CN102155729A - Heat dissipation method of LED (light-emitting diode) device and device - Google Patents
Heat dissipation method of LED (light-emitting diode) device and device Download PDFInfo
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- CN102155729A CN102155729A CN201110108240XA CN201110108240A CN102155729A CN 102155729 A CN102155729 A CN 102155729A CN 201110108240X A CN201110108240X A CN 201110108240XA CN 201110108240 A CN201110108240 A CN 201110108240A CN 102155729 A CN102155729 A CN 102155729A
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Abstract
The invention discloses a heat dissipation method of an LED (light-emitting diode) device, which comprises the following steps of: conducting the heat of the LED device into a phase change material which emits heat with the external environment. The invention also discloses a heat sink of the LED device; the heat sink comprises a metal shell, a heat dissipation baseboard and a heat-conducting fin, wherein the metal shell is internally filled with the phase change material, and the heat dissipation baseboard is connected with the metal shell by the heat-conducting fin. The invention also discloses another heat sink of the LED device; the heat sink comprise the metal shell, the heat dissipation baseboard, a heat pipe and a metal outer cover, wherein the metal shell and the metal outer cover are internally filled with the phase change material, and the heat dissipation baseboard is connected with the metal shell by the heat pipe. The phase change materials of the invention is a composite phase change material of an organic matter and an inorganic metal, has faster heat response rate and heat storage capacity, can rapidly absorb the heat generated by the LED device, and controls the junction temperature of the LED device to be within 60 DEG C, thereby avoiding the luminous decay phenomenon caused by the overheating of the LED device and prolonging the service life of the LED device.
Description
Technical field
The present invention relates to the heat dissipation technology field of electric light source, be specifically related to a kind of heat dissipating method and device of LED device.
Background technology
Countries in the world are the Application and Development of the LED key construction project as national energy-conserving and environment-protective, and list in the national budget.Along with the fast development of LED technology, the caloric value and the heat flow density of LED device significantly improve, and the ubiquitous application obstacle of LED device is exactly that the LED junction temperature is too high.At present, the junction temperature of LED device still is about 70 ℃, and the best junction temperature of LED device is below 60 ℃, and the too high meeting of junction temperature causes a series of problems such as light decay phenomenon, reduction in service life, makes the application of LED device be subjected to the restriction that is difficult to go beyond.Especially for the high-power LED device, the too high phenomenon of junction temperature is more outstanding.The technical scheme of current solution LED device heat radiation is concluded two kinds, and a kind of is to increase external connection radiating device, and another kind is to adopt heat pipe and radiating component.But shortcomings such as radiating effect is poor, manufacturing cost height that prior art mainly exists can't satisfy the radiating requirements of LED device.
Summary of the invention
The objective of the invention is to overcome the deficiencies in the prior art, a kind of heat dissipating method of LED device of stable, quick heat absorption is provided, can be applied to various lighting apparatus and display device, dispel the heat for the LED device of equipment.
A kind of heat dissipating method of LED device comprises the steps:
(1) heat with the LED device is transmitted in the phase-change material;
(2) with the heat diffusion in the phase-change material in environment.
The heat dissipating method of a kind of LED device of the present invention comprises that also the heat of LED device is transmitted on the radiating bottom plate, and metal conducting strip or heat pipe are with the heat transferred metal shell and the phase-change material of radiating bottom plate then.
The mode of the heat diffusion of phase-change material of the present invention in the environment is for utilizing the metal shell heat radiation, utilize heat pipe heat radiation or utilizing the fan forced convection heat radiation.
Phase-change material of the present invention is the composite phase-change material of organic matter and inorganic metal, and phase transition temperature is 30 ~ 65 ℃; In the described composite phase-change material, organic quality percentage composition is 40 ~ 95%.
Organic matter of the present invention is one or more of saturated fatty acid or linear paraffin; Described inorganic metal is inorganic porous material such as expanded graphite, sepiolite, zeolite, active carbon or CNT, and porous metals such as foamed aluminium, foam copper, nickel foam or foam silver.
The molecular formula of saturated fatty acid of the present invention is: CH
3(CH
2)
nCOOH, n=8,10,12,14,16; The molecular formula of described linear paraffin is: C
nH
2n+2, n is 20～40.
The present invention also provides a kind of heat abstractor of LED device, comprises radiating bottom plate 1, conducting strip 2 and metal shell 3; Described metal shell 3 outer surfaces have annular fin, bar shaped fin or three-dimensional rib plate; The connected mode of described fin and metal shell is Integratively formed or welding; Described radiating bottom plate 1 is connected by conducting strip 2 with metal shell 3; Be filled with composite phase-change material 4 in the described metal shell 3.
The present invention also provides the heat abstractor of another kind of LED device, comprises radiating bottom plate 1, heat pipe 6, metal shell 3 and metal housing 5; Described metal shell 3 outer surfaces have annular fin, bar shaped fin or three-dimensional rib plate; The connected mode of described fin and metal shell is Integratively formed or welding; Described radiating bottom plate 1 is connected by heat pipe 6 with metal shell 3, and the condensation end of heat pipe 6 is connected with metal shell 3, and the evaporation ends of heat pipe is connected with radiating bottom plate 1; Fill composite phase-change material 4 respectively in described metal shell 3 and the metal housing 5.
The material of radiating bottom plate of the present invention, metal shell, metal housing and heat pipe is aluminium, aluminium alloy, copper or copper alloy.
Conducting strip of the present invention and the connected mode of radiating bottom plate and metal shell are that bonding, welding or bolt are connected, and contact-making surface scribbles heat-conducting glue; Described heat pipe and the connected mode of radiating bottom plate and metal shell are that bonding, welding or bolt are connected, and contact-making surface scribbles heat-conducting glue.
The present invention compared with prior art has following beneficial effect:
1. but the heat that the present invention fast Absorption LED device sends makes the junction temperature of LED be stabilized in below 60 ℃, prolongs the service life of LED device;
2. heat dissipating method of the present invention, heat absorption is quick, and stable and reliable operation can make the heat dissipation problem that solves the LED device, especially is fit to the heat radiation of great power LED device;
3. heat dissipating method of the present invention, the phase-change material that adopts is that phase transition temperature is at the organic matter of 30 ~ 65 ℃ of scopes and the composite phase-change material of inorganic metal, this material has the typing phase transformation, density is less, heat storage capacity is strong (the phase transformation enthalpy is more than 120kJ/kg), the fast advantages such as (thermal conductivity factor are greater than 4W/mK) of heat conduction, metal material consumption and the weight that reduces the LED device more than 50% can be saved, the heat radiation needs of LED device can be better adapted to.
Description of drawings
Fig. 1 is a Principle of Process schematic diagram of the present invention.
Fig. 2 is the structural representation of the heat abstractor of one embodiment of the invention, and wherein: 1 is that radiating bottom plate, 2 is conducting strip, and 3 is metal shell, and 4 is the composite phase-change material of filling in the metal shell 3.
Fig. 3 is the structural representation of the heat abstractor of another embodiment of the present invention, and wherein: 1 is that radiating bottom plate, 6 is that heat pipe, 3 is metal shell, and 5 is metal housing, and 4 is the composite phase-change materials of filling in metal shell 3 and the metal housing 5.
The specific embodiment
In order to make those skilled in the art person better understand the present invention program, the present invention is further detailed explanation below in conjunction with accompanying drawing, but embodiments of the present invention are not limited only to this.
The heat dissipating method of LED device of the present invention and device can be applied to various lighting apparatus and display device, dispel the heat for the LED device of equipment.
As shown in Figure 1, heat dissipating method of the present invention mainly may further comprise the steps: (1) is transmitted to the heat of LED device in the phase-change material; (2) with the heat diffusion in the phase-change material in environment.
Phase-change material of the present invention can fast Absorption LED device heat, reduce the junction temperature of LED device, can save heat sink material again simultaneously.After the heat of LED device was delivered in the phase-change material, phase-change material was with the heat transferred metal shell, and the outer surface of dependence metal shell contacts with air and dispels the heat.Heat dissipating method of the present invention can be applicable to different occasions, is two kinds of Application Examples of this heat dissipating method below:
Embodiment 1
As shown in Figure 2, this embodiment is fit to the heat radiation of common LED lighting apparatus.The heat abstractor of LED device of the present invention comprises radiating bottom plate 1, conducting strip 2, metal shell 3; Metal shell 3 outer surfaces have annular fin; The annular fin is welded on the metal shell; Radiating bottom plate 1 is connected by conducting strip 2 with metal shell 3; Fill composite phase-change material 4 in the metal shell 3.
The employing phase transition temperature is that the composite phase-change material of paraffin/expanded graphite of 52 ° of C is filled in the metal shell, and the LED lamp power is 2W.The heat of LED light fixture is transmitted to earlier on the radiating bottom plate, and radiating bottom plate is again with the heat transferred metal shell, and when the metal shell outer surface dispelled the heat, unnecessary heat can be absorbed by the phase-change material in the metal shell.When environment temperature is 40 ° of C, the work of LED light fixture is after 2 hours, the temperature of metal shell and environment contact-making surface reaches 45 ° of C, and temperature reaches 52 ° of C on the contact-making surface of metal shell and radiating bottom plate, and the radiating bottom plate temperature reaches 54 ° of C, phase-change material temperature reaches 52 ° of C, phase-change material absorbs heat and undergoes phase transition, and is solid-solid phase-change on the macroscopic view, and the volume of phase-change material does not change, but what take place on the microcosmic is solid-liquid phase change, and phase-change material stores heat.Work after 10 hours, the temperature of metal shell and environment contact-making surface reaches 48 ° of C, temperature stabilization is at 54 ° of C on the contact-making surface of metal shell and radiating bottom plate, phase-change material temperature is stabilized in 52 ° of C, the radiating bottom plate temperature stabilization is at 56 ° of C, and this radiating mode can be controlled at the junction temperature of LED lamp 60 ° below the C.
As shown in Figure 3, this embodiment is fit to the heat radiation of band lampshade LED lighting apparatus.The heat abstractor of LED device of the present invention comprises radiating bottom plate 1, conducting strip 2, metal shell 3 and metal housing 5, and metal shell 3 outer surfaces have the bar shaped fin, and fin and metal shell are Integratively formed; Radiating bottom plate 1 is connected by heat pipe 6 with metal shell 3, and the condensation end of heat pipe 6 is connected with metal shell 3, and the evaporation ends of heat pipe is connected with radiating bottom plate 1; Fill composite phase-change material 5 in metal shell and the metal housing respectively.
The employing phase transition temperature is that the composite phase-change material of paraffin/expanded graphite of 52 ° of C is filled in the metal shell, and the employing phase transition temperature is that the Composite Paraffin material of 45 ° of C is filled in the metal housing, and the power of LED light fixture is 50W.The heat of LED light fixture is transmitted on the radiating bottom plate earlier, radiating bottom plate is again with the heat transferred metal shell, when the metal shell outer surface dispels the heat, a unnecessary heat wherein part can be absorbed by the phase-change material in the metal shell, another part is absorbed by metal housing, metal housing also can dissipate the part heat to environment, and unnecessary heat is absorbed by the phase-change material in the metal housing again.When environment temperature is 35 ° of C, the work of LED light fixture is after 3 hours, metal housing case surface temperature stabilization is at 43 ° of C, the temperature of metal shell and environment contact-making surface reaches 45 ° of C, temperature reaches 52 ° of C on the contact-making surface of metal shell and radiating bottom plate, the radiating bottom plate temperature reaches 54 ° of C, phase-change material temperature in the metal shell reaches 52 ° of C and undergoes phase transition, phase-change material also undergoes phase transition when temperature reaches 45 ° of C in the metal housing, it on the macroscopic view solid-solid phase-change, the volume of phase-change material does not change, but what take place on the microcosmic is solid-liquid phase change, and phase-change material stores heat.Work after 24 hours, metal housing case surface temperature stabilization is at 43 ° of C, the temperature of metal shell and environment contact-making surface reaches 48 ° of C, temperature stabilization is at 54 ° of C on the contact-making surface of metal shell and radiating bottom plate, phase-change material temperature is stabilized in 52 ° of C, the radiating bottom plate temperature stabilization is at 56 ° of C, and this radiating mode can be controlled at the junction temperature of LED lamp 60 ° below the C.
Claims (10)
1. the heat dissipating method of a LED device is characterized in that, comprises the steps:
(1) heat with the LED device is transmitted in the phase-change material;
(2) with the heat diffusion in the phase-change material in environment.
2. the heat dissipating method of a kind of LED device according to claim 1 is characterized in that, this method comprises that also the heat of LED device is transmitted on the radiating bottom plate, and metal conducting strip or heat pipe are with the heat transferred metal shell and the phase-change material of radiating bottom plate then.
3. the heat abstractor of a kind of LED device according to claim 1 is characterized in that, the mode of the heat diffusion of phase-change material in the environment is for utilizing the metal shell heat radiation, utilize heat pipe heat radiation or utilizing the fan forced convection heat radiation.
4. the heat dissipating method of a kind of LED device according to claim 1 is characterized in that, described phase-change material is the composite phase-change material of organic matter and inorganic metal, and phase transition temperature is 30 ~ 65 ℃; In the described composite phase-change material, organic quality percentage composition is 40 ~ 95%.
5. according to the heat dissipating method of the described a kind of LED device of one of claim 1 ~ 4, it is characterized in that described organic matter is one or more of saturated fatty acid or linear paraffin; Described inorganic metal is inorganic porous material such as expanded graphite, sepiolite, zeolite, active carbon or CNT, and porous metals such as foamed aluminium, foam copper, nickel foam or foam silver.
6. the heat dissipating method of a kind of LED device according to claim 5 is characterized in that, the molecular formula of described saturated fatty acid is: CH
3(CH
2)
nCOOH, n=8,10,12,14,16; The molecular formula of described linear paraffin is: C
nH
2n+2, n is 20～40.
7. the heat abstractor of a LED device is characterized in that, comprises radiating bottom plate (1), conducting strip (2) and metal shell (3); Described metal shell (3) outer surface has annular fin, bar shaped fin or three-dimensional rib plate; The connected mode of described fin and metal shell is Integratively formed or welding; Described radiating bottom plate (1) is connected by conducting strip (2) with metal shell (3); Be filled with composite phase-change material (4) in the described metal shell (3).
8. the heat abstractor of a LED device is characterized in that, comprises radiating bottom plate (1), heat pipe (6), metal shell (3) and metal housing (5); Described metal shell (3) outer surface has annular fin, bar shaped fin or three-dimensional rib plate; The connected mode of described fin and metal shell is Integratively formed or welding; Described radiating bottom plate (1) is connected by heat pipe (6) with metal shell (3), and the condensation end of heat pipe (6) is connected with metal shell (3), and the evaporation ends of heat pipe (6) is connected with radiating bottom plate (1); Fill composite phase-change material (4) respectively in described metal shell (3) and the metal housing (5).
9. according to the heat abstractor of claim 7 and 8 described LED devices, it is characterized in that the material of described radiating bottom plate, metal shell, metal housing, conducting strip and heat pipe is aluminium, aluminium alloy, copper or copper alloy.
10. according to the heat abstractor of claim 7 and 8 described LED devices, it is characterized in that described conducting strip and the connected mode of radiating bottom plate and metal shell are that bonding, welding or bolt are connected, contact-making surface scribbles heat-conducting glue; Described heat pipe and the connected mode of radiating bottom plate and metal shell are that bonding, welding or bolt are connected, and contact-making surface scribbles heat-conducting glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110108240XA CN102155729A (en) | 2011-04-28 | 2011-04-28 | Heat dissipation method of LED (light-emitting diode) device and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110108240XA CN102155729A (en) | 2011-04-28 | 2011-04-28 | Heat dissipation method of LED (light-emitting diode) device and device |
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| CN102155729A true CN102155729A (en) | 2011-08-17 |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102352997A (en) * | 2011-10-27 | 2012-02-15 | 贵州光浦森光电有限公司 | LED lamp bulb with radiator and method for forming lighting lamp based on same |
| CN102407931A (en) * | 2011-09-28 | 2012-04-11 | 华南理工大学 | Method and device for regulating cabin temperature of energy-saving ship |
| CN102548361A (en) * | 2011-12-21 | 2012-07-04 | 华中科技大学 | Heat dissipation device using latent heat functional fluid and heat dissipation method thereof |
| CN102833990A (en) * | 2012-09-24 | 2012-12-19 | 山东大学 | Heat dissipation device and heat dissipation method for temperature control through thermo-chemical method |
| CN103438411A (en) * | 2013-09-22 | 2013-12-11 | 陈云芽 | LED (light-emitting diode) radiator |
| CN103940268A (en) * | 2014-04-23 | 2014-07-23 | 浙江大学 | Combined energy storage temperature control system based on low-temperature alloy |
| CN104565946A (en) * | 2015-01-19 | 2015-04-29 | 华南理工大学 | Large-power LED lamp based on compound phase-change energy storing material radiating |
| CN104713046A (en) * | 2015-04-15 | 2015-06-17 | 厦门理工学院 | LED cooling lampshade |
| CN105825783A (en) * | 2016-04-29 | 2016-08-03 | 广东欧珀移动通信有限公司 | Display screen bracket and terminal |
| CN106524090A (en) * | 2016-11-18 | 2017-03-22 | 桑夏太阳能股份有限公司 | Round tube type heat tube nest radiator for high power LED cooling |
| CN106904262A (en) * | 2017-03-10 | 2017-06-30 | 上海船舶研究设计院（中国船舶工业集团公司第六〇四研究院） | A kind of marine cabin phase transformation absorption systems |
| CN106931382A (en) * | 2017-03-29 | 2017-07-07 | 华南理工大学 | A kind of heat dissipation element for LED car lamp and preparation method thereof |
| CN113082239A (en) * | 2021-03-30 | 2021-07-09 | 湖北协进半导体科技有限公司 | LED sterilization and disinfection lamp with double-ultraviolet-light-gain interlayer packaging |
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Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102407931B (en) * | 2011-09-28 | 2013-11-13 | 华南理工大学 | Method and device for regulating cabin temperature of energy-saving ship |
| CN102407931A (en) * | 2011-09-28 | 2012-04-11 | 华南理工大学 | Method and device for regulating cabin temperature of energy-saving ship |
| CN102352997A (en) * | 2011-10-27 | 2012-02-15 | 贵州光浦森光电有限公司 | LED lamp bulb with radiator and method for forming lighting lamp based on same |
| CN102352997B (en) * | 2011-10-27 | 2014-08-13 | 贵州光浦森光电有限公司 | LED lamp bulb with radiator and method for forming lighting lamp based on same |
| CN102548361B (en) * | 2011-12-21 | 2014-12-10 | 华中科技大学 | Heat dissipation device using latent heat functional fluid and heat dissipation method thereof |
| CN102548361A (en) * | 2011-12-21 | 2012-07-04 | 华中科技大学 | Heat dissipation device using latent heat functional fluid and heat dissipation method thereof |
| CN102833990A (en) * | 2012-09-24 | 2012-12-19 | 山东大学 | Heat dissipation device and heat dissipation method for temperature control through thermo-chemical method |
| CN103438411A (en) * | 2013-09-22 | 2013-12-11 | 陈云芽 | LED (light-emitting diode) radiator |
| CN103438411B (en) * | 2013-09-22 | 2016-07-06 | 陈云芽 | A kind of LED radiator |
| CN103940268B (en) * | 2014-04-23 | 2016-03-02 | 浙江大学 | Based on the energy storage combined type temperature-controlling system of low-temperature alloy |
| CN103940268A (en) * | 2014-04-23 | 2014-07-23 | 浙江大学 | Combined energy storage temperature control system based on low-temperature alloy |
| CN104565946A (en) * | 2015-01-19 | 2015-04-29 | 华南理工大学 | Large-power LED lamp based on compound phase-change energy storing material radiating |
| CN104713046A (en) * | 2015-04-15 | 2015-06-17 | 厦门理工学院 | LED cooling lampshade |
| CN105825783A (en) * | 2016-04-29 | 2016-08-03 | 广东欧珀移动通信有限公司 | Display screen bracket and terminal |
| CN106524090A (en) * | 2016-11-18 | 2017-03-22 | 桑夏太阳能股份有限公司 | Round tube type heat tube nest radiator for high power LED cooling |
| CN106904262A (en) * | 2017-03-10 | 2017-06-30 | 上海船舶研究设计院（中国船舶工业集团公司第六〇四研究院） | A kind of marine cabin phase transformation absorption systems |
| CN106904262B (en) * | 2017-03-10 | 2019-07-16 | 上海船舶研究设计院（中国船舶工业集团公司第六〇四研究院） | A kind of marine cabin phase transformation absorption systems |
| CN106931382A (en) * | 2017-03-29 | 2017-07-07 | 华南理工大学 | A kind of heat dissipation element for LED car lamp and preparation method thereof |
| CN113082239A (en) * | 2021-03-30 | 2021-07-09 | 湖北协进半导体科技有限公司 | LED sterilization and disinfection lamp with double-ultraviolet-light-gain interlayer packaging |
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Application publication date: 20110817 |