CN102216849B - 光学成像写入*** - Google Patents
光学成像写入*** Download PDFInfo
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- CN102216849B CN102216849B CN2009801374589A CN200980137458A CN102216849B CN 102216849 B CN102216849 B CN 102216849B CN 2009801374589 A CN2009801374589 A CN 2009801374589A CN 200980137458 A CN200980137458 A CN 200980137458A CN 102216849 B CN102216849 B CN 102216849B
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- photomask data
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Images
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B27/00—Photographic printing apparatus
- G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
- G03B27/52—Details
- G03B27/62—Holders for the original
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70283—Mask effects on the imaging process
- G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/703—Non-planar pattern areas or non-planar masks, e.g. curved masks or substrates
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
Claims (27)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US9949508P | 2008-09-23 | 2008-09-23 | |
US61/099,495 | 2008-09-23 | ||
US12/337,504 | 2008-12-17 | ||
US12/337,504 US8253923B1 (en) | 2008-09-23 | 2008-12-17 | Optical imaging writer system |
PCT/US2009/056740 WO2010036524A1 (en) | 2008-09-23 | 2009-09-11 | An optical imaging writer system |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102216849A CN102216849A (zh) | 2011-10-12 |
CN102216849B true CN102216849B (zh) | 2013-06-19 |
Family
ID=42060043
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009801374589A Active CN102216849B (zh) | 2008-09-23 | 2009-09-11 | 光学成像写入*** |
Country Status (3)
Country | Link |
---|---|
US (2) | US8253923B1 (zh) |
CN (1) | CN102216849B (zh) |
WO (1) | WO2010036524A1 (zh) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8253923B1 (en) * | 2008-09-23 | 2012-08-28 | Pinebrook Imaging Technology, Ltd. | Optical imaging writer system |
US9405203B2 (en) | 2008-09-23 | 2016-08-02 | Applied Materials, Inc. | Pixel blending for multiple charged-particle beam lithography |
US8670106B2 (en) * | 2008-09-23 | 2014-03-11 | Pinebrook Imaging, Inc. | Optical imaging writer system |
US9025136B2 (en) * | 2008-09-23 | 2015-05-05 | Applied Materials, Inc. | System and method for manufacturing three dimensional integrated circuits |
US9507271B1 (en) * | 2008-12-17 | 2016-11-29 | Applied Materials, Inc. | System and method for manufacturing multiple light emitting diodes in parallel |
US20130207544A1 (en) | 2011-09-30 | 2013-08-15 | Pinebrook Imaging Technology, Ltd. | Illumination system |
WO2014033118A1 (en) * | 2012-08-27 | 2014-03-06 | Micronic Mydata AB | Maskless writing in different focal planes |
US10149390B2 (en) | 2012-08-27 | 2018-12-04 | Mycronic AB | Maskless writing of a workpiece using a plurality of exposures having different focal planes using multiple DMDs |
JP6212299B2 (ja) * | 2013-06-26 | 2017-10-11 | キヤノン株式会社 | ブランキング装置、描画装置、および物品の製造方法 |
WO2016018598A1 (en) * | 2014-08-01 | 2016-02-04 | Applied Materials, Inc. | Digital grey tone lithography for 3d pattern formation |
US9927723B2 (en) | 2015-03-24 | 2018-03-27 | Applied Materials, Inc. | Apparatus and methods for on-the-fly digital exposure image data modification |
WO2017011188A1 (en) * | 2015-07-13 | 2017-01-19 | Applied Materials, Inc. | Quarter wave light splitting |
EP3282254B1 (en) * | 2016-08-12 | 2019-07-31 | IST Austria (Institute of Science and Technology Austria) | Method of producing a device for guided cell activation |
TWI581211B (zh) * | 2016-11-18 | 2017-05-01 | 財團法人工業技術研究院 | 影像融合裝置及其方法 |
ES2692818B2 (es) * | 2017-06-05 | 2019-11-28 | Univ Valencia Politecnica | Sintesis de la zeolita beta en su forma nanocristalina, procedimiento de sintesis y su uso en aplicaciones cataliticas |
Citations (3)
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US6470489B1 (en) * | 1997-09-17 | 2002-10-22 | Numerical Technologies, Inc. | Design rule checking system and method |
US6717650B2 (en) * | 2002-05-01 | 2004-04-06 | Anvik Corporation | Maskless lithography with sub-pixel resolution |
CN1695076A (zh) * | 2002-08-24 | 2005-11-09 | 无掩模平版印刷公司 | 连续地直接写的光刻技术 |
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US5416616A (en) | 1990-04-06 | 1995-05-16 | University Of Southern California | Incoherent/coherent readout of double angularly multiplexed volume holographic optical elements |
EP0527166B1 (de) | 1990-05-02 | 1995-06-14 | Fraunhofer-Gesellschaft Zur Förderung Der Angewandten Forschung E.V. | Belichtungsvorrichtung |
WO1993009472A1 (de) | 1991-10-30 | 1993-05-13 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Belichtungsvorrichtung |
JPH0770470B2 (ja) | 1991-10-30 | 1995-07-31 | フラウンホファー・ゲゼルシャフト・ツール・フォルデルング・デル・アンゲバンテン・フォルシュング・アインゲトラーゲネル・フェライン | 照射装置 |
JP3384068B2 (ja) | 1993-12-22 | 2003-03-10 | 株式会社ニコン | 走査型露光装置 |
US6312134B1 (en) | 1996-07-25 | 2001-11-06 | Anvik Corporation | Seamless, maskless lithography system using spatial light modulator |
US5850218A (en) | 1997-02-19 | 1998-12-15 | Time Warner Entertainment Company L.P. | Inter-active program guide with default selection control |
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US8395752B2 (en) | 2008-09-23 | 2013-03-12 | Pinebrook Imaging Technology, Ltd. | Optical imaging writer system |
US8253923B1 (en) * | 2008-09-23 | 2012-08-28 | Pinebrook Imaging Technology, Ltd. | Optical imaging writer system |
-
2008
- 2008-12-17 US US12/337,504 patent/US8253923B1/en active Active
-
2009
- 2009-09-11 CN CN2009801374589A patent/CN102216849B/zh active Active
- 2009-09-11 WO PCT/US2009/056740 patent/WO2010036524A1/en active Application Filing
-
2012
- 2012-08-16 US US13/587,773 patent/US9158190B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US6470489B1 (en) * | 1997-09-17 | 2002-10-22 | Numerical Technologies, Inc. | Design rule checking system and method |
US6717650B2 (en) * | 2002-05-01 | 2004-04-06 | Anvik Corporation | Maskless lithography with sub-pixel resolution |
CN1695076A (zh) * | 2002-08-24 | 2005-11-09 | 无掩模平版印刷公司 | 连续地直接写的光刻技术 |
Also Published As
Publication number | Publication date |
---|---|
US9158190B2 (en) | 2015-10-13 |
WO2010036524A1 (en) | 2010-04-01 |
US20120307225A1 (en) | 2012-12-06 |
US8253923B1 (en) | 2012-08-28 |
CN102216849A (zh) | 2011-10-12 |
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Effective date of registration: 20140922 Address after: American California Patentee after: PINEBROOK IMAGING SYSTEMS Corp. Address before: Chinese Taiwan Taoyuan City Patentee before: Paiyinbuluke Imaging Technology Co.,Ltd. Effective date of registration: 20140922 Address after: Chinese Taiwan Taoyuan City Patentee after: Paiyinbuluke Imaging Technology Co.,Ltd. Address before: California, USA Patentee before: PINEBROOK IMAGING SYSTEMS Corp. |
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