CN102223774A - Method for manufacturing in mode forming film with metal surface - Google Patents
Method for manufacturing in mode forming film with metal surface Download PDFInfo
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- CN102223774A CN102223774A CN2010101510427A CN201010151042A CN102223774A CN 102223774 A CN102223774 A CN 102223774A CN 2010101510427 A CN2010101510427 A CN 2010101510427A CN 201010151042 A CN201010151042 A CN 201010151042A CN 102223774 A CN102223774 A CN 102223774A
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Abstract
A method for manufacturing an in mode forming film with a metal surface comprises the following steps: firstly, providing a metal plate layer which possesses a joint surface presetting at least one etching area; then, performing an etching operation on the etching area of the joint surface so that a plurality of depressed structures are inwardly formed on the etching area surface; after finishing etching the metal plate layer, ejecting plastic with an injection moulding pressure to the joint surface of the metal plate layer so that the plastic which is under an compression of the injection moulding pressure clads the depressed structures of the etching area; finally, bearing the metal plate layer after the plastic is solidified, wherein the solidified plastic forms a close bonding relationship with the depressed structures. Therefore, an adhesion layer doses not need to be additionally arranged between the metal plate layer and the ejected plastic. Manufacturing costs are saved and processing operations can be reduced during the making programs.
Description
Technical field
The present invention relates to a kind of method of making mould internal shaping film, particularly a kind of manufacturing has the method for the mould internal shaping film of metal surface.
Background technology
Microminiaturized and the lightening trend along with electronic product, many portable products are as notebook computer, individual mobile assistant, mobile phone etc., because of the demand that meets general masses is widely used.Except entity function, appearance design commercial also be considerable consideration.
The production of conventional plastic product is subject to the technology that plastics penetrate, and only can do monochromatic the ejaculation, lacks to change.If want to give pattern or other Spanish furnish, only can utilize the mode of printing or spraying that pattern is coated the casing surface to plastic product.Though utilize the higher general printing process of maturity, cost is low and processing is relatively easy, directly contacts with extraneous owing to be covered in the printing-ink on plastic product surface, when using the phenomenon that will cause color to peel off or wear and tear after a period of time, influences overall appearance.In addition, quite consuming time and operation is numerous and diverse owing to spray with various coating again after must be repeatedly in during the spraying forming the zone of institute's desire spraying if process with masking coating or shielding plate in the mode of spraying, be unfavorable for industrial large-scale manufacturing.In addition, the conventional spray paint process produces the spittle that contains plumbous class or other heavy metal in a large number, not only causes the waste of coating, more causes serious environmental to pollute.And when spraying coating material solidified or anti-spread coated paint, be easy to when especially handling bending position, often cause the situation of buildup because the difference of zones of different quantity for spray causes surface thickness inhomogeneous.
For addressing the above problem, industry is developed a series of in-mold decoration (In Mode Decoration, IMD) operation, comprised in-mold transfer printing (In Mold Roller, IMR), in-mold label (In Mold Label, IML) and the mould internal shaping (In Mold Forming, IMF) etc.Wherein, in-mold transfer printing (IMR) be with ink printing on the plastics carrier film that possesses release ability, treat that plastics penetrate after mutually combining with printing ink on this plastics carrying mould, can should carry mould and peel off, and make the extremely plastic product surface after the shaping of printing ink " transfer printing "; On the other hand, in-mold label (IML) and mould internal shaping (IMF) etc. then are to prepare a film earlier, this film be with ink printing in a cured layer, again a plastic layer is covered on this printing ink, the printing ink clamping is formed between this cured layer and this plastic layer, this film is attached on the plastic product after plastics penetrate to form, need not the plastics carrier film be peeled off as in-mold transfer printing (IMR) operation.
Though decoration technique inside mold can provide electronic product cosmetic variation to a certain degree, giving people's sense organ as a complete unit still only is plastic products.In order to make electronic product possess selection except the conventional plastic outward appearance, the dealer takes up to be electroplated on the plastic casing surface, the mode of sputter or thermal spraying forms metal surfaces such as a bronze medal, nickel, aluminium, titanium alloy at frosting, as U.S. US 6,045, No. 866 patents, No. the 515751st, TaiWan, China, M346244 number, M334131 patent etc.Though and can make the surface of conventional plastic shell present the metal sense by above-mentioned technology, after long-term the use, face coat still can peel off because of friction, appears frosting originally.Being can the strengthening surface metal structure, and industry further develops and the technology that metallic film directly is coated on the plastic casing surface, shown in No. 200934371 patent of TaiWan, China.This electronic installation has an at least one electronic component and a casing.Casing comprises a casing basic layer and a metallic film.This metallic film is integrally formed by an in-mold decoration operation and casing basic layer.Metallic film comprises that also a bonding coat is in order in conjunction with casing basic layer.Yet, the method need metallic film and and casing basic layer between be provided with a bonding coat.Because this metallic film and this casing basic layer adhere to different materials separately, the selection of bonding coat will determine whether this metallic film can firmly be coated in the key on casing surface, and certainly will increase manufacturing cost on production process.
Summary of the invention
Main purpose of the present invention is to make the electronic product outward appearance to present metal-like, and metal-surface strengthening is attached to the binding ability with electronic product casing.For achieving the above object, the invention provides the method that a kind of manufacturing has the mould internal shaping film of metal surface, comprise that step has:
A) provide a sheet-metal layers, this sheet-metal layers has the default at least one etching area in a composition surface;
B) impose the etching area of an etching work procedure on this composition surface,, make this etching area surface inwardly form a plurality of sunk structures through one first etching period;
C) with an injection pressure jet-out plastic in the composition surface of this sheet-metal layers, the compressing that these plastics are subjected to this injection pressure coats the sunk structure of this etching area; And
D) solidify these plastics to carry this sheet-metal layers, this solidifies and forms the fluid-tight engagement relation between back plastics and the sunk structure.
Wherein, before imposing an etching work procedure, have one the step of a protective layer in the non-etching area on this composition surface is set.So, can decide the pattern and the size of etching area according to protective layer set position and shape.This etching work procedure can select to impose the surface etching of mode chemical solution or plasma carry out to(for) this etching area.
In another embodiment of the present invention, then utilize the prolongation etching period to increase the etched degree of sheet-metal layers.In imposing the step of this etching work procedure, again through one second etching period, this etching area is etched fully, make this sheet-metal layers form an engraved structure in this etching area position.Wherein, be provided with an Anneta module in this engraved structure, this Anneta module can be home control network communication protocol module, Bluetooth transmission module or radio frequency transmission module.
Have the method for the mould internal shaping film of metal surface by manufacturing of the present invention, make that metal material can be applicable to allow the electronic product outward appearance present metal-like in in-mold decoration (IMD) technology.In addition, the etched a plurality of sunk structure that is subjected in the etching area of this sheet-metal layers is able to the plastics fluid-tight engagement emitted with the in-mold decoration operation.Therefore, in manufacture process, can save the setting of bonding coat, can reach again than the more firm engagement relationship of bonding coat is set.On production process, also can reduce production costs because of the step of saving the bonding coat setting.
Description of drawings
Fig. 1 is the steps flow chart schematic diagram of method one embodiment of the mould internal shaping film of manufacturing of the present invention with metal surface;
Fig. 2-1 is to Fig. 2-the 6th, and manufacturing of the present invention has the procedure of processing schematic diagram of method one embodiment of the mould internal shaping film of metal surface;
Fig. 3 is the sheet-metal layers cross-sectional view of another embodiment of method of the mould internal shaping film of manufacturing of the present invention with metal surface;
Fig. 4 is the finished product cross-sectional view of another embodiment of method of the mould internal shaping film of manufacturing of the present invention with metal surface;
Fig. 5 is the finished product perspective view of another embodiment of method of the mould internal shaping film of manufacturing of the present invention with metal surface.
Embodiment
Below in conjunction with specific embodiment and accompanying drawing thereof, technology contents of the present invention is described in further detail.
The present invention can be applicable to multiple in-mold decoration (In-Mold Decoration, IMD) in the operation, comprise in-mold transfer printing (In Mold Roller, IMR), in-mold label (In Mold Label, IML) and mould internal shaping (InMold Forming, IMF) etc., in-mold transfer printing (IMR) technology especially.
See also Fig. 1, it is the steps flow chart schematic diagram of one embodiment of the invention, as shown in the figure: the invention discloses the method that a kind of manufacturing has the mould internal shaping film of metal surface, comprise that step has:
A) provide sheet-metal layers (S10): this sheet-metal layers has the default at least one etching area in a composition surface;
B) impose etching work procedure (S20): the etching area on this composition surface is carried out etching work procedure,, make this etching area surface inwardly form a plurality of sunk structures through one first etching period;
C) jet-out plastic (S30): in the composition surface of this sheet-metal layers, the compressing that these plastics are subjected to this injection pressure coats the sunk structure of this etching area with an injection pressure jet-out plastic; And
D) hardened plastic (S40): solidify these plastics to carry this sheet-metal layers, this solidifies and forms the fluid-tight engagement relation between back plastics and the sunk structure.
Wherein, in step b) (S20), directly the etching area on this composition surface is carried out etching work procedure; Perhaps, can carry out step b) (S20) before, a protective layer is being set earlier behind the non-etching area on this composition surface, impose etching work procedure again in etching area.
For further understanding the fabrication schedule of the decorating film of the foregoing description, Fig. 2-1 is depicted as the procedure of processing schematic diagram of one embodiment of the invention to Fig. 2-6.At first, prepare a sheet-metal layers 10.The material of this sheet-metal layers 10 can be steel, iron, stainless steel, titanium alloy, aluminium alloy, magnesium alloy, nickel alloy or kirsite etc.This sheet-metal layers 10 has a composition surface 11 and a decorative cover 12, shown in Fig. 2-1.Default at least one etching area 111 and the place outside etching area 111 on this composition surface 11 are provided with a protective layer 13 on this composition surface 11.This protective layer 13 can surface printing mode be formed on the composition surface 11 of sheet-metal layers 10, shown in Fig. 2-2.
Afterwards, can carry out etching, the sheet-metal layers 10 that is provided with protective layer 13 is soaked in the etching chemistry solution composition surface 11.The sheet-metal layers 10 that does not have protective layer 13, just the etching area 111 on this composition surface 11 can react to each other with this etching chemistry solution.Treat that through after one first etching period, this etching area 111 is caved inward by the surface and forms a plurality of sunk structures 112, shown in Fig. 2-3.For stopping the lasting erosion of this etching chemistry solution to this sheet-metal layers 10, after finishing this etching, remove the etching chemistry solution and the protective layer 13 that are attached on this sheet-metal layers 10, the etching chemistry reaction is stopped.Do not limit etching mode in the present invention, above-mentioned just the mode of wet etching (wet etching) is carried out with chemical solution except using, also can use the mode of plasma etching dry ecthing just (dry etching) to realize.
To finish etched sheet-metal layers 10 and place an in-mold decoration shaping dies 20.This in-mold decoration shaping dies 20 includes the master mold portion 22 that a male model portion 21 and with injection moulding cast gate 211 supplies this sheet-metal layers 10 to be provided with.See also shown in Fig. 2-4, this male model portion 21 forms a shaping chamber 23 with these master mold portion 22 combination backs, and this shaping chamber 23 is interconnected with this injection moulding cast gate 211.See also shown in Fig. 2-5, this injection moulding cast gate 211, and is filled in this shaping chamber 23 in the composition surface of this sheet-metal layers 10 with an injection pressure jet-out plastic 30 again.These plastics 30 can be metal or plastic material.Metal material can be aluminium, magnesium, zinc or its alloy etc.Plastic material then can be polyethylene terephthalate (polyethyleneterephthalate, PET), acrylonitrile-butadiene-phenylethylene copolymer (acrylonitrile butadienestyrene, ABS), Merlon (polycarbonate, PC), polyvinyl chloride (polyvinyl chloride, PVC) or polypropylene (polypropylene, PP) etc.The pushing that these plastics 30 are subjected to this injection pressure enters the etching area 111 on this composition surface 11, and coats the sunk structure 112 that is produced after the etching.At last, treat that this plastics 30 solidify after, the formation fluid-tight engagement concerns between these plastics 30 and the institute sunk structure that coats 112, shown in Fig. 2-6.
In another embodiment of the present invention, carrying out etched the time, if the etching area on this composition surface 11 111 is understood the time that reacts to each other with this etching chemistry solution, except originally being enough to form first etching period of sunk structure 112, through one second etching period, the sheet-metal layers 10 of this etching area 111 is etched fully more again.Like this, this sheet-metal layers 10 forms an engraved structure 113 in these etching area 111 positions, as shown in Figure 3.And can be provided with in this hollow out zone 113 behind the Anneta module 14 again through as the above-mentioned in-mold decoration operation of carrying out, plastics 30 are filled in this hollow out zone 113, and fix the position of this Anneta module 14 in this hollow out zone 113, as Fig. 4, shown in Figure 5.This Anneta module 14 can be home control network communication protocol module, Bluetooth transmission module or radio frequency transmission module etc.
In sum, manufacturing of the present invention has the method for the mould internal shaping film of metal surface, make the surface of electronic product be possessed the metal sense, and make and need not be bonded with each other by setting up bonding coat between this sheet-metal layers and the plastics, on production process, can reduce production costs because of the step of saving the bonding coat setting.
Below the present invention is described in detail, but the above only is a preferred embodiment of the present invention, can not limit protection scope of the present invention.Be that all equalizations of doing according to the disclosure of invention change and modify etc., all should be covered by in the scope of the present invention.
Claims (9)
1. a manufacturing has the method for the mould internal shaping film of metal surface, it is characterized in that comprising that step has:
One sheet-metal layers (10) is provided, and this sheet-metal layers (10) has the default at least one etching area (111) in a composition surface (11);
Impose the etching area (111) of an etching work procedure on this composition surface (11),, make this etching area (111) surface inwardly form a plurality of sunk structures (112) through one first etching period;
With the composition surface (11) of an injection pressure jet-out plastic (30) in this sheet-metal layers (10), the compressing that these plastics (30) are subjected to this injection pressure coats the sunk structure (112) of this etching area (111); And
Solidify these plastics (30) to carry this sheet-metal layers (10), this solidifies and forms the fluid-tight engagement relation between back plastics (30) and the sunk structure (112).
2. manufacturing as claimed in claim 1 has the method for the mould internal shaping film of metal surface, it is characterized in that, before imposing an etching work procedure, has one the step of a protective layer in the non-etching area on this composition surface is set.
3. manufacturing as claimed in claim 1 has the method for the mould internal shaping film of metal surface, it is characterized in that, after imposing an etching work procedure, has the step of this etching work procedure of removal.
4. manufacturing as claimed in claim 1 has the method for the mould internal shaping film of metal surface, it is characterized in that, this etching work procedure is to impose the surface etching of mode chemical solution carries out to(for) this etching area.
5. manufacturing as claimed in claim 1 has the method for the mould internal shaping film of metal surface, it is characterized in that, this etching work procedure is to impose plasma carries out surface etching to this etching area mode.
6. manufacturing as claimed in claim 1 has the method for the mould internal shaping film of metal surface, it is characterized in that, in imposing the step of this etching work procedure, again through one second etching period, this etching area is etched fully, makes this sheet-metal layers form an engraved structure in this etching area position.
7. manufacturing as claimed in claim 6 has the method for the mould internal shaping film of metal surface, it is characterized in that, is provided with an Anneta module in this engraved structure.
8. manufacturing as claimed in claim 7 has the method for the mould internal shaping film of metal surface, it is characterized in that, this Anneta module is selected from the group that is made up of home control network communication protocol module, Bluetooth transmission module, radio frequency transmission module.
9. manufacturing as claimed in claim 1 has the method for the mould internal shaping film of metal surface, it is characterized in that the material of this sheet-metal layers is selected from the group that is made up of steel, iron, stainless steel, titanium alloy, aluminium alloy, magnesium alloy, nickel alloy and kirsite.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010101510427A CN102223774A (en) | 2010-04-19 | 2010-04-19 | Method for manufacturing in mode forming film with metal surface |
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| CN2010101510427A CN102223774A (en) | 2010-04-19 | 2010-04-19 | Method for manufacturing in mode forming film with metal surface |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103963214A (en) * | 2013-02-05 | 2014-08-06 | 台北科技大学 | Method for bonding aluminum-containing base material and plastic |
| CN105773090A (en) * | 2014-12-24 | 2016-07-20 | 宇龙计算机通信科技(深圳)有限公司 | Method for generating gridding pattern products and foundation part with gridding patterns |
| WO2019000773A1 (en) * | 2017-06-26 | 2019-01-03 | 马培中 | Circuit board with insulating carrier made of plastics by injection moulding |
| CN109383098A (en) * | 2017-08-08 | 2019-02-26 | 浙江兆奕科技有限公司 | A kind of imitative anodic process moulding and its processing technology suitable for cell phone rear cover |
| CN109732845A (en) * | 2018-12-26 | 2019-05-10 | 美智光电科技有限公司 | Manufacturing method, light source board and the light source assembly of light source board |
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| TW200743578A (en) * | 2006-05-25 | 2007-12-01 | Laminate Industry Co Ltd | Manufacturing method of laminated metal plate and laminated metal plate manufactured by the method |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103963214A (en) * | 2013-02-05 | 2014-08-06 | 台北科技大学 | Method for bonding aluminum-containing base material and plastic |
| CN105773090A (en) * | 2014-12-24 | 2016-07-20 | 宇龙计算机通信科技(深圳)有限公司 | Method for generating gridding pattern products and foundation part with gridding patterns |
| WO2019000773A1 (en) * | 2017-06-26 | 2019-01-03 | 马培中 | Circuit board with insulating carrier made of plastics by injection moulding |
| CN109383098A (en) * | 2017-08-08 | 2019-02-26 | 浙江兆奕科技有限公司 | A kind of imitative anodic process moulding and its processing technology suitable for cell phone rear cover |
| CN109732845A (en) * | 2018-12-26 | 2019-05-10 | 美智光电科技有限公司 | Manufacturing method, light source board and the light source assembly of light source board |
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Application publication date: 20111019 |