CN102298262B - Thermocuring photosensitive resin composition - Google Patents
Thermocuring photosensitive resin composition Download PDFInfo
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Abstract
The invention provides a thermocuring photosensitive resin composition, which can be used for a photoresist and a photosensitive insulating layer of paints, printing inks and printed circuit boards. The thermocuring photosensitive resin composition mainly comprises the following components by mass percentage: (a) 5-60% of photosensitive resin; (b) 5-60% of responsive diluent; (c) 0.01-20% of curcumin modified substance which has at least two nonsaturated double bonds and at least two carboxylic groups; (d) 0.1-15% of photoinitiator; and (e) 0.5-40% of thermosetting resin.
Description
Technical field
The present invention relates to a kind of heat curing photosensitive resin composition, can be applicable to coating, printing ink, use in printed circuit board photoresist and sensitization insulation course etc., be particularly useful for the green lacquer that the protection of printed circuit board surface is filmed.
Background technology
Printed circuit board (PCB) provides main carrier and the supporter of electronic component when installing and interconnect, and is the indispensable important component of electronic product.
In recent years; Since electronic product towards compact, be easy to carry, complex function and highdensity trend development; And along with the demand of electronic equipment to high I/O number, granular and aspect such as compact; The technology of printed circuit board (PCB) also must constantly promote thereupon, and the physical and chemical performance of associated materials also requires to improve constantly.Wherein be applied to the green lacquer that the printed circuit board surface protection is filmed; Also be referred to as anti-welding photoresistance printing ink (solder resist ink); Because its processing is harsh more with application conditions; Except original insulativity, scolding tin thermotolerance, high rigidity and chemical-resistance, also need have character such as high-res, fast, the anti-metallide property height of developing powder and high-temp resisting high-humidity resisting degree.
Current, general green lacquer can't reach above-mentioned these high functionality requirements, and the present invention improves to above problem.
In the prior art, the open communique spy of Jap.P. opens flat 11-21327 and has disclosed a kind of light-cured resin, and it is synthesized by epoxy resin/(methyl) acrylic acid and monocarboxylic acid compound/acid anhydrides and makes.Wherein the monocarboxylic acid compound has photo curable unsaturated group more than two; The photo-curable of composition is promoted; Exposure is less, but for efficient exposure machine, does not save how many time shutter, and it can't significantly increase combination and developing powder.
The open communique of Jap.P. is special flatly to be opened 10-274849 and has disclosed a kind of composition, and it has the function of general anti-welding photoresistance printing ink commonly used, but its developing powder is slower and anti-metallide property, high-temp resisting high-humidity resisting property are all poor.
The open communique spy of Jap.P. opens in the composition of putting down the 5-202332 disclosure contains photosensitive resin; Has plural acrylate-based and more than one carboxylic acid group in the molecule; It has high-resolution property; Excellent electrical properties, but the molecular weight of its photosensitive resin less than 1000, drying property is relatively poor.
Summary of the invention
One of the object of the invention just provides a kind of heat curing photosensitive resin composition, is applicable to coating, printing ink, use in printed circuit board photoresist and sensitization insulation course etc.
Two of the object of the invention just provides a kind of high performance heat curing photosensitive resin composition, is applicable to the green lacquer that protection is filmed as printed circuit board surface.
Three of the object of the invention just provides a kind of have high-res and the anti-welding fast photoresistance printing ink of development.
Four of the object of the invention just provides a kind of anti-welding photoresistance printing ink, and it has good high temperature resistant moisture resistance property and anti-metallide property.
The present invention realizes above-mentioned purpose through following technical scheme: the present invention provides a kind of heat curing photosensitive resin composition, mainly comprises: (a) photosensitive resin of 5～60 mass percents; (b) reactive diluent of 5～50 mass percents; (c) curcumin of 0.01～20 mass percent (cur cumin) modifier, it has at least two unsaturated double-bonds and at least two carboxylic acid groups; (d) light trigger of 0.1～15 quality percentage composition; And (e) thermoset resin of 0.5～40 quality percentage composition.In addition, can optionally add other adjuvants such as a certain amount of filling agent, pigment.
The modifier of curcumin of the present invention is by curcumin and anhydride reaction and generate, and its structure has sizable benefit for the needed physical property of green lacquer.
Prepared resin combination has (121 ℃ of good heat-resistance high humility property according to the present invention; 100%RH; 100hr), anti-metallide property is (60 ℃; PH=3 3min) and rapid development property significant characteristics such as (10sec), is very suitable for the green lacquer that protection is filmed as printed circuit board surface.
According to heat curing photosensitive resin composition of the present invention; Composition (a) is a photosensitive resin; Be preferably epoxy resin modification thing with ethylene unsaturated bond and carboxylic acid group; As well known to those skilled in the art, this kind sense organ resin can make through epoxy resin, unsaturated monocarboxylic and anhydride reaction.Be fit to be used for for the epoxy resin of this kind photosensitive resin as: bisphenol-type epoxy resin, phenolic resin varnish, cresol novolak epoxy, naphthalene be epoxy resin, encircle epoxy resin, the epoxy propyl ester is that resin, epoxy propylamine are resin and the heterocyclic ring epoxy resins that contains N, S, O atom etc. more.
Being fit to be used for the unsaturated monocarboxylic of synthetic photosensitive resin comprises: acrylic acid, methacrylic acid, crotonic acid, meat silicic acid, 2-metering system anilide oxyethylene group succinate, 2-propylene anilide oxyethylene group succinate, 2-metering system anilide oxygen ethyl six hydrogen phthalate esters, 2-propylene anilide oxygen ethyl six hydrogen titanate esters, 2-metering system anilide oxygen ethyl phthalate ester and 2-propylene anilide oxygen ethyl phthalate ester etc.Be the best with (methyl) acrylic acid especially wherein.
The acid anhydrides that can be used to synthetic photosensitive resin comprises: maleic anhydride, acid phthalic anhydride, tetrahydrochysene acid phthalic anhydride, six hydrogen acid phthalic anhydrides, methyl tetrahydrochysene acid phthalic anhydride, ethyl tetrahydrochysene acid phthalic anhydride, methyl six hydrogen acid phthalic anhydrides, ethyl six hydrogen acid phthalic anhydrides, succinic anhydride and itaconic anhydride etc.
The acid value of photosensitive resin (a) is preferably in 30～300mgKOH/g, and under this scope, anti-welding photoresistance printing ink is preferable by the removal ability and the chemical resistance of alkali lye.The weight-average molecular weight of photosensitive resin is generally 4,000～500, between the 000g/mol, preferably 8,000～150, between 000.
According to heat curing photosensitive resin composition of the present invention, composition (b) is a reactive diluent.The reactive diluent that the present invention adopted is preferably the reactive diluent that contains unsaturated double-bond, for example is the acryl monomer with two above unsaturated double-bonds.The reactive diluent that is suitable for for example has: 1; 4-butylene glycol two (methyl) acrylic ester, 1, two pentaerythrityl three (methyl) acrylic ester of two (methyl) acrylic acid bicyclopentadiene ester of 6-hexanediol two (methyl) acrylic ester, neopentyl ethylene glycol bisthioglycolate (methyl) acrylic ester, polyglycol two (methyl) acrylic ester, neopentyl ethylene glycol bisthioglycolate (methyl) acrylic acid adipate, neopentyl ethylene glycol bisthioglycolate (methyl) acrylic acid carboxyl pivalate, two (methyl) acrylic acid bicyclopentadiene ester, caprolactone modification, two (methyl) cyclohexyl acrylate of allylation, two (methyl) acrylic acid chlorinated isocyanurates, trihydroxy methyl three (methyl) propyl acrylate, two pentaerythrityl three (methyl) acrylic ester, propionic acid modification, pentaerythrityl three (methyl) acrylic ester, trihydroxy methyl three (methyl) propyl acrylate, three (propylene oxygen ethyl) the isocyanic acid urea ester of propylene oxide modification, two pentaerythrityl five (methyl) acrylic ester of propionic acid modification, two pentaerythrityl six (methyl) acrylic ester.
According to heat curing photosensitive resin composition of the present invention, component (c) is the curcumin modifier, and it has at least two unsaturated double-bonds and at least two carboxylic acid groups.Be with curcumin curcumin in the present invention; 1,7-bis (4-hydroxymethoxyphenyl)-1,6-heptadiene-3,5-dione are main chemical constitution, import acid anhydrides and carry out modification.For example, can the reaction of curcumin and tetrahydrochysene acid anhydride phthalein be formed the curcumin modified material, like following reaction equation:
Description of drawings
Other acid anhydrides that are fit to be used for to carry out modification comprise: maleic anhydride, acid phthalic anhydride, six hydrogen acid phthalic anhydrides, methyl tetrahydrochysene acid phthalic anhydride, ethyl tetrahydrochysene acid phthalic anhydride, methyl six hydrogen acid phthalic anhydrides, ethyl six hydrogen acid phthalic anhydrides, succinic anhydride, itaconic anhydride, fatty cyclic anhydride, 3,3,4; 4-benzophenone tetracarboxylic dianhydride, PMDA, 3,3,4; 4 diphenyl tetracarboxylic dianhydrides, 2,2-pair-(3,4-dicarboxyl phenyl) hexafluoropropane dianhydride, 4; 4-oxygen base two acid phthalic anhydrides, 3,3,4; 4-diphenyl sulfone tetracarboxylic dianhydride, 5-(2,5-dioxy tetrahydrochysene base)-3-methyl-3-cyclic ethylene-1,2-dicarboxylic anhydride, ethylene glycol bis trihemellitic acid acid anhydride.Can use one or more acid anhydrides to carry out modification in the present invention.The acid value of curcumin modifier (c) is preferably between 30～400mgKOH/g.
The curcumin modifier that the present invention adopted has following characteristic:
1. because of having benzene ring structure, can significantly promote the thermotolerance and the associativity of resin combination.
2. have two or more unsaturated double-bonds, can be by photocuring, and other contain the compound phase bonding of unsaturated double-bond in composition, have increased the cross-linking density of composition.
3. have two or more-COOH group, can promote the developing powder of resin combination and can increase cross-linking density.
4. comprehensive 1. above-mentioned～as 3., promptly can to increase high functionality physical properties such as the high-temp resisting high-humidity resisting degree property of resin combination, anti-metallide property.
According to heat curing photosensitive resin composition of the present invention, component (d) is a light trigger, is through producing the material of free radical after the rayed.Be applicable to that light trigger of the present invention for example has: diphenylhydroxyethanone, diphenylhydroxyethanone alkyl ether, two phenylglyoxals, ketal, acetophenone compound, benzophenone, 4,4-dimethyl-amido-benzophenone, sulfo-xanthone compound, groom's Lin-acetonide etc.
According to heat curing photosensitive resin composition of the present invention, its component (e) is a thermoset resin.Preferred thermoset resin is the epoxy resin that has plural epoxy radicals in the epoxy resin, particularly per molecule.Be applicable to that epoxy resin of the present invention comprises: bisphenol-type epoxy resin, phenolic resin varnish, cresol novolak epoxy, encircle epoxy resin more, the epoxy propyl ester is that resin, epoxy propylamine are resin, heterocyclic ring epoxy resins and halogenated epoxy resin.
In resin combination of the present invention, component a photosensitive resin accounts for 5～60 mass percents; The components b reactive diluent accounts for 5～50 mass percents; Amount of component b curcumin modifier accounts for 0.01～20 mass percent; Component d light trigger accounts for 0.1～15 mass percent; Component e thermoset resin accounts for 0.5～40 mass percent.Preferably, photosensitive resin a accounts for 15～45 mass percents; The components b reactive diluent accounts for 10～40 mass percents; Amount of component b curcumin modifier accounts for 0.1～15 mass percent; Component d light trigger accounts for 1～10 mass percent; Component e thermoset resin accounts for 10～30 mass percents.
Heat curing photosensitive resin composition of the present invention is except above-mentioned key component; Can also comprise other known additives, for example: thermal stabilizer, anti-oxidant, light stabilizer, lubricant, foam-breaking agent, levelling agent, colorant, filling agent and supporting material etc.
Embodiment
Can be clear more understandable for making above-mentioned technical scheme of the present invention and characteristic thereof close advantage, below the spy enumerate its preferred version and elaborate as follows:
1. the curcumin modifier synthetic routine 1:
Curcumin 74g (0.2mol), oxalic acid methoxyl ethyl ester 270g, tetrahydrochysene acid phthalic anhydride 60.8g (0.4mol) are closed quinhydrones 0.2g as in the reactor, be warming up to 110 ℃, reacted 3 hours, promptly make curcumin modifier (C-1).
2. the curcumin modifier synthetic routine 2:
Second maleic anhydride 39.2g (0.4mol) replaces the tetrahydrochysene acid phthalic anhydride in the synthetic example 1 of curcumin modifier, makes curcumin modifier (C-2).
3. the curcumin modifier synthetic routine 3:
Close the tetrahydrochysene acid phthalic anhydride that tetrahydrochysene acid phthalic anhydride (tetrahydrophthalic anhydride) 30.4g (0.2mol) replaces the synthetic example 1 of curcumin modifier with PMDA (pyromellitic dianhydride) 21.8g (0.1mol), make curcumin modifier (C-3).
4. the curcumin modifier synthetic routine 4:
With 3,3,4,4-diphenyl tetracarboxylic dianhydride 29g (0.2mol) and tetrahydrochysene acid phthalic anhydride 30.4g (0.2mol) replace the tetrahydrochysene acid phthalic anhydride in the synthetic example 1 of curcumin modifier, make curcumin modifier (C-4).
The synthetic example 1 of photosensitive resin:
Cresol novolak epoxy (cresol novolac type epoxy resin) CNE-200 (Changchun reagent corporate system, epoxide equivalent=200) 60g and oxalic acid ethoxy ethyl ester 75g are placed reactor, with 60 ℃ of dissolvings; Add acrylic acid 21.7g (0.3 equivalent), quinhydrones 0.09g, triphenylphosphine 0.3g; Under 90 ℃, react to acid value and approach zero; Add tetrahydrochysene acid phthalic anhydride 45.6g (0.3 equivalent) at last, reacted 3 hours down, can get photosensitive resin (a-1) at 110 ℃～120 ℃.
The synthetic example 1 of reactive diluent:
Two pentaerythrityls, five acrylic ester 52.4g (0.1 equivalent), tetrahydrochysene acid phthalic anhydride 15.2g (0.1 equivalent), quinhydrones 0.06g and triphenylphosphine 0.26g are placed reactor; With 80 ℃ of dissolvings 1 hour; Reacted 32 hours down at 105 ℃, can get reactive diluent (b-3).
Embodiment 1-4: the preparation of heat curing photosensitive resin composition:
According to compound and the proportional quantity shown in the table 1, mix and stirring, at normal temperatures, use three roller mullers to grind, each component is uniformly dispersed.
Comparative example 1-3: heat curing photosensitive resin composition preparation:
According to compound and the proportional quantity shown in the table 1, and according to the heat curing photosensitive resin composition in the step preparation comparative example of embodiment.Wherein, do not add the curcumin modifier in the composition of comparative example 1,2.
Test pieces is made:
Heat curing photosensitive resin composition is coated on the copper clad laminate, with 80 ℃ of following preliminary drying 30min, treat substrate cooling after, observe its dry to touch property.This test pieces covered to contain on the circular egative film with the resolution circle of GTG and with ultraviolet exposure machine make public Na with 1%
2CO
3The WS develops, and observes its development time.Then clean test pieces, observe photosensitive properties such as its GTG resolution with clear water.Toast 60min down at 150 ℃ at last and make its sclerosis, and test its insulativity, anti-metallide property, high-temp resisting high-humidity resisting type, its result lists in the table 2, and wherein the criterion of each item test index is following:
Dry to touch property: touch test pieces with finger, can glue hand and then be recorded as X, the tack-free 〇 that then is recorded as.
Developing powder: with 1%Na
2CO
3The WS develops, and writes down non-exposure circular portion and removes the needed time fully.
GTG: it is circular to observe GTG, and record is filmed fully by the minimum exponent number of flush away.
Resolution: it is circular to observe resolution, and record circle line is minimum feature/line-spacing clearly.
Insulativity: the surface resistance tester is placed on the test pieces, test the insulativity of filming, be recorded as initial value.Test pieces is placed 60 ℃, in the 90%RH constant temperature and humidity machine, take out behind the 960hr, wiping is dry, tests its insulativity and record.
High-temp resisting high-humidity resisting property (pressure cooker test; Be called for short PCT): with test pieces place pressure cooker (121 ℃, 2atm, 100%RH) in; Take out behind the 100hr; In addition hundred lattice associativities test is write down and is still combined good lattice number (0/100 for having no associativity, and 100/100 is that associativity is outstanding) in hundred lattice.
Anti-metallide property: after handling test pieces with the metallide process, in addition hundred lattice associativities test is write down and is still combined good lattice number (0/100 for having no associativity, and 100/100 is that associativity is outstanding) in hundred lattice.
Anti-plated by electroless plating property: after handling test pieces with the plated by electroless plating process, in addition hundred lattice associativities test is write down and is still combined good lattice number (0/100 for having no associativity, and 100/100 is that associativity is outstanding) in hundred lattice.
Table 1: photoresistance ink composite formula table
Annotate: b-1: two pentaerythrityls, five acrylic ester
B-2: Chinese parasol tree erythrite triolefin acid esters
D-1:Irgacure907 (Ciba corporate system)
d-2：isopropyl?thioxanthone
E-1:CNE-200 (Changchun preparation corporate system, cresol novolak epoxy)
E-2:EXA-4700 (Dainippon Ink and Chemicals Co.Ltd. system, naphthalene is an epoxy resin)
Table 2 physical property test result
Physical property test result by table 2 can be known: heat curing photosensitive resin composition of the present invention has good dry to touch property, developing powder, resolution, insulativity, anti-metallide property, anti-plated by electroless plating property and high-temp resisting high-humidity resisting property.Opposite, comparative example 1 described composition does not add the curcumin modifier according to the present invention, and not only developing powder is slow, and other physical property such as high-temp resisting high-humidity resisting property etc. are also relatively poor.Also do not add curcumin modifier of the present invention in the prescription of comparative example 2, its developing powder is also slower, and its high-temp resisting high-humidity resisting property and anti-metallide property are not good enough yet.
Claims (10)
1. heat curing photosensitive resin composition comprises:
(a) photosensitive resin of 5～60 mass percents;
(b) reactive diluent of 5～50 mass percents;
(c) curcumin of 0.01～20 mass percent (curcumin) modifier, it has at least two unsaturated double-bonds and at least two carboxylic acid groups, and described curcumin modifier is main chemical constitution with curcumin, imports acid anhydrides and carries out modification;
(d) light trigger of 0.1～15 quality percentage composition; And
(e) thermoset resin of 0.5～40 quality percentage composition.
2. the described photosensitive resin composition of claim 1, wherein the described photosensitive resin of component (a) is the epoxy resin modification thing with unsaturated link and carboxylic acid group.
3. the described photosensitive resin composition of claim 2, wherein the described epoxy resin modification thing of component (a) is to make through epoxy resin, unsaturated monocarboxylic and anhydride reaction.
4. it is epoxy resin that the described photosensitive resin composition of claim 3, wherein said epoxy resin are selected from bisphenol-type epoxy resin, phenolic resin varnish, cresol novolak epoxy, naphthalene, encircle epoxy resin more, the epoxy propyl ester is that resin, epoxy propylamine are resin, contain the heterocyclic ring epoxy resins of N, S, O atom and in the halogenated epoxy resin one or more.
5. the described photosensitive resin composition of claim 3, wherein said unsaturated monocarboxylic is selected from one or more in acrylic acid, methacrylic acid, crotonic acid, cinnamic acid, 2-metering system anilide oxyethylene group succinate, 2-propylene anilide oxyethylene group succinate, 2-metering system anilide oxygen ethyl six hydrogen phthalate esters, 2-propylene anilide oxygen ethyl six hydrogen titanate esters, 2-metering system anilide oxygen ethyl phthalate ester and the 2-propylene anilide oxygen ethyl phthalate ester.
6. the described photosensitive resin composition of claim 3, wherein said acid anhydrides is selected from one or more in maleic anhydride, acid phthalic anhydride, tetrahydrochysene acid phthalic anhydride, six hydrogen acid phthalic anhydrides, methyl tetrahydrochysene acid phthalic anhydride, ethyl tetrahydrochysene acid phthalic anhydride, methyl six hydrogen acid phthalic anhydrides, ethyl six hydrogen acid phthalic anhydrides, succinic anhydride and the itaconic anhydride.
7. the described photosensitive resin composition of claim 1, wherein component (b) reactive diluent has unsaturated double-bond.
8. the described photosensitive resin composition of claim 7, wherein this reactive diluent with unsaturated double-bond is the acryl monomer.
9. the described photosensitive resin composition of claim 8, wherein this acryl monomer is the acryl monomer with two above unsaturated double-bonds.
10. the described photosensitive resin composition of claim 9; Wherein this acryl monomer with two above unsaturated double-bonds is selected from 1; 4-butylene glycol two (methyl) acrylic ester, 1, trihydroxy methyl three (methyl) propyl acrylate, three (propylene oxygen ethyl) the isocyanic acid urea ester of two pentaerythrityl three (methyl) acrylic ester of two (methyl) acrylic acid bicyclopentadiene ester of 6-hexanediol two (methyl) acrylic ester, neopentyl ethylene glycol bisthioglycolate (methyl) acrylic ester, polyglycol two (methyl) acrylic ester, neopentyl ethylene glycol bisthioglycolate (methyl) acrylic acid adipate, neopentyl ethylene glycol bisthioglycolate (methyl) acrylic acid carboxyl pivalate, two (methyl) acrylic acid bicyclopentadiene ester, caprolactone modification, two (methyl) cyclohexyl acrylate of allylation, two (methyl) acrylic acid chlorinated isocyanurates, trihydroxy methyl three (methyl) propyl acrylate, two pentaerythrityl three (methyl) acrylic ester, propionic acid modification, pentaerythrityl three (methyl) acrylic ester, propylene oxide modification, two pentaerythrityl five (methyl) acrylic ester of propionic acid modification, in two pentaerythrityl six (methyl) acrylic ester one or more.
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| CN 201110161262 CN102298262B (en) | 2011-06-16 | 2011-06-16 | Thermocuring photosensitive resin composition |
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| TWI559082B (en) | 2014-07-07 | 2016-11-21 | 財團法人工業技術研究院 | Biomass material and method for manufacturing the same and print circuit board |
| CN104391428B (en) * | 2014-11-20 | 2018-06-19 | 京东方科技集团股份有限公司 | Emulsion, photoetching compositions and preparation method containing diazonium groups |
| KR102460271B1 (en) * | 2015-04-03 | 2022-10-28 | 닛산 가가쿠 가부시키가이샤 | Step substrate coating composition having photocrosslinking group |
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| KR100634341B1 (en) * | 2000-02-14 | 2006-10-16 | 타이요 잉크 메뉴펙츄어링 컴퍼니, 리미티드 | Photocurable/thermosetting composition for forming matte film |
| CN1235089C (en) * | 2000-11-23 | 2006-01-04 | 富士胶片株式会社 | Photosensitive lithographic printing plate |
| US7807230B2 (en) * | 2005-06-16 | 2010-10-05 | Rensselaer Polytechnic Institute | Curcumin and curcuminoid compounds, and use thereof as photosensitizers of onium salts |
| US7947091B2 (en) * | 2006-03-01 | 2011-05-24 | Arkles Barry C | Curcumin and its derivatives for use as silicone colorants |
| JP5384929B2 (en) * | 2008-12-26 | 2014-01-08 | 東京応化工業株式会社 | Photocurable resin composition for forming transparent electrode and method for producing transparent electrode |
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Granted publication date: 20121205 Termination date: 20140616 |
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