CN102248319A - Low-silver Sn-Ag-Cu unleaded brazing filler metal - Google Patents
Low-silver Sn-Ag-Cu unleaded brazing filler metal Download PDFInfo
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- CN102248319A CN102248319A CN2011101820786A CN201110182078A CN102248319A CN 102248319 A CN102248319 A CN 102248319A CN 2011101820786 A CN2011101820786 A CN 2011101820786A CN 201110182078 A CN201110182078 A CN 201110182078A CN 102248319 A CN102248319 A CN 102248319A
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- filler metal
- brazing filler
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Abstract
The invention discloses a low-silver Sn-Ag-Cu unleaded brazing filler metal and relates to an unleaded brazing filler metal. By means of the low-silver Sn-Ag-Cu unleaded brazing filler metal disclosed by the invention, the problems that a conventional Sn-3.5Ag-0.7Cu brazing filler metal has poor oxidation resistance and high brazing filler metal cost because of high silver content are solved. The low-silver Sn-Ag-Cu unleaded brazing filler metal disclosed by the invention is made from Ag, Cu, Mn, Ni, In, P, Y and Sn. A wetting angle of the low-silver Sn-Ag-Cu unleaded brazing filler metal on a Cu base plate is 10-15 DEG; the shearing strength of an obtained BGA (Ball Grid Array) welding spot is 62-74MPa; under the same exposed area in the air, the surface oxidation film formation amount is decreased by 15-20% compared with that of the Sn-3.5Ag-0.7Cu brazing filler metal after the temperature of 260 DEG C is maintained for 180 minutes; in the meantime, the production cost of the brazing filler metal is reduced because of reducing the silver content in the brazing filler metal. The low-silver Sn-Ag-Cu unleaded brazing filler metal is applied to the technical field of unleaded brazing.
Description
Technical field
The present invention relates to a kind of lead-free brazing.
Background technology
In the Electronic Packaging process, owing to the feasible lead-free brazing of developing of the toxicity of Pb in the Sn-Pb eutectic solder and compound thereof becomes irreversible trend.The Sn-3.5Ag-0.7Cu solder is used comparatively extensive as Sn-Pb eutectic solder substitute, but it exists oxidation resistance poor, and makes the solder cost higher owing to Ag content is higher.When therefore making the Sn-Ag-Cu solder not reduce solder performance, reducing Ag content reduces the solder cost, improves the solder non-oxidizability, to make the Sn-Ag-Cu series leadless solder obtain to use more widely, therefore become solder manufacturer and correlative study personnel's target.
Summary of the invention
The present invention is that will to solve existing Sn-3.5Ag-0.7Cu solder non-oxidizability poor, because the silver content height causes the high problem of solder cost, provides a kind of low silver-colored Sn-Ag-Cu series leadless solder.
The low silver-colored Sn-Ag-Cu series leadless solder of the present invention is made by 2.0%～2.5% Ag, 0.6%～0.8% Cu, 0.1%～0.2% Mn, 0.08%～0.12% Ni, 0.1%～0.3% In, 0.08%～0.12% P, 0.012% Y and the Sn of surplus by mass percentage.
The angle of wetting of low silver-colored Sn-Ag-Cu series leadless solder of the present invention on the Cu substrate is 10 °～15 °, gained BGA solder joint shear strength is 62～74MPa, low silver-colored Sn-Ag-Cu series leadless solder is in air under the identical exposed area, behind 260 ℃ of maintenance 180min, the surface film oxide growing amount has reduced 15%～25% than Sn-3.5Ag-0.7Cu.Low silver-colored Sn-Ag-Cu series leadless solder of the present invention is compared with existing Sn-3.5Ag-0.7Cu solder, under the same terms, angle of wetting has reduced by 4 °～6 °, and non-oxidizability has improved 15%～25%, shear strength has improved 10%～20%, can access the higher joint of reliability in the soldering.
The Mn element that adds with Cu-Mn intermediate alloy form among the present invention can reduce the solder fusing point, improve solder wetting performance and plasticity, and the effect that has the secondary deoxidation because of Mn has improved the solder antioxygenic property.The adding of Mn, P element can improve the non-oxidizability of lead-free brazing; The adding of In element can reduce the fusing point of lead-free brazing, increases the wettability of dissolving the back solder; The adding of Ni element helps to improve the mechanical property of brazing filler metal alloy; But the adding of Y element then refinement solder crystal grain improves joint toughness.The present invention has reduced the production cost of solder because of the silver content in the reduction solder.
The specific embodiment
Technical solution of the present invention is not limited to the following cited specific embodiment, also comprises any combination between each specific embodiment.
The specific embodiment one: the low silver-colored Sn-Ag-Cu series leadless solder of present embodiment is made by 2.0%～2.5% Ag, 0.6%～0.8% Cu, 0.1%～0.2% Mn, 0.08%～0.12% Ni, 0.1%～0.3% In, 0.08%～0.12% P, 0.012% Y and the Sn of surplus by mass percentage.
The Mn element is to add with the form of Cu-Mn alloy in the present embodiment, and Y element is that the form with rare-earth copper alloy adds, and the quality of the Cu in Cu-Mn alloy and the rare-earth copper alloy will be calculated within the Cu element in low silver-colored Sn-Ag-Cu series leadless solder.
The preparation method of the low silver-colored Sn-Ag-Cu series leadless solder of present embodiment is as follows: one, by mass ratio KCl: LiCl=1.4: 1 takes by weighing KCl and LiCl, makes the protection fused salt after mixing; Two, the protection fused salt that earlier Ag, Cu, Sn and step 1 is made is put into heat fused in the alumina crucible, successively In, P, Ni, Cu-Mn alloy and the copper alloy that contains yttrium are added alumina crucible then, be heated to about 700 ℃, treat to be incubated 2 hours after the off-bottom, and stir once with quartz pushrod every 10min between soak; Three, alloy melted in the alumina crucible is carried out precooling, casting, promptly obtain low silver-colored Sn-Ag-Cu series leadless solder; Described low silver-colored Sn-Ag-Cu series leadless solder is made by 2.0%～2.5% Ag, 0.6%～0.8% Cu, 0.1%～0.2% Mn, 0.08%～0.12% Ni, 0.1%～0.3% In, 0.08%～0.12% P, 0.012% Y and the Sn of surplus by mass percentage.
The angle of wetting of low silver-colored Sn-Ag-Cu series leadless solder on the Cu substrate of present embodiment is 10 °～15 °, gained BGA solder joint shear strength is 62～74MPa, low silver-colored Sn-Ag-Cu series leadless solder is in air under the identical exposed area, behind 260 ℃ of maintenance 180min, the surface film oxide growing amount has reduced 15%～25% than Sn-3.5Ag-0.7Cu.The low silver-colored Sn-Ag-Cu series leadless solder of present embodiment is compared with existing Sn-3.5Ag-0.7Cu solder, under the same terms, angle of wetting has reduced by 4 °～6 °, and non-oxidizability has improved 15%～25%, shear strength has improved 10%～20%, can access the higher joint of reliability in the soldering.Present embodiment has reduced the silver content in the solder, thereby has reduced the production cost of solder.
The specific embodiment two: what present embodiment and the specific embodiment one were different is: low silver-colored Sn-Ag-Cu series leadless solder is made by 2.5% Ag, 0.7% Cu, 0.1% Mn, 0.08% Ni, 0.2% In, 0.08% P, 0.012% Y and the Sn of surplus by mass percentage.
The wetting and spreading of low silver-colored Sn-Ag-Cu series leadless solder on the Cu substrate that present embodiment obtains is functional, and the angle of wetting on the Cu substrate is 12 °, and gained BGA solder joint shear strength is 67MPa.
The specific embodiment three: what present embodiment and the specific embodiment one were different is: low silver-colored Sn-Ag-Cu series leadless solder is made by 2.0% Ag, 0.7% Cu, 0.1% Mn, 0.08% Ni, 0.2% In, 0.08% P, 0.012% Y and the Sn of surplus by mass percentage.
The wetting and spreading of low silver-colored Sn-Ag-Cu series leadless solder on the Cu substrate that present embodiment obtains is functional, and the angle of wetting on the Cu substrate is 15 °, and gained BGA solder joint shear strength is 70MPa.
The specific embodiment four: what present embodiment and the specific embodiment one were different is: low silver-colored Sn-Ag-Cu series leadless solder is made by 2.0% Ag, 0.8% Cu, 0.1% Mn, 0.08% Ni, 0.2% In, 0.08% P, 0.012% Y and the Sn of surplus by mass percentage.
The wetting and spreading of low silver-colored Sn-Ag-Cu series leadless solder on the Cu substrate that present embodiment obtains is functional, and the angle of wetting on the Cu substrate is 10 °, and gained BGA solder joint shear strength is 74MPa.
The specific embodiment five: what present embodiment and the specific embodiment one were different is: low silver-colored Sn-Ag-Cu series leadless solder is made by 2.0% Ag, 0.7% Cu, 0.2% Mn, 0.08% Ni, 0.2% In, 0.08% P, 0.012% Y and the Sn of surplus by mass percentage.
The wetting and spreading of low silver-colored Sn-Ag-Cu series leadless solder on the Cu substrate that present embodiment obtains is functional, and the angle of wetting on the Cu substrate is 11 °, and gained BGA solder joint shear strength is 65MPa.
The specific embodiment six: what present embodiment and the specific embodiment one were different is: low silver-colored Sn-Ag-Cu series leadless solder is made by 2.0% Ag, 0.7% Cu, 0.1% Mn, 0.1% Ni, 0.2% In, 0.08% P, 0.012% Y and the Sn of surplus by mass percentage.
The wetting and spreading of low silver-colored Sn-Ag-Cu series leadless solder on the Cu substrate that present embodiment obtains is functional, and the angle of wetting on the Cu substrate is 12 °, and gained BGA solder joint shear strength is 71MPa.
The specific embodiment seven: what present embodiment and the specific embodiment one were different is: low silver-colored Sn-Ag-Cu series leadless solder is made by 2.0% Ag, 0.7% Cu, 0.1% Mn, 0.08% Ni, 0.3% In, 0.08% P, 0.012% Y and the Sn of surplus by mass percentage.
The wetting and spreading of low silver-colored Sn-Ag-Cu series leadless solder on the Cu substrate that present embodiment obtains is functional, and the angle of wetting on the Cu substrate is 14 °, and gained BGA solder joint shear strength is 69MPa.
The specific embodiment eight: what present embodiment and the specific embodiment one were different is: low silver-colored Sn-Ag-Cu series leadless solder is made by 2.0% Ag, 0.7% Cu, 0.1% Mn, 0.08% Ni, 0.2% In, 0.1% P, 0.012% Y and the Sn of surplus by mass percentage.
The wetting and spreading of low silver-colored Sn-Ag-Cu series leadless solder on the Cu substrate that present embodiment obtains is functional, and the angle of wetting on the Cu substrate is 10 °, and gained BGA solder joint shear strength is 72MPa.
Claims (8)
1. one kind low silver-colored Sn-Ag-Cu series leadless solder is characterized in that low silver-colored Sn-Ag-Cu series leadless solder made by 2.0%～2.5% Ag, 0.6%～0.8% Cu, 0.1%～0.2% Mn, 0.08%～0.12% Ni, 0.1%～0.3% In, 0.08%～0.12% P, 0.012% Y and the Sn of surplus by mass percentage.
2. a kind of low silver-colored Sn-Ag-Cu series leadless solder according to claim 1 is characterized in that low silver-colored Sn-Ag-Cu series leadless solder made by 2.5% Ag, 0.7% Cu, 0.1% Mn, 0.08% Ni, 0.2% In, 0.08% P, 0.012% Y and the Sn of surplus by mass percentage.
3. a kind of low silver-colored Sn-Ag-Cu series leadless solder according to claim 1 is characterized in that low silver-colored Sn-Ag-Cu series leadless solder made by 2.0% Ag, 0.7% Cu, 0.1% Mn, 0.08% Ni, 0.2% In, 0.08% P, 0.012% Y and the Sn of surplus by mass percentage.
4. a kind of low silver-colored Sn-Ag-Cu series leadless solder according to claim 1 is characterized in that low silver-colored Sn-Ag-Cu series leadless solder made by 2.0% Ag, 0.8% Cu, 0.1% Mn, 0.08% Ni, 0.2% In, 0.08% P, 0.012% Y and the Sn of surplus by mass percentage.
5. a kind of low silver-colored Sn-Ag-Cu series leadless solder according to claim 1 is characterized in that low silver-colored Sn-Ag-Cu series leadless solder made by 2.0% Ag, 0.7% Cu, 0.2% Mn, 0.08% Ni, 0.2% In, 0.08% P, 0.012% Y and the Sn of surplus by mass percentage.
6. a kind of low silver-colored Sn-Ag-Cu series leadless solder according to claim 1 is characterized in that low silver-colored Sn-Ag-Cu series leadless solder made by 2.0% Ag, 0.7% Cu, 0.1% Mn, 0.1% Ni, 0.2% In, 0.08% P, 0.012% Y and the Sn of surplus by mass percentage.
7. a kind of low silver-colored Sn-Ag-Cu series leadless solder according to claim 1 is characterized in that low silver-colored Sn-Ag-Cu series leadless solder made by 2.0% Ag, 0.7% Cu, 0.1% Mn, 0.08% Ni, 0.3% In, 0.08% P, 0.012% Y and the Sn of surplus by mass percentage.
8. a kind of low silver-colored Sn-Ag-Cu series leadless solder according to claim 1 is characterized in that low silver-colored Sn-Ag-Cu series leadless solder made by 2.0% Ag, 0.7% Cu, 0.1% Mn, 0.08% Ni, 0.2% In, 0.1% P, 0.012% Y and the Sn of surplus by mass percentage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101820786A CN102248319A (en) | 2011-06-30 | 2011-06-30 | Low-silver Sn-Ag-Cu unleaded brazing filler metal |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101820786A CN102248319A (en) | 2011-06-30 | 2011-06-30 | Low-silver Sn-Ag-Cu unleaded brazing filler metal |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002307187A (en) * | 2001-02-09 | 2002-10-22 | Taiho Kogyo Co Ltd | Lead-free solder and solder joint |
| CN1803381A (en) * | 2006-01-11 | 2006-07-19 | 黄守友 | Leadless soldering material and its preparation method |
| WO2007102588A1 (en) * | 2006-03-09 | 2007-09-13 | Nippon Steel Materials Co., Ltd. | Lead-free solder alloy, solder ball and electronic member, and lead-free solder alloy, solder ball and electronic member for automobile-mounted electronic member |
| CN101569965A (en) * | 2007-05-25 | 2009-11-04 | 韩国生产技术研究院 | Quaternary Pb-free solder composition incorporating Sn-Ag-Cu-In |
| CN102107339A (en) * | 2009-12-28 | 2011-06-29 | 深圳市亿铖达工业有限公司 | Low-silver lead-free solder alloy |
-
2011
- 2011-06-30 CN CN2011101820786A patent/CN102248319A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002307187A (en) * | 2001-02-09 | 2002-10-22 | Taiho Kogyo Co Ltd | Lead-free solder and solder joint |
| CN1803381A (en) * | 2006-01-11 | 2006-07-19 | 黄守友 | Leadless soldering material and its preparation method |
| WO2007102588A1 (en) * | 2006-03-09 | 2007-09-13 | Nippon Steel Materials Co., Ltd. | Lead-free solder alloy, solder ball and electronic member, and lead-free solder alloy, solder ball and electronic member for automobile-mounted electronic member |
| CN101569965A (en) * | 2007-05-25 | 2009-11-04 | 韩国生产技术研究院 | Quaternary Pb-free solder composition incorporating Sn-Ag-Cu-In |
| CN102107339A (en) * | 2009-12-28 | 2011-06-29 | 深圳市亿铖达工业有限公司 | Low-silver lead-free solder alloy |
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Application publication date: 20111123 |