CN102155814B - Variable current semiconductor refrigerator - Google Patents
Variable current semiconductor refrigerator Download PDFInfo
- Publication number
- CN102155814B CN102155814B CN201110021019A CN201110021019A CN102155814B CN 102155814 B CN102155814 B CN 102155814B CN 201110021019 A CN201110021019 A CN 201110021019A CN 201110021019 A CN201110021019 A CN 201110021019A CN 102155814 B CN102155814 B CN 102155814B
- Authority
- CN
- China
- Prior art keywords
- resistance
- semiconductor refrigeration
- pin
- temperature
- refrigeration chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 88
- 238000005057 refrigeration Methods 0.000 claims abstract description 69
- 238000000034 method Methods 0.000 claims description 22
- 230000036962 time dependent Effects 0.000 claims description 12
- 230000006698 induction Effects 0.000 claims description 11
- 230000017525 heat dissipation Effects 0.000 claims description 8
- 230000000694 effects Effects 0.000 abstract description 9
- 238000001816 cooling Methods 0.000 abstract description 4
- 239000003990 capacitor Substances 0.000 description 13
- 238000010586 diagram Methods 0.000 description 4
- 230000005679 Peltier effect Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000004378 air conditioning Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000009347 mechanical transmission Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Amplifiers (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to a variable current semiconductor refrigerator. The variable current semiconductor refrigerator is characterized by comprising a semiconductor refrigeration chip, a semiconductor refrigeration chip hot-side radiator, a semiconductor refrigeration chip cold-side radiator, a temperature collector for collecting the hot-side temperature T2 of the semiconductor refrigeration chip and the cold-side temperature T1 of the semiconductor refrigeration chip, an adjustable constant current source for controlling the operation of the semiconductor refrigeration chip and a microprocessor for receiving signals output by the temperature collector and adjusting the output current I of the adjustable constant current source. The invention has the advantages that: the operation current of the semiconductor refrigeration chip is variable, so that operating current is in the optimal operation state all the time, and an obvious energy-saving effect is achieved; the operation current is adjusted, so that the semiconductor refrigeration chip can be operated in the maximum refrigeration capacity state, and the cooling rate is high; and the refrigerator has a simple structure and low cost.
Description
Technical field
The present invention relates to a kind of controller of semiconductor cooler, the time-dependent current semiconductor cooler that utensils such as the refrigerator of particularly a kind of employing semiconductor cooler refrigeration (or heating), water dispenser, air-conditioning are used.
Background technology
Semiconductor refrigerating is to utilize pyroelectric effect to realize a kind of refrigerating method of refrigeration; This refrigerating method does not have mechanical transmission component; The work noiseless does not need refrigeration working medium, and equipment volume is little; Place in light weight, as to be widely used in various refrigeration (heat) utensil or to need refrigeration (heat) conversion to use.The operation principle of semiconductor cooling device is based on Pa Er card principle; Promptly utilize when the circuit of two kinds of different conductors ((p type and n type)) composition and when being connected with direct current, except that Joule heat, also can discharge certain other heat in the joint, another joint then absorbs heat; And the caused this phenomenon of peltier effect is reversible; When changing the sense of current, the joint of heat release and heat absorption also changes thereupon, and absorption and liberated heat are directly proportional with current strength I; And relevant with the temperature T of the character of two kinds of conductors (p, n type) and corresponding joint, that is:
The temperature difference of
-galvanic couple arm; The all-in resistance of
-galvanic couple arm; The overall thermal conductance of
-galvanic couple arm
Because the Energy Efficiency Ratio of semiconductor refrigerating (heat) and running current and the cold and hot end temperature difference have very big relation, when operation, there is best running current.At present when product design, generally confirm a fixing running current value according to standard condition; But in user's use, the semiconductor cooler working conditions change is bigger, and fixed current departs from the operation optimum current mostly; Therefore, the semiconductor cooler Energy Efficiency Ratio is lower.
Summary of the invention
The purpose of this invention is to provide a kind of time-dependent current semiconductor cooler, can regulate its running current automatically, make semiconductor cooler be in optimum Working all the time according to the temperature of the cold and hot end of semiconductor cooler.
For achieving the above object; A kind of scheme of the present invention is to realize like this; It is a kind of time-dependent current semiconductor cooler, it is characterized in that: the Temperature sampler that comprises semiconductor refrigeration chip, semiconductor refrigeration chip hot-side heat dissipation device, semiconductor refrigeration chip cold junction radiator, collection semiconductor refrigeration chip hot-side temperature T2 and semiconductor refrigeration chip cold junction temperature T1; The adjustable constant-flow source and signal that the reception Temperature sampler is exported and the microprocessor of adjusting the output current I in adjustable constant-flow source that also comprise the work of control semiconductor refrigeration chip; Described microprocessor comprises little process chip, first resistance and first electric capacity; A termination dc source after first resistance and first capacitances in series, other end ground connection, its series connection point connects 4 pin of little process chip; The model of little process chip is SN8P2711, and its 6 pin connects the input in said adjustable constant-flow source, and its 1 pin connects dc source, its 14 pin ground connection, the output of the cold junction temperature of its 9 pin jointing temp collector, the output of the hot-side temperature of its 10 pin jointing temp collector.
Another kind of scheme of the present invention is to realize like this; It is a kind of time-dependent current semiconductor cooler; It is characterized in that: comprise semiconductor refrigeration chip, semiconductor refrigeration chip hot-side heat dissipation device, semiconductor refrigeration chip cold junction radiator and Temperature sampler, said Temperature sampler is used to gather semiconductor refrigeration chip hot-side temperature T2, semiconductor refrigeration chip cold junction temperature T1 and with cold or hot spot temperature T 3; The adjustable constant-flow source and signal that the reception Temperature sampler is exported and the microprocessor of adjusting the output current I in adjustable constant-flow source that also comprise the work of control semiconductor refrigeration chip; Described microprocessor comprises little process chip, first resistance and first electric capacity; A termination dc source after first resistance and first capacitances in series, other end ground connection, its series connection point connects 4 pin of little process chip; The model of little process chip is SN8P2711, and its 6 pin connects the input in said adjustable constant-flow source, and its 1 pin connects dc source, its 14 pin ground connection, the output of the cold junction temperature of its 9 pin jointing temp collector, the output of the hot-side temperature of its 10 pin jointing temp collector.
Described Temperature sampler comprises first thermistor of induction cold junction temperature T1, second thermistor, second electric capacity, the 3rd electric capacity, the 3rd resistance and the 4th resistance of induction hot junction temperature T 2; Connect with first thermistor after the 3rd resistance and the second electric capacity parallel connection, its series connection point connects 9 pin of said microprocessor again; Connect with second thermistor after the 4th resistance and the 3rd electric capacity parallel connection, its series connection point connects 10 pin of said microprocessor again; Two series circuits are parallel connection again, the circuit one termination dc source after the parallel connection, other end ground connection.
Described Temperature sampler also comprises three thermistor, five electric capacity and six resistance of induction with cold or hot spot temperature T 3; Connect with the 3rd thermistor again after the 5th electric capacity and the 6th resistance parallel connection; One termination dc source of this series circuit; Other end ground connection, its series connection point connect 11 pin of said microprocessor.
Described adjustable constant-flow source comprises second resistance, the 5th resistance, the 4th electric capacity and amplifying triode; 6 pin of the said microprocessor of one termination of second resistance; One end of the base stage of another termination amplifying triode and the 4th electric capacity; The other end ground connection of the 4th electric capacity and an end of the 5th resistance, the emitter stage of another termination amplifying triode of the 5th resistance, the colelctor electrode of amplifying triode connects the input of semiconductor refrigeration chip.
The present invention compared with prior art has following advantage:
(1) the semiconductor refrigeration chip running current is variable, makes operating current be in optimal operational condition all the time, thereby has remarkable energy saving effect.
(2) through the adjustment running current, semiconductor refrigeration chip is worked under the maximum cooling capacity state, cooling rate is fast.
(3) the present invention is simple in structure, and is with low cost.
Description of drawings
Fig. 1 is the theory diagram of the embodiment of the invention one;
Fig. 2 is the circuit theory diagrams of Fig. 1;
Fig. 3 is the theory diagram of the embodiment of the invention two;
Fig. 4 is the circuit theory diagrams of Fig. 3.
The specific embodiment
To combine accompanying drawing and embodiment that the present invention is done concrete detailed description below:
Embodiment one
As shown in Figure 1; It is a kind of two temperatures feedback-type time-dependent current semiconductor cooler, and characteristics of the present invention are: the Temperature sampler 2 that comprises semiconductor refrigeration chip 4, semiconductor refrigeration chip hot-side heat dissipation device 5, semiconductor refrigeration chip cold junction radiator 6, collection semiconductor refrigeration chip hot-side temperature T2 and semiconductor refrigeration chip cold junction temperature T1; The adjustable constant-flow source 3 and signal that the reception Temperature sampler is exported and the microprocessor 1 of adjusting the output current I in adjustable constant-flow source that also comprise the work of control semiconductor refrigeration chip.
During work; External power source is that semiconductor refrigeration chip 4 provides direct current through the adjustable constant-flow source, and semiconductor refrigeration chip produces peltier effect under galvanic effect, and an end of semiconductor refrigeration chip produces heat; Dispel the heat through semiconductor refrigeration chip hot-side heat dissipation device 5; The other end produces cold, absorbs heat through semiconductor refrigeration chip cold junction radiator 6, for cold or hot spot heat or cold being provided.Microprocessor 1 is adjusted the output current I in adjustable constant-flow source according to cold junction temperature T1 and hot-side temperature T2 output voltage U, thereby adjustment semiconductor refrigeration chip refrigerating capacity forms a closed-loop control process.
As shown in Figure 2, microprocessor 1 comprises little process chip U1, first resistance R 1 and first capacitor C 1; A termination dc source after first resistance and first capacitances in series, other end ground connection, its series connection point connects 4 pin of little process chip; The model of little process chip is SN8P2711; Its 6 pin connects the input in said adjustable constant-flow source 3, and its 1 pin connects dc source, its 14 pin ground connection; The output of the cold junction temperature of its 9 pin jointing temp collector 2, the output of the hot-side temperature of its 10 pin jointing temp collector 2.Temperature sampler 2 comprises the second thermistor HR2, second capacitor C 2, the 3rd capacitor C 3, the 3rd resistance R 3 and the 4th resistance R 4 of the first thermistor HR1, the induction hot junction temperature T 2 of induction cold junction temperature T1; Connect with first thermistor after the 3rd resistance and the second electric capacity parallel connection, its series connection point connects 9 pin of said microprocessor 1 again; Connect with second thermistor after the 4th resistance and the 3rd electric capacity parallel connection, its series connection point connects 10 pin of said microprocessor 1 again; Two series circuits are parallel connection again, the circuit one termination dc source after the parallel connection, other end ground connection.Adjustable constant-flow source 3 comprises second resistance R 2, the 5th resistance R 5, the 4th capacitor C 4 and amplifying triode Q1; 6 pin of the said microprocessor 1 of one termination of second resistance; One end of the base stage of another termination amplifying triode and the 4th electric capacity; The other end ground connection of the 4th electric capacity and an end of the 5th resistance, the emitter stage of another termination amplifying triode of the 5th resistance, the colelctor electrode of amplifying triode connects the input of semiconductor refrigeration chip 4.
During work; The first thermistor HR1 and the second thermistor HR2 gather cold junction temperature T1, and the hot-side temperature T2 of above-mentioned semiconductor refrigeration chip 4 respectively; Microprocessor U1 utilizes two-way ADC to gather T1, T2, and microprocessor is exported the pwm signal of different duty according to the T1 value different with T2 from 6 pin, and this pwm signal will be controlled the adjustable constant-flow source of being made up of second resistance R 2, the 5th resistance R 5, the 4th capacitor C 4 and amplifying triode Q1; The different dutycycle of PWM corresponding the different output current I in adjustable constant-flow source; Wherein, second resistance R 2, the 4th capacitor C 4 play the effect of filter rectification, and amplifying triode Q1 is high-power power discharging device; Play the effect that electric current amplifies, the 5th resistance R 5 is confirmed the static working current of amplifying triode Q1.
Embodiment two
As shown in Figure 3; It is a kind of time-dependent current semiconductor cooler; Characteristics of the present invention are: comprise semiconductor refrigeration chip 4, semiconductor refrigeration chip hot-side heat dissipation device 5, semiconductor refrigeration chip cold junction radiator 6 and Temperature sampler 2, said Temperature sampler 2 is gathered semiconductor refrigeration chip hot-side temperature T2, semiconductor refrigeration chip cold junction temperature T1 and with cold or hot spot temperature T 3; The adjustable constant-flow source 3 and signal that the reception Temperature sampler is exported and the microprocessor 1 of adjusting the output current I in adjustable constant-flow source that also comprise the work of control semiconductor chilling plate.
[0016]During work; External power source is that semiconductor refrigeration chip 4 provides direct current through the adjustable constant-flow source, and semiconductor refrigeration chip produces peltier effect under galvanic effect, and an end of semiconductor refrigeration chip produces heat; Dispel the heat through semiconductor refrigeration chip hot-side heat dissipation device 5; The other end produces cold, absorbs heat through semiconductor refrigeration chip cold junction radiator 6, for cold or hot spot heat or cold being provided.Microprocessor 1 is according to cold junction temperature T1, hot-side temperature T2 and with cold or hot spot temperature T 3 output voltage U, the output current I in adjustment adjustable constant-flow source, thus adjustment semiconductor refrigeration chip refrigerating capacity forms a closed-loop control process.
As shown in Figure 4, microprocessor 1 comprises little process chip U1, first resistance R 1 and first capacitor C 1; A termination dc source after first resistance and first capacitances in series, other end ground connection, its series connection point connects 4 pin of little process chip; The model of little process chip is SN8P2711; Its 6 pin connects the input in said adjustable constant-flow source 3; Its 1 pin connects dc source, its 14 pin ground connection, the output of the cold junction temperature of its 9 pin jointing temp collector 2; The output of the hot-side temperature of its 10 pin jointing temp collector 2, the output of the cold or hot spot temperature of the usefulness of its 11 pin jointing temp collector 2.Temperature sampler 2 comprises that the second thermistor HR2, induction of the first thermistor HR1, the induction cold junction temperature T1 of induction cold junction temperature T1 are with the 3rd thermistor HR3 of cold or hot spot temperature T 3, second capacitor C 2, the 3rd capacitor C 3, the 5th capacitor C 5, the 3rd resistance R 3, the 4th resistance R 4, the 6th resistance R 6; Connect with first thermistor after the 3rd resistance and the second electric capacity parallel connection, its series connection point connects 9 pin of said microprocessor 1 again; Connect with second thermistor after the 4th resistance and the 3rd electric capacity parallel connection, its series connection point connects 10 pin of said microprocessor 1 again; Connect with the 3rd thermistor after the 6th resistance and the 5th electric capacity parallel connection, its series connection point connects 11 pin of said microprocessor 1 again, three series circuits parallel connections again, the circuit one termination dc source after the parallel connection, other end ground connection.Adjustable constant-flow source 3 comprises second resistance R 2, the 5th resistance R 5, the 4th capacitor C 4 and amplifying triode Q1; 6 pin of the said microprocessor 1 of one termination of second resistance; One end of the base stage of another termination amplifying triode and the 4th electric capacity; The other end ground connection of the 4th electric capacity and an end of the 5th resistance, the emitter stage of another termination amplifying triode of the 5th resistance, the colelctor electrode of amplifying triode connects the input of semiconductor refrigeration chip 4.
During work; The first thermistor HR1, the second thermistor HR2, the 3rd thermistor HR3 gather the cold junction temperature T1, hot-side temperature T2 of above-mentioned semiconductor refrigeration chip 4 respectively and with cold or hot spot temperature T 3; Microprocessor U1 utilizes three road ADC to gather T1, T2, T3, and microprocessor is according to the pwm signal of the different value of T1, T2, T3 from 6 pin output different duty, and this pwm signal will be controlled the adjustable constant-flow source of being made up of second resistance R 2, the 5th resistance R 5, the 4th capacitor C 4 and amplifying triode Q1; The different dutycycle of PWM corresponding the different output current I in adjustable constant-flow source; Wherein, second resistance R 2, the 4th capacitor C 4 play the effect of filter rectification, and amplifying triode Q1 is high-power power discharging device; Play the effect that electric current amplifies, the 5th resistance R 5 is confirmed the static working current of amplifying triode Q1.
Claims (2)
1. a time-dependent current semiconductor cooler is characterized in that: the Temperature sampler (2) that comprises semiconductor refrigeration chip (4), semiconductor refrigeration chip hot-side heat dissipation device (5), semiconductor refrigeration chip cold junction radiator (6), collection semiconductor refrigeration chip hot-side temperature T2 and semiconductor refrigeration chip cold junction temperature T1; The adjustable constant-flow source (3) and signal that the reception Temperature sampler is exported and the microprocessor (1) of adjusting the output current I in adjustable constant-flow source that also comprise the work of control semiconductor refrigeration chip; Described microprocessor (1) comprises little process chip (U1), first resistance (R1) and first electric capacity (C1); A termination dc source after first resistance and first capacitances in series, other end ground connection, its series connection point connects 4 pin of little process chip; The model of little process chip is SN8P2711; Its 6 pin connects the input in said adjustable constant-flow source (3), and its 1 pin connects dc source, its 14 pin ground connection; The output of the cold junction temperature of its 9 pin jointing temp collector (2), the output of the hot-side temperature of its 10 pin jointing temp collector.
2. time-dependent current semiconductor cooler; It is characterized in that: comprise semiconductor refrigeration chip (4), semiconductor refrigeration chip hot-side heat dissipation device (5), semiconductor refrigeration chip cold junction radiator (6) and Temperature sampler (2), said Temperature sampler (2) is used to gather semiconductor refrigeration chip hot-side temperature T2, semiconductor refrigeration chip cold junction temperature T1 and with cold or hot spot temperature T 3; The adjustable constant-flow source (3) and signal that the reception Temperature sampler is exported and the microprocessor (1) of adjusting the output current I in adjustable constant-flow source that also comprise the work of control semiconductor refrigeration chip; Described microprocessor (1) comprises little process chip (U1), first resistance (R1) and first electric capacity (C1); A termination dc source after first resistance and first capacitances in series, other end ground connection, its series connection point connects 4 pin of little process chip; The model of little process chip is SN8P2711; Its 6 pin connects the input in said adjustable constant-flow source (3), and its 1 pin connects dc source, its 14 pin ground connection; The output of the cold junction temperature of its 9 pin jointing temp collector (2), the output of the hot-side temperature of its 10 pin jointing temp collector.
3, time-dependent current semiconductor cooler according to claim 1 and 2 is characterized in that: described Temperature sampler (2) comprises first thermistor (HR1) of induction cold junction temperature T1, second thermistor (HR2), second electric capacity (C2), the 3rd electric capacity (C3), the 3rd resistance (R3) and the 4th resistance (R4) of induction hot junction temperature T 2; Connect with first thermistor after the 3rd resistance and the second electric capacity parallel connection, its series connection point connects 9 pin of said microprocessor (1) again; Connect with second thermistor after the 4th resistance and the 3rd electric capacity parallel connection, its series connection point connects 10 pin of said microprocessor again; Two series circuits are parallel connection again, the circuit one termination dc source after the parallel connection, other end ground connection.
4, time-dependent current semiconductor cooler according to claim 2; It is characterized in that: described Temperature sampler (2) also comprises three thermistor (HR3), five electric capacity (C5) and six resistance (R6) of induction with cold or hot spot temperature T 3; Connect with the 3rd thermistor again after the 5th electric capacity and the 6th resistance parallel connection; One termination dc source of this series circuit, other end ground connection, its series connection point connects 11 pin of said microprocessor (1).
5, time-dependent current semiconductor cooler according to claim 1 and 2; It is characterized in that: described adjustable constant-flow source (3) comprises second resistance (R2), the 5th resistance (R5), the 4th electric capacity (C4) and amplifying triode (Q1); 6 pin of the said microprocessor of one termination (1) of second resistance; One end of the base stage of another termination amplifying triode and the 4th electric capacity; The other end ground connection of the 4th electric capacity and an end of the 5th resistance, the emitter stage of another termination amplifying triode of the 5th resistance, the colelctor electrode of amplifying triode connects the input of semiconductor refrigeration chip (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110021019A CN102155814B (en) | 2011-01-19 | 2011-01-19 | Variable current semiconductor refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110021019A CN102155814B (en) | 2011-01-19 | 2011-01-19 | Variable current semiconductor refrigerator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102155814A CN102155814A (en) | 2011-08-17 |
| CN102155814B true CN102155814B (en) | 2012-08-29 |
Family
ID=44437401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110021019A Active CN102155814B (en) | 2011-01-19 | 2011-01-19 | Variable current semiconductor refrigerator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102155814B (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103438630B (en) * | 2013-09-06 | 2016-08-24 | 广东富信科技股份有限公司 | Semiconductor refrigeration system control method and semiconductor refrigeration system |
| CN104329898B (en) * | 2014-03-28 | 2017-01-18 | 海尔集团公司 | Semiconductor refrigerator and power supply voltage control method for semiconductor refrigeration chip of semiconductor refrigerator |
| CN104329900B (en) * | 2014-03-28 | 2017-03-29 | 海尔集团公司 | A kind of control system for semiconductor freezer |
| CN105091399A (en) * | 2014-05-20 | 2015-11-25 | 中兴通讯股份有限公司 | Refrigeration circuit, terminal and terminal refrigeration method |
| CN104180576B (en) * | 2014-09-03 | 2016-08-17 | 四川航天***工程研究所 | Cryogenic semiconductor refrigerator and the method providing linear voltage for its cooling piece |
| CN105716341B (en) * | 2014-12-01 | 2019-05-31 | 青岛海尔特种电冰柜有限公司 | Semiconductor refrigerating equipment and its temprature control method |
| CN109405378B (en) * | 2017-08-15 | 2021-08-31 | 珠海市联电科技有限公司 | Work control method of semiconductor refrigeration sheet and dehumidifier |
| WO2019127608A1 (en) * | 2017-12-31 | 2019-07-04 | 鄞楠 | Uv light booth having heat dissipating function |
| CN109323482B (en) * | 2018-10-24 | 2020-08-11 | 中国石油天然气集团有限公司 | Semiconductor refrigerator and refrigeration control method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4014178A (en) * | 1976-05-03 | 1977-03-29 | Kells John D | Refrigerator temperature controls |
| US5572873A (en) * | 1995-03-02 | 1996-11-12 | Emertech Incorporated | Carrier method and apparatus for maintaining pharmaceutical integrity |
| US6470696B1 (en) * | 2001-09-18 | 2002-10-29 | Valerie Palfy | Devices and methods for sensing condensation conditions and for removing condensation from surfaces |
| CN2733327Y (en) * | 2004-08-31 | 2005-10-12 | 中国科学院安徽光学精密机械研究所 | Totally digitalized multipoint temperature monitoring system based on intelligent temperature sensor |
| CN201926226U (en) * | 2011-01-19 | 2011-08-10 | 顺德职业技术学院 | Varying circuit semiconductor refrigerator |
-
2011
- 2011-01-19 CN CN201110021019A patent/CN102155814B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4014178A (en) * | 1976-05-03 | 1977-03-29 | Kells John D | Refrigerator temperature controls |
| US5572873A (en) * | 1995-03-02 | 1996-11-12 | Emertech Incorporated | Carrier method and apparatus for maintaining pharmaceutical integrity |
| US6470696B1 (en) * | 2001-09-18 | 2002-10-29 | Valerie Palfy | Devices and methods for sensing condensation conditions and for removing condensation from surfaces |
| CN2733327Y (en) * | 2004-08-31 | 2005-10-12 | 中国科学院安徽光学精密机械研究所 | Totally digitalized multipoint temperature monitoring system based on intelligent temperature sensor |
| CN201926226U (en) * | 2011-01-19 | 2011-08-10 | 顺德职业技术学院 | Varying circuit semiconductor refrigerator |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102155814A (en) | 2011-08-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102155814B (en) | Variable current semiconductor refrigerator | |
| CN201926226U (en) | Varying circuit semiconductor refrigerator | |
| CN201699105U (en) | Thermal management device of battery | |
| CN204087018U (en) | A kind of temperature control system of semiconductor laser | |
| CN107883622B (en) | Self-adaptive power control condensation dehumidification method | |
| CN104062990A (en) | Noise reduction and temperature control system based on semiconductor refrigeration mechanism | |
| CN101872107A (en) | Refrigerating plant for heat dissipation of surveillance camera | |
| CN102778906B (en) | Dual-stage thermostatical control semiconductor laser | |
| CN107588576A (en) | The thermoelectric cooling power optimization regulating system and method for high precision temperature control | |
| CN211698735U (en) | Control system of semiconductor temperature adjusting device | |
| CN201322491Y (en) | Novel durable multi-function semiconductor refrigerating-and-heating box | |
| CN201266326Y (en) | Temperature and temperature change rate control compensation apparatus | |
| CN103227411B (en) | A kind of distinguished and admirable pair causes constant temperature laser and constant temperature method thereof | |
| CN204808071U (en) | No surge semiconductor laser temperature control system based on H bridge circuit | |
| CN202306359U (en) | Working temperature regulating and controlling circuit device of outdoor cabinet | |
| CN204259262U (en) | A kind of overtemperature protection module of LED actuation temperature warning circuit | |
| CN201985430U (en) | Thermoelectric refrigerating system | |
| CN204576313U (en) | The permanent low temperature automatic control device of a kind of electronic equipment | |
| CN110985428B (en) | Cooling fan drive circuit and cooking utensil | |
| CN204254926U (en) | Intelligent and high-efficiency environmental protection is cold and hot can utilize system simultaneously | |
| CN112327967B (en) | Temperature control device and method of power device and electrical equipment | |
| CN104331110A (en) | Greenhouse temperature adjusting method based on semiconductor temperature control system | |
| CN102495648B (en) | Temperature regulating device and temperature instrument checking device with same | |
| CN101860329A (en) | High-power professional audio power amplifier based on Peltier effect radiation technology | |
| CN201622742U (en) | Semiconductor cooling and heating training device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: GUANGDONG LONGWEI ELECTRIC CO., LTD. Free format text: FORMER OWNER: SHUNDE VOCATIONAL-TECHNICAL COLLEGE Effective date: 20150205 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20150205 Address after: 528300 Guangdong Province, Foshan city Shunde District Lunjiao Street Chung Hei Industrial Zone Longwei Road No. 1 Patentee after: Guangdong Longwei Electronics Co. Ltd. Address before: 528300 Guangdong Province, Foshan city Shunde District Daliang Desheng Road Patentee before: Shunde Vocational-Technical College |
|
| ASS | Succession or assignment of patent right |
Owner name: GUANGDONG KEZHIWEI ELECTRONICS CO., LTD. Free format text: FORMER OWNER: GUANGDONG LONGWEI ELECTRIC CO., LTD. Effective date: 20150901 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20150901 Address after: 528300 Guangdong Province, Foshan city Shunde District Lunjiao Street office Xi Yong Cun Wei Hui Wei 1 No. six Patentee after: Guangdong techrich Wei Electronics Co. Ltd. Address before: 528300 Guangdong Province, Foshan city Shunde District Lunjiao Street Chung Hei Industrial Zone Longwei Road No. 1 Patentee before: Guangdong Longwei Electronics Co. Ltd. |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160401 Address after: 528300, No. 18, Xinhui Road, Daliang street, Shunde District, Guangdong, Foshan, two Patentee after: Foshan Shunde Homesun Electric Appliance Co., Ltd. Address before: 528300 Guangdong Province, Foshan city Shunde District Lunjiao Street office Xi Yong Cun Wei Hui Wei 1 No. six Patentee before: Guangdong techrich Wei Electronics Co. Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20201203 Address after: 528333 no.18-5, Xinhui Road, Wusha neighborhood committee, Daliang sub district office, Shunde District, Foshan City, Guangdong Province Patentee after: Foshan Shunde Dapan Electrical Appliance Industry Co.,Ltd. Address before: 528300, No. 18, Xinhui Road, Daliang street, Shunde District, Guangdong, Foshan, two Patentee before: HOMESUN ELECTRIC APPLIANCE Co.,Ltd. |