CN102301192A - Semiconductor Mist-type Air-conditioning Equipment - Google Patents
Semiconductor Mist-type Air-conditioning Equipment Download PDFInfo
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- CN102301192A CN102301192A CN2009801557310A CN200980155731A CN102301192A CN 102301192 A CN102301192 A CN 102301192A CN 2009801557310 A CN2009801557310 A CN 2009801557310A CN 200980155731 A CN200980155731 A CN 200980155731A CN 102301192 A CN102301192 A CN 102301192A
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- water
- semiconductor
- fin
- mist
- atomized
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F6/00—Air-humidification, e.g. cooling by humidification
- F24F6/02—Air-humidification, e.g. cooling by humidification by evaporation of water in the air
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
- F24F5/0042—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
Abstract
Semiconductor mist-type air-conditioning equipment is provided. The air conditioning includes a housing (A3) whose interior is divided into a refrigeration room (A), a heat dissipation room (A1) and a water atomization tank (A2). In the refrigeration room (A), a semiconductor refrigerating chip (4) is arranged and the cold side of the semiconductor refrigerating chip (4) is adjacent to a heatsink (1) so as to enlarge the refrigerating area of the semiconductor refrigerating chip (4). Besides, a first fan (3) is adjacent to the heatsink (1) in order to blowing the processed air. In the heat dissipation room (A1), another heatsink (5) is adjacent to the heat side of the semiconductor refrigerating chip (4), and a second fan (31) is used to dissipate the heat from the heatsink (5).In the water atomization tank (A2), an electronic chip (72) is arranged to atomizate the water stored in the tank into mist, and the mist is guided into the refrigeration room (A) so as to humidify the processed air. The semiconductor mist-type air- conditioning equipment can work at cooling, heating, humidifying or dehumidifying modes.
Description
Semiconductor Mist-type Air-conditioning Equipment
Technical field
The present invention is especially a kind of to form the device adjusted for indoor temperature on a kind of semiconductor Mist-type Air-conditioning Equipment.Background technology
General air-conditioning equipment, refer mainly to air-cooling system, and the operating construction and drive manner of cold air, refrigerant is typically compressed into the gas coolant of high pressure-temperature through compressor, condenser is sent to cool down refrigerant, refrigerant is after high pressure-temperature heat release cooling, liquid refrigerants as high pressure low temperature, bottle is stored via refrigerant store unnecessary refrigerant again, other refrigerants are depressurized into low-pressure low-temperature at expansion valve, then flow into evaporator, can be with the temperature in absorption chamber through the gaseous coolant of low-pressure low-temperature, and after being absorbed heat through low temperature refrigerant, the interior space is blown to by power, cause cold house's effect.But; the drawbacks of prior art has serious; contain CFCs (CFCs) mainly due to cold coal; it is not easy to decompose in the Nature; and the content of its accumulation can consume the ozone in stratosphere with characteristic; so that ozone content is increasingly reduced; form the scarce hole of earth protection; and ultraviolet is in the without hindrance situation direct irradiation earth; except easily causing various lesions to the mankind and biology; and for ecological environment, can also produce climatic variation and the unbalance serious consequence of Ecological regulation.The content of the invention
Refrigerant is used as the serious problems produced by the raw material of air-conditioning in view of prior art, inventor appreciates that should have a kind of can improve the construction of drawback, the present invention is on a kind of semiconductor Mist-type Air-conditioning Equipment, main purpose is by the semiconductor electronic refrigeration (refrigeration of above and below, relative is pyrogenicity, below unify claimed with refrigeration) or electrothermal tube pyrogenicity produced by low-temperature receiver and thermal source, via refrigerating sheet do amplification refrigeration area.The atomized water particulate that electronic atomized chip is formed is recycled as conducting cold or hot medium (its principle is that the m of l u m ~ 3 atomized water particulate pyroconductivity is better than general air), atomized water particulate is driven by refrigerating sheet group in the presence of heat exchange and heat transfer through the first fan, reaches the purpose for producing cold air or hot gas.
And be to reach object defined above, technological means used in the present invention, major design, which is constituted, includes a refrigerator compartment, and the cold side of semiconductor refrigerating sheet is provided with inside the refrigerator compartment；The cold side of one refrigerating sheet group, refrigerating sheet group and semiconductor refrigeration sheet is adjacent；One electrothermal tube, electrothermal tube is also adjacent with refrigerating sheet group；Refrigerating sheet group can amplification semiconductor refrigerating sheet and electrothermal tube refrigeration area；One atomized water particulate air inlet, plural number is preferable, enters refrigeration chamber inlet as atomized water particulate；One first fan, is adjacent to refrigerating sheet group, and form cold (heat) air blows drive；One is cold
Solidifying water water-collecting tray, as collecting in refrigeration processes in the condensed water produced by refrigerating sheet group, atomized water particulate air inlet is installed on condensed water and catchmented above tray bottom；Refrigerator compartment internal layer is adopted bright face and heat reflection and can be isolated for the compound composition of heat-resisting and heat-insulated material and other constitute.Semiconductor refrigerating sheet heat dissipation chamber, the semiconductor refrigeration sheet heat dissipation chamber is provided with a groups of fins, and groups of fins is adjacent to the hot side of semiconductor refrigeration sheet；One second fan, radiates with groups of fins formation.An electronic atomized chip, the atomized water particulate of electronic atomized chip formation are provided with one atomization water tank, the atomization water tank；One atomized water particulate gas outlet, plural number is preferable, atomized water particulate gas outlet is on atomization water tank, and it is connected to fog particulate pipe one end, the atomized water particulate pipe other end is connected to the atomized water particulate air inlet on the condensed water water-collecting tray in refrigerator compartment, water produces atomized water particulate through electronic atomized chip, and atomized water particulate leads to refrigerator compartment through atomized water particulate pipe；One air inlet, plural number is preferable, and the air inlet is atomized the hollow atmospheric pressure of water tank on atomization water tank as balance；One water inlet, water inlet is on atomization water tank, as atomization water tank water filling port.
When the water in atomization water tank is by electronic atomized chip generation atomized water particulate, atomized water particulate sucks driving effect in the first fan, enter refrigerator compartment through atomized water particulate pipe, semiconductor refrigeration sheet or electrothermal tube in refrigerator compartment produce cold or heat, amplify refrigeration area through refrigerating sheet group, atomized water particulate is driven across refrigerating sheet group in the suction of the first fan, in the presence of heat exchange, reaches the purpose for producing cold air or hot gas.
And semiconductor refrigeration sheet needs to discharge semiconductor Mist-type Air-conditioning Equipment in the heat that refrigeration processes are produced, therefore in the groups of fins of hot side device one and one second fan of semiconductor refrigeration sheet, radiating is formed by the heat discharge semiconductor Mist-type Air-conditioning Equipment of generation.
An of the invention purpose is that controllable ambient humidity has humidification and the function of dehumidifying to air; because the present invention is producing cold air or hot gas process; it is using atomized water particulate as conduction low-temperature receiver and the medium rather than general air of thermal source; and atomized water particulate can increase air humidity; so the present invention is also air wetting machine when typically producing cold air or hot gas process, this part, which is different from traditional air conditioner, can operationally cause the too low disadvantage of ambient humidity；When the present apparatus does not activate electronic atomized chip in refrigeration processes, i.e. with general air as conduction low-temperature receiver medium, cold dry air and condensed water can now be produced, i.e. when refrigeration in this manner, during damp-heat air in environment be sucked into refrigerator compartment in the first fans drive, damp-heat air is when contacting refrigerating sheet group in the presence of heat exchange, except can reduce air themperature and condensed water can be produced in refrigerating sheet group, under the first fan blows and driven i.e. generation cold air can also reduce surrounding air in humidity, and ^1After the condensed water of generation can be concentrated by the condensed water water-collecting tray on device, and atomization water tank is flowed into by atomized water particulate air inlet, therefore it is that an air conditioner is also a dehumidifier that the present invention is removed in this mode operating；The present invention can control the humidity in environment by two kinds of operating mode switchings.
Another object of the present invention is, using control circuit, to control the size of the height and wind-force of temperature and humidity, is adjustable semiconductor refrigeration sheet cryogenic temperature or electric heating by through circuit control panel control chip adjustment size of current
Pipe pyrogenicity temperature, with the first fan wind-force size, the second fan open and close, and the activation of electronic atomized chip or closing, also can pass through activation and closing that control chip sets air-conditioning with humiture sensing component.
Another object of the present invention is that refrigerating sheet group mechanism is designed; increase the heat exchanger effectiveness with atomized water particulate or air as amplification semiconductor refrigerating sheet and electrothermal tube refrigeration (area), its mechanism composition is two groups of groups of fins and connected using several solid or Kong Xin Luo Pattern materials as the refrigerating sheet group thermal conducting tube phase of aluminium bar or red metal rod；Two groups of groups of fins, one group is plural mountain type fin fin, the cold side of each mountain type fin fin and semiconductor refrigeration sheet is adjacent, its material is aluminum or aluminum alloy or copper, fin thickness on the various fin fin is the legs of 1 Chung 2, and two fin are alternate with fin to be divided into 2 M！4 legs；One group is plural plate type heat radiating piece, its material is aluminum or aluminum alloy or copper, each plate type heat radiating piece is with aluminium frame as support frame, support frame intermediate parallel welds tens of rectangle strip fin, each fin material is aluminium flake or aluminum alloy sheet or copper sheet, rectangle strip fin thickness is the mm of 0.5 leg 1, and the two fin parallel interval is 2 awake 4 legs.
Another object of the present invention is that groups of fins mechanism is designed, groups of fins is as the heat produced by discharge semiconductor refrigeration sheet refrigeration processes, its mechanism composition is that a radiating stock material is aluminum or aluminum alloy or copper and a plate type heat radiating piece group, both are simultaneously connected with several solid or Kong Xin Luo Pattern groups of fins thermal conducting tube phase, material is aluminium bar, copper rod or red metal rod, and the hot side of radiating block and semiconductor refrigeration sheet is adjacent；Its material of plate type heat radiating piece group is aluminum or aluminum alloy or copper, plate type heat radiating piece group is with aluminium frame as support frame, support aluminium frame intermediate parallel welds tens of strip fin, fin material is aluminium flake or aluminum alloy sheet or copper sheet, strip fin thickness is the legs of 0.5 Chant 1, and fin parallel interval is 2 mn！4 wake up.
Another object of the present invention is the mechanism design of the adjacent waterproof of the cold side of refrigerating sheet group and semiconductor refrigeration sheet, due to the medium atomization water particulate as heat transfer, semiconductor refrigeration sheet can be caused to damage, therefore design uses the mountain type fin fin for being more than semiconductor refrigeration sheet area to take, and in the bottom of mountain type fin fin and the adjacent place's device water proof rubber bar of refrigerator compartment, semiconductor refrigeration sheet freezing capacity water-proof sealing contact surface is not lost for formation.
Another object of the present invention is the material design of refrigerator compartment internal layer institute coating, because refrigerator compartment need to avoid heat loss and the concentration of heat radiation and heat-resisting heat-insulating problem during refrigeration and pyrogenicity, therefore refrigerator compartment internal layer adopt bright face can heat reflection and be the compound composition of heat-resisting and heat-insulated material, bright face can heat reflection and be that heat-resisting material can be aluminium foil or aluminium flake, heat-insulated material can be the low-temperature insulation material such as PUR foams or PE foams.
Another object of the present invention is that the first fan and the second fan can be straight fan or straight barrel type fan from design, using various forms of fans from designing, semiconductor Mist-type Air-conditioning Equipment can be made, which to produce different external forms, can so be useful in different occasions and space.
Another object of the present invention be semiconductor Mist-type Air-conditioning Equipment can be vertical type and scheme design, by
Refrigerator compartment and semiconductor refrigeration sheet radiating ^:And the different position grouping of atomization water tank, semiconductor Mist-type Air-conditioning Equipment can be made to produce different external forms so can be applicable in different occasions and space.
Another object of the present invention is the mechanism design that the atomized water particulate gas outlet of device atomization water tank and air inlet prevent water from overflowing, other electrical mechanism assemblies are undermined to avoid the water being atomized in water tank from being overflowed by atomized water particulate gas outlet and air inlet, therefore take unidirectional design, only atomized water particulate is allowed to be passed in and out with air, the water in atomization water tank can not overflow from atomized water particulate gas outlet and air inlet.
Another object of the present invention is the water inlet mouth mechanism design for being installed on atomization water tank, other electrical mechanism assemblies are undermined to avoid the water being atomized in water tank from being overflowed by water inlet, therefore take unidirectional design, i.e., only allow water to enter, the water in atomization water tank can not overflow from water inlet；Other electronic atomized chip is during conversion water is atomized water particulate, air need to be reserved with space to be converted into atomized water particulate as water, therefore atomization water tank can not fill water in the injecting process, atomized water particle conversion space is reserved by water inlet installation site in the design of intake of the present invention, and coordinate the ball float full-water level water check valve in water inlet to design, come avoid atomization water tank with water overfill without space to convert the water to atomized water particulate the problem of.
Another object of the present invention is in atomization water tank that electronic atomized chip is automatically stopped movements design in low water level, if because electronic atomized chip is having the danger burnt without continuation action under aqueous condition, therefore in low water level, electronic atomized chip is automatically stopped action in design atomization ice case, to avoid the danger that electronic atomized chip burns.
Still a further object of the present invention is that can add essence oil from plant in atomization water tank makes semiconductor Mist-type Air-conditioning Equipment be changed into air cleaner and air fragrant machine, because electronic atomized chip is to convert water to atomized water particulate using 1,600,000 vibrations, a large amount of anions can be produced in conversion process, carry the dust in the adsorbable air of water particulate of anion to reach the purpose of peace and quiet air；If in water tank add essence oil from plant electronic atomized chip action when, essence oil from plant can also be changed into the aerial particulate molecular of floatability, with the first fan blow drive and reach room air reach fragrance purpose.Brief description of the drawings
Fig. 1 is planar structure schematic diagram of the present invention；
Fig. 2 is refrigerating/heating piece group three-view diagram of the invention；
Fig. 3 is refrigerating/heating piece group of the invention and the straight fan of the first fan；
Fig. 4 is refrigerating/heating piece group of the invention and the first fan straight barrel type fan；
Fig. 5 is water-collecting tray three-view diagram and stereogram of the invention；
Fig. 6 is refrigerating/heating room frame wall profile of the invention；
Fig. 7 is water proof rubber bar installation site figure of the invention；
Fig. 8 is atomized water particulate pipe profile of the invention；
Fig. 9 is groups of fins three-view diagram of the invention；
Figure 10 is groups of fins of the invention and the straight fan three-view diagram of the second fan;
Figure 11 is groups of fins of the invention and the second fan straight barrel type fan；
Figure 12 is water tank three-view diagram and stereogram of the invention；
Figure 13 is electronic atomized chip of the invention and water level switch circuit diagram；
Figure 14 is the water inlet profile of the present invention；
Figure 15 is air inlet profile of the invention；
Figure 16 is the framework floor map for controlling circuit of the invention；
Figure 17 combines legend one for the various structures of the present invention；
Figure 18 combines legend two for the various structures of the present invention；
Figure 19 combines legend three for the various structures of the present invention.
Wherein
A. refrigerator compartment A1. semiconductor refrigeration sheets heat dissipation chamber
A2. water tank A3. frame walls are atomized
A4. the bright faces of water proof rubber bar A5. can heat reflection and be heat-resisting and heat-insulated material
A5A. bright face can the heat-insulated materials of heat reflection material A5B.
1. the mountain type fin fin of refrigerating sheet group 11.
12. plate type heat radiating piece 12A. supports aluminium frame
The refrigerating sheet group heat pipe of 12B. strips fin 13.
2. the fan of electrothermal tube 3. first
Fan (the straight barrel type fans of 3A. first）31. the second fan
Fan (the straight barrel type fans of 31A. second）4. semiconductor refrigeration sheet
5. the radiating block of groups of fins 51.
52. the plate type heat radiating piece group of groups of fins heat pipe 53.
54. support the strip fin of aluminium frame 55.
6. the circuit control panel of condensed water water-collecting tray 7.
71. the electronic atomized chip of water level switch 72.
73. control the temperature sensing component of chip 74.
75. the power supply of humidity component 76.
8. the air inlet of atomized water particulate air inlet 81.
81 A. hollow base 81B. solid rubber balls
82. the atomized water particulate gas outlet of atomized water particulate pipe 83.
84. the water inlet of solid rubber ball 9.
91. the hollow base of hollow rubber ball 92.
93. lid embodiment of intaking
Illustrate construction, feature and the embodiment of the present invention by schema below, so that expensive careful Check personnel are further understood by for the present invention.
Refer to shown in Fig. 1 and Figure 16, the present invention relates generally to a kind of semiconductor Mist-type Air-conditioning Equipment, enclosed by a frame wall A3 for outside outline frame, and the atomization water tanks of a refrigerator compartment A and semiconductor refrigerating sheet heat dissipation chamber A1 and one A2 is defined as with frame wall A3 separations.
Include the cold side of semiconductor refrigerating sheet 4, a refrigerating sheet group 1, an electrothermal tube 2, plural atomized water particulate air inlet 8, one first fan 3, a condensed water water-collecting tray 6 inside refrigerator compartment A.
Semiconductor refrigeration sheet heat dissipation chamber A1 then includes, a groups of fins 5, one second fan 31, the hot side of semiconductor refrigerating sheet 4.
Atomization water tank A2 includes an electronic atomized chip 72, plural atomized water particulate gas outlet 83, plural air inlet 81, a water inlet 9.The other connection atomized water particulate of atomized water particulate gas outlet 83 pipe 82, is connected to the atomized water particulate air inlet 8 on the condensed water water-collecting tray 6 in refrigerator compartment A.
Other refrigerator compartment A internal layers paving can heat reflection and for heat-resisting and heat-insulated material A5, the heat produced by hot side to obstruct semiconductor chilling plate 4, it is to avoid reduction refrigerator compartment A cooling effects with bright face.
Include as component basic inside refrigerator compartment A：
The cold side of semiconductor refrigerating sheet 4： 、
It please coordinate shown in Figure 16, the cold side of the semiconductor refrigeration sheet 4 is constituted with power supply 76 and is electrically connected with, and be powered driving refrigeration by power supply 76.
One refrigerating sheet group 1:
Please coordinate shown in Fig. 2, be adjacent to the cold side of semiconductor refrigeration sheet 4 and electrothermal tube 2, can amplification semiconductor cooling piece 4 and electrothermal tube 2 refrigerating/heating area；Its mechanism of refrigerating sheet group 1 composition is two groups of groups of fins and connected by the refrigerating sheet group heat pipe 13 of aluminium bar or red metal rod of several solid or hollow thread material；Two groups of groups of fins, one group is plural mountain type fin fin 11, and each bottom of mountain type fin fin 11 and the cold side of semiconductor refrigeration sheet 4 are adjacent, and its material is the radiating on aluminum or aluminum alloy or copper, each mountain type fin fin 11
Piece thickness is the legs of 1 Surface 2, and two fin are alternate with fin to be divided into the legs of 2 Surface 4；One group is plural plate type heat radiating piece 12, the plural plate type heat radiating piece and electrothermal tube 2 are adjacent, its material is aluminum or aluminum alloy or copper, each plate type heat radiating piece 12 is with aluminium frame as support frame, support frame 12A intermediate parallels weld tens of strip fin 12B, fin material is aluminium flake or aluminum alloy sheet or copper sheet, and strip fin 12B thickness is the Chant of 0.5 Meetings 1, and fin parallel interval is 2 ran！〜 4 ππη.
One first fan 3:
Refer to shown in Fig. 3 and Fig. 4, be adjacent to the plate type heat radiating piece group 13 in refrigerating sheet group 1, drive is blown with refrigerating sheet group 1 formation air, can be straight first fan 3 or be straight barrel type the Α of the first fan 3;Using various forms of fans from designing, semiconductor Mist-type Air-conditioning Equipment can be made, which to produce different external forms, can so be useful in different occasions and space.
One electrothermal tube 2:
The plate type heat radiating piece group 13 in refrigerating sheet group 1 is adjacent to, constitutes and is electrically connected with power supply 76, and is powered driving pyrogenicity by power supply 76.
One condensed water water-collecting tray 6:
Refer to shown in Fig. 1 and Fig. 5, its location means is in refrigerator compartment Α bottoms, as collecting in refrigeration processes in the condensed water produced by refrigerating sheet group 1；Again above the bottom of condensed water water-collecting tray 6, device plural number atomized water particulate air inlet 8;Condensed water produced by refrigerating sheet group 1, because the condensed water that condensed water water-collecting tray 6 is adopted inclined design therefore collected is concentrated in the bottom of condensed water water-collecting tray 6, and flows into atomization water tank A2 by atomized water particulate air inlet 8.
Please refer to shown in Fig. 1 and Fig. 6, refrigerator compartment A frame wall A3 internal layers adopt bright face can heat reflection and be the compound compositions of heat-resisting and heat-insulated material A5, be isolated with other compositions；Heat-resisting and heat-insulated material A5 compound composition, respectively by the bright face of outer layer can the heat-insulated material A5B of heat reflection material A5A and internal layer constituted, bright face can heat reflection and be that heat-resisting material A6 can be aluminium foil or aluminium flake, heat-insulated material A7 can be the low-temperature insulation material such as PUR foams or PE foams.Refrigerator compartment A frame wall A3 internal layers adopt bright face can heat reflection and be the design of heat-resisting and heat-insulated material, the purpose is to avoided in the refrigeration processes of semiconductor refrigeration sheet 4 because low-temperature receiver leaks influence freezing capacity, or in pyrogenicity process can concentrate heat radiation in electrothermal tube 2, increase pyrogenicity effect.
Refer to shown in Fig. 7, each bottom area of mountain type fin fin 11 during another refrigerating sheet group 1 is constituted need to be more than the refrigeration face area of semiconductor refrigeration sheet 4, and in the bottom of each mountain type fin fin 11 and the adjacent place's device water proof rubber bar A4 of refrigerator compartment A, the water-proof sealing contact surface that semiconductor refrigeration sheet freezing capacity is not lost is formed with this；Its object is to prevent the medium atomization water particulate of heat transfer, semiconductor refrigeration sheet is caused to damage.
Please refer to shown in Fig. 1 and Fig. 5 and Fig. 8, the device of condensed water water-collecting tray 6 in refrigerator compartment A bottoms
Plural atomized water particulate air inlet 8, refrigerator compartment A entrance is entered as atomized water particulate；The connection atomized water particulate of atomized water particulate air inlet 8 pipe 82, atomized water particulate pipe 82 is connected to the atomized water particulate gas outlet 83 on atomization water tank A2;Its mechanism of atomized water particulate pipe 82 is connected with a short big-inch pipe by a long small-diameter pipe and constituted, small-diameter pipe is connected to atomized water particulate air inlet 8, big-inch pipe, which is connected in atomized water particulate gas outlet 83, big-inch pipe, a solid rubber ball 84;The diameter of solid rubber ball 84 is more than the small-diameter pipe in mechanism, but less than atomized water particulate gas outlet 83, to prevent solid rubber ball 84 from coming off；It can normally lead to refrigerator compartment A in normally situation atomized water particulate, when semiconductor Mist-type Air-conditioning Equipment is toppled over, solid rubber ball 84 will block atomized water particulate air inlet 8, it is to avoid atomization water tank A2 water is overflowed by water particulate air inlet 8 undermines the other electric devices of semiconductor Mist-type Air-conditioning Equipment.
Basic component includes inside semiconductor refrigeration sheet heat dissipation chamber A1：
One groups of fins 5:
Refer to shown in Fig. 9, be adjacent to the hot side of semiconductor refrigeration sheet 4, radiated with the formation of the second fan 31；Its mechanism composition is a radiating block 51 and a plate type heat radiating piece group 53, wherein the material of radiating block 51 is aluminum or aluminum alloy or copper, both are simultaneously connected with several solid or Kong Xin Luo Pattern groups of fins heat pipe 52, and material is aluminium bar or copper rod or red metal rod；Its material of plate type heat radiating piece group 53 is aluminum or aluminum alloy or copper, and plate type heat radiating piece group 53 is with aluminium frame as support frame, and the intermediate parallel of support aluminium frame 54 welds tens of strip fin:55, fin material is aluminium flake or aluminum alloy sheet or copper sheet, and the thickness of strip fin 55 is 0.5 mn！1 ware, fin parallel interval is the Let of 2 mm 4.
One second fan 31:
Refer to shown in Figure 10 and Figure 11, second fan 31 is adjacent to the plate type heat radiating piece group 53 in groups of fins 5, radiated with the formation of groups of fins 5, can be straight second fan 31 or be straight barrel type the second fan 31A;Using various forms of fans from designing, semiconductor Mist-type Air-conditioning Equipment can be made, which to produce different external forms, can so be useful in different occasions and space.
Basic component includes inside atomization water tank A2：
One electronic atomized chip 72:
Refer to shown in Fig. 1 and Figure 12, the electronic atomized chip 72 is installed on atomization water tank A2 inner bottom parts, is electrically connected with water level switch 71, and powered driving by power supply 76；When the water level being atomized inside water tank A2 is too low, electronic atomized chip 72 can be automatically stopped action, avoid electronic atomized chip 72 from burning with this, and electronic atomized chip 72 is referred to shown in Figure 13 with the circuit diagram of water level switch 71.
One water inlet 9:
Refer to shown in Figure 12 Figure 14, the water inlet 9 is installed on atomization water tank A2, for atomization water tank A2
Water filling inlet；Because electronic atomized chip 72 is during conversion water is atomized water particulate, air need to be reserved with space to be converted into atomized water particulate as water, therefore atomization water tank A2 can not fill water in the injecting process, design by the installation site of water inlet 9 to reserve atomization " water " particle conversion space in the water inlet 9 of the present invention；The mechanism of water inlet 9 composition is linked by two sections of hollow tubes of size diameter, there is a hollow rubber ball 91 in large diameter pipe, large diameter pipe bottom has a hollow base 92 to prevent hollow rubber ball 91 from coming off, the diameter of hollow rubber ball 91 is more than minor diameter hollow tube but less than diameter hollow pipe, and the hollow pipe end of minor diameter sets a water inlet lid 93;When water is injected into estimated water level, hollow rubber ball 91 just firmly allows unnecessary water not reinject because water buoyancy floats to block water inlet 9, thereby to avoid atomization water tank A2 water fillings overfill without space to convert the water to atomized water particulate the problem of.
Refer to shown in Figure 12 Figure 15, water tank A2 is atomized in addition and is provided with plural air inlet 81, as air pressure in balance atomization water tank A2；Its mechanism composition is linked by two sections of hollow tubes of size diameter, there is a solid rubber ball 81B in large diameter pipe, there is a hollow base 81A large diameter pipe bottom to prevent solid rubber ball 81B from coming off, and solid rubber ball 81B diameters are more than minor diameter hollow tube but less than diameter hollow pipe；It can normally lead to atomization water tank A2 in normally situation air, when semiconductor Mist-type Air-conditioning Equipment is toppled over, solid rubber ball 81B will block air inlet 81, it is to avoid atomization water tank A2 water is overflowed by air inlet 81 undermines the other electric devices of semiconductor Mist-type Air-conditioning Equipment.
As shown in fig.8, separately atomization water tank A2 is provided with plural atomized water particulate gas outlet 83, atomized water particulate gas outlet 83 is connected with atomized water particulate pipe 82, is the entrance that atomized water particulate leads to refrigerator compartment A.
When the water in atomization water tank A2 is by electronic atomized chip 72 generation atomized particles, atomized water particulate sucks driving effect in the-fan 3, enter refrigerator compartment A through being atomized " water " particulate pipe 82, semiconductor refrigeration sheet 4 or electrothermal tube 2 in refrigerator compartment A produce cold or heat, amplify refrigeration area through refrigerating sheet group 1, atomized water particulate is driven across refrigerating sheet group 1 in the suction of the first fan 3, in the presence of heat exchange, reaches the purpose for producing cold air or hot gas.And semiconductor refrigeration sheet 4 needs to discharge semiconductor Mist-type Air-conditioning Equipment in the heat that refrigeration processes are produced, therefore in the groups of fins 5 of hot side device one of semiconductor refrigeration sheet 4 and one second fan 31, radiating is formed by the heat discharge semiconductor Mist-type Air-conditioning Equipment of generation.
The present invention can activate with closing two kinds of mode of operations to control ambient humidity by electronic atomized chip 72；It is of the invention general in generation cold air or hot gas process; it is using atomized water particulate as conduction low-temperature receiver and the medium of thermal source; now electronic atomized chip 72 is activation; and atomized water particulate can increase air humidity, so the present invention is also air wetting machine when typically producing cold air or hot gas process；When electronic atomized chip 72 in off position under, cold dry air and condensed water can now be produced, i.e., when refrigeration in this manner as conduction low-temperature receiver medium with general air, during damp-heat air in environment be sucked into refrigerator compartment A in the driving of the first fan 3, damp-heat air is connecing
During tactile refrigerating sheet group 1 in the presence of heat exchange, except can reduce air themperature and condensed water can be produced in refrigerating sheet group 1, the humidity during cold air can also reduce surrounding air is being produced under first fan 3 blows and driven, and after produced condensed water can be concentrated by the condensed water water-collecting tray 6 on device, and atomization water tank A2 is flowed into by atomized water particulate air inlet 81, therefore it is that an air conditioner is also a dehumidifier that the present invention is removed in this mode operating；The present invention can control the humidity in environment by two kinds of operating mode switchings.
Refer to shown in Fig. 1 and Figure 16, the present invention can utilize circuit control panel 7, the size of the height and wind-force of setting control temperature and humidity, can pass through the adjustment of control chip 73 size of current in circuit control panel 7 is the adjustable cold temperatures of semiconductor refrigeration sheet 4 or the pyrogenicity temperature of electrothermal tube 2, with the wind-force size of the first fan 3 and the open and close of the second fan 31, and electronic atomized chip 72 is activated or closed, activation and closing that control chip 73 sets air-conditioning with temperature sensing component 74 and humidity component 75 also can pass through.
Refer to shown in Figure 17 and Figure 18 and Figure 19, the semiconductor Mist-type Air-conditioning Equipment of the present invention can be vertical type and scheme design, by the refrigerator compartment A position groupings different from semiconductor refrigeration sheet heat dissipation chamber A1 and atomization water tank A2, semiconductor Mist-type Air-conditioning Equipment can be made to produce different external forms, so i.e. applicable various different occasions and space.
Essence oil from plant, which can be added, in the atomization water tank A2 of the present invention again makes semiconductor Mist-type Air-conditioning Equipment be changed into air cleaner and air fragrant machine, because electronic atomized chip 72 is to convert water to atomized water particulate using 1,600,000 vibrations, a large amount of anions can be produced in conversion process, carry the dust in the adsorbable air of water particulate of anion to reach the purpose of peace and quiet air；If adding essence oil from plant in atomization water tank A2 when electronic atomized chip 72 is in action, essence oil from plant can also be changed into the aerial particulate molecular of floatability, drive with blowing for the first fan 3 and reach room air and reach the purpose of fragrance.
Effect of the present invention can reach：
First, the present invention is adopted using semiconductor refrigeration sheet and electrothermal tube as low-temperature receiver and thermal source, and is heat-conduction medium using the atomized water particulate produced by electronic atomized chip, thereby produces cold air and heating；The present invention can also be opened and closed by electronic atomized chip, come control ambient humidity high with it is low.The present invention remove for a new invention without using traditional cold coal environment-friendly air conditioner device, be also cold air, heating, dehumidifying, humidification the comprehensive air-conditioning device of four-in-one.
2nd, the present invention can reach the purpose of control temperature and humidity using artificial intelligence control chip, when temperature height to setting value (30 degree Celsius of such as design temperature) is the power switch of automatic activation control device circuit board, activating semiconductor Mist-type Air-conditioning Equipment.To setting value (20 degree Celsius of such as design temperature) it is automatic to close semiconductor Mist-type Air-conditioning Equipment when temperature is low.
3rd, the present invention can adjust temperature.
4th, the present invention can adjust wind-force size.
5th, the present invention can adjust humidity it is high with it is low.
6th, the present invention can be by using multi-form fan and by the refrigerator compartment position grouping different from semiconductor refrigeration sheet heat dissipation chamber and atomization water tank, and semiconductor Mist-type Air-conditioning Equipment can be made, which to produce different external forms, can so be useful in different occasions and space.
7th, the present invention, which can add essence oil from plant, makes semiconductor Mist-type Air-conditioning Equipment be changed into air cleaner and air fragrant machine.
In summary, the present invention possesses practical function, is not found in publication or openly uses, meets patent requirement, patent application is proposed in accordance with the law.Above-mentioned institute is old, is a preferred embodiment in industry of the present invention, and the equivalence changes made such as according to scope of the present invention patent all belong to the row of this case claim.
Claims (12)
- Claims1st, a kind of semiconductor Mist-type Air-conditioning Equipment, is included and is enclosed by a frame wall frame, and inside is divided into：The refrigerator compartment of ' one：Inside is provided with the cold side of semiconductor refrigerating sheet, and a refrigerating sheet group：The cold side of the refrigerating sheet group and the semiconductor refrigeration sheet is adjacent, and sets an electrothermal tube, and the electrothermal tube and the refrigerating sheet group are adjacent, uses the amplification semiconductor refrigeration sheet and the electrothermal tube refrigeration area；If one first fan, the refrigerating sheet group is adjacent to, form cold heat air blows drive；The refrigerator compartment bottom sets a condensed water water-collecting tray；And the condensed water catchments tray bottom provided with an atomized water particulate air inlet；Semiconductor refrigerating sheet heat dissipation chamber：Inside is provided with a groups of fins, and the groups of fins is adjacent to the hot side of semiconductor refrigeration sheet；And one second fan is set, it is available for radiating to groups of fins formation；One atomization water tank：Inside is provided with an electronic atomized chip, can supply water to form atomized water particulate；And provided with an atomized water particulate gas outlet, the atomized water particulate gas outlet connects an atomized water particulate pipe, the atomized water particulate pipe then connects the atomized water particulate air inlet, and atomized water particulate leads to refrigerator compartment through atomized water gas outlet；And an air inlet, for the balance atomization hollow atmospheric pressure of water tank；And set a water inlet there is provided water filling.2nd, semiconductor Mist-type Air-conditioning Equipment as claimed in claim 1, wherein the refrigerator compartment internal layer adopt bright face can heat reflection and be the compound composition of heat-resisting and heat-insulated material, and be isolated with other compositions.3rd, semiconductor Mist-type Air-conditioning Equipment as claimed in claim 1, wherein more set a control circuit, it is available for controlling the size of the height and wind-force of temperature and humidity, it is adjustable semiconductor refrigeration sheet refrigeration ^ degree or electrothermal tube pyrogenicity temperature by through circuit control panel control chip adjustment size of current, with the first fan wind-force size, the second fan open and close, and electronic atomized chip activation or closing, it also can pass through activation and closing that control chip sets air-conditioning with humiture sensing component.4th, semiconductor Mist-type Air-conditioning Equipment as claimed in claim 1, wherein the refrigerating sheet group are two groups of groups of fins, and are connected using several solid or hollow thread material as the refrigerating sheet group thermal conducting tube phase of aluminium bar or red metal rod.5th, semiconductor Mist-type Air-conditioning Equipment as claimed in claim 4, wherein two groups of groups of fins, ' one group is plural mountain type fin fin, the cold side of each mountain type fin fin and semiconductor refrigeration sheet is adjacent, its material is aluminum or aluminum alloy or copper, fin thickness on each mountain type fin fin is the π π η of 1 ware 2, and two fin is alternate is divided into 2 ware 4mm;- group for plural plate type heat radiating piece, its material is aluminum or aluminum alloy or copper, each plate type heat radiating piece is with aluminium frame as support frame, support frame intermediate parallel welds tens of rectangle strip fin, each fin material is aluminium flake or aluminum alloy sheet or copper sheet, rectangle strip fin thickness is waken up for 0.5 Surface 1, and the two fin parallel interval is waken up for 2 Earn 4. 6th, semiconductor Mist-type Air-conditioning Equipment as claimed in claim 1, wherein the groups of fins is that a radiating stock material is aluminum or aluminum alloy or copper and a plate type heat radiating piece group, both are simultaneously connected with several solid or Kong Xin Luo Pattern groups of fins thermal conducting tube phase, material is aluminium bar or copper rod or red metal rod, and the hot side of radiating block and semiconductor refrigeration sheet is adjacent；Its material of plate type heat radiating piece group is aluminum or aluminum alloy or copper, plate type heat radiating piece group is with aluminium frame as support frame, support aluminium frame intermediate parallel welds tens of strip fin, and fin material is aluminium flake or aluminum alloy sheet or copper sheet, and strip fin thickness is 0.5 π ι π！1 Sa, fin parallel interval is 2M！〜 47th, the semiconductor Mist-type Air-conditioning Equipment described in claim 1, wherein adjacent a proof mechanism of water is set in the cold side of refrigerating sheet group and semiconductor refrigeration sheet, the proof mechanism of water uses the mountain type fin fin more than semiconductor refrigeration sheet area, and in the bottom of mountain type fin fin and the adjacent place's device water proof rubber bar of refrigerator compartment, form the water-proof sealing contact surface that semiconductor refrigeration sheet freezing capacity is not lost.8th, semiconductor Mist-type Air-conditioning Equipment as claimed in claim 2, wherein the refrigerator compartment internal layer are aluminium foil or aluminium flake, and the heat-insulated material can be the low-temperature insulation material such as PUR foams or PE foams.9th, semiconductor Mist-type Air-conditioning Equipment as claimed in claim 1, wherein first fan and the second fan can be straight fan or straight barrel type fan from design.10, semiconductor Mist-type Air-conditioning Equipment as claimed in claim 1, wherein the frame wall are vertical type or scheme design.11, semiconductor Mist-type Air-conditioning Equipment as claimed in claim 1, wherein the atomized water particulate gas outlet of the atomization water tank and air inlet prevent the mechanism design that water overflows, unidirectional design is taken in its design, only atomized water particulate is allowed to be passed in and out with air, the water in atomization water tank can not overflow from atomized water particulate gas outlet and air inlet.12, the water inlet mouth mechanism design of semiconductor Mist-type Air-conditioning Equipment as claimed in claim 1, wherein the atomization water tank, i.e., only allow water to enter, and the water in atomization water tank can not overflow from water inlet；And reserve atomized water particle conversion space by water inlet installation site, and coordinate the wealthy design of ball float full-water level sealing in water inlet, the problem of to avoid atomization water tank with water overfill without space to convert the water to atomized water particulate.13, semiconductor Mist-type Air-conditioning Equipment as claimed in claim 1, the wherein electronic atomized chip can be by the water level controls in atomization water tank.14, essence oil from plant can be added in semiconductor Mist-type Air-conditioning Equipment as claimed in claim 1, wherein the atomization water tank.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2009/000143 WO2010091531A1 (en) | 2009-02-10 | 2009-02-10 | Semiconductor mist-type air-conditioning equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102301192A true CN102301192A (en) | 2011-12-28 |
| CN102301192B CN102301192B (en) | 2013-04-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200980155731.0A Expired - Fee Related CN102301192B (en) | 2009-02-10 | 2009-02-10 | Semiconductor mist-type air-conditioning equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102301192B (en) |
| WO (1) | WO2010091531A1 (en) |
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| CN103868212A (en) * | 2012-12-17 | 2014-06-18 | 格力电器（中山）小家电制造有限公司 | Water adding device for air conditioning device, humidifier and air conditioning fan |
| CN104180436A (en) * | 2014-04-08 | 2014-12-03 | 中国计量学院 | High-grade air purifying device consisting of water spraying as well as refrigerating and heating programs |
| CN105916346A (en) * | 2016-05-13 | 2016-08-31 | 浙江理工大学 | Integrated power box |
| CN111529224A (en) * | 2020-05-11 | 2020-08-14 | 青岛大学附属医院 | Isolation device for epidemic prevention medical vehicle |
| CN112696751A (en) * | 2021-01-22 | 2021-04-23 | 东莞市万维热传导技术有限公司 | Air conditioning device based on 3D temperature-uniforming plate module |
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| KR100809568B1 (en) * | 2004-04-23 | 2008-03-04 | 마츠시다 덴코 가부시키가이샤 | Heating blower with electrostatic atomizing device |
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| CN112696751A (en) * | 2021-01-22 | 2021-04-23 | 东莞市万维热传导技术有限公司 | Air conditioning device based on 3D temperature-uniforming plate module |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2010091531A1 (en) | 2010-08-19 |
| CN102301192B (en) | 2013-04-17 |
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