CN102161823A - Composite material, high-frequency circuit substrate therefrom and manufacture method thereof - Google Patents
Composite material, high-frequency circuit substrate therefrom and manufacture method thereof Download PDFInfo
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Abstract
The invention relates to a composite material, a high-frequency circuit substrate therefrom and a manufacture method thereof. The composite material comprises thermoset mixture, glass fiber cloth, power filler, a fire retardant and a curing initiator, wherein the thermoset mixture comprises more than one kind of vinyl liquid resin and polyphenyl ether resin; the molecular weight of the vinyl liquid resin is below 10000, and the vinyl liquid resin is provided with a polar functional group; the molecular weight of the polyphenyl ether resin is less than 5000, and the molecular tail end of the polyphenyl ether resin is provided with unsaturated double bonds. The high-frequency circuit substrate manufactured with the composite material comprises multiple layers of semi-solidified sheets and copper foils, wherein the semi-solidified sheets are mutually overlaid, and the copper foils are respectively pressed on two sides. The composite material disclosed by the invention causes the semi-solidified sheets to be easily manufactured and have high adhesive bonding force with the copper foils. The high-frequency circuit substrate manufactured by the material has the advantages of low dielectric constant, low dielectric loss angle tangent, good heat resistance and simple technical operation. Thus, the composite material disclosed by the invention is suitable for manufacturing the circuit substrate of the high-frequency electronic equipment.
Description
Technical field
The present invention relates to a kind of matrix material, with high-frequency circuit board of its making and preparation method thereof, relate in particular to a kind of thermoset dielectric composite material, with high-frequency circuit board of its making and preparation method thereof.
Background technology
In recent years, along with the development of computer and information communication device high performance, multifunction and networking, for high-speed transfer and processing large vol information, operation signal trends towards high frequencyization, thereby the material of circuit substrate has been proposed requirement.
The existing material that is used for tellite, be extensive use of the Resins, epoxy of adhesion properties excellence, yet, general specific inductivity of Resins, epoxy circuit substrate and dielectric loss angle tangent are higher, and (specific inductivity is greater than 4, about dielectric loss angle tangent 0.02), high frequency characteristics is insufficient, requirement that can not the adaptation signal high frequencyization.Therefore must develop the resin of dielectric characteristics excellence, i.e. the low resin of specific inductivity and dielectric loss angle tangent.Those skilled in the art studies the good heat cured polyhutadiene of dielectric properties or polyhutadiene and cinnamic copolymer resin for a long time, below further inquires into regard to these achievements in research.
PCT patent (WO97/38564) adopts the tetramer of nonpolar vinylbenzene and divinyl and Vinylstyrene to add silicoaluminate magnesium filler, the circuit substrate of making as strongthener with glasscloth, though dielectric properties excellence, but the thermotolerance of substrate is very poor, second-order transition temperature has only about 100 ℃, thermal expansivity is very big, is difficult to satisfy high temperature (more than the 240 ℃) requirement of the unleaded processing procedure of PCB making processes.
United States Patent (USP) (US5571609) adopt molecular weight less than 5000 low-molecular-weight 1,2-polybutadiene or poly-isobutyl diene, cooperate with cinnamic multipolymer with the high-molecular weight divinyl, and add a large amount of silicon powders as filler, with the circuit substrate of glasscloth as the strongthener making, though dielectric properties excellence, but because in this patent, adopted high-molecular weight to become to assign to improve the sticking hand situation of prepreg, feasible processing performance variation of making the process of prepreg; And because the ratio of the rigid structure phenyl ring in the molecular resin of whole resin system seldom, and crosslinked later segment mostly is made up of the very low methylene radical of rigidity, so the panel stiffness that is made into is bad, flexural strength is very low.
United States Patent (USP) (US6569943) uses molecular end to have the liquid polybutadiene resin of the amido modification of vinyl, add a large amount of low-molecular-weight monomers (Dowspray 9) as solidifying agent and thinner, the circuit substrate that impregnated glass fiber cloth is made into, though dielectric properties are fine, but because resin system is liquid at normal temperatures, can not be made into tack-free prepreg, therefore when the compression moulding of sheet material, be difficult to adopt the folded fore-telling of general prepreg technology, technological operation is difficulty relatively.
Chinese patent CN1280337C uses molecular end to have the polyphenylene oxide resin of unsaturated double-bond, adopt low-molecular-weight vinyl monomer (as Dowspray 9) as solidifying agent, but because these low-molecular-weight monomer boiling points are low, in the drying course of impregnated glass fiber cloth making prepreg, can vapor away, be difficult to guarantee sufficient hardener dose.Though this patent is mentioned the viscosity that can adopt the polyhutadiene resinoid to remove modified system in addition, clearly propose to adopt to have the polyhutadiene resinoid of polar group and polyhutadiene resinoid that employing has polar group goes to improve stripping strength.
Above-described patent, also there are distinct issues, the stripping strength of the copper coated foil plate material that is made into exactly low (being lower than 0.8N/mm) makes the copper coated foil plate material be made in the process of PCB circuit processing and the risk that circuit comes off occurs in the equipment use like this.
Summary of the invention
The object of the present invention is to provide a kind of matrix material, the needed high-frequency dielectric performance of high-frequency circuit board, resistance to elevated temperatures and higher circuit substrate stripping strength and technological forming performance can be provided.
Another object of the present invention is to provide the high-frequency circuit board that uses above-mentioned matrix material to make, have high-frequency dielectric performance, resistance to elevated temperatures and higher circuit substrate stripping strength (stripping strength can greater than 1.0N/mm).
A further object of the present invention is to provide the making method of the high-frequency circuit board that uses above-mentioned matrix material making, by improving the resin system of matrix material, impregnated glass fiber cloth is made into tack-free prepreg, can take general foretelling from fold to operate when pressing plate, technological operation is easier.
For achieving the above object, the invention provides a kind of matrix material, it comprises component and weight weight part (pressing matrix material gross weight listed as parts by weight) is as follows:
(1) thermoset mixture 20-70 weight part, it comprises more than one molecular weight is the ethylene liquid resin that has polar functional group below 10000; A kind of molecular weight has the polyphenylene oxide resin of unsaturated double-bond less than 5000 molecular end;
(2) glasscloth 10-60 weight part;
(3) powder filler 0-55 weight part;
(4) curing initiator 1-3 weight part;
(5) fire retardant accounts for the 0-35 weight part.
Described molecular weight is the ethylene liquid resin that has polar functional group below 10000, accounts for the 15-75% of thermoset mixture weight weight part, and the contents of ethylene of 1,2 addition is preferably greater than or equals 70% in its its molecule; Described molecular weight is the ethylene liquid resin that has polar functional group below 10000 polybutadiene that is selected from the carboxy-modified polybutadiene of polybutadiene, the end of maleic anhydride modified polybutadiene, amido modification, terminal hydroxy group modification, maleic anhydride modified divinyl and styrol copolymer, acrylate modified divinyl and styrol copolymer or their mixture.
Described molecular weight has the polyphenylene oxide resin of unsaturated double-bond less than 5000 molecular end, accounts for the 25-85% of thermoset mixture weight weight part.It is that to have the ethylene liquid resin solidification of polar functional group below 10000 crosslinked that the polyphenylene oxide resin that described molecular weight has a unsaturated double-bond less than 5000 molecular end uses molecular weight.
Described powder filler is selected from one or more in powdered quartz, unformed silicon-dioxide, spherical silica, titanium dioxide, strontium titanate, barium titanate, boron nitride, aluminium nitride, silicon carbide, aluminum oxide, glass fibre, tetrafluoroethylene, polyphenylene sulfide, the polyethersulfone.
Comprise that also brominated or phosphorated hinders right agent.Described bromated fire retardant is the two tetrabromo phthalimides of decabromodiphynly oxide, TDE or ethylene; Phosphonium flame retardant is three (2, the 6-3,5-dimethylphenyl) phosphine, 10-(2, the 5-dihydroxy phenyl)-9, the 10-dihydro-9-oxy is mixed-10-phosphine phenanthrene-10-oxide compound, 2,6-two (2, the 6-3,5-dimethylphenyl) phosphino-benzene or 10-phenyl-9, the 10-dihydro-9-oxy is mixed-10-phosphine phenanthrene-10-oxide compound.
The preferred dicumyl peroxide of described curing initiator, peroxidized t-butyl perbenzoate or 2,5-two (2-ethyl hexanoyl peroxide)-2,5-dimethylhexane.
Further comprise additional crosslinker, it is selected from triallyl isocyanuric acid ester, triallyl cyanurate, Vinylstyrene or polyfunctional acrylate.
Simultaneously, the invention provides a kind of high-frequency circuit board that uses above-mentioned matrix material to make, comprising: several layers of prepreg that is superimposed with each other and be overlaid on the Copper Foil of its both sides respectively, these several layers of prepregs are made by described matrix material.
Further, the present invention also provides the method for making as above-mentioned high-frequency circuit board, comprises the steps:
Step 1, take by weighing the constituent of matrix material: (1) thermoset mixture 20-70 weight part, it comprises more than one molecular weight is the ethylene liquid resin that has polar functional group below 10000; A kind of molecular weight has the polyphenylene oxide resin of unsaturated double-bond less than 5000 molecular end; (2) glasscloth 10-60 weight part; (3) powder filler 0-55 weight part; (4) curing initiator 1-3 weight part; (5) fire retardant accounts for the 0-35 weight part;
Step 2, the thermoset mixture with taking by weighing, powder filler, fire retardant and curing initiator mix, with solvent cut to suitable viscosity, mix, make being dispersed in the resin of filler homogeneous, make glue, flood above-mentioned glue with glasscloth, and control to suitable thickness, remove the formation prepreg that desolvates then;
Step 3, above-mentioned prepreg number is superimposed, respectively covers a Copper Foil up and down, put press into and be cured and make described high-frequency circuit board, solidification value is 150-300C, and solidifying pressure is 25-70Kg/cm
2
Beneficial effect of the present invention: at first, adopt the dielectric properties excellence to have the ethylene liquid resin of polar functional group, carrying out crosslinking reaction by a large amount of unsaturated double-bond in the resin provides needed high-frequency dielectric performance of circuit substrate and resistance to elevated temperatures, and improves stripping strength;
Secondly, adopt the terminal polyphenylene oxide resin that has unsaturated double-bond to improve thermotolerance, the rigidity of circuit substrate, and improve stripping strength;
Once more, the polyphenylene oxide resin that adopts the solid end to have unsaturated double-bond is used with the ethylene liquid resin that has polar functional group, has improved single sticking hand problem of prepreg that produces with liquid resin;
In a word, matrix material of the present invention makes prepreg make easily, bonding force height with Copper Foil, high-frequency circuit board with its making, specific inductivity and dielectric loss angle tangent are low, good heat resistance, technological operation is convenient, and therefore matrix material of the present invention is suitable for making the circuit substrate of high-frequency electronic equipment.
Embodiment
Below embodiments of the present invention are elaborated.
The constituent of one matrix material
1. thermoset mixture resin system
First kind of composition of matrix material of the present invention is thermoset mixture 20-70 weight part (pressing matrix material gross weight listed as parts by weight), preferred 20-50 weight part, it comprises component: (1) comprises more than one molecular weight is the ethylene liquid resin that has polar functional group below 10000; (2) a kind of molecular weight has the polyphenylene oxide resin of unsaturated double-bond less than 5000 molecular end.
Component (1) is the ethylene liquid resin that has polar functional group, and preferred molecular weight is less than 10000, and preferred molecular weight at room temperature is a liquid less than 7000, and the viscosity of liquid resin is very low, thereby helps the impregnation technology operation of back.Molecular weight is the 15-75% that the ethylene liquid resin that has polar functional group below 10000 accounts for thermoset mixture weight weight part, and the contents of ethylene of 1,2 addition is preferably greater than 50% greater than 10% in its molecule, and is better more than or equal to 70%.Needed a large amount of unsaturated ethylene thiazolinyls when the ethylene liquid resin that has a polar functional group can provide curing cross-linked can improve the cross-linking density when solidifying, and offer the good high thermal resistance of circuit base material; In addition, molecular weight is the ethylene liquid resin that has polar functional group below 10000, contains the polar group that improves bounding force in its molecule, as amido, hydroxyl, carboxyl, maleic anhydride modified group, acrylate modified group etc.These resins may be used alone, can also be used in combination, and can significantly improve the stripping strength of sheet material.Preferred resin such as TE2000 (Japanese Cao Da), Ricon 131MA20 (Sartomer company) resin, Poly bd 45CT (Sartomer company) resin etc.
Component (1) at room temperature is all liquid, if the problem of sticking hand takes place in the semicure sector-meeting of only adopting them to make, is unfavorable for follow-up laminating technology operation, therefore introduces solid ingredient (2) and improves the sticking hand problem of prepreg.
Component (2) is the polyphenylene oxide resin (PPO) that the solid molecular end has unsaturated double-bond, add solid PPO resin, be because solid PPO resin is used with the liquid resin that has the vinyl reactive group on the one hand, improved single sticking hand problem of prepreg that produces with liquid resin, on the other hand, the PPO resin is compared with the butadiene resin that existing patent is used because contain the better rigidity phenyl ring in the molecular structure, and panel stiffness and the physical strength made are better.It will be further appreciated that the bounding force of PPO resin is very high, can improve the stripping strength of sheet material.Its content of polyphenylene oxide resin that the solid molecular end has a unsaturated double-bond accounts for the 25-85% of thermoset mixture weight weight part, consumption does not reach the purpose of improving sticking hand and stripping strength less than 25%, and consumption is greater than 85%, can make the processing performance variation, bad to the effect of impregnation may of woven fiber glass.The adoptable MX9000 of having of polyphenylene oxide resin (SABIC company) that has unsaturated double-bond as molecular weight less than 5000 molecular end.Its structural formula is as follows.
2, powder filler
In matrix material of the present invention, powder filler plays and improves the glue solids content, improves the sticking chirality of prepreg, improves dimensional stability, reduces purpose such as CTE.Powder filler 0-55 weight part used in the present invention (pressing matrix material gross weight listed as parts by weight), comprise powdered quartz, unformed silicon-dioxide, spherical silica, titanium dioxide, strontium titanate, barium titanate, boron nitride, aluminium nitride, silicon carbide, aluminum oxide, glass fibre, tetrafluoroethylene, polyphenylene sulfide, polyethersulfone etc., above filler can use or mix use separately, wherein, best filler is a silicon-dioxide, the particle diameter moderate value of filler is 1-15 μ m, the particle diameter moderate value of preferred filler is 1-10 μ m, and the filler that is arranged in this particle diameter section has good dispersiveness in resin liquid.Adoptable silica filler such as CE44I (CE minerals company), FB-35 (Denka company), 525 (Sibelco companies).
3, glasscloth
In matrix material of the present invention, glasscloth plays the dimensional stability that improves substrate, reduces the effect that the veneer sheet resin shrinks in solidification process.Glasscloth accounts for 10-60 weight part (pressing matrix material gross weight listed as parts by weight), and preferred 30-57 weight part requires difference according to substrate, uses different glasscloths, its specification such as following table 1:
Table 1
| The cloth kind | Cloth thick (mm) | Manufactory |
| 7628 | 0.18 | Shanghai grand and |
| 2116 | 0.094 | Shanghai grand and |
| 1080 | 0.056 | Shanghai grand and |
| 106 | 0.04 | Shanghai grand and |
4, fire retardant
In the present invention, can add the right performance of resistance that fire retardant improves sheet material.Fire retardant of the present invention accounts for 0-35 weight part (pressing matrix material gross weight listed as parts by weight), can adopt brominated flame-retardant or phosphonium flame retardant, the fire retardant that is adopted is good not reduce dielectric properties, preferable brominated flame-retardant such as decabromodiphynly oxide, TDE, the two tetrabromo phthalimides of ethylene etc.; Preferable phosphonium flame retardant is as three (2, the 6-3,5-dimethylphenyl) phosphine, 10-(2, the 5-dihydroxy phenyl)-9, the 10-dihydro-9-oxy is mixed-10-phosphine phenanthrene-10-oxide compound, 2,6-two (2, the 6-3,5-dimethylphenyl) phosphino-benzene, 10-phenyl-9, the 10-dihydro-9-oxy is assorted-10-phosphine phenanthrene-10-oxide compound etc.
5, curing initiator
In matrix material of the present invention, curing initiator plays the effect of accelerated reaction, and when composition of the present invention was heated, curing initiator decomposed the generation free radical, and the molecular chain of initiated polymerization thing takes place crosslinked.The consumption of curing initiator is the 1-10% of thermoset amount of mixture, roughly accounts for the total 1-3 weight part of forming (pressing matrix material gross weight listed as parts by weight) of matrix material.Curing initiator is selected from the material that can produce free radical, and preferable curing initiator has dicumyl peroxide, peroxidized t-butyl perbenzoate, 2,5-two (2-ethyl hexanoyl peroxide)-2,5-dimethylhexane etc.
6, additional crosslinker
In matrix material of the present invention, can add a certain amount of additional crosslinker and improve cross-linking density, can adopt triallyl isocyanuric acid ester, triallyl cyanurate, Vinylstyrene or polyfunctional acrylate etc.
Two matrix materials are made high-frequency circuit board
Use above-mentioned matrix material to make the method for high-frequency circuit board, comprise the steps:
Step 1, take by weighing the constituent of matrix material, (1) thermoset mixture 20-70 weight part (pressing matrix material gross weight listed as parts by weight), (1) comprises more than one molecular weight is the ethylene liquid resin that has polar functional group below 10000; A kind of molecular weight has the polyphenylene oxide resin of unsaturated double-bond less than 5000 molecular end.(2) glasscloth 10-60 weight part; (3) powder filler 0-55 weight part; (4) curing initiator 1-3 weight part; (5) fire retardant accounts for the 0-35 weight part.
Step 2, the thermoset mixture with taking by weighing, powder filler, fire retardant and curing initiator mix, with solvent cut to suitable viscosity, mix, make being dispersed in the resin of filler homogeneous, make glue, flood above-mentioned glue with glasscloth, and control to suitable thickness, remove the formation prepreg that desolvates then.
Step 3, above-mentioned prepreg number is superimposed, respectively covers a Copper Foil up and down, put press into and be cured and make described high-frequency circuit board, the solidification value of this step is 150-300 ℃, and solidifying pressure is 25-70Kg/cm
2
The high-frequency circuit board of made comprises: several layers of prepreg that is superimposed with each other and be overlaid on the Copper Foil of its both sides respectively, these several layers of prepregs are made by described matrix material.
At the dielectric properties of the above-mentioned high-frequency circuit board of making, promptly specific inductivity and dielectric loss angle tangent, high frequency performance and resistance toheat further give to illustrate in detail and describe as following embodiment.
The constituent of the matrix material that the embodiment of the invention is selected such as following table 2:
Table 2
Embodiment 1
Maleic anhydride modified polybutadiene (Ricon 131MA20) with 55.6 weight weight parts, 44.4 the PPO of the acrylate ended of weight weight part (MX9000), the silicon-dioxide of 85 weight weight parts (525), the TDE of 32 weight weight parts (SAYTEX8010), 6.5 the initiator dicumyl peroxide (DCP) of weight weight part mixes, transfer to suitable viscosity with solvent xylene, mix, make being dispersed in the resin of filler homogeneous, make glue.Flood above glue with 1080 glasscloths, make prepreg after solvent is removed in oven dry then, because this prepreg is tack-free, technological operation is easy.Eight Manufactured prepregs are superimposed, cover the Copper Foil of loz (ounce) thickness in its both sides, carry out solidifying in 2 hours in press, solidifying pressure is 50Kg/cm
2, solidification value is 190 ℃.Physical data is as shown in table 3.
Embodiment 2
Manufacture craft is identical with embodiment 1, and the proportioning and the physical data thereof that change matrix material are as shown in table 3.
Embodiment 3
Manufacture craft is identical with embodiment 1, and the proportioning and the physical data thereof that change matrix material are as shown in table 3.
Comparative example
Manufacture craft is identical with embodiment 1, remove the PPO (MX9000) of maleic anhydride modified polybutadiene (Ricon131MA20) and acrylate ended, adopt divinyl and cinnamic copolymer resin (Ricon 100), mold temperature adopts 300 ℃, is incubated 30 minutes.Material mixture ratio is as shown in table 3.
The material mixture ratio and the physical data thereof of each embodiment of table 3 and comparative example
Physical Property Analysis
From the physical data result of table 3 as can be seen, circuit base material specific inductivity and dielectric loss angle tangent that embodiment 1, embodiment 2 and embodiment 3 make are low, and high frequency performance is fine.Embodiment 1, embodiment 2 compare with comparative example with embodiment 3, introduced the PPO of acrylate ended, effectively improved the sticking chirality of prepreg, flexural strength also is improved, behind 288 ℃ of constant temperature, can tolerate 15 minutes and not stratified, thermotolerance is fine, and specific inductivity and dielectric loss angle tangent are all very little, and stripping strength also is improved.
As mentioned above, compare with general copper clad laminate, circuit substrate of the present invention has excellent more dielectric properties, promptly has lower specific inductivity and dielectric loss angle tangent, and high frequency performance is fine.
Above embodiment, be not that content to composition of the present invention imposes any restrictions, every foundation technical spirit of the present invention or composition become weight part or content to any trickle modification, equivalent variations and modification that above embodiment did, all still belong in the scope of technical solution of the present invention.
Claims (10)
1. a matrix material is characterized in that, comprises component and the weight weight part is as follows:
(1) thermoset mixture 20-70 weight part, it comprises more than one number-average molecular weights is the ethylene liquid resin that has polar functional group below 10000; A kind of number-average molecular weight has the polyphenylene oxide resin of unsaturated double-bond less than 5000 molecular end;
(2) glasscloth 10-60 weight part;
(3) powder filler 0-55 weight part;
(4) curing initiator 1-3 weight part;
(5) fire retardant accounts for the 0-35 weight part.
2. matrix material as claimed in claim 1, it is characterized in that described molecular weight is the ethylene liquid resin that has polar functional group below 10000, accounts for the 15-75% of thermoset mixture weight part, the contents of ethylene of 1,2 addition is preferably greater than or equals 70% in its molecule; Described molecular weight is the ethylene liquid resin that has polar functional group below 10000 polybutadiene that is selected from the carboxy-modified polybutadiene of polybutadiene, the end of maleic anhydride modified polybutadiene, amido modification, terminal hydroxy group modification, maleic anhydride modified divinyl and styrol copolymer, acrylate modified divinyl and styrol copolymer or their mixture.
3. matrix material as claimed in claim 1 is characterized in that, described molecular weight has the polyphenylene oxide resin of unsaturated double-bond less than 5000 molecular end, accounts for the 25-85% of thermoset mixture weight part.
4. matrix material as claimed in claim 1 is characterized in that, it is that to have the ethylene liquid resin solidification of polar functional group below 10000 crosslinked that the polyphenylene oxide resin that described molecular weight has a unsaturated double-bond less than 5000 molecular end uses molecular weight.
5. matrix material as claimed in claim 1, it is characterized in that described powder filler is selected from one or more in powdered quartz, unformed silicon-dioxide, spherical silica, titanium dioxide, strontium titanate, barium titanate, boron nitride, aluminium nitride, silicon carbide, aluminum oxide, glass fibre, tetrafluoroethylene, polyphenylene sulfide, the polyethersulfone.
6. matrix material as claimed in claim 1 is characterized in that, the right agent of described resistance is brominated or phosphonium flame retardant; Described bromated fire retardant is the two tetrabromo phthalimides of decabromodiphynly oxide, TDE or ethylene; Described phosphonium flame retardant is three (2, the 6-3,5-dimethylphenyl) phosphine, 10-(2, the 5-dihydroxy phenyl)-9, the 10-dihydro-9-oxy is mixed-10-phosphine phenanthrene-10-oxide compound, 2,6-two (2, the 6-3,5-dimethylphenyl) phosphino-benzene or 10-phenyl-9, the 10-dihydro-9-oxy is mixed-10-phosphine phenanthrene-10-oxide compound.
7. matrix material as claimed in claim 1 is characterized in that, the preferred dicumyl peroxide of described curing initiator, peroxidized t-butyl perbenzoate or 2,5-two (2-ethyl hexanoyl peroxide)-2,5-dimethylhexane.
8. matrix material as claimed in claim 1 is characterized in that, further comprises additional crosslinker, and it is selected from triallyl isocyanuric acid ester, triallyl cyanurate, Vinylstyrene or polyfunctional acrylate.
9. high-frequency circuit board that uses matrix material as claimed in claim 1 to make comprises: several layers of prepreg that is superimposed with each other and be overlaid on the Copper Foil of its both sides respectively is characterized in that these several layers of prepregs are made by described matrix material.
10. a method of making high-frequency circuit board as claimed in claim 9 is characterized in that, comprises the steps:
Step 1, take by weighing the constituent of matrix material: (1) thermoset mixture 20-70 weight part, it comprises more than one molecular weight is the ethylene liquid resin that has polar functional group below 10000; A kind of molecular weight has the polyphenylene oxide resin of unsaturated double-bond less than 5000 molecular end; (2) glasscloth 10-60 weight part; (3) powder filler 0-55 weight part; (4) curing initiator 1-3 weight part; (5) fire retardant accounts for the 0-35 weight part;
Step 2, the thermoset mixture with taking by weighing, powder filler, fire retardant and curing initiator mix, with solvent cut to suitable viscosity, mix, make being dispersed in the resin of filler homogeneous, make glue, flood above-mentioned glue with glasscloth, and control to suitable thickness, remove the formation prepreg that desolvates then;
Step 3, above-mentioned prepreg number is superimposed, respectively covers a Copper Foil up and down, put press into and be cured and make described high-frequency circuit board, solidification value is 150-300 ℃, and solidifying pressure is 25-70Kg/cm
2
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| PCT/CN2010/075149 WO2012006776A1 (en) | 2010-07-14 | 2010-07-14 | Composite material and high frequency circuit substrate manufactured with the composite material and the manufacturing method thereof |
| CN2010106231660A CN102161823B (en) | 2010-07-14 | 2010-12-22 | Composite material, high-frequency circuit substrate therefrom and manufacture method thereof |
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