CN102162961B - Array substrate - Google Patents
Array substrate Download PDFInfo
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- CN102162961B CN102162961B CN 201110100304 CN201110100304A CN102162961B CN 102162961 B CN102162961 B CN 102162961B CN 201110100304 CN201110100304 CN 201110100304 CN 201110100304 A CN201110100304 A CN 201110100304A CN 102162961 B CN102162961 B CN 102162961B
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- spacing
- auxiliary patterns
- lead
- base palte
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- 239000000758 substrate Substances 0.000 title claims abstract description 21
- 238000001514 detection method Methods 0.000 claims abstract description 42
- 230000002093 peripheral effect Effects 0.000 abstract 4
- 238000003698 laser cutting Methods 0.000 description 14
- 238000005520 cutting process Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 9
- 238000013461 design Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 238000009826 distribution Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 210000000697 sensory organ Anatomy 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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Abstract
The invention discloses an array substrate, which comprises a substrate, an active element array, a first positioning mark, a plurality of detection leads and at least one first auxiliary pattern. The substrate is provided with an active area and a peripheral circuit area beside the active area. The active element array is configured in the active area. The first positioning mark is configured in the peripheral circuit area. The detection wires are arranged in the peripheral circuit area at a first interval and are electrically connected with the active element array. The first auxiliary pattern is configured on the peripheral circuit area and is positioned between the first positioning mark and the detection lead. The first auxiliary pattern is separated from the nearest detection lead by a second distance, and the second distance is not equal to the first distance.
Description
Technical field
The present invention relates to a kind of array base palte, and particularly relates to a kind of array base palte of being convenient to the detection laser cutting technique.
Background technology
In the display technique of plane,, power saving compact to have, low radiation, full-color and LCD (Liquid Crystal Display, LCD) the most skillful and universalness of technology of advantage such as be convenient for carrying.Such as mobile phone, digital camera, digital camera, PDA(Personal Digital Assistant), notebook computer, LCD TV etc. have its range of application.
Though it is ripe that LCD Technology has become, display panels can produce some flaws (defect) unavoidably among manufacture process.These flaws can cause when the LCD show image in the active elements array substrates of discomfort, particularly LCD on the sense organ if flaw is arranged, and the suffered shadow of its display quality is apparent more notable.Therefore, before LCD is dispatched from the factory, array base palte must be carried out electrical detection, to guarantee quality.
Generally speaking, when making active elements array substrates, can detect wire producing in the periphery circuit region of active elements array substrates, with convenient detection operation.Finish after the detection, in the mode of cut these electrical measurement leads are cut off so that each element of active elements array substrates is independent of one another again.In the process of cut, if the error in the contraposition has taken place, will cause the failure of cut, and cause testing circuit fully not cut or the circuit that part must connect is cut off.
So, after the cut, must carry out suitable detection and guarantee whether cutting technique is accurate.For example, a kind of detection design of robotization is the active elements array substrates that utilizes after CCD camera is absorbed cutting, and whether observe cutting technique thus has bit errors to produce.Though such robotization detection design can be accelerated detection rates, CCD camera often only has fixing enlargement ratio.Therefore, in circuit layout density high product, can't judge rightly out the position of cut of CCD camera.
Summary of the invention
The invention provides a kind of array base palte, utilize auxiliary patterns be configured to be convenient to after cut, detect.
The present invention proposes a kind of array base palte, comprises substrate, active device array, first telltale mark, many detection leads and at least one first auxiliary patterns.Substrate has active area and is positioned at the other perimeter circuit district of active area.Active device array is disposed in the active area.First telltale mark is disposed in the perimeter circuit district.Detect lead with in first spacing configuration perimeter circuit district, and the detection lead is electrically connected at active device array.First auxiliary patterns is disposed in the perimeter circuit district, between first telltale mark and detection lead.First auxiliary patterns and immediate one detect lead second spacing of being separated by, and second spacing is not equal to first spacing.
The present invention proposes a kind of array base palte in addition, comprises substrate, active device array, first telltale mark, second telltale mark, many detection leads and a plurality of auxiliary patterns.Substrate has active area and is positioned at the other perimeter circuit district of active area.Active device array is disposed in the active area.First telltale mark is disposed in the perimeter circuit district.Second telltale mark is disposed in the perimeter circuit district.Detect lead with in first spacing configuration perimeter circuit district, and between first telltale mark and second telltale mark, and the detection lead is electrically connected at active device array.Auxiliary patterns is disposed in the perimeter circuit district, between first telltale mark and detection lead.Be separated by second spacing and second spacing of wantonly two adjacent auxiliary patterns is not equal to first spacing.
Based on above-mentioned, the present invention's array base palte is provided with auxiliary patterns, and it is between telltale mark and detection lead.Auxiliary patterns is the pattern of floating, it does not electrically conduct with any element, thereby can its allocation position be set according to specific demand, the integral body of auxiliary patterns for example can be fully between telltale mark and detection lead, wherein between auxiliary patterns and the adjoining detection lead spacing at interval can be greater than the spacing that detects between the lead, or the spacing between a plurality of auxiliary patterns can be greater than the spacing that detects between the lead.Thus, array base palte is after laser cutting parameter, and the path that can detect cut easily is correct.
For above-mentioned feature and advantage of the present invention can be become apparent, embodiment cited below particularly, and cooperate appended graphic being described in detail below.
Description of drawings
Fig. 1 illustrates the array base palte schematic top plan view into the embodiment of the invention.
Fig. 2 illustrates the local enlarged diagram when the embodiment into perimeter circuit district in the array base palte of Fig. 1.
Fig. 3 illustrates to first telltale mark, first auxiliary patterns among Fig. 2 and partly detects the local enlarged diagram of lead after cut.
Fig. 4 illustrates the local enlarged diagram when another embodiment into perimeter circuit district in the array base palte of Fig. 1.
Fig. 5 illustrates the local enlarged diagram when the another embodiment into perimeter circuit district in the array base palte of Fig. 1.
Fig. 6 illustrates the local enlarged diagram when another embodiment into perimeter circuit district in the array base palte of Fig. 1.
Description of reference numerals
100: array base palte 110: substrate
112: active area 114: the perimeter circuit district
120: 130: the first telltale marks of active device array
132: cross pattern 134: the tolerance pattern
140: detect lead and cut off line at 142: the second
150,250: the first auxiliary patterns cut off line at 152: the first
160: drive 170: the second telltale marks of chip
350,450: the second auxiliary patterns P1: first spacing
P2: the second spacing P3: the 3rd spacing
P4: the 4th spacing P5: the 5th spacing
L: cut path L1, L2: length
Embodiment
Fig. 1 illustrates the array base palte schematic top plan view into the embodiment of the invention, and Fig. 2 illustrates the local enlarged diagram when the embodiment into perimeter circuit district in the array base palte of Fig. 1.Please be simultaneously with reference to Fig. 1 and Fig. 2, array base palte 100 comprises substrate 110, active device array 120, first telltale mark 130, many detection leads 140 and at least one first auxiliary patterns 150.The perimeter circuit district 114 that substrate 110 has active area 112 and is positioned at active area 112 sides.Active device array 120 is disposed in the active area 112.First telltale mark 130 is disposed in the perimeter circuit district 114.Detect lead 140 with in the first spacing P1 configuration perimeter circuit district 114, and detection lead 140 is electrically connected at active device array 120.First auxiliary patterns 150 is disposed in the perimeter circuit district 114, between first telltale mark 130 and detection lead 140.First auxiliary patterns 150 detects the lead 140 second spacing P2 of being separated by with immediate one.In the present embodiment, the second spacing P2 for example is greater than the first spacing P1.In addition, array base palte 100 also optionally comprises driving chip 160, and it is disposed in the perimeter circuit district 114, and is connected in detection lead 150.
Particularly, the relation between clear each element of expression drives chip 160 and does not illustrate out in Fig. 2.And as shown in Figure 2, array base palte 100 can comprise second telltale mark 170, and detects lead 140 between first telltale mark 130 and second telltale mark 170.First telltale mark 130 can include cross pattern 132 and tolerance pattern 134, and second telltale mark 170 also can have similar design.When adopting the laser cutting parameter cutting to detect lead 140, can according to the scale of tolerance on the pattern 134 adjust laser reference position so that laser alignment in cross pattern 132, and make laser be drawn to cut towards second telltale mark 160 by first telltale mark 130 to detect lead 140.That is to say that laser can detect lead 140 along cut path L cutting in fact, and after cutting, all detection leads 140 are electrically independent each other.
Generally speaking, be subject to the restriction of precision, laser not necessarily can fully cut along predetermined path.Therefore, after cutting, the action that need detect is to determine whether cut path L drops in the correct position range.For example, in automation equipment, be to take array base palte 100 after the cutting to confirm the position of cut path L with CCD camera mostly.
But, when driving the specification of chip 160 employing high pin density, the configuration density that detects lead 140 also can more beneficial improve.At this moment, the usage quantity that drives chip 160 can reduce and saves cost.But when the enlargement ratio of CCD camera immobilizes, then the comparatively intensive detection lead 140 of distribution density will present fuzzy shade in image, can't correctly pick out each and transfer and detect lead 140.Certainly, cut path L also just can't correctly be distinguished out in the image that CCD camera is absorbed.
Therefore, in the present embodiment, first auxiliary patterns 150 the identification that can help cut path L is set, whether the detection laser cutting technique accurate thus.What deserves to be mentioned is that first auxiliary patterns 150 of present embodiment is the element that is floated on the substrate 100 for example.That is to say that first auxiliary patterns 150 can not electrically conduct in any element.Therefore, the allocation position of first auxiliary patterns 150 there is no specific restriction, and can be in order to the position of detection laser cutting path L.
In detail, present embodiment makes win auxiliary patterns 150 and immediate one detect the second spacing P2 that lead 140 is separated by and be not equal to (for example greater than) and detect the first spacing P1 between the lead 140.That is in the present embodiment, the second spacing P2 is for example greater than the first spacing P1.So in the image that CCD camera intercepts, the second spacing P2 relatively easy identification comes out, and can confirm the position of cut path L thus.In addition, when carrying out cut, laser positions according to first telltale mark, 130 positions to I haven't seen you for ages.So for the possible position of certain detection laser cutting path L, the length L 1 of first auxiliary patterns 150 can equal the length L 2 of first telltale mark 130 at least.
Furthermore, Fig. 3 illustrates to first telltale mark, first auxiliary patterns among Fig. 2 and partly detects the local enlarged diagram of lead after cut.Please refer to Fig. 3, after cut, first auxiliary patterns 150 has first and cuts off line 152, this first cuts off line 152 first auxiliary patterns 150 is broken at least two non-blocks connected to one another, have second and cut off line 142 and respectively detect lead 140, and first cuts off line 152 and second and cut off line 142 and distribute along the cut path L that Fig. 2 illustrates in fact.That is to say, first auxiliary patterns 150 and respectively detect lead 140 all can be along cut path L disconnection after cutting, and the image that CCD camera is absorbed is exactly to judge whether the position of these gaps is correct.
Can be known by Fig. 3 and to know that the first spacing P1 is less relatively, and the second spacing P2 is relatively large, so in the image that CCD camera is absorbed, the second spacing P2 can easily be recognized.The tester also can easily recognize first on first auxiliary patterns 150 cuts off line 152 positions, confirms thus whether the cut path L among Fig. 2 is correct.That is to say that present embodiment does not need to improve the enlargement ratio of testing tool or the position that resolution just can correctly be recognized cut path L under the setting of first auxiliary patterns 150, with the correctness of detection laser cutting.Certainly, whether the configuration density that no matter detects lead 140 is enhanced, and the correctness of cut step can be correctly confirmed in the design of present embodiment.In other words, when the driving chip 160 on the array base palte 100 is to use the specification of high pin density, though detect suitable little of the first spacing P1 of 140 in lead, the tester still can judge rightly the position of cut path L to determine the correctness of laser cutting parameter.
Fig. 4 illustrates the local enlarged diagram when another embodiment into perimeter circuit district in the array base palte of Fig. 1.Please refer to Fig. 4, the described element of present embodiment all elements except illustrating among Fig. 2 also comprise another first auxiliary patterns 250.That is to say, can dispose a plurality of first auxiliary patterns 150,250 in the perimeter circuit district 114.In addition, in the present embodiment, the 3rd spacing P3 of can being separated by between first auxiliary patterns 150 and 250.
Particularly, at least one is not equal to (for example be greater than) first spacing P1 among the second spacing P2 and the 3rd spacing P3, and then first auxiliary patterns 150,250 just can be in order to the detection of auxiliary laser cutting path.Therefore, in an embodiment, if the second spacing P2 is greater than the first spacing P1, then the size of the 3rd spacing P3 does not need to limit especially, it can equal, greater than or less than the first spacing P1.Similarly, if the 3rd spacing P3 is greater than the first spacing P1, then the second spacing P2 can optionally equal, greater than or less than the first spacing P1.By such design, first auxiliary patterns 150,250 can be clearly be distinguished out in the image that CCD camera is absorbed, and is used for judging the position in cut path.
In addition, above embodiment all describes to be provided with auxiliary patterns 150,250 between first telltale mark 130 and the detection lead 140.In other embodiment, also can be provided with auxiliary patterns between second telltale mark 170 and the detection lead 140.For example, Fig. 5 illustrates the local enlarged diagram when the another embodiment into perimeter circuit district in the array base palte of Fig. 1.Please refer to Fig. 5, the described element of present embodiment all elements except illustrating among Fig. 2 also comprise second auxiliary patterns 350.That is to say that present embodiment also is provided with second auxiliary patterns 350 except first telltale mark, 130 other being provided with first auxiliary patterns 150 between second telltale mark 170 and the detection lead 140.
With present embodiment, the size design of second auxiliary patterns 350 and Position Design can be with reference to the designs of first auxiliary patterns 150.In brief, second auxiliary patterns 350 detects lead 140 the 4th spacing P4 of being separated by with immediate one, and the 4th spacing P4 for example can be greater than the first spacing P1.In addition, second auxiliary patterns 350 is elements of floating, and it does not electrically connect with other element, and the length of second auxiliary patterns 350 equals the length of second telltale mark 170 at least.Certainly, carry out laser cutting parameter after, second auxiliary patterns 350 can have along the 3rd of cut path profile and cuts off line (not illustrating).The tester just can judge by observing the 3rd position of cutting off line (not illustrating) whether cut is executed on the correct position.
Generally speaking, present embodiment all is provided with to confirm the pattern of the position in cut path in the both sides of detecting lead 140, and it can clearly be distinguished out in CCD camera.Therefore, the tester does not need just can confirm easily with higher resolution or the checkout equipment of big multiplying power whether laser cutting parameter is correct.Especially, when the distribution density that detects lead 140 improved, whether the tester still can detect laser cutting parameter efficiently and conform to the standard.
In addition, though present embodiment only illustrates first auxiliary patterns 150 and second auxiliary patterns 350 describes.But the present invention is not as limit.In other embodiment, second auxiliary patterns 350 also can be a plurality of, and it as shown in Figure 6.As shown in Figure 6, the 5th spacing P5 of can being separated by between a plurality of second auxiliary patterns 350,450.In addition, the 4th spacing P4 and the 5th spacing P5 are as long as at least one just helps the position of detection laser cutting path correctly greater than the first spacing P1 that detects between the lead 140.That is, when the 4th spacing P4 greater than the first spacing P1, then the 5th spacing P5 do not need to limit especially and can equal, greater than or less than the first spacing P1.In addition, when the 5th spacing P5 greater than the first spacing P1, then the 4th spacing P4 do not need to limit especially and can equal, greater than or less than the first spacing P1.Furthermore, in other embodiment, first auxiliary patterns 150 and second auxiliary patterns 350,450 quantity can all be a plurality of, all be one or wherein one for a plurality of another persons be one.
In sum, the auxiliary patterns floated of utilization of the present invention is arranged at that to detect lead other to judge the position in cut path in the laser cutting parameter.Therefore, which kind of no matter the detection line on the array base palte of the present invention join Density Distribution with, tester can judge rightly the out position in cut path.In automation equipment, when the CCD camera that detects usefulness only has a kind of enlargement ratio, still can be correctly detected cut path, even the detection lead on the array base palte is with high wiring density setting.
Though the present invention discloses as above with embodiment; right its is not in order to limiting the present invention, any under those of ordinary skill in the technical field, without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention defines and is as the criterion when looking claim.
Claims (10)
1. array base palte comprises:
Substrate has active area and is positioned at the other perimeter circuit district of this active area;
Active device array is disposed in this active area;
First telltale mark is disposed in this perimeter circuit district;
Many are detected lead, dispose in this perimeter circuit district with first spacing, and these many detection leads are electrically connected at this active device array; And
At least one first auxiliary patterns is disposed in this perimeter circuit district, detects between the lead this first telltale mark and these many, and this first auxiliary patterns and an immediate detection lead second spacing of being separated by, and this second spacing is greater than this first spacing.
2. array base palte as claimed in claim 1, wherein the length of this first auxiliary patterns equals this first specifically labelled length at least.
3. array base palte as claimed in claim 1, wherein this first auxiliary patterns is floated on this substrate.
4. array base palte as claimed in claim 1, wherein this first auxiliary patterns has first and cuts off line, have second and cut off line and respectively detect lead, and this first cuts off line and cuts off line along the cut path profile with these many second.
5. array base palte as claimed in claim 1 also comprises:
Second telltale mark is disposed in this perimeter circuit district; And
At least one second auxiliary patterns is disposed in this perimeter circuit district, detects between the lead this second telltale mark and these many, and this second auxiliary patterns and an immediate detection lead the 3rd spacing of being separated by, and the 3rd spacing is greater than this first spacing.
6. array base palte as claimed in claim 5, wherein this first auxiliary patterns has first and cuts off line, each detects lead has second and cuts off line, cut off line and this second auxiliary patterns has the 3rd, and this first cuts off line, these many second and cuts off line and the 3rd and cut off line along the cut path profile.
7. array base palte as claimed in claim 5, wherein the length of this second auxiliary patterns equals this second specifically labelled length at least, and this second auxiliary patterns is floated on this substrate.
8. array base palte as claimed in claim 1 also comprises the driving chip, is disposed in this perimeter circuit district, is connected in these many and detects lead.
9. array base palte comprises:
Substrate has active area and is positioned at the other perimeter circuit district of this active area;
Active device array is disposed in this active area;
First telltale mark is disposed in this perimeter circuit district;
Second telltale mark is disposed in this perimeter circuit district;
Many are detected lead, dispose in this perimeter circuit district with first spacing, and between this first telltale mark and this second telltale mark, and these many detection leads are electrically connected at this active device array; And
A plurality of auxiliary patterns, be disposed in this perimeter circuit district, detect between the lead this first telltale mark and these many, these a plurality of auxiliary patterns and these many bee-lines that detect between lead are second spacing, the 3rd spacing of being separated by between the wantonly two adjacent auxiliary patterns, and in this second spacing and the 3rd spacing at least one is greater than this first spacing.
10. array base palte as claimed in claim 9, wherein each auxiliary patterns has first and cuts off line, and each detects lead has second and cuts off line, and these many first cut off line and these many second and cut off line along the cut path profile.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW099144818 | 2010-12-20 | ||
| TW99144818A TWI435151B (en) | 2010-12-20 | 2010-12-20 | Arry substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102162961A CN102162961A (en) | 2011-08-24 |
| CN102162961B true CN102162961B (en) | 2013-10-02 |
Family
ID=44464271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110100304 Expired - Fee Related CN102162961B (en) | 2010-12-20 | 2011-04-21 | Array substrate |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102162961B (en) |
| TW (1) | TWI435151B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109634008A (en) * | 2018-12-21 | 2019-04-16 | 惠科股份有限公司 | Display panel and method for manufacturing the same |
| CN109557738B (en) * | 2018-12-21 | 2022-06-10 | 惠科股份有限公司 | Test circuit, test method and display panel |
| CN113156727B (en) * | 2021-04-29 | 2022-09-20 | 惠科股份有限公司 | Array substrate, liquid crystal display panel and liquid crystal display device |
| CN114211549B (en) * | 2021-12-24 | 2023-12-19 | 海安绿发环保科技有限公司 | Cutting equipment with side seam is handled based on XPS extruded sheet |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1447189A (en) * | 2002-03-27 | 2003-10-08 | 株式会社东芝 | Light mark, focusing monitoring method, light exposure monitoring method, and mfg. method of semiconductor device |
| CN101437359A (en) * | 2007-11-15 | 2009-05-20 | 福建华映显示科技有限公司 | Circuit board with position indication and jointing method (thereof) |
| CN201242635Y (en) * | 2008-08-20 | 2009-05-20 | 北京京东方光电科技有限公司 | Substrate for liquid crystal display panel |
| CN101515430A (en) * | 2009-03-30 | 2009-08-26 | 友达光电股份有限公司 | Display panel and line inspection method thereof |
-
2010
- 2010-12-20 TW TW99144818A patent/TWI435151B/en not_active IP Right Cessation
-
2011
- 2011-04-21 CN CN 201110100304 patent/CN102162961B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1447189A (en) * | 2002-03-27 | 2003-10-08 | 株式会社东芝 | Light mark, focusing monitoring method, light exposure monitoring method, and mfg. method of semiconductor device |
| CN101437359A (en) * | 2007-11-15 | 2009-05-20 | 福建华映显示科技有限公司 | Circuit board with position indication and jointing method (thereof) |
| CN201242635Y (en) * | 2008-08-20 | 2009-05-20 | 北京京东方光电科技有限公司 | Substrate for liquid crystal display panel |
| CN101515430A (en) * | 2009-03-30 | 2009-08-26 | 友达光电股份有限公司 | Display panel and line inspection method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102162961A (en) | 2011-08-24 |
| TWI435151B (en) | 2014-04-21 |
| TW201227112A (en) | 2012-07-01 |
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