CN102268720A - Substrate electroplating clamp with covered rubber on surface - Google Patents
Substrate electroplating clamp with covered rubber on surface Download PDFInfo
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- CN102268720A CN102268720A CN201110180408A CN201110180408A CN102268720A CN 102268720 A CN102268720 A CN 102268720A CN 201110180408 A CN201110180408 A CN 201110180408A CN 201110180408 A CN201110180408 A CN 201110180408A CN 102268720 A CN102268720 A CN 102268720A
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- coating layer
- clamp
- folder
- substrate
- contact
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Abstract
The invention discloses a substrate electroplating clamp with covered rubber on the surface. The substrate electroplating clamp comprises two clamp bodies; the opposite positions at the clamp ends of the clamp bodies are respectively provided with a protruding contact, and the protruding contacts are opposite to each other; a first PVC (Poly Vinyl Chloride) coating layer with hardness range of 30-80 degrees covers on the non-opposite sides of the contacts and extends to parts of the clamping ends of the clamp bodies; a second PVC coating layer with hardness range of 80-110 degrees covers on the clamping ends of the clamp bodies; the first coating layer extends to the clamping end parts of the clamp bodies and is covered by the second coating layer; and the first coating layer is 0.1-0.8 mm longer than the opposite sides of the contacts. According to the substrate electroplating clamp with the covered rubber on surface disclosed by the invention, the problem that an electroplating solution easily damages the electroplating clamp at the adhesive jointing position; and while the substrate is clamped, a good conductive effect of the contacts can be guaranteed, and the contacts are sealed well and used for isolating the electroplating solution.
Description
Technical field
The significant components substrate that the present invention relates in a kind of full-automatic vertical continuous electroplating device (VCPS) is electroplated folder, and substrate is electroplated folder and is used at electroplating process clamping substrate, and the effect with conduction.
Background technology
Finish in the galvanized process of substrate with full-automatic vertical continuous electroplating device, need be with electroplating the folder chucking substrate and being immersed in the electroplate liquid.Substrate is by electroplating the clamping connection power cathode, and electroplate liquid connects positive pole.Metal ion in the electroplate liquid to substrate move and attached to substrate on, reach the purpose of plated metal on substrate.
Electroplate and press from both sides the effect that has conduction current because of needs, all can adopt stainless steel SUS304 material usually.In electroplating process, electroplate in the folder meeting part immersion plating liquid, if do not take sfgd., electroplating folder can be corroded, and locates to plate metal in the contact of electroplating folder clamping substrate.Along with the increase of metal thickness and the increasing of extent of corrosion, can cause and electroplate scrapping of folder.Therefore the device fabrication commercial city can press from both sides the coating layer of other material of coating one deck on the part that need be immersed in electroplate liquid to prevent to electroplate the double-layered quilt corrosion in plating.
As Fig. 1, encapsulate is called terminal encapsulate on the forward and backward end of forward and backward clamp respectively; Encapsulate (requiring forward and backward contact opposite face exposed, the slightly outstanding forward and backward contact of coating layer opposite face) is called the contact encapsulate on the forward and backward contact of forward and backward clamp respectively.Aspect the selecting for use of coating layer material, domestic manufacturer adopts following dual mode usually:
One, electroplates the terminal encapsulate of folder and adopt hard PP or PVC material, electroplate folder contact encapsulate and adopt viton (name of an article FPM) material.This kind mode is the mode that domestic electroplating device manufacturers generally adopts.
The advantage of this kind mode: terminal encapsulate adopts hard PP or PVC material, not only can isolate and electroplate folder and electroplate liquid, can also play the effect that folder is electroplated in protection.The viton material that the contact encapsulate adopts, because of its matter soft, behind the clamping substrate, coating layer closely contacts with substrate, forward and backward contact is sealed between coating layer and the substrate, can plays the effect that prevents electroplate liquid etch plating folder contact, be extruded owing to coating layer simultaneously, the direct contact substrate in contact, the not electroconductibility between influencing contactor and the substrate.
The shortcoming of this kind mode is: different because of terminal encapsulate with the used material of contact encapsulate, can't adopt the one form, and cementitious method can only be adopted in both junctions.In the long-term production process, from weld, electroplate the folder contact and easily corroded by electroplate liquid, cause damage to electroplating folder.
Two: electroplate terminal encapsulate of folder and contact encapsulate and all adopt hard PP or PVC material.
The advantage of this kind mode:, can adopt the mode of one encapsulate because of two portions all are hard PP or PVC.Can play the effect of isolating plating folder and electroplate liquid, protection is electroplated to press from both sides and is not corroded.
The shortcoming of this kind mode: because of the contact encapsulate also is hard PP or PVC, after plating is clamped to substrate, can't accomplish fine sealing between coating layer and the substrate, can cause in galvanized process, the contact that folder is electroplated in the electroplate liquid corrosion, and can plate layer of metal at the place, contact.Thereby influence the quality of plated item, and folder is electroplated in infringement.
If two portions all with the flexible PVC parcel, come off because of integument is soft easily, do not satisfy service requirements.
Summary of the invention
Technical problem to be solved by this invention is: the plating that a kind of surface is provided with encapsulate folder is provided, uses described plating folder can solve in the prior art electroplate liquid easily from weld or because coating layer is electroplated the problem of pressing from both sides with the bad infringement of base plate seals.
A kind of surface is provided with the substrate of encapsulate and electroplates folder, comprise two clamps, it is relative that the relative position of the folder end of described clamp respectively is provided with a contact of giving prominence to, be provided with durometer level and be the part that 30 °～80 ° PVC first coating layer coats the non-opposite face of described contact and extends to described clamp folder end, it is that 80 °～110 ° PVC second coating layer coats described clamp folder end that durometer level is arranged again, and described first coating layer extends to clamp folder end parts and coated by second coating layer.
Described first coating layer grows contact opposite face (non-parcel face) 0.1～0.8mm, and through facts have proved this scope that is in, sealing effectiveness and the conductive effect of electroplating the folder contact are best.
The described first coating layer durometer level is 30 °～80 °, favourable sealing.
The described second coating layer durometer level is 80 °～110 °, and is better to the protection effect of electroplating folder.
Described clamp material is SUS316.
Relative prior art, beneficial effect of the present invention:
The contact encapsulate adopts nonrigid plastic, and contact first coating layer, the 0.1～0.8mm that caves in can guarantee good conductive effect, and the contact obtains sealing simultaneously, and the protection contact is not damaged by electroplate liquid; Adopt the plastics of hard to make second coating layer, isolate and electroplate folder and electroplate liquid, simultaneously plating is picked up fine protection effect; The first soft coating layer extends the part of putting forward and backward folder end and is coated by second coating layer fully, owing to be material of the same race, can one make, there is not bonding surface each other, good sealing effect has solved electroplate liquid and has easily infiltered the problem that folder is electroplated in infringement from the bonding surface weld of different materials.
Description of drawings
Fig. 1 is the schematic perspective view of preferred embodiment of the present invention;
Fig. 2 is the decomposition and the assembling back synoptic diagram of preferred embodiment of the present invention.
Embodiment
Below, in conjunction with the accompanying drawings the present invention is further described:
As shown in Figure 2, the surface of preferred embodiment is provided with the substrate of encapsulate and electroplates folder, comprise from the centre hinged before, back two elongated clamps 1,2, the clamp material is SUS316, the pin joint forward is a clamp folder end, the rear portion for holding end, before, the relative position place of the folder end of back clamp, respectively be provided with an outstanding contact 3,4 is relative, PVC first coating layer 5 that is provided with durometer level and is 30 °～80 ° (it is 65 ° that present embodiment is got hardness) coats the non-opposite face of contacts 3 and contact 4 and extends to the part of clamp folder end, it is the PVC second coating layer 6 coating clamp folder ends of 80 °～110 ° (it is 90 ° that present embodiment is got hardness) that durometer level is arranged again, and first coating layer extends to clamp folder end parts and coated by second coating layer.
First coating layer 5 grows opposite face (the non-parcel face) 0.1～0.8mm (present embodiment is got 0.35mm) of contact 3 and 4, and through facts have proved this scope that is in, sealing effectiveness and the conductive effect of electroplating the folder contact are best.
The first coating layer durometer level is 30 °～80 ° favourable sealings; The second coating layer durometer level is that 80 °～110 ° protection effects to the plating folder are better.
The encapsulation process of electroplating folder is: 1, first coating layer made from flexible PVC is earlier finished the contact encapsulate and is extended the forward and backward end of putting forward and backward clamp, the outstanding corresponding contact 0.1～0.8mm of described first coating layer, durometer level is 30 °～80 °, and best hardness is 65 °; 2, second coating layer made from hard PVC is again finished terminal encapsulate, and the extension of first coating layer is put forward and backward terminal portions and tightly is coated on the second coating inside, and the described second coating durometer level is 80 °～110 °, and best hardness is 90 °.After finishing above-mentioned encapsulate, assemble the plating folder again and get final product.
Technical scheme of the present invention adopts the same material one to make, but soft should the locating firmly in this soft place overcome the deficiencies in the prior art part firmly dexterously, produced good effect and obtained obvious improvement.
The present invention has overcome mechanical thinking set to have spent the result that many performing creative labours just draw, those skilled in the art expects the time of the present invention never easily not seeing though the present invention looks simple, one of this reason that also why before never same product comes out just, especially concrete most preferred embodiment: first coating layer 5 grows opposite face (the non-parcel face) 0.35mm of contact 3 and 4, the first coating layer hardness is 65 °, the second coating layer hardness is 90 ° parameter, the clamp material is SUS316, be the optimum parameter that has adopted special manufacture craft just to draw through technological test many times, obtained best effect.
Claims (4)
1. the surface substrate that is provided with encapsulate is electroplated folder, comprise two clamps, it is relative that the relative position of the folder end of described clamp respectively is provided with a contact of giving prominence to, it is characterized in that: be provided with durometer level and be the part that 30 °～80 ° PVC first coating layer coats the non-opposite face of described contact and extends to described clamp folder end, it is that 80 °～110 ° PVC second coating layer coats described clamp folder end that durometer level is arranged again, and described first coating layer extends to clamp folder end parts and coated by second coating layer.
2. surface according to claim 1 is provided with the substrate of encapsulate and electroplates folder, and it is characterized in that: described first coating layer grows contact opposite face 0.1～0.8mm.
3. surface according to claim 2 is provided with the substrate of encapsulate and electroplates folder, and it is characterized in that: described first coating layer grows contact opposite face 0.35mm, and the described first coating layer hardness is 65 °, and the described second coating layer hardness is 90 °.
4. surface according to claim 3 is provided with the substrate of encapsulate and electroplates folder, and it is characterized in that: described clamp material is SUS316.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110180408 CN102268720B (en) | 2011-06-30 | 2011-06-30 | Substrate electroplating clamp with covered rubber on surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110180408 CN102268720B (en) | 2011-06-30 | 2011-06-30 | Substrate electroplating clamp with covered rubber on surface |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102268720A true CN102268720A (en) | 2011-12-07 |
| CN102268720B CN102268720B (en) | 2013-10-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110180408 Active CN102268720B (en) | 2011-06-30 | 2011-06-30 | Substrate electroplating clamp with covered rubber on surface |
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| Country | Link |
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| CN (1) | CN102268720B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102703960A (en) * | 2012-07-04 | 2012-10-03 | 中国振华集团群英无线电器材厂 | Winding-free electroplating clamp of relay base |
| CN105088322A (en) * | 2014-05-13 | 2015-11-25 | 恒劲科技股份有限公司 | Hanger device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM320559U (en) * | 2007-04-11 | 2007-10-11 | Jian-Ming Weng | Electroplating fixture |
| CN101165222A (en) * | 2006-09-04 | 2008-04-23 | 日本梅克特隆株式会社 | Electroplating cramp printed circuit board |
| WO2008097218A1 (en) * | 2007-02-05 | 2008-08-14 | Honeywell International, Inc. | Heat spreader plating methods and devices |
| CN201809473U (en) * | 2010-07-27 | 2011-04-27 | 广州明毅电子机械有限公司 | Movable substrate clamping mechanism for electroplating of substrates |
-
2011
- 2011-06-30 CN CN 201110180408 patent/CN102268720B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101165222A (en) * | 2006-09-04 | 2008-04-23 | 日本梅克特隆株式会社 | Electroplating cramp printed circuit board |
| WO2008097218A1 (en) * | 2007-02-05 | 2008-08-14 | Honeywell International, Inc. | Heat spreader plating methods and devices |
| TWM320559U (en) * | 2007-04-11 | 2007-10-11 | Jian-Ming Weng | Electroplating fixture |
| CN201809473U (en) * | 2010-07-27 | 2011-04-27 | 广州明毅电子机械有限公司 | Movable substrate clamping mechanism for electroplating of substrates |
Non-Patent Citations (3)
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| 《聚氯乙烯加工手册》编写组: "《聚氯乙烯加工手册》", 28 February 1990, article "《聚氯乙烯加工手册》", pages: 663-664 * |
| 吴勤等: "大型缸体镀铬夹具的设计与应用", 《一重技术》, no. 3, 15 August 2000 (2000-08-15) * |
| 陆江祥: "挂具的绝缘方法", 《电镀与精饰》, vol. 9, no. 3, 1 April 1987 (1987-04-01), pages 38 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102703960A (en) * | 2012-07-04 | 2012-10-03 | 中国振华集团群英无线电器材厂 | Winding-free electroplating clamp of relay base |
| CN102703960B (en) * | 2012-07-04 | 2014-07-30 | 中国振华集团群英无线电器材厂 | Winding-free electroplating clamp of relay base |
| CN105088322A (en) * | 2014-05-13 | 2015-11-25 | 恒劲科技股份有限公司 | Hanger device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102268720B (en) | 2013-10-16 |
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| C14 | Grant of patent or utility model | ||
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A base plate electroplating clip with adhesive coating on the surface Effective date of registration: 20230110 Granted publication date: 20131016 Pledgee: Zengcheng sub branch of Bank of Guangzhou Co.,Ltd. Pledgor: GUANGZHOU MING YI ELECTRONIC MACHINERY Co.,Ltd. Registration number: Y2023980030728 |
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