CN102268720B - Substrate electroplating clamp with covered rubber on surface - Google Patents
Substrate electroplating clamp with covered rubber on surface Download PDFInfo
- Publication number
- CN102268720B CN102268720B CN 201110180408 CN201110180408A CN102268720B CN 102268720 B CN102268720 B CN 102268720B CN 201110180408 CN201110180408 CN 201110180408 CN 201110180408 A CN201110180408 A CN 201110180408A CN 102268720 B CN102268720 B CN 102268720B
- Authority
- CN
- China
- Prior art keywords
- clamp
- coating layer
- electroplating
- substrate
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The invention discloses a substrate electroplating clamp with covered rubber on the surface. The substrate electroplating clamp comprises two clamp bodies; the opposite positions at the clamp ends of the clamp bodies are respectively provided with a protruding contact, and the protruding contacts are opposite to each other; a first PVC (Poly Vinyl Chloride) coating layer with hardness range of 30-80 degrees covers on the non-opposite sides of the contacts and extends to parts of the clamping ends of the clamp bodies; a second PVC coating layer with hardness range of 80-110 degrees covers on the clamping ends of the clamp bodies; the first coating layer extends to the clamping end parts of the clamp bodies and is covered by the second coating layer; and the first coating layer is 0.1-0.8 mm longer than the opposite sides of the contacts. According to the substrate electroplating clamp with the covered rubber on surface disclosed by the invention, the problem that an electroplating solution easily damages the electroplating clamp at the adhesive jointing position; and while the substrate is clamped, a good conductive effect of the contacts can be guaranteed, and the contacts are sealed well and used for isolating the electroplating solution.
Description
Technical field
The present invention relates to the significant components substrate electroplating clamp in a kind of full-automatic vertical continuous electroplating device (VCPS), substrate electroplating clamp is used at electroplating process clamping substrate, and the effect with conduction.
Background technology
In the process with full-automatic vertical continuous electroplating device completing substrate plating, need to and be immersed in the electroplate liquid with the electroplating clamp chucking substrate.Substrate is by electroplating the clamping connection power cathode, and electroplate liquid connects positive pole.Metal ion in the electroplate liquid moves and is attached on the substrate to substrate, reaches the purpose of plated metal on substrate.
Electroplating clamp has the effect of conduction current because of needs, usually all can adopt stainless steel SUS304 material.In electroplating process, in the electroplating clamp meeting part immersion plating liquid, if do not take sfgd., electroplating clamp can be corroded, and plates metal at the place, contact of electroplating clamp clamping substrate.Along with the increase of metal thickness and the increasing of extent of corrosion, can cause scrapping of electroplating clamp.Therefore the device fabrication commercial city coating layer that can coat in the part that electroplating clamp need to be immersed in electroplate liquid other material of one deck is corroded to prevent electroplating clamp.
Such as Fig. 1, encapsulate is called terminal encapsulate on the forward and backward end of forward and backward clamp respectively; Encapsulate (requiring forward and backward contact opposite face exposed, the slightly outstanding forward and backward contact of coating layer opposite face) is called the contact encapsulate on the forward and backward contact of forward and backward clamp respectively.Aspect the selecting of coating layer material, domestic manufacturer adopts following dual mode usually:
One, the terminal encapsulate of electroplating clamp adopts hard PP or PVC material, and electroplating clamp contact encapsulate adopts viton (name of an article FPM) material.This kind mode is the mode that Domestic Plating equipment manufacturers generally adopt.
The advantage of this kind mode: terminal encapsulate adopts hard PP or PVC material, not only can isolate electroplating clamp and electroplate liquid, can also play the effect of protection electroplating clamp.The viton material that the contact encapsulate adopts, because of its matter soft, behind the clamping substrate, coating layer and substrate close contact, forward and backward contact is sealed between coating layer and the substrate, can plays the effect that prevents electroplate liquid etch electroplating clamp contact, be extruded owing to coating layer simultaneously, the direct contact substrate in contact, the not electroconductibility between influencing contactor and the substrate.
The shortcoming of this kind mode is: different from the used material of contact encapsulate because of terminal encapsulate, can't adopt the one form, and the method for splicing can only be adopted in both junctions.In long-term production process, from weld, the electroplating clamp contact is easily corroded by electroplate liquid, and electroplating clamp is caused damage.
Two: the terminal encapsulate of electroplating clamp and contact encapsulate all adopt hard PP or PVC material.
The advantage of this kind mode: because two portions all are hard PP or PVC, can adopt the mode of one encapsulate.Can play the effect of isolation electroplating clamp and electroplate liquid, the protection electroplating clamp is not corroded.
The shortcoming of this kind mode: because the contact encapsulate also is hard PP or PVC, after electroplating clamp is clamped to substrate, can't accomplish fine sealing between coating layer and the substrate, can cause in the process of electroplating, the contact of electroplate liquid corrosion electroplating clamp, and can plate layer of metal at the place, contact.Thereby affect the quality of plated item, and infringement electroplating clamp.
If two portions all with the flexible PVC parcel, easily come off because integument is soft, do not satisfy service requirements.
Summary of the invention
Technical problem to be solved by this invention is: the electroplating clamp that provides a kind of surface to be provided with encapsulate, use described electroplating clamp can solve electroplate liquid in the prior art easily from weld or because the problem of coating layer and the bad infringement electroplating clamp of base plate seals.
A kind of surface is provided with the substrate electroplating clamp of encapsulate, comprise two clamps, it is relative that the relative position of the folder end of described clamp respectively is provided with a contact of giving prominence to, be provided with durometer level and be the part that PVC the first coating layer of 30 °~80 ° coats the non-opposite face of described contact and extends to described clamp folder end, it is that PVC the second coating layer of 80 °~110 ° coats described clamp folder end that durometer level is arranged again, and described the first coating layer extends to clamp folder end parts and coated by the second coating layer.
Described the first coating layer grows contact opposite face (non-parcel face) 0.1~0.8mm, is proven this scope that is in, and sealing effectiveness and the conductive effect of electroplating clamp contact are best.
Described the first coating layer durometer level is 30 °~80 °, favourable sealing.
Described the second coating layer durometer level is 80 °~110 °, and is better to the protection effect of electroplating clamp.
Described clamp material is SUS316.
Relative prior art, beneficial effect of the present invention:
The contact encapsulate adopts nonrigid plastic, and contact the first coating layer 0.1~0.8mm that caves in can guarantee good conductive effect, and the contact is sealed simultaneously, and the protection contact is not damaged by electroplate liquid; Adopt the plastics of hard to make the second coating layer, isolation electroplating clamp and electroplate liquid play fine protection effect to electroplating clamp simultaneously; The first soft coating layer extends the part of putting forward and backward folder end and is coated by the second coating layer fully, owing to being material of the same race, can one make, there is not each other bonding surface, good sealing effect has solved electroplate liquid and has easily infiltered the problem of damaging electroplating clamp from the bonding surface weld of different materials.
Description of drawings
Fig. 1 is the schematic perspective view of preferred embodiment of the present invention;
Fig. 2 is decomposition and the rear schematic diagram of assembling of preferred embodiment of the present invention.
Embodiment
Below, the invention will be further described by reference to the accompanying drawings:
As shown in Figure 2, the surface of preferred embodiment is provided with the substrate electroplating clamp of encapsulate, comprise from the centre hinged before, rear two elongated clamps 1,2, the clamp material is SUS316, the pin joint front portion be clamp folder end, the rear portion for holding end, before, the relative position place of the folder end of back clamp, respectively be provided with an outstanding contact 3,4 is relative, PVC the first coating layer 5 that is provided with durometer level and is 30 °~80 ° (it is 65 ° that the present embodiment is got hardness) coats the non-opposite face of contacts 3 and contact 4 and extends to the part of clamp folder end, it is PVC the second coating layer 6 coating clamp folder ends of 80 °~110 ° (it is 90 ° that the present embodiment is got hardness) that durometer level is arranged again, and the first coating layer extends to clamp folder end parts and coated by the second coating layer.
The first coating layer 5 grows opposite face (the non-parcel face) 0.1~0.8mm (the present embodiment is got 0.35mm) of contact 3 and 4, is proven this scope that is in, and sealing effectiveness and the conductive effect of electroplating clamp contact are best.
The first coating layer durometer level is 30 °~80 ° favourable sealings; The second coating layer durometer level is that 80 °~110 ° protection effects to electroplating clamp are better.
The encapsulation process of electroplating clamp is: the first coating layer of 1, making with flexible PVC is first finished the contact encapsulate and is extended the forward and backward end of putting forward and backward clamp, the outstanding corresponding contact 0.1~0.8mm of described the first coating layer, durometer level is 30 °~80 °, and best hardness is 65 °; 2, the second coating layer made from hard PVC is again finished terminal encapsulate, and the extension of the first coating layer is put forward and backward terminal portions and tightly is coated on the second coating inside, and described the second coating durometer level is 80 °~110 °, and best hardness is 90 °.After finishing above-mentioned encapsulate, assemble again electroplating clamp and get final product.
Technical scheme of the present invention adopts the same material one to make, but soft should firmly the locating in this soft place overcome the deficiencies in the prior art part firmly dexterously, produced good effect and obtained significant progress.
The present invention has overcome mechanical thinking set to have spent the result that many performing creative labours just draw, those skilled in the art never easily expects the time of the present invention not seeing although the present invention looks simple, one of this reason that also why before never same product comes out just, especially concrete most preferred embodiment: the first coating layer 5 grows opposite face (the non-parcel face) 0.35mm of contact 3 and 4, the first coating layer hardness is 65 °, the second coating layer hardness is 90 ° parameter, the clamp material is SUS316, be the optimum parameter that has adopted special manufacture craft just to draw through technological test many times, obtained best effect.
Claims (4)
1. a surface is provided with the substrate electroplating clamp of encapsulate, comprise two clamps, it is relative that the relative position of the folder end of described clamp respectively is provided with a contact of giving prominence to, it is characterized in that: be provided with durometer level and be the part that PVC the first coating layer of 30 °~80 ° coats the non-opposite face of described contact and extends to described clamp folder end, it is that PVC the second coating layer of 80 °~90 ° coats described clamp folder end that durometer level is arranged again, and described the first coating layer extends to clamp folder end parts and coated by the second coating layer.
2. surface according to claim 1 is provided with the substrate electroplating clamp of encapsulate, it is characterized in that: described the first coating layer grows contact opposite face 0.1~0.8mm.
3. surface according to claim 2 is provided with the substrate electroplating clamp of encapsulate, it is characterized in that: described the first coating layer grows contact opposite face 0.35mm, and described the first coating layer hardness is 65 °, and described the second coating layer hardness is 90 °.
4. surface according to claim 3 is provided with the substrate electroplating clamp of encapsulate, it is characterized in that: described clamp material is SUS316.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201110180408 CN102268720B (en) | 2011-06-30 | 2011-06-30 | Substrate electroplating clamp with covered rubber on surface |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201110180408 CN102268720B (en) | 2011-06-30 | 2011-06-30 | Substrate electroplating clamp with covered rubber on surface |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102268720A CN102268720A (en) | 2011-12-07 |
CN102268720B true CN102268720B (en) | 2013-10-16 |
Family
ID=45051167
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 201110180408 Active CN102268720B (en) | 2011-06-30 | 2011-06-30 | Substrate electroplating clamp with covered rubber on surface |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN102268720B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102703960B (en) * | 2012-07-04 | 2014-07-30 | 中国振华集团群英无线电器材厂 | Winding-free electroplating clamp of relay base |
TWI458860B (en) * | 2014-05-13 | 2014-11-01 | Phoenix Pioneer Technology Co Ltd | Plating rack |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM320559U (en) * | 2007-04-11 | 2007-10-11 | Jian-Ming Weng | Electroplating fixture |
CN101165222A (en) * | 2006-09-04 | 2008-04-23 | 日本梅克特隆株式会社 | Electroplating cramp printed circuit board |
WO2008097218A1 (en) * | 2007-02-05 | 2008-08-14 | Honeywell International, Inc. | Heat spreader plating methods and devices |
CN201809473U (en) * | 2010-07-27 | 2011-04-27 | 广州明毅电子机械有限公司 | Movable substrate clamping mechanism for electroplating of substrates |
-
2011
- 2011-06-30 CN CN 201110180408 patent/CN102268720B/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101165222A (en) * | 2006-09-04 | 2008-04-23 | 日本梅克特隆株式会社 | Electroplating cramp printed circuit board |
WO2008097218A1 (en) * | 2007-02-05 | 2008-08-14 | Honeywell International, Inc. | Heat spreader plating methods and devices |
TWM320559U (en) * | 2007-04-11 | 2007-10-11 | Jian-Ming Weng | Electroplating fixture |
CN201809473U (en) * | 2010-07-27 | 2011-04-27 | 广州明毅电子机械有限公司 | Movable substrate clamping mechanism for electroplating of substrates |
Non-Patent Citations (5)
Title |
---|
《聚氯乙烯加工手册》编写组.《聚氯乙烯加工手册》.《聚氯乙烯加工手册》.中国轻工业出版社,1990,(第1版),663-664页. * |
吴勤等.大型缸体镀铬夹具的设计与应用.《一重技术》.2000,(第3期),56-57页3.3节. |
大型缸体镀铬夹具的设计与应用;吴勤等;《一重技术》;20000815(第3期);全文 * |
挂具的绝缘方法;陆江祥;《电镀与精饰》;19870401;第9卷(第3期);全文 * |
陆江祥.挂具的绝缘方法.《电镀与精饰》.1987,第9卷(第3期),第38页. |
Also Published As
Publication number | Publication date |
---|---|
CN102268720A (en) | 2011-12-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
RU2615009C1 (en) | Device for application of metal film and method of application of metal film | |
KR20170003367U (en) | Precious-metal-alloy contacts | |
CN102268720B (en) | Substrate electroplating clamp with covered rubber on surface | |
KR101290670B1 (en) | A integrated antenna manufacturing method has the plating reliability enhancement function | |
CN101165222A (en) | Electroplating cramp printed circuit board | |
CN106252953B (en) | USB socket and forming method thereof | |
CN103975094A (en) | Composition for production of contact, contact using same and process for production of contact | |
CN210958421U (en) | Lid behind three-dimensional line 3D cell-phone glass | |
CN210140632U (en) | Single-side anodic oxidation clamping fixture | |
KR20120111600A (en) | The surface treatment method for radio communication connectors using thereof | |
US20160305036A1 (en) | System for insulating high current busbars | |
TWI429787B (en) | A substrate with an encapsulated substrate | |
CN208414587U (en) | A kind of pipe spray formula selective plating device | |
CN209974919U (en) | Polar plate for electrolyzing zinc | |
CN204251742U (en) | A kind of modified version volume to volume upright plating line electroplating clamp and plating tank transmission rig | |
CN105002528A (en) | Cyanide-free silver electroplating solution and electroplating method thereof | |
CN203746963U (en) | Connection terminal of lead-acid storage battery | |
CN101193489A (en) | Plating part and its making method | |
GB2076427A (en) | The in situ metal plating of the cathode terminal surface of an electrochemical cell | |
CN201109794Y (en) | Vacuum ion film-coating clamper | |
CN210287567U (en) | Electroplating clamp | |
CN210371513U (en) | Magnetic steel bonding tool | |
CN201339063Y (en) | Ion film electrolytic tank rubber gasket preventing crevice corrosion used in polytetrafluoroethylene film full-coated chlorine engineering | |
CN113285003B (en) | Method for manufacturing LED support and LED support | |
CN208379029U (en) | Electroplated structural |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A base plate electroplating clip with adhesive coating on the surface Effective date of registration: 20230110 Granted publication date: 20131016 Pledgee: Zengcheng sub branch of Bank of Guangzhou Co.,Ltd. Pledgor: GUANGZHOU MING YI ELECTRONIC MACHINERY Co.,Ltd. Registration number: Y2023980030728 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right |