CN205408285U - PCB back drilling pore structure - Google Patents
PCB back drilling pore structure Download PDFInfo
- Publication number
- CN205408285U CN205408285U CN201620191334.6U CN201620191334U CN205408285U CN 205408285 U CN205408285 U CN 205408285U CN 201620191334 U CN201620191334 U CN 201620191334U CN 205408285 U CN205408285 U CN 205408285U
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- China
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- hole
- back drilling
- back drill
- pcb
- pore structure
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- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The utility model discloses a PCB back drilling pore structure, including multi -storied printing board, be equipped with the through -hole on the printing board, the pore wall of through -hole has plated the first metal layer, and the appointed degree of depth of one side face down back drilling that the through -hole is located this printing board forms the back drilling hole, the diameter of the diameter more than or equal to through -hole in back drilling hole, insulating material is expired in the downthehole packing of through -hole and back drilling, prints the board and is located back drilling hole surface and has plated one deck second metal level. This PCB back drilling pore structure adopts plated -through hole back drilling technique, realizes interconnection between the random layer with the through -hole, has solved the problem of the big depth of the unable processing of traditional radium -shine technology than the blind hole, the back drilling of elder generation is consent, surface metal chemical industry skill more again, need not during the wiring to avoid the back drilling hole, has improved the space utilization on printing board surface, the back drilling hole need not to avoid, can great degree shorten the wire length, increase the width of wire, reduce the signal transmission loss, the mode that adopts the blind hole of big depth ratio the through -hole realizes, can reduce the through hole of big depth when the blind hole copper facing risk that harmfully became invalid.
Description
Technical field
This utility model relates to a kind of PCB back drill pore structure.
Background technology
In PCB manufacture process, need through hole to realize the connection between each internal layer circuit plate, through hole leads to into and is processed to form by rig, and its requirement on machining accuracy is high, and also needs to heavy copper, plating etc. after being drilled to through hole and process, form conductive layer in through-holes, thus the connection realized between each internal layer circuit, but the plated-through-hole silver of some pcb boards needs partially ON, causes turning back of signal, cause the phenomenons such as reflection that signal transmits, scattering, delay, act on behalf of " distortion " problem to signal.
For preventing the generation of above-mentioned phenomenon, by needs, PCB is carried out the process of back drill hole, bore to fall not play the through hole section of any connection or transmitting effect, namely in the plated-through-hole of small diameter, the signals layer that part does not connect is removed by larger-diameter drill, to reduce the loss of signal.
But above-mentioned existing PCB back drill pore structure, when printed board copper foil surface circuit etching, it is necessary to evade back drill aperture, waste copper foil surface space；The blind hole relatively larger for depth cannot be processed by Radium art；Signal transmission distance strengthens, and signal intensity dies down.
Summary of the invention
In order to overcome drawbacks described above, this utility model provides a kind of PCB back drill pore structure, solves that back drill vent surface Copper Foil space availability ratio in prior art is low, signal transmission is more weak, and the problem such as live width line-spacing difficult design.
This utility model be the technical scheme is that a kind of PCB back drill pore structure to solve its technical problem, printed board including multilamellar, this printed board is provided with through hole, the hole wall of this through hole is coated with the first metal layer, this through hole is positioned at the downward back drill designated depth of one side of this printed board and forms back drill hole, and the diameter in this back drill hole is be more than or equal to the diameter of this through hole, fill full insulant in described through hole and back drill hole, and be positioned at described back drill hole surface in this printed board and be coated with one layer of second metal level.
As further improvement of the utility model, described the first metal layer and the second metal level are layers of copper, and described insulant is resin.
The beneficial effects of the utility model are: 1. adopt plated-through hole back drill technology, it is possible to realize the interconnection of any interlayer with through hole, solve tradition Radium art and cannot process the great depth problem than blind hole.2. adopt first back drill consent again, again surface metal metallization processes, without evading back drill hole during wiring, improve the space availability ratio of printing board surface.3., without evading back drill hole, the length of wire can be shortened largely, strengthen the width of wire, reduce signal transmission attenuation.4. adopt the mode of through hole to realize the blind hole of great depth ratio, it is possible to reduce great depth than blind hole copper facing time the bad failure risk of perforation.
Accompanying drawing explanation
Fig. 1 is structural representation after plated-through-hole described in embodiment；
Fig. 2 is structural representation behind back drill hole described in embodiment；
Fig. 3 is structural representation after consent described in embodiment；
Fig. 4 is structural representation after surface metalation；
Fig. 5 is the PCB construction schematic diagram without back of the body drilling design；
Fig. 6 is the structural representation after adopting PCB back drill hole of the present invention.
In conjunction with accompanying drawing, make the following instructions:
1 printed board 2 through hole
3 the first metal layer 4 back drill holes
5 insulant 6 second metal levels
7 circuits
Detailed description of the invention
Below in conjunction with accompanying drawing, a preferred embodiment of the present utility model is elaborated.But protection domain of the present utility model is not limited to following embodiment, the simple equivalence namely in every case made with this utility model claim and description changes and modifies, and all still belongs within this utility model patent covering scope.
Consult Fig. 4, for a kind of PCB back drill pore structure, printed board 1 including multilamellar, this printed board is provided with through hole 2, the hole wall of this through hole is coated with the first metal layer 3, and this through hole is positioned at the downward back drill designated depth of one side of this printed board and forms back drill hole 4, and the diameter in this back drill hole is be more than or equal to the diameter of this through hole, it is characterized in that: described through hole and fill full insulant 5 in back drill hole, and be positioned at described back drill hole surface in this printed board and be coated with one layer of second metal level 6.Wherein, described the first metal layer and the second metal level are layers of copper, and described insulant is resin.
The processing method of the structure in above-mentioned PCB back drill hole, comprises the following steps:
1. printed board 1 and the consent insulant of multilamellar are prepared；
2. specify position holes drilled through 2 in printed board, and hole wall is plated the first metal layer 3, referring to Fig. 1；
3. facing down drilled designated depth from described through hole one be more than or equal to the brill nozzle of described through-hole diameter, form back drill hole 4, referring to Fig. 2, the layer that need not turn on this through hole is disconnected by this designated depth with the first metal layer on hole wall, it is achieved blind hole effect；
4. back drill hole and through hole are filled with insulant full, solidify rear surface and grind smooth, referring to Fig. 3；
5. it is positioned at back drill hole surface part in printed board and plates the second metal level 6, referring to Fig. 4.
Wherein, described the first metal layer and the second metal level are layers of copper, and described insulant is resin.
Fig. 5 is the PCB construction schematic diagram without back of the body drilling design, and printing board surface needs when connecting up 7 to evade back drill aperture.And Fig. 6 is the structural representation after adopting PCB back drill hole of the present invention, can arbitrarily devised circuit 7 in back drill aperture.
Thus, the present invention 1. adopts plated-through hole back drill technology, it is possible to realize the interconnection of any interlayer with through hole, solves tradition Radium art and cannot process the great depth problem than blind hole.2. adopt first back drill consent again, again surface metal metallization processes, without evading back drill hole during wiring, improve the space availability ratio of printing board surface.3., without evading back drill hole, the length of wire can be shortened largely, strengthen the width of wire, reduce signal transmission attenuation.4. adopt the mode of through hole to realize the blind hole of great depth ratio, it is possible to reduce great depth than blind hole copper facing time the bad failure risk of perforation.
Claims (2)
1. a PCB back drill pore structure, printed board (1) including multilamellar, this printed board is provided with through hole (2), the hole wall of this through hole is coated with the first metal layer (3), this through hole is positioned at the downward back drill designated depth of one side of this printed board and forms back drill hole (4), and the diameter in this back drill hole is be more than or equal to the diameter of this through hole, it is characterized in that: described through hole and fill full insulant (5) in back drill hole, and be positioned at described back drill hole surface in this printed board and be coated with one layer of second metal level (6).
2. PCB back drill pore structure according to claim 1, it is characterised in that: described the first metal layer and the second metal level are layers of copper, and described insulant is resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620191334.6U CN205408285U (en) | 2016-03-14 | 2016-03-14 | PCB back drilling pore structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620191334.6U CN205408285U (en) | 2016-03-14 | 2016-03-14 | PCB back drilling pore structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205408285U true CN205408285U (en) | 2016-07-27 |
Family
ID=56422933
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620191334.6U Active CN205408285U (en) | 2016-03-14 | 2016-03-14 | PCB back drilling pore structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205408285U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105578748A (en) * | 2016-03-14 | 2016-05-11 | 江苏普诺威电子股份有限公司 | PCB backdrilling hole structure and processing method thereof |
| CN114340223A (en) * | 2021-12-08 | 2022-04-12 | 江苏普诺威电子股份有限公司 | Manufacturing method of multilayer board based on high aspect ratio selective semiconductor through hole |
-
2016
- 2016-03-14 CN CN201620191334.6U patent/CN205408285U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105578748A (en) * | 2016-03-14 | 2016-05-11 | 江苏普诺威电子股份有限公司 | PCB backdrilling hole structure and processing method thereof |
| CN114340223A (en) * | 2021-12-08 | 2022-04-12 | 江苏普诺威电子股份有限公司 | Manufacturing method of multilayer board based on high aspect ratio selective semiconductor through hole |
| CN114340223B (en) * | 2021-12-08 | 2023-11-14 | 江苏普诺威电子股份有限公司 | Manufacturing method of high aspect ratio-based selective semi-conductive hole multilayer board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |