CN102290391A - 半导体器件及其制造方法和制造装置 - Google Patents
半导体器件及其制造方法和制造装置 Download PDFInfo
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- CN102290391A CN102290391A CN2011100667897A CN201110066789A CN102290391A CN 102290391 A CN102290391 A CN 102290391A CN 2011100667897 A CN2011100667897 A CN 2011100667897A CN 201110066789 A CN201110066789 A CN 201110066789A CN 102290391 A CN102290391 A CN 102290391A
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- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
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- H01L2924/01—Chemical elements
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- H—ELECTRICITY
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/20—Parameters
- H01L2924/207—Diameter ranges
- H01L2924/2075—Diameter ranges larger or equal to 1 micron less than 10 microns
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/20—Parameters
- H01L2924/207—Diameter ranges
- H01L2924/20751—Diameter ranges larger or equal to 10 microns less than 20 microns
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/20—Parameters
- H01L2924/207—Diameter ranges
- H01L2924/20752—Diameter ranges larger or equal to 20 microns less than 30 microns
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/20—Parameters
- H01L2924/207—Diameter ranges
- H01L2924/20753—Diameter ranges larger or equal to 30 microns less than 40 microns
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Wire Bonding (AREA)
- Led Devices (AREA)
Abstract
Description
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP139998/2010 | 2010-06-18 | ||
JP2010139998A JP2012004464A (ja) | 2010-06-18 | 2010-06-18 | 半導体装置、半導体装置の製造方法及び半導体装置の製造装置 |
Publications (2)
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CN102290391A true CN102290391A (zh) | 2011-12-21 |
CN102290391B CN102290391B (zh) | 2014-11-12 |
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CN201110066789.7A Active CN102290391B (zh) | 2010-06-18 | 2011-03-18 | 半导体器件及其制造方法和制造装置 |
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Country | Link |
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US (1) | US8237295B2 (zh) |
JP (1) | JP2012004464A (zh) |
CN (1) | CN102290391B (zh) |
TW (1) | TWI484613B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI478221B (zh) * | 2012-01-10 | 2015-03-21 | Toshiba Kk | Semiconductor device manufacturing method and bonding device |
Families Citing this family (1)
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KR102621753B1 (ko) | 2018-09-28 | 2024-01-05 | 삼성전자주식회사 | 본딩 와이어, 이를 포함하는 반도체 패키지, 및 와이어 본딩 방법 |
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Also Published As
Publication number | Publication date |
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TWI484613B (zh) | 2015-05-11 |
US20110309502A1 (en) | 2011-12-22 |
CN102290391B (zh) | 2014-11-12 |
JP2012004464A (ja) | 2012-01-05 |
US8237295B2 (en) | 2012-08-07 |
TW201201341A (en) | 2012-01-01 |
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