CN102280430A - 安装结构、电子部件、电路板、板组件、电子装置及应力缓解部件 - Google Patents
安装结构、电子部件、电路板、板组件、电子装置及应力缓解部件 Download PDFInfo
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Abstract
本发明涉及安装结构、电子部件、电路板、板组件、电子装置,以及应力缓解部件。公开了一种用于在电路板上安装电子部件的安装结构。该安装结构包括设置在该电子部件与该电路板之间的***层;和形成在该***层中的多个螺旋形导体。所述多个螺旋形导体使它们的一个端部接合至该电子部件的多个外部连接端子中的对应连接端子,而使它们另一端部接合至该电子部件的多个电极中的对应电极。
Description
技术领域
在此公开的实施方式涉及用于在板上安装电子部件的安装结构。
背景技术
在许多情况下,电子装置并入有其上安装有诸如半导体器件的电子部件的电路板。随着近来在电子装置最小化方面的进展,并入到电子装置中的电路板已经通过高密度安装而最小化,并且安装在该电路板上的诸如半导体器件的电子部件也已经最小化。因此,用于在电路板上安装电子部件的安装结构也已经最小化。
作为用于在电路板上安装半导体器件的接合部件,通常使用焊料块。利用焊料块的焊料接合提供了电连接并将半导体器件以机械方式固定至电路板。在如上所述安装结构被最小化并且使焊料块变小的情况下,也使焊料接合件变小。因此,焊料块接合件容易因热应力和外力而变形和受损,其导致倾向于出现差的连接。
这里,参照图1A和1B,对在将外力施加至作为安装结构的焊料块接合件时焊料块的变形进行描述。图1A例示了其中通过焊料块2将半导体器件的电极焊盘1接合至电路板3的连接焊盘4的安装结构。在焊料回流时使焊料块2熔化并凝固,使得形成与电极焊盘1和连接焊盘4紧密接触的焊料接合件2a。图1A例示了其中未向焊料块2施加外力并且该焊料块2未变形的状态。
当向如图1A所示电路板3的一部分施加外力时,该电路板3按这样的方式变形,即,该电路板的该外力所施加至的一部分升高,同时焊料块2也如图1B所示变形。因为外力所施加至的该部分远离焊料块2的中心,所以应力集中在焊料接合件2a的靠近外力所施加的部分一侧的端部上。当停止施加外力时,该应力也不再施加。结果,焊料块2变得解除其变形状态,并且恢复如图1A初始状态。
如果将这种外力重复地施加至电路板3,则该应力重复地集中在焊料接合件2a与连接焊盘4之间,其又进而分离了焊料接合件2a的该端部与连接焊盘4。而且,如果焊料接合件2a的端部的分离传到焊料接合件2a和连接焊盘4,则焊料接合件2a与连接焊盘4之间的电连接丧失,其导致出现差的连接。
而且,例如,在半导体器件具有由硅形成的基础材料并且电路板3具有由玻璃环氧树脂形成的基础材料的情况下,它们之间的热膨胀系数存在极大差异,并由此在它们的接合件(焊料块)中出现热应力。如果因热膨胀系数的差异而造成的热应力重复出现,则在接合件(焊料块)的靠近半导体器件一侧出现裂纹,其导致出现差的连接。
鉴于上述问题,已经采用了一种在已安装的半导体器件与电路板之间的一部分中填充孔型(underfill)材料以加强焊料接合件的方法。换句话说,将由环氧树脂等形成的孔型材料填充在焊料接合件周围,以在它们的外周加强,并且通过孔型材料将半导体器件的底面和电路板的正面接合在一起,以机械地固定。由此,改进了焊料接合件的抗压性和长期可靠性。
同时,随着近来特别是在诸如移动计算机(包括笔记本计算机)和移动电话的电子装置的小型化和功能能力方面的发展,施加至电子装置的外壳的压力容易传动至它们的内部电路板和安装结构。因此,为了进一步改进焊料接合件的抗压性和长期可靠性,使用具有增加的接合强度和更高杨氏模量的孔型材料。然而,如果孔型材料的接合强度增加,则难于从电路板去除由孔型材料固定的半导体器件。
例如,如果在将半导体器件安装在电路板之后该半导体器件中出现故障,则不能从电路板中仅去除和替换出现故障的半导体器件。因此,必须整体替换昂贵的电路板,其导致电路板的损坏成本增加。另外,不能单单检查假定具有故障的半导体器件的功能并分析该故障的原因。因此,不能确定针对故障的原因,其进而增加了不良率。
为致力于解决上述问题,已经提出了这样一种安装结构(例如,参见专利文献1到3),其中,将诸如线圈弹簧的弹性主体***在已安装电子部件的电极与电路板的连接电极之间来缓解应力。
专利文献1:日本特开专利公报2002-151550
专利文献2:日本特开专利公报2004-140195
专利文献3:日本特开专利公报2009-211133
因为在专利文献1到3中公开的安装结构具有接合至许多电子部件的电极的线圈弹簧,所以它们不适于精细安装结构。换句话说,难于提供精细的线圈弹簧一对一地用于许多电极,并且专利文献1到3中公开的安装结构不能应用至新近的具有高密度和最小化电极的半导体器件。
因此,希望开发这样一种安装结构,即,其能够在不需要使用孔型材料的情况下,改进半导体器件的接合件的抗压性和长期可靠性,并且能够容易从电路板去除已安装半导体器件。
发明内容
根据本发明的一个方面,提供了一种用于在电路板上安装电子部件的安装结构。该安装结构包括:***层,该***层设置在所述电子部件与所述电路板之间;和多个螺旋形导体,所述多个螺旋形导体形成在所述***层中。所述多个螺旋形导体的一个端部接合至所述电子部件的多个外部连接端子中的对应外部连接端子,而使它们的另一端部接合至所述电子部件的多个电极中的对应电极。
根据本发明的实施方式,因为多个螺旋形导体和***层可弹性地变形,所以它们随应力变形。因而,缓解了接合件中出现的应力,在接合件中不出现过度应力,从而防止在接合件中造成的裂纹。因此,不需要利用孔型材料将电子部件固定至电路板,并且可以将已安装的电子部件容易地从电路板去除。
本发明的目的和优点通过在权利要求书中具体指出的部件和组合而被认识到并获得。
应当明白,前述一般描述和下面的详细描述都是示范性和解释性的,而不是对要求保护的本发明的限制。
附图说明
图1A和1B是例示当将外力施加至作为安装结构的焊料块接合件时该焊料块的变形的视图;
图2是用于说明因在焊料块接合件中出现热应力而造成裂纹的状态的视图;
图3是例示根据一种实施方式的具有安装结构的半导体器件的一部分的截面图;
图4是例示在将外力施加至安装有图3所示半导体器件的电路板的情况下安装结构的状态的视图;
图5是例示当在图4所示的安装结构中出现热应力时包括螺旋形导体的***层的变形状态的视图;
图6A到6E是例示形成嵌入在***层中的螺旋形导体的方法的视图;
图7是例示在安装结构中使用的部分的特性和尺寸的表;
图8A和8B是例示在施加外力的情况下的应力分析模型的视图;
图9A和9B是例示在施加热应力的情况下的应力分析模式的视图;
图10是例示在将嵌入在***层中的螺旋形导体设置在电路板上的情况下的安装结构的视图;
图11是在形成有螺旋形导体的***层是作为应力缓解部件的单一单元并且半导体器件安装在电路板上的情况下的视图;
图12是例示在利用设置有外部连接端子的应力缓解部件将半导体器件安装在电路板上的情况下的安装结构的视图;以及
图13是并入有板组件的笔记本计算机的立体图,该板组件上利用应力缓解部件安装了半导体器件。
具体实施方式
接下来,参照附图,描述本发明的实施方式。
图3是例示根据该实施方式的具有安装结构的半导体器件的一部分的截面图。根据该实施方式的安装结构具有形成在例如采用BGA封装件的半导体10的电极10a与作为外部连接端子的焊料块(焊料球)12之间的螺旋形导体14。该螺旋形导体14由导电材料(例如,铜)形成。螺旋形导体14的一个端部连接至半导体10的多个电极10a中的对应电极,而另一端部连接至多个焊料块12中的对应焊料块。
螺旋形导体14在由树脂绝缘片16a制成的层压主体16中形成(如后文所述)。因此,该螺旋形导体14可与由树脂绝缘片16a制成的层压主体16一起弹性地变形(可压缩和扩展)。因而,因外力和热膨胀系数中的差异而造成的热应力所施加至焊料块12的应力可以被缓解,这又进而可以降低对焊料块12的接合件的破坏。
图4是例示在将外力施加至安装有图3所示半导体器件10的电路板的情况下安装结构的状态的视图。半导体器件10的焊料块12接合至电路板18的连接电极18a。因此,半导体器件10的电极10a经由焊料块12和螺旋形导体14连接至电路板的连接电极18a。
这里,当如图4所示将外力施加至电路板18的一部分时,将压缩力被施加至焊料块12的靠近外力的一侧上,而将张力施加至焊料块12的远离外力的一侧上。如果半导体器件10和电路板18仅通过焊料块12接合在一起,则该压缩力和张力分别直接变成焊料块12的压缩应力和张应力。结果,在焊料块12上出现大的应力。
然而,在这种实施方式中,将包括可弹性变形的螺旋形导体14的***层16设置在焊料块12与半导体器件10之间。当螺旋形导体14和***层16弹性地变形时,可以缓解焊料块12中出现的应力。换句话说,在焊料块12中出现的压缩应力按该螺旋形导体14和***层16被压缩而弹性地变形的这种方式来缓解。另一方面,在焊料块12中出现的张应力按螺旋形导体14和***层16被拉伸而弹性地变形的这种方式来缓解。
图5是例示当在图4所示的安装结构中出现热应力时包括螺旋形导体14的***层16的变形状态的视图。在半导体器件10具有由硅形成的基础材料而电路板18具有由玻璃环氧树脂制成的基础材料的情况下,电路板18的热膨胀系数远大于半导体器件10的热膨胀系数。因此,电路板18以大于半导体器件10的程度膨胀。具体来说,靠近半导体器件10的外周,半导体器件10的位移(膨胀变形)变得远大于电路板18的位移。结果,在安装结构中出现如图5所示的热应力。
在这种实施方式中,因为螺旋形导体14和***层16可沿横向(热应力方向)弹性地变形,所以它们根据该热应力沿横向变形。因而,将焊料块12中的热应力缓解,在焊料块12中不会出现过度应力,从而防止在焊料块12中造成的裂纹。因此,当利用根据这个实施方式的安装结构将诸如半导体器件的电子部件安装在电路板上时,不需要利用孔型材料来固定电子部件,并且可以将已安装电子部件从电路板容易地去除。
这里,对形成螺旋形导体14的方法进行描述。根据下面描述的方法,螺旋形导体14可以按焊块总数针对半导体器件10的相应多个电极10a来设置。图6A到6E是例示形成嵌入在***层中的螺旋形导体14的方法的视图。在图6A到6E中的每一个图中,仅例示了包括半导体器件10的电极10a的一部分,并且分别在其上侧和下侧例示了螺旋形导体14的截面图及其平面图。
首先,制备如图6A所示的具有电极10a的半导体器件10。该电极10a可以具有例如300μm的外径,但电极10a的外径不限于这个值。接着,在半导体10的前表面(包含电极10a的前表面)上形成具有例如50μm的厚度的第一绝缘片16a-1。第一绝缘片16a-1以将光敏聚酰亚胺膜例如接合至半导体器件10的前表面的这种方式来形成。接下来,如图6B所示,在将该聚酰亚胺膜的一部分剪裁成条形并且通过光刻法去除之后,例如将铜镀覆到该部分中,以在第一绝缘片16a-1中形成第一铜板14a-1。该第一铜板14a-1具有例如50μm的宽度和大约300μm的长度,但第一铜板14a-1的宽度和长度不限于这些值。
接着,将第二绝缘片16a-2层压在第一绝缘片16a-1(包含第一铜板14a-1的前表面)上。第二绝缘片16a-2以将与第一绝缘片16a-1类似的光敏聚酰亚胺膜附加至第一绝缘片16a-1这种方式来形成。接下来,如图16C所示,在将聚酰亚胺膜的一部分剪裁成条形并且通过光刻法去除之后,例如将铜镀覆到该部分中,以形成第二铜板14a-2,作为第二绝缘片16a-2中的导电部分。这时,形成在第二绝缘片16a-2中的条形开口是这样的,其一个端部与形成在第一绝缘片16a-1中的第一铜板14a-1交叠并且沿相对于第一铜板14a-1的纵向旋转了90度的方向延伸。因此,在第二绝缘片16a-2中形成的条形第二铜板14a-2的一个端部接合至第一铜板14a-1的一个端部并且沿相对于第一铜板14a-1的纵向旋转了90度的方向延伸。该第二铜板14a-2具有例如50μm的宽度和例如300μm的长度,但第二铜板14a-2的宽度和长度不限于这些值。
接着,将第三绝缘片16a-3层压在第二绝缘片16a-2(包括第二铜板14a-2的前表面)上。该第三绝缘片16a-3按将与第一绝缘片16a-1类似的光敏聚酰亚胺膜附加至第二绝缘片16a-2的这种方式来形成。接下来,在将聚酰亚胺膜的一部分剪裁成条形并且通过光刻法去除之后,例如将铜镀覆到该部分中,以形成第三铜板14a-3,作为第三绝缘片16a-3中的导电部分。这时,形成在第三绝缘片16a-3中的条形整形开口是这样的,其一个端部与形成在第二绝缘片16a-2中的第二铜板14a-2交叠并且沿相对于第二铜板14a-2的纵向旋转了90度的方向延伸。因此,在第三绝缘片16a-3中形成的条形第三铜板14a-3的一个端部接合至第二铜板14a-2的一个端部并且沿相对于第二铜板14a-2的纵向旋转了90度的方向延伸。该第三铜板14a-3具有例如50μm的宽度和例如300μm的长度,但第三铜板14a-3的宽度和长度不限于这些值。
接着,将第四绝缘片16a-4层压在第三绝缘片16a-3(包括第三铜板14a-3的前表面)上。该第四绝缘片16a-4按将与第一绝缘片16a-1类似的光敏聚酰亚胺膜附加至第三绝缘片16a-3的这种方式来形成。接下来,如图6E所示,在将聚酰亚胺膜的一部分剪裁成圆形并且通过光刻法去除之后,例如将铜镀覆到该部分中,以形成第四铜板14a-4,作为第四绝缘片16a-4中的导电部分。这时,形成在第四绝缘片16a-4中的圆形开口是这样的,其与形成在第三绝缘片16a-3中的第三铜板14a-3交叠并且设置在和半导体器件10的电极10a相同的位置处。因此,在第四绝缘片16a-4中形成的圆形铜板14a-4接合至第三铜板14a-3的整个表面。该第四铜板14a-4由电极焊盘形成并且是具有例如300μm的直径的圆形,但第四铜板14a-4的直径不限于这个值。
在上述方法中,可以形成嵌入在***层16中的螺旋形导体14。接着,将焊料块12形成在螺旋形导体14的圆形第四铜板14a-4(电极焊盘)上并且用作半导体器件10的外部连接端子。
应注意到,在上述方法中,将条形的第一到第三铜板14a-1到14a-3连接在一起,以形成螺旋形导体14。然而,第一到第三铜板14a-1到14a-3的形状不限于条形,而例如可以是圆弧形,其每一个都具有1/4圆周的长度。
而且,在上述方法中,螺旋形导体14由铜形成,然而,螺旋形导体14的材料不限于铜,而例如可以是镍和具有相对较高杨氏模量的其它金属。
而且,在上述方法中,将聚酰亚胺膜用作绝缘片16a-1到16a-4。然而,绝缘片16a-1到16a-4不限于聚酰亚胺膜,而是可以使用具有耐热性和弹性的诸如硅片的其它绝缘片。
接下来,对针对上述安装结构进行的应力分析的结果进行描述。
首先,图7中例示了在安装结构中使用的部件的特性和尺寸。在图7中,“封装板”对应于半导体器件10的基材,并且“焊料块”指焊料块12。而且,“焊盘”对应于半导体器件10的电极10a和电路板18的连接电极18a,并且“布线板”对应于电路板18的基材。而且,“导体(铜)”对应于与螺旋形导体14,而“绝缘片”对应于***层16。该安装结构利用上述部件形成,并且根据对该结构的分析来寻找在焊料块中出现的最大应力。
执行该应力分析,假定其中将外力施加至如图8A所示的常规安装结构的情况被指定为模型1,而其中将外力施加至如图8B所示的具有根据该实施方式的嵌入在***层16中的螺旋形导体14的安装结构的情况被指定为模型2。
作为应力分析条件,将基准外力施加至模型1和2的半导体器件10。外力的大小是这样的,即,在压缩模型2的安装结构时,半导体器件10与电路板18之间的距离减小10μm。作为应力分析的结果,证明在作为常规安装结构的模型1中,在焊料块12中出现的应力的最大值为889Mpa。另一方面,证明在作为根据该实施方式的安装结构的模型2中,在焊料块12中出现的应力的最大值为350MPa。
如通常已知的,如果外力将500MPa或以上的应力重复地施加至焊料块12,则将在焊料块12中造成裂纹。因此,确认在常规安装结构的模型1的焊料块12中将造成裂纹,而在根据该实施方式的安装结构的模型2中很难造成裂纹。
进一步,执行应力分析,假定其中在如图9A所示常规安装结构中出现热应力的情况被指定为模型3,而其中在如图9B所示具有根据该实施方式的嵌入在***层16中的螺旋形导体14的安装结构中出现热应力的情况指定为模型4。这时,封装板具有由陶瓷(热膨胀系数α1=7ppm)形成的基材,而电路板具有由耐热玻璃环氧树脂层压板(热膨胀系数α2=25ppm)形成的基材。
假定封装板和电路板是四边形,每一个都具有20mm的边,并且保持在125℃下,在它们的最外周处显现最大变形量(最大畸形),其表达为公式λ=εL=(α1-α2)ΔT·L=(25-7)·10-6·100·100mm=0.018mm(18μm)。在这个公式中,ε表示热膨胀系数之差,ΔT表示温升值,而L表示封装板中心与其最外周之间的距离。在这个条件下,沿横向约束模型3和4,来执行应力分析,以寻找在焊料块中出现的最大应力。
作为应力分析的结果,证明:在作为常规安装结构的模型3中,在焊料块12中出现的应力的最大值为619MPa。另一方面,证明:在作为根据这个实施方式的安装结构的模型4中,在焊料块12中出现的应力的最大值为377MPa。如通常已知的,如果通过热应力将500MPa或以上的应力反复施加至焊料块12,则将在焊料块12中造成裂纹。因此,确认在常规安装结构的模型3中将在焊料块12中造成裂纹,而在根据这个实施方式的安装结构的模型4中很难造成裂纹。
在上述实施方式中,将嵌入在***层16中的螺旋形导体14***在半导体器件10的电极10a与焊料块12之间作为应力缓解(减轻)部件。然而,可以将该应力缓解部件形成在电路板18的一侧上。图10是例示其中将嵌入在***层16中的螺旋形导体14设置在电路板10上的情况下的安装结构的视图。
在图10中,将***层16形成在电路板18的前表面(包括电极18a的前表面)上,并且***层16中的螺旋形导体14的一个端部连接至电路板18的多个连接电极18a中的对应连接电极。因此,在螺旋形导体14的最外侧部分处的第四铜板14a-4充任电路板18的连接电极。在图10中,将半导体器件10的焊料块12接合至螺旋形导体14的最外侧部分处的第四铜板14a-4,由此,将半导体器件10安装在电路板18上。
而且,其中形成有螺旋形导体14的***层16可以是作为应力缓解部件的单个单元。图11是在其中形成有螺旋形导体14的***层16是作为应力缓解部件的单个单元并且***在半导体器件10与电路板18之间的情况下的视图。为了形成其中形成有螺旋形导体14的单个单元***层16,首先制备容易与***层16分离的基材。接着,根据在图6A到6E中描述的方法,将***层16和螺旋形导体14形成在基材上。此后,将基材分离和去除。该基材可以通过蚀刻而非分离来去除。
图11例示了其中通过焊剂使单个单元绝缘层压主体16中的螺旋形导体14的一个端部接合至电路板18的多个连接电极18中的对应连接电极而使另一端部接合至半导体器件10的多个焊料块12中的对应焊料块的状态。
而且,如图12所示,其中形成有螺旋形导体14的***层16可以是作为应力缓解部件的单个单元,其中,该螺旋形导体使它们的一个端部设置有多个焊料块12中的对应焊料块。换句话说,图12所示应力缓解部件具有利用其将半导体器件10接合至电路板18的焊料块12。
在将诸如半导体器件的电子部件安装在并入电子装置中的电路板上时,使用根据这个实施方式的作为应力缓解部件的包括螺旋形导体14的***层16。图13是并入了其上利用根据本实施方式的应力缓解部件来安装半导体器件44的板组件48的笔记本计算机的立体图。
笔记本计算机40的具有键盘的主机42并入有其中将半导体器件44安装在电路板46上的板组件48。在将半导体器件44安装在电路板46方面,使用根据这个实施方式的作为应力缓解部件的包括螺旋形导体14的绝缘片层压主体16。因为笔记本计算机40较薄,所以从外侧向主机42施加的力容易传动至电路板46,致使电路板容易达到变形状态。因此,根据这个实施方式的应力缓解部件可以缓解在笔记本计算机40的安装结构的接合件中出现的应力,从而改进半导体器件与电路板46之间的接合件的抗压性和长期可靠性。
应注意到,利用焊料作为接合材料对这个实施方式进行了描述。然而,该接合材料不限于焊料,而是可以使用其它热熔融材料。此外,将铜用作螺旋形导体14的材料,但可以使用镍和具有高杨氏模量的其它金属。
Claims (14)
1.一种安装结构,该安装结构用于在电路板上安装电子部件,所述安装结构包括:
***层,该***层设置在所述电子部件与所述电路板之间;和
多个螺旋形导体,所述多个螺旋形导体形成在所述***层中;其中,
所述多个螺旋形导体的一端接合至所述电子部件的外部连接端子中的对应外部连接端子,而另一端接合至所述电子部件的电极中的对应电极。
2.根据权利要求1所述的安装结构,其中,
所述***层包括层叠的绝缘片。
3.根据权利要求1所述的安装结构,其中,
各个螺旋形导体包括在所述***层中彼此连接的多个导电件。
4.根据权利要求2所述的安装结构,其中,
所述多个绝缘片由聚酰亚胺或硅形成。
5.根据权利要求3所述的安装结构,其中,
所述导电件由铜形成。
6.一种电子部件,所述电子部件包括根据权利要求1所述的安装结构。
7.一种电路板,所述电路板包括根据权利要求1所述的安装结构。
8.一种板组件,该板组件包括:
电路板;和
电子部件,该电子部件经由根据权利要求1所述的安装结构安装在所述电路板上。
9.一种电子装置,所述电子装置包含根据权利要求8所述的板组件。
10.一种应力缓解部件,该应力缓解部件设置在电子部件与电路板之间,所述应力缓解部件包括:
***层,该***层是通过层叠多个绝缘片而形成的;和
多个螺旋形导体,所述多个螺旋形导体形成在所述***层中。
11.根据权利要求10所述的应力缓解部件,其中,
各个螺旋形导体包括在所述***层中彼此连接的多个导电件。
12.根据权利要求10所述的应力缓解部件,其中,所述***层包括层叠的多个绝缘片。
13.根据权利要求12所述的应力缓解部件,其中,所述多个绝缘片由聚酰亚胺或硅形成。
14.根据权利要求11所述的应力缓解部件,其中,所述导电件由铜形成。
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JP2010133371A JP2011258835A (ja) | 2010-06-10 | 2010-06-10 | 実装構造、電子部品、回路基板、基板組立体、電子機器、及び応力緩和部材 |
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CN114190009A (zh) * | 2021-11-19 | 2022-03-15 | 气派科技股份有限公司 | 表面贴装器件封装结构及其上板焊接方法 |
CN114630494A (zh) * | 2022-05-12 | 2022-06-14 | 之江实验室 | 晶圆集成***与顶部pcb板的互连结构及其制造方法 |
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US20230138918A1 (en) * | 2021-10-29 | 2023-05-04 | Avago Technologies International Sales Pte. Limited | Integrated circuit package with serpentine conductor and method of making |
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JP2011258835A (ja) | 2011-12-22 |
EP2395822A1 (en) | 2011-12-14 |
US20110303450A1 (en) | 2011-12-15 |
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