CN102184001A - Thermal insulation structure - Google Patents
Thermal insulation structure Download PDFInfo
- Publication number
- CN102184001A CN102184001A CN2009103091798A CN200910309179A CN102184001A CN 102184001 A CN102184001 A CN 102184001A CN 2009103091798 A CN2009103091798 A CN 2009103091798A CN 200910309179 A CN200910309179 A CN 200910309179A CN 102184001 A CN102184001 A CN 102184001A
- Authority
- CN
- China
- Prior art keywords
- heat insulation
- temperature
- insulation structural
- heat
- electronic installation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention provides a thermal insulation structure. The thermal insulation structure is arranged on the surface of a shell of an electronic device; the thermal insulation structure comprises a plurality of parallel tubular structures which extend in an extension direction; each tubular structure comprises at least one tube wall which encircles to form a hollow area; the tubular structures change thermal resistance distribution to change the proportion of heat transfer in the different directions, so that the area of a hot spot region is enlarged relatively, the maximum temperature of the surface is reduced, and the high-temperature hot spot region cannot be formed on the outer surface of a heating element of the electronic device.
Description
Technical field
The present invention is heat insulation relevant with electronic installation, particularly about being arranged at the heat insulation structural on electronic installation surface.
Background technology
Notebook computer (NotebookComputer) is called laptop computer (Laptop Computer) again, and is available when being seated for a user, and it is placed in above-knee use.
Notebook computer possesses little thickness usually, so the heat generating component of its inside, and the high heat that for example central processing unit sent conducts to the surface easily apace.Particularly in order to strengthen the radiating effect of central processing unit, the also bottom surfaces that utilize notebook computer of central processing unit or its heating radiator (for example heat pipe) as heat conduction path, so that the heat conduction path of another heat radiation to be provided outside air cooling fan more.
Yet the operational temperature of existing central processing unit often surpasses more than 60 degree Celsius, even arrives 70-80 degree Celsius.Its heat partly sees through after the bottom surface conduction of notebook computer, because the thickness of notebook computer casing is thinner relatively, so heat can promptly pass shell and arrive the bottom surface, and forms a focus corresponding to central processing unit (Hot Spot) zone in the bottom surface.This temperature arrives stable state (Steady-State) afterwards in temperature variation, still has the high temperature that surpasses 50 degree Celsius, surpasses the temperature that human body can bear, and causes the user can't continue placing notebook computer in above-knee use.
After in the bottom surface of notebook computer one heat insulating mattress being set, can temporarily block high temperature, continue computing machine is put in above-knee use in order to the user.Yet heat insulating mattress mainly utilizes the characteristic of high thermal resistance, delays the conduction of temperature, makes the user can not experience the high temperature of hot spot region immediately.But heat insulation electricity is not that heat is disappeared, but delays heat transferred speed.Notebook computer makes heat insulating mattress also can be heated to an equilibrium temperature through after using for a long time, and its Temperature Distribution also can be approximate with the Temperature Distribution of notebook computer bottom surface.That is, after long-time the use, the hot spot region of high temperature can appear on the heat insulating mattress equally, and cause the user can't continue placing notebook computer in above-knee use.Therefore, the use of notebook computer on the practice still must searching can be furnished the plane of notebook computer on exceeding the time limit, can't be in the problem of above-knee use to avoid aforementioned high temperature hotspot zone to cause.
Summary of the invention
In view of the above problems, the present invention proposes a kind of heat insulation structural, in order to improve the Temperature Distribution on electronic installation surface, avoids forming the high temperature hotspot zone.
The present invention proposes a kind of heat insulation structural, is arranged at the case surface of electronic installation.Heat insulation structural comprises several tubular structures that is arranged in parallel, and extends along a bearing of trend respectively.Respectively this tubular structure has at least one tube wall, around forming a hollow region.Tubular structure changes thermal resistance and distributes, and changes heat and in the ratio of different directions transmission the hot spot region area is enlarged relatively, and reduce the maximum temperature of its outer plate surfaces.
The present invention sees through the composition of tubular structure, changes thermal resistance and distributes, thereby improve temperature distribution state, but not merely intercept temperature transfer with thermal resistance.Therefore, the present invention still has comparatively even Temperature Distribution after the temperature calibration arrives stable state, avoids the high temperature hotspot zone to form.
Description of drawings
Fig. 1 is for seeing stereographic map outside the electronic installation of using the embodiment of the invention.
Fig. 2 is another visual angle stereoscopic figure of the electronic installation of the application embodiment of the invention.
Fig. 3 is the partial enlarged drawing of Fig. 2.
Fig. 4 is the diagrammatic cross-section of the electronic installation of the application embodiment of the invention.
Fig. 5 is that the transient temperature of electronic installation bottom surface distributes.
Fig. 6 is that the steady temperature of electronic installation bottom surface distributes.
Fig. 7 is that the transient temperature of electronic installation bottom surface additional insulation pad distributes.
Fig. 8 is that the steady temperature of electronic installation bottom surface additional insulation pad distributes.
Fig. 9 distributes for the transient temperature of the additional embodiment of the invention in electronic installation bottom surface.
Figure 10 distributes for the steady temperature of the additional embodiment of the invention in electronic installation bottom surface.
Figure 11 is for seeing stereographic map outside the electronic installation of using another embodiment of the present invention.
Embodiment
See also Fig. 1, Fig. 2, with shown in Figure 3, a kind of heat insulation structural 100 that is disclosed by first embodiment of the invention, be arranged at shell 201 outside the electronic installation 200, with stable state (Steady-State) Temperature Distribution of improving electronic installation 200 surfaces, eliminate focus (Hot Spot) zone because of heat generating component produced.Aforementioned electronic installation 200 can be a notebook computer, and heat insulation structural 100 is arranged at shell 201 bottom surfaces outside the electronic installation 100, that is the bottom of notebook computer.Heat insulation structural 100 can be eliminated the notebook computer bottom because of the hot spot region that central processing unit caused, and makes the steady temperature of notebook computer bottom distribute more even.
Consult Fig. 1, Fig. 2, Fig. 3 again, with shown in Figure 4, heat insulation structural 100 comprises an outside plate 110, an inner panel 120 and attached several are arranged at spacer block 130 between outside plate 110 and the inner panel 120.Inner panel 120 is arranged at shell 201 surfaces outside the electronic installation 200, in order to the heat of reception from electronic installation 200 inside, and heat is transmitted in inner panel 120.Spacer block 130 is arranged on the inner panel 120, and each spacer block 130 extends (being one of electronic installation 20 y direction X among the figure) along a bearing of trend parallel to each other, and the adjacent spacing distance of each spacer block difference.Outside plate 110 is arranged on the spacer block 130, sees through the isolation of each spacer block 130, forms the plural tubular structure 140 that is arranged in parallel between outside plate 110 and the inner panel 120.That is spacer block 130, outside plate 110 and inner panel 120 make tubular structure 140 have at least one tube wall around the tube wall that forms tubular structure 140, and around formation one hollow region, and tubular structure 140 extends along aforementioned y direction X.
Consult Fig. 5 and shown in Figure 6, be the Temperature Distribution of electronic installation 200 bottom surfaces, mark A place is the heat generating component position, for example central processor among the notebook computer.
Instantaneous (transient-state) Temperature Distribution that is measured when Figure 5 shows that firm start, the temperature that heat generating component produced only influences the temperature arround the mark A place by a small margin, though form a hot spot region, but the temperature of this hot spot region is still approaching with other regional temperature, makes the bottom surface temperature between 36.09-39.63 degree Celsius.
Figure 6 shows that notebook computer after start a period of time, Temperature Distribution presents the Temperature Distribution of stable state.Form a high temperature hotspot zone in mark A place, that is the high temperature hotspot zone is just corresponding to heat generating component, its temperature reaches 53.21.Temperature is outwards successively decreased with higher variable gradient again, is 45.03-47.70 degree Celsius at the bottom surface periphery regional temperature, with focus the bigger temperature difference (5.51-8.18) is arranged.That is the heat that heat generating component sends concentrates on the hot spot region, and forms the zone of a relatively-high temperature.That is after the user used a period of time, the zone of central processing unit or heat generating component correspondence still can arrive higher temperature, forms a high temperature hotspot, made that the user can't continue notebook computer is positioned over above-knee use.
Consult Fig. 7 and shown in Figure 8, be the Temperature Distribution of notebook computer bottom surface, wherein the notebook computer bottom surface pastes a heat insulating mattress, and heat insulating mattress is with high thermal resistivity material institute processing procedure, for example PVC.
The transient temperature that is measured when Figure 7 shows that firm start distributes, and the temperature that heat generating component produced only influences the temperature at mark A place by a small margin.The temperature in actual hot spot zone is still approaching with other regional temperature, between the 37.09-39.84 degree.
Figure 8 shows that notebook computer after start a period of time, Temperature Distribution presents the Temperature Distribution of stable state.Form a high temperature hotspot zone in mark A place, just corresponding to heat generating component, its temperature reaches 51.6 degree Celsius.Temperature is outwards successively decreased with higher variable gradient again, is 46.72 degree Celsius in the bottom surface periphery temperature, still spends above 5 with the temperature difference of focus.That is, paste heat insulating mattress and only delayed heat transferred speed, use a period of time, Temperature Distribution is presented after the steady-state distribution at notebook computer, the zone of central processing unit or focus correspondence still can arrive higher temperature, makes that the user can't continue notebook computer is positioned over above-knee use.Particularly after Temperature Distribution arrived stable state, heat insulating mattress had or not the distribution that does not influence temperature.
Consult Fig. 9 and shown in Figure 10, be the Temperature Distribution of notebook computer bottom surface, wherein the notebook computer bottom surface pastes the heat insulation structural 100 that a present invention is disclosed.
The transient temperature that is measured when Figure 9 shows that firm start distributes, and the temperature that heat generating component produced only influences the temperature at mark A place by a small margin, and the temperature in actual hot spot zone is still approaching with other regional temperature, between the 37.65-37.15 degree.
Figure 10 shows that notebook computer after start a period of time, Temperature Distribution presents the Temperature Distribution of stable state.Shown in scheming upward, isotherm is subjected to the tubular structure influence, reforming phenomena appears in X in y direction, and isotherm distributes thick and fast, reduce thermograde, make heat not concentrate on the heat generating component position, but present average Temperature Distribution that particularly the hot spot region total area enlarges but the temperature reduction.That is, under the situation that thermal value is fixed,, therefore also make the maximum temperature of hot spot region reduce because heat insulation structural makes Temperature Distribution comparatively average, be about 49.07 degree Celsius, be about Celsius 44.34 in the bottom surface periphery temperature and spend.Though the temperature difference of the highest temperature and lowest temperature still is about 5 degree, but because Temperature Distribution is more average, make spread heat plate 110 outside heat insulation structural, so maximum temperature drops to below 50 degree Celsius, help the user and continue to place notebook computer in above-knee use.
In addition, tubular structure 140 is moderately air feed stream circulation also, takes away the part heat, uses and reduces the heat that is passed to outside plate 110, makes the medial temperature of outside plate be lower than the temperature that does not add heat insulation structural or add solid heat insulating mattress.
Heat insulation structural 100 can be an additional mechanism providing additional operation, also can be shell 201 parts outside the electronic installation 200, reduces the needed operation of assembling.Plate 110, inner panel 120 and spacer block 130 can be all or part of being integrally formed on the shell 201 outside aforementioned, and for example inner panel 120 is integrally formed in shell 201 (or inner panel 120 forms a part of at least shell 201), spacer block 130 is integrally formed in inner panel 120 or outside plate 110 is one of the forming with spacer block 130.In addition, heat insulation structural 200 is mainly concentrated the problem that forms focus in order to reduce heat, does not therefore also need intactly to be covered in the bottom surface of electronic installation 200, only need be provided with at the zone at heat generating component place to get final product.
Consult shown in Figure 11, for inventing another embodiment, wherein outside this electronic installation 200 on shell 201 end faces (or dorsal part of display screen) in regional area heat insulation structural 100 (be formed at Zone Full also can) is set, and heat insulation structural 100 is integrally formed in shell 201 outside the electronic installation 200 (or dorsal part of display screen), several tubular structures 140 to be arranged in parallel in formation extend along y direction X.Wherein, tubular structure 140 does not need for isometric, and can change the length of each tubular structure 140 according to demand, is covered in the heat generating component region and gets final product.And except the end face of electronic installation, bottom surface, tubular structure 100 also can be set at putting in the palm district 202 of electronic installation 200 among Fig. 1.
The bearing of trend of heat insulation structural 100 of the present invention must not be defined as the y direction X of this electronic installation 200, and this bearing of trend also may be defined as the X direction Z of this electronic installation 200, or is defined as this bearing of trend and this y direction X and has an acute angle and all can.
Claims (10)
1. a heat insulation structural is arranged at shell outside the electronic installation, it is characterized in that, this heat insulation structural comprises
The tubular structure that several are arranged in parallel extend along a bearing of trend, and respectively this tubular structure has at least one tube wall, around forming a hollow region.
2. the heat insulation structural according to claim 1 is characterized in that, comprises:
Several spacer blocks are arranged on this shell, and wherein respectively this spacer block extends along this bearing of trend parallel to each other, and respectively this spacer block is distinguished an adjacent spacing distance; And
One outside plate is arranged at and makes these spacer blocks, this outside plate and this shell tube wall around these tubular structures of formation on these spacer blocks.
3. the heat insulation structural according to claim 2 is characterized in that these spacer blocks are integrally formed in this shell.
4. the heat insulation structural according to claim 2 is characterized in that, this outside plate and these spacer blocks are one of the forming.
5. the heat insulation structural according to claim 2 is characterized in that, this shell, this outside plate and these spacer blocks are one of the forming.
6. the heat insulation structural according to claim 1 is characterized in that, comprises:
One inner panel is arranged at this case surface, receives the heat from this electronic installation inside, and heat is transmitted in this inner panel;
Several spacer blocks are arranged on this inner panel, and wherein respectively this spacer block extends along this bearing of trend parallel to each other, and respectively this spacer block is distinguished an adjacent spacing distance; And
One outside plate is arranged at and makes these spacer blocks, this outside plate and the inner panel tube wall around these tubular structures of formation on these spacer blocks.
7. the heat insulation structural according to claim 6 is characterized in that these spacer blocks are integrally formed in this inner panel.
8. the heat insulation structural according to claim 6 is characterized in that, this outside plate and these spacer blocks are one of the forming.
9. the heat insulation structural according to claim 1 is characterized in that, this heat insulation structural is formed at bottom surface, the end face of this electronic installation or puts palm district.
10. the heat insulation structural according to claim 1 is characterized in that, this bearing of trend is defined as one of this electronic installation y direction, an X direction or presss from both sides an acute angle with this y direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009103091798A CN102184001A (en) | 2009-10-31 | 2009-10-31 | Thermal insulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009103091798A CN102184001A (en) | 2009-10-31 | 2009-10-31 | Thermal insulation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102184001A true CN102184001A (en) | 2011-09-14 |
Family
ID=44570186
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009103091798A Pending CN102184001A (en) | 2009-10-31 | 2009-10-31 | Thermal insulation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102184001A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105674456A (en) * | 2016-01-25 | 2016-06-15 | 中山昊天节能科技有限公司 | Domestic air energy humidifier |
| CN107295782A (en) * | 2017-07-05 | 2017-10-24 | 华勤通讯技术有限公司 | The structure and terminal of a kind of silicagel pad suitable for terminal |
| CN109788832A (en) * | 2016-09-16 | 2019-05-21 | 厄尔本阿莫吉尔有限公司 | Shell suitable for electronic equipment |
-
2009
- 2009-10-31 CN CN2009103091798A patent/CN102184001A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105674456A (en) * | 2016-01-25 | 2016-06-15 | 中山昊天节能科技有限公司 | Domestic air energy humidifier |
| CN109788832A (en) * | 2016-09-16 | 2019-05-21 | 厄尔本阿莫吉尔有限公司 | Shell suitable for electronic equipment |
| CN107295782A (en) * | 2017-07-05 | 2017-10-24 | 华勤通讯技术有限公司 | The structure and terminal of a kind of silicagel pad suitable for terminal |
| CN107295782B (en) * | 2017-07-05 | 2024-02-23 | 华勤技术股份有限公司 | Silica gel pad structure suitable for terminal and terminal |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2020259552A1 (en) | Heat equalising plate and folding terminal | |
| CN203896662U (en) | Mobile terminal composite type heat radiating structure and mobile phone | |
| Kim et al. | Heat pipe cooling technology for desktop PC CPU | |
| CN103822318B (en) | Radiant heat exchange plate component | |
| JP6702286B2 (en) | Heat transfer device | |
| CN102184001A (en) | Thermal insulation structure | |
| CN105611804B (en) | Heat conductive pad, radiator and electronic product | |
| JP2018100822A5 (en) | ||
| CN105704978A (en) | Electronic device | |
| CN207763128U (en) | Radiator and air-conditioning | |
| CN102404976A (en) | Electronic device | |
| CN205160997U (en) | Handheld electronic equipment with novel heat radiation structure | |
| JP2013019645A (en) | Panel heating device | |
| CN205693973U (en) | A kind of pcb board assembly | |
| JPH10256764A (en) | Heat-dissipating material | |
| US20100246134A1 (en) | Thermal insulation structure | |
| CN105050369B (en) | A kind of intelligent terminal | |
| CN108282984A (en) | A kind of heat-conducting pad and air conditioner | |
| CN109893157A (en) | A kind of pet detector radiator structure | |
| CN108790361A (en) | A kind of heating device and its control method of laminating machine | |
| CN108377632A (en) | Air conditioner electrical box and air-conditioning | |
| CN209358905U (en) | Radiator, cooling system and electronic equipment | |
| WO2016095508A1 (en) | Heat conduction pad, heat dissipator and heat dissipation component | |
| JP2009052778A (en) | Floor heating panel, floor heating system, panel and construction method of floor heating panel | |
| CN106400438A (en) | Miniature steam boiler and clothes nursing equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| ASS | Succession or assignment of patent right |
Owner name: HANDA PRECISION ELECTRONIC (KUNSHAN) CO., LTD. Free format text: FORMER OWNER: FOSHAN SHUNDE DISTRICT MITAC PRECISION TECHNOLOGY CO., LTD. Effective date: 20130704 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 528308 FOSHAN, GUANGDONG PROVINCE TO: 215300 SUZHOU, JIANGSU PROVINCE |
|
| TA01 | Transfer of patent application right |
Effective date of registration: 20130704 Address after: 215300 No. second, 269 Avenue, comprehensive bonded area, Jiangsu, Kunshan Applicant after: Mitac Precision Technology (Kunshan) Corp. Address before: 528308 Guangdong Province, Foshan city Shunde District Lunjiao Street Chung Hei Lun Xing Zhong Lu Applicant before: Foshan Shunde District Mitac Precision Technology Co., Ltd. |
|
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20110914 |