water tank A2 that atomizes is provided with plural atomized water particulate gas outlet 83, and atomized water particulate gas outlet 83 is connected with atomized water particulate pipe 82, is the entrance that the atomized water particulate leads to refrigerator compartment A.
Water in atomizing water tank A2 produces atomized particles through electronic atomized wafer 72, the atomized water particulate sucks the driving effect at the first fan 3, enter refrigerator compartment A through atomizing " water " particulate pipe 82, conductor refrigeration sheet 4 in the refrigerator compartment A or electrothermal tube 2 produce cold or hot, amplify the refrigeration area through refrigerating sheet group 1, the atomized water particulate drives through refrigerating sheet group 1 in the suction of the first fan 3, under the effect of heat exchange, reaches the purpose that produces cold air or hot gas.And conductor refrigeration sheet 4 need to be discharged semiconductor Mist-type Air-conditioning Equipment in the heat that refrigeration processes produces, so conductor refrigeration sheet 4 hot side device one groups of fins 5 and one second fan 31, form the hot type that heat radiation will produce and go out semiconductor Mist-type Air-conditioning Equipment.
The present invention can activate and closes two kinds of mode of operations humidity that controls environment by electronic atomized wafer 72; The present invention is generally producing cold air or hot gas process, take the medium of atomized water particulate as conduction low-temperature receiver and thermal source, this moment, electronic atomized wafer 72 activated, and the atomized water particulate can increase air humidity, so the present invention also is the air wetting machine when general generation cold air or hot gas process; When electronic atomized wafer 72 descends in off position, namely with general air as conduction low-temperature receiver medium, can produce cold dry air and condensed water this moment, namely when with this pattern refrigeration, damp-heat air in the process in the environment drives at the first fan 3 and is sucked into refrigerator compartment A, damp-heat air is when contact refrigerating sheet group 1 under the effect in heat exchange, except reducing air themperature and can producing condensed water in refrigerating sheet group 1, blow at the first fan 3 and to drive the lower cold air that namely produces and also can reduce humidity in the surrounding air, and after the condensed water that produces can concentrate by the condensed water water-collecting tray 6 on the device, and by atomized water particulate air inlet 81 inflow atomizing water tank A2, be that an air conditioner also is a dehumidifier so the present invention removes at this mode operating; Two kinds of operating modes of mat of the present invention are switched the humidity in can controling environment.
See also Fig. 1 and shown in Figure 16, the present invention can utilize circuit control panel 7, the height of setup control temperature and humidity and the size of wind-force, the control wafer 73 adjustment size of current that can see through in the circuit control panel 7 are capable of regulating conductor refrigeration sheet 4 refrigeration temperature or electrothermal tube 2 pyrogenicity temperature, with the first fan 3 wind-force size and 31 open and close of the second fan, and electronic atomized wafer 72 activates or closes, and also can see through activation that control wafer 73 and temperature sensing component 74 and humidity assembly 75 set air-conditionings and close.
See also Figure 17 and Figure 18 and shown in Figure 19, semiconductor Mist-type Air-conditioning Equipment of the present invention can be vertical type and scheme design, by the refrigerator compartment A position grouping different from the conductor refrigeration sheet A1 of heat dissipation chamber and atomizing water tank A2, can make semiconductor Mist-type Air-conditioning Equipment produce different external forms, so be applicable various different occasions and space.
Can add again essence oil from plant in the atomizing water tank A2 of the present invention makes semiconductor Mist-type Air-conditioning Equipment become air cleaner and air fragrant machine, because electronic atomized wafer 72 is to utilize 1,600,000 vibrations that water is changed into the atomized water particulate, can produce a large amount of anions in the conversion process, thereby the adsorbable airborne dust of water particulate that carries anion reaches the purpose of peace and quiet air; During in action, also essence oil from plant can be changed into the aerial particulate molecule of floatability at electronic atomized wafer 72 if add essence oil from plant in the atomizing water tank A2, drive and reach the purpose that room air reaches fragrance with blowing of the first fan 3.
Effect of the present invention can reach:
One, the present invention adopts take conductor refrigeration sheet and electrothermal tube as low-temperature receiver and thermal source, and the atomized water particulate that utilizes electronic atomized wafer to produce is heat-conduction medium, produces by this cold air and heating installation; The present invention also can open and close by electronic atomized wafer, and the humidity that controls environment is high and low.The present invention also is cold air, heating installation, dehumidifying, the comprehensive aircondition of humidification four unifications except being the environment-friendly air conditioner device that a new invention is not used the traditional cold coal.
Two, the present invention can utilize artificial intelligence control wafer to reach the purpose of control temperature and humidity, is the power switch of automatic activation control device circuit board when temperature is high to setting value (such as design temperature 30 degree Celsius), the activating semiconductor Mist-type Air-conditioning Equipment.Hanging down to setting value (such as design temperature 20 degree Celsius) when temperature is the autoshutdown semiconductor Mist-type Air-conditioning Equipment.
Three, the present invention can adjust temperature.
Four, the present invention can adjust the wind-force size.
Five, the present invention can adjust the humidity height with low.
Six, but the present invention's mat uses multi-form fan and by the refrigerator compartment position grouping different from conductor refrigeration sheet heat dissipation chamber and atomizing water tank, can make semiconductor Mist-type Air-conditioning Equipment produce different external forms and so can be useful in different occasions and space.
Seven, the present invention can add essence oil from plant and makes semiconductor Mist-type Air-conditioning Equipment become air cleaner and air fragrant machine.
In sum, the present invention possesses practical function, does not see publication or open use, meets patent requirement, proposes patent application in accordance with the law.Above-mentioned institute is old, is a preferred embodiment on the industry of the present invention, and the equivalence of such as doing according to the present patent application claim changes, and all belongs to the row of this case claim.
Claims (14)
1. semiconductor Mist-type Air-conditioning Equipment, it is enclosed by a frame wall frame, and inside is divided into:
One refrigerator compartment:
Inside is provided with the cold side of semiconductor refrigerating sheet, an and refrigerating sheet group: the cold side of this refrigerating sheet group and this conductor refrigeration sheet is adjacent, and establish an electrothermal tube, this electrothermal tube and this refrigerating sheet group are adjacent, use and amplify this conductor refrigeration sheet and this electrothermal tube refrigeration area/pyrogenicity area; If one first fan is adjacent to this refrigerating sheet group, forms blowing of cold/hot-air and drive; A condensed water water-collecting tray is established in this refrigerator compartment bottom; And this condensed water water-collecting tray bottom is provided with an atomized water particulate air inlet;
Semiconductor refrigerating sheet heat dissipation chamber:
Inside is provided with a groups of fins, and this groups of fins is adjacent to the hot side of conductor refrigeration sheet; And establish one second fan, can be for this groups of fins is formed heat radiation;
One atomizing water tank:
Inside is provided with an electronic atomized wafer, can supply water to form the atomized water particulate; And be provided with an atomized water particulate gas outlet, and this atomized water particulate gas outlet is communicated with an atomized water particulate pipe, and this atomized water particulate pipe then is communicated with this atomized water particulate air inlet, and the atomized water particulate leads to refrigerator compartment through atomized water particulate gas outlet; And an air inlet, for balance atomizing water tank Air pressure; And establish a water inlet, water filling is provided.
2. semiconductor Mist-type Air-conditioning Equipment as claimed in claim 1, but wherein this refrigerator compartment internal layer adopts bright heat reflection and is the compound composition of heat-resisting and heat insulation material, and isolated with other formation.
3. semiconductor Mist-type Air-conditioning Equipment as claimed in claim 1, wherein more establish a control circuit, can be for the size of the height of controlling temperature and humidity with wind-force, it is capable of regulating conductor refrigeration sheet cryogenic temperature or electrothermal tube pyrogenicity temperature that mat sees through circuit control panel control wafer adjustment size of current, with the first fan wind-force size, the second fan open and close, and electronic atomized wafer activates or closes, and also can see through the control wafer and set the activation of air-conditioning with the humiture sensing component and close.
4. semiconductor Mist-type Air-conditioning Equipment as claimed in claim 1, wherein this refrigerating sheet group is two groups of groups of fins, and the refrigerating sheet group thermal conducting tube phase take several solid or hollow thread materials as aluminium bar or red metal rod connects.
5. semiconductor Mist-type Air-conditioning Equipment as claimed in claim 4, these two groups of groups of fins wherein, one group is plural mountain type fin formula fin, the cold side of this each mountain type fin formula fin and conductor refrigeration sheet is adjacent, its material is aluminum or aluminum alloy or copper, fin thickness on this each mountain type fin formula fin is 1 ㎜～2 ㎜, and alternate 2 ㎜～4 ㎜ that are divided into of this each mountain type fin formula fin; One group is plural plate type heat radiating piece, its material is aluminum or aluminum alloy or copper, this each plate type heat radiating piece with the aluminium frame as support frame, tens of rectangle strips of parallel welding fin in the middle of the support frame, this each fin material is aluminium flake or aluminum alloy sheet or copper sheet, rectangle strip fin thickness is 0.5 ㎜～1 ㎜, and two rectangle strip fin parallel interval are 2 ㎜～4 ㎜.
6. semiconductor Mist-type Air-conditioning Equipment as claimed in claim 1, wherein this groups of fins is that a radiating block material is aluminum or aluminum alloy or copper and a plate type heat radiating piece group, both also connect with the groups of fins thermal conducting tube phases of several solid or hollow threads, material is aluminium bar or copper rod or red metal rod, and the hot side of radiating block and conductor refrigeration sheet is adjacent; Its material of plate type heat radiating piece group is aluminum or aluminum alloy or copper, the plate type heat radiating piece group with the aluminium frame as support frame, support tens of strip fin of the middle parallel welding of aluminium frame, the fin material is aluminium flake or aluminum alloy sheet or copper sheet, strip fin thickness is 0.5 ㎜～1 ㎜, and two rectangle strip fin parallel interval are 2 ㎜～4 ㎜.
7. semiconductor Mist-type Air-conditioning Equipment claimed in claim 1, wherein establish a proof mechanism of water in the adjacent place of cold side of refrigerating sheet group and conductor refrigeration sheet, this proof mechanism of water uses the mountain type fin formula fin greater than conductor refrigeration sheet area, and at bottom and the adjacent place of the refrigerator compartment device water proof rubber bar of mountain type fin formula fin, form the water-proof sealing contact-making surface of not loss conductor refrigeration sheet freezing capacity.
8. semiconductor Mist-type Air-conditioning Equipment as claimed in claim 2, wherein this refrigerator compartment internal layer is aluminium foil or aluminium flake, and this heat insulation material is PUR foam or PE foam.
9. semiconductor Mist-type Air-conditioning Equipment as claimed in claim 1, wherein this first fan and the second fan are selected and are designed to straight fan or straight barrel type fan.
10. semiconductor Mist-type Air-conditioning Equipment as claimed in claim 1, wherein this frame wall is vertical type or scheme design.
11. semiconductor Mist-type Air-conditioning Equipment as claimed in claim 1, wherein the atomized water particulate gas outlet of this atomizing water tank and air inlet have the mechanism design that anti-sealing overflows, unidirectional design is taked in its design, namely only allow atomized water particulate and air to pass in and out, the water in the atomizing water tank can't overflow from atomized water particulate gas outlet and air inlet.
12. semiconductor Mist-type Air-conditioning Equipment as claimed in claim 1, the water inlet mechanism design of the water tank that wherein should atomize namely only allows water to enter, and the water in the atomizing water tank can't overflow from water inlet; And reserve atomized water particle conversion space by the water inlet installation site, and and cooperating the ball float full-water level water check valve design in the water inlet, the water tank water filling overfill of avoiding atomizing is converted into water without the space problem of atomized water particulate.
13. semiconductor Mist-type Air-conditioning Equipment as claimed in claim 1, wherein the water level that atomized in the water tank of this electronic atomized wafer is controlled.
14. semiconductor Mist-type Air-conditioning Equipment as claimed in claim 1, the interior essence oil from plant that adds in the water tank that wherein should atomize.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2009/000143 WO2010091531A1 (en) | 2009-02-10 | 2009-02-10 | Semiconductor mist-type air-conditioning equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102301192A CN102301192A (en) | 2011-12-28 |
| CN102301192B true CN102301192B (en) | 2013-04-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200980155731.0A Expired - Fee Related CN102301192B (en) | 2009-02-10 | 2009-02-10 | Semiconductor mist-type air-conditioning equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102301192B (en) |
| WO (1) | WO2010091531A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103822343A (en) * | 2014-02-14 | 2014-05-28 | 美的集团股份有限公司 | Air-conditioner moisture-accumulation and humidifying device and air-conditioning system and air-conditioner indoor unit using same |
| CN104197452B (en) * | 2014-09-19 | 2017-01-04 | 江苏蓝鑫电子科技有限公司 | A kind of air conditioning system with air-cleaning function |
| CN107514715A (en) * | 2016-06-15 | 2017-12-26 | 奇岩电子股份有限公司 | Air-conditioning device |
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| WO2005102101A1 (en) * | 2004-04-23 | 2005-11-03 | Matsushita Electric Works, Ltd. | Fan heater with electrostatic atomizer |
| CN103868212B (en) * | 2012-12-17 | 2016-07-06 | 格力电器（中山）小家电制造有限公司 | The priming apparatus of conditioner, humidifier and air cooler |
| CN103791575A (en) * | 2014-02-12 | 2014-05-14 | 丹东星光电器有限公司 | Electronic air-conditioner type anion humidification fan |
| CN104180436A (en) * | 2014-04-08 | 2014-12-03 | 中国计量学院 | High-grade air purifying device consisting of water spraying as well as refrigerating and heating programs |
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| CN106642371B (en) * | 2016-09-30 | 2022-08-02 | 芜湖美智空调设备有限公司 | Air conditioner, shell assembly of air conditioner and assembly method of shell assembly |
| WO2019116156A1 (en) * | 2017-12-14 | 2019-06-20 | 周兆泰 | Semiconductor cooling or heating air conditioner |
| CN110375408A (en) * | 2019-08-19 | 2019-10-25 | 深圳市一粒创新设计有限公司 | A kind of exhaust apparatus |
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| CN1392372A (en) * | 2002-07-02 | 2003-01-22 | 海尔集团公司 | Air conditioner cabinet with humidifying function |
| CN1455191A (en) * | 2003-03-28 | 2003-11-12 | 陈定弟 | Ultrasonic air-conditioning fan equipped with semiconductor cooler |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN102301192A (en) | 2011-12-28 |
| WO2010091531A1 (en) | 2010-08-19 |
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