CN102154669A - Method for plating thick soft gold by utilizing plating thin golden cylinder - Google Patents
Method for plating thick soft gold by utilizing plating thin golden cylinder Download PDFInfo
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- CN102154669A CN102154669A CN 201110075454 CN201110075454A CN102154669A CN 102154669 A CN102154669 A CN 102154669A CN 201110075454 CN201110075454 CN 201110075454 CN 201110075454 A CN201110075454 A CN 201110075454A CN 102154669 A CN102154669 A CN 102154669A
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Abstract
The invention relates to a method for plating thick soft gold by utilizing a plating thin gold cylinder. The technical key point is that the method comprises the following steps: surface treatment, deoiling, washing, micro-etching, washing, nickel plating, washing by pure water and gold plating. The method is characterized in that during the gold plating, the plating time is 2 minutes, after a plating plate enters the cylinder, current is input, a current value is counted according to the plated area, when the plated time is 80-130 seconds, the current is zeroed out, and after two seconds, the current is input again, in the way, the current is repeatedly input to a plating solution, so that the positive and negative electrodes of the plating solution repeatedly exist, the positive electrode in the plating solution is agglutinated, and a gold-plated layer can reach the required thickness by adjusting the times of inputting current into the plating solution. In the method disclosed by the invention, the plating thin gold cylinder is used for direct plating thick soft gold, therefore, the production cost is reduced, the profit is improved, the quantity of thick soft gold produced by one time is not limited, various requirements of clients can be met, and the market prospect is wide. The method disclosed by the invention belongs to the technical field of plating.
Description
Technical field
The present invention relates to a kind of electric plating method, specifically, is a kind of method of electroplating the thin soft gold of golden cylinder plating thick of utilizing, and belongs to the electroplating technology field.
Technical background
Wiring board client in making processes often require to electroplate hard gold or soft gold at circuit board surface.Hard gold is general to be electroplated at finger or button place, helps friction like this, and thickness can reach 60 microinchs, but it needs " bus bar " to reach interconnection, therefore is subjected to high-density printed board SMT that restriction is installed.Soft gold adopts the flash method; has good bonding effect; and coating is smooth; contact resistance is low; weldability is good; advantage such as wear-resisting; be particularly suitable for the printed board of routing technology; particularly along with the miniaturization of printed board lead; the development of small-boreization; soft gold layer becomes indispensable coating, but electrical equipment in the market mostly is the thin soft gold of plating, and promptly space of a whole page gold layer is the 24K proof gold; thickness of coating is 0.01-0.05um; it has good electrical conductivity and weldability, the coating uniform and delicate, and purity and internal stress are low; inferior product adaptation is in routing; cause barrier propterty to degenerate but the gold layer is too thin, influenced the reliability of system after electron device is installed, stability and security; the PAD that particularly present wiring board need be bound is more and more smart little; generally all needing soft golden thickness is the above coating of 0.05um, promptly thick soft gold layer, and it not only has outside the advantage of thin soft gold; also has the reliability that the protection electron device is installed the back system, advantages such as stability and security.Particularly increase golden layer thickness, reach and wear-resistingly to wipe again by routing, be not damaged with protection components and parts position weld layer for some crucial connector components.
Adopt the high speed gold plating liquid and plate thick gold thread, by change equipment, liquid medicine becomes to grade and reaches its thick metal plated requirement, to produce thick soft gold for this reason, the thin gold thread of original production just can not satisfy its requirement, and this just needs to drop into the soft golden production line of plating thick, but has the cost of investment height, and property production for once will reach some amount, just can recoup capital outlay.Like this, production for the soft gold of those short run plating thick, there is this production cost height, problems such as profit is low, limited the development of manufacturer, simultaneously also brought inconvenience, therefore pressed for a kind of equipment that promptly do not increase and invest the production method that can satisfy the thick soft gold of customer requirement again with other to the user.
Summary of the invention
At the problems referred to above, the present invention discloses a kind of production line that do not need to increase, and makes anodal aggegation in the electroplate liquid by giving the plating bath received current repeatedly, by adjusting the number of times of giving the electroplate liquid received current, makes Gold plated Layer reach the method for required thickness
Technical scheme of the present invention is such: a kind of method of electroplating the thin soft gold of golden cylinder plating thick of utilizing, comprise the steps: to show the limit successively and handle oil removing, washing, microetch, washing, electronickelling, pure water is washed, and electrogilding is characterized in that, during electrogilding, electroplating time is set at 2 minutes, and received current made zero electric current when being subjected to 80～130 seconds plating time according to being subjected to the long-pending current value that is calculated of surfacing after the plating plate advanced cylinder, received current again after 2 seconds, make the plating bath positive and negative electrode exist repeatedly for so repeatedly the plating bath received current, cause the anodal aggegation in the electroplate liquid, Gold plated Layer thickens, by adjusting the number of times of giving the electroplate liquid received current, make Gold plated Layer reach required thickness.
Above-mentioned a kind of method of electroplating the thin soft gold of golden cylinder plating thick of utilizing, wherein, described electrogilding liquid composition is KAu (CN)
2, conducting salt, gloss-imparting agent, stablizer.
Further, above-mentioned a kind of method of electroplating the thin soft gold of golden cylinder plating thick of utilizing, wherein, described electrogilding liquid conducting salt is a Citrate trianion, and gloss-imparting agent is the nickel gloss-imparting agent, and stablizer is a Fe stabilizer.
Further, above-mentioned a kind of method of electroplating the thin soft gold of golden cylinder plating thick of utilizing is characterized in that the pH value scope of described electrogilding liquid is 3.9～4.2, and degree Beaume is 5～6.7, and Au content is that 0.8～1.2g/L, temperature are room temperature.
Further, above-mentioned a kind of method of electroplating the thin soft gold of golden cylinder plating thick of utilizing, wherein, the pH value of described electrogilding liquid is 4.0, degree Beaume is 5.5, Au content is 1.0g/L.
Above-mentioned a kind of method of electroplating the thin soft gold of golden cylinder plating thick of utilizing is characterized in that described current density parameter is 0.6～1.2 ASD.
Principle of the present invention is: electroplate the galvanic effect by the external world that refers to, in solution, carry out electrolytic reaction, make electrical conductor for example metallic surface deposit a metal or alloy layer, the positive and negative electrode that is about to galvanic current is wired to respectively on the cathode and anode of plating, when direct current passes through the electrolytic solution of two electrodes and two interpolar metal ion, yin, yang ion in the electroplate liquid is owing to be subjected to electric field action, steady shift takes place, negatively charged ion is shifted to anode, positively charged ion is shifted to negative electrode, and this phenomenon is " electromigration ".At this moment, metal ion reduce deposition on negative electrode becomes coating, and anodic oxidation is an ion with metal transfer.
Thickness of coating and electroplating current and electroplating time are proportional, and influence the electrolytic coating quality simultaneously and also have: the component content of plating bath, pH value, current parameters, temperature or the like, electroplating voltage or electric power and thickness of coating do not have direct relation.
Electrogilding is the anodal aggegation in containing golden electrolytic solution, exists as long as guarantee positive and negative electrode, and the accumulation of gold will continue, and golden layer thickness can infinite thickness on the principle, and thickness 2-40U " does not wait.
Prior art is compared, and the present invention has following advantage:
1. not needing additionally increases investment in fixed assets again, has reduced production cost, has improved rate of profit;
2. to the quantity of the thick soft gold of disposable production without limits, can satisfy user's various demands;
3. the thick soft gold of being produced is best in quality, and the electron device behind the soft gold of plating thick can punch, and is more wear-resisting again, and the reliability of back system is installed, and stability and security are good.
Embodiment
The present invention is described in further detail below in conjunction with specific embodiment, but do not constitute any limitation of the invention.
Embodiment 1
Production is of a size of 300*500mm, and it is 8%, 10% that pros and cons is subjected to long-pending being respectively of surfacing, and soft golden thickness reaches the PCB of 2.2um, wherein, contains KAu (CN) in the used electroplate liquid
2, Citrate trianion, be used for pH value in the regulator solution, guarantee that gold-plated quality, gloss-imparting agent are nickel gloss-imparting agent Nickel 808, but steady current density enlarges range of current, make the electric current equalization, high district of electric current and the same light of low district institute metal cladding prevent various bad phenomenon, improve coating luminance brightness gloss-imparting agent, stablizer is Fe stabilizer netzmittel 27, for preventing owing to Fe in the electrolytic solution of deposit N i one Fe alloy layer
2+Be oxidized to Fe easily
3+, causing the plating bath instability, quality of coating worsens a kind of stablizer, and pH value is 4.0, and degree Beaume is 5.5, and Au content is 1.0g/L.Making step is followed successively by: at first handle leaf fat dirt to be plated, oxide compound etc., wash plate to be plated again, with washing plate to be plated after the weak acid microetch once more, nickel plating is then carried out gold-plated at last; When electrogilding, electroplating time is set at 2 minutes, when the plating plate is gold-plated after advancing cylinder with time set 100 seconds, current density is 0.8ASD, according to being subjected to the long-pending current value that calculates of surfacing is 300*500/10000*0.8* (0.08+0.1)=2.16A, when being subjected to the plating time, electric current is made zero at 100 seconds, again received current once more after 2 seconds, re-enter electric current to plating bath so repeatedly, the plating bath positive and negative electrode is existed repeatedly, cause the anodal aggegation that contains in the golden electrolytic solution, the accumulation of gold is on the plating plate, and soft gold layer thickens, such 100 seconds once can electrogilding thickness 0.45um about, re-enter electric current 5 times to plating bath repeatedly, the washing oven dry gets final product more than the thick tester of X-RAY gold is tested golden layer thickness 2.2um.
Embodiment 2
Production is of a size of 400*500mm, and it is 4%, 8% that pros and cons is subjected to long-pending being respectively of surfacing, and soft golden thickness reaches the PCB of 4um, wherein, contains KAu (CN) in the used electroplate liquid
2, Citrate trianion, be used for pH value in the regulator solution, guarantee gold-plated quality), be used for pH value in the regulator solution, guarantee that gold-plated quality, gloss-imparting agent are nickel gloss-imparting agent Nickel 808, but steady current density, enlarge range of current, make the electric current equalization, high district of electric current and the same light of low district institute metal cladding, prevent various bad phenomenon, improve coating luminance brightness gloss-imparting agent, stablizer is Fe stabilizer netzmittel 27, for preventing owing to Fe in the electrolytic solution of deposit N i one Fe alloy layer
2+Be oxidized to Fe easily
3+, causing the plating bath instability, quality of coating worsens a kind of stablizer, and the PPH value is 4.0, and degree Beaume is 5.5, and Au content is 1.0g/L.Making step is followed successively by: at first handle leaf fat dirt to be plated, oxide compound etc., wash plate to be plated again, with washing plate to be plated after the weak acid microetch once more, nickel plating is then carried out gold-plated at last; When electrogilding, electroplating time is set at 2 minutes, when the plating plate is gold-plated after advancing cylinder with time set 120 seconds, current density is 0.8ASD, according to being subjected to the long-pending current value that calculates of surfacing is 400*500/10000*0.8* (0.04+0.08)=1.92A, when being subjected to the plating time, electric current is made zero at 120 seconds, again received current once more after 2 seconds, re-enter electric current to plating bath so repeatedly, the plating bath positive and negative electrode is existed repeatedly, cause the anodal aggegation that contains in the golden electrolytic solution, the accumulation of gold is on the plating plate, and soft gold layer thickens, such 120 seconds once can electrogilding thickness 0.5um about, re-enter electric current 8 times to plating bath repeatedly, the washing oven dry gets final product more than the thick tester of X-RAY gold is tested golden layer thickness 4um.
Claims (6)
1. one kind is utilized the method for electroplating the thin soft gold of golden cylinder plating thick, comprise the steps: to show the limit successively and handle oil removing, washing, microetch, washing, electronickelling, pure water is washed, and electrogilding is characterized in that, when electrogilding, electroplating time is set at 2 minutes, and received current made zero electric current when being subjected to 80～130 seconds plating time according to being subjected to the long-pending current value that is calculated of surfacing after the plating plate advanced cylinder, again received current once more after 2 seconds, make the plating bath positive and negative electrode exist repeatedly for so repeatedly the plating bath received current, cause the anodal aggegation in the electroplate liquid, Gold plated Layer thickens, by adjusting the number of times of giving the electroplate liquid received current, make Gold plated Layer reach required thickness.
2. a kind of method of electroplating the thin soft gold of golden cylinder plating thick of utilizing according to claim 1 is characterized in that the composition of described electroplate liquid is KAu (CN)
2, conducting salt, gloss-imparting agent, stablizer.
3. a kind of method of electroplating the thin soft gold of golden cylinder plating thick of utilizing according to claim 2 is characterized in that described electroplate liquid conducting salt is a Citrate trianion, and gloss-imparting agent is the nickel gloss-imparting agent, and stablizer is a Fe stabilizer.
4. a kind of method of electroplating the thin soft gold of golden cylinder plating thick of utilizing according to claim 1 is characterized in that the pH value scope of described electroplate liquid is 3.9～4.2, and degree Beaume is 5～6.7, and Au content is that 0.8～1.2g/L, temperature are room temperature.
5. a kind of method of electroplating the thin soft gold of golden cylinder plating thick of utilizing according to claim 4 is characterized in that the pH value of described electroplate liquid is 4.0, and degree Beaume is 5.5, and Au content is 1.0g/L.
6. a kind of method of electroplating the thin soft gold of golden cylinder plating thick of utilizing according to claim 1 is characterized in that described current density parameter is 0.6～1.2 ASD.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110075454 CN102154669B (en) | 2011-03-28 | 2011-03-28 | Method for plating thick soft gold by utilizing plating thin golden cylinder |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110075454 CN102154669B (en) | 2011-03-28 | 2011-03-28 | Method for plating thick soft gold by utilizing plating thin golden cylinder |
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| CN102154669A true CN102154669A (en) | 2011-08-17 |
| CN102154669B CN102154669B (en) | 2013-03-13 |
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| CN 201110075454 Expired - Fee Related CN102154669B (en) | 2011-03-28 | 2011-03-28 | Method for plating thick soft gold by utilizing plating thin golden cylinder |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55104495A (en) * | 1979-01-30 | 1980-08-09 | Electroplating Eng Of Japan Co | Gold plating liquid and gold plating method for using gold plating liquid |
| RU1828880C (en) * | 1990-07-23 | 1993-07-23 | Научно-производственное объединение "ЭЛАС" | Method of gold plating |
| CN1940147A (en) * | 2005-09-30 | 2007-04-04 | 恩伊凯慕凯特股份有限公司 | Formation method of gold bump or gold wiring |
| CN101748427A (en) * | 2008-12-02 | 2010-06-23 | 北京有色金属研究总院 | Titanium plate of a kind of plated with thick gold membrane and preparation method thereof |
| CN101831680A (en) * | 2010-05-14 | 2010-09-15 | 合肥工业大学 | Preparation method of double-pulse plating solution of single metal Au, Sn and Au-Sn alloy soldering flux |
-
2011
- 2011-03-28 CN CN 201110075454 patent/CN102154669B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55104495A (en) * | 1979-01-30 | 1980-08-09 | Electroplating Eng Of Japan Co | Gold plating liquid and gold plating method for using gold plating liquid |
| RU1828880C (en) * | 1990-07-23 | 1993-07-23 | Научно-производственное объединение "ЭЛАС" | Method of gold plating |
| CN1940147A (en) * | 2005-09-30 | 2007-04-04 | 恩伊凯慕凯特股份有限公司 | Formation method of gold bump or gold wiring |
| CN101748427A (en) * | 2008-12-02 | 2010-06-23 | 北京有色金属研究总院 | Titanium plate of a kind of plated with thick gold membrane and preparation method thereof |
| CN101831680A (en) * | 2010-05-14 | 2010-09-15 | 合肥工业大学 | Preparation method of double-pulse plating solution of single metal Au, Sn and Au-Sn alloy soldering flux |
Non-Patent Citations (1)
| Title |
|---|
| 《镀金与节金新技术》 19910228 戴传忠等 脉冲镀金 上海科学普及出版社 64-81 1-6 , * |
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Address after: 514768 Meijiang District Dongsheng Industrial Park, Meizhou, Guangdong Patentee after: Guangdong crown Polytron Technologies Inc Address before: 514068 Guofeng Electronic Technology (Meizhou) Co., Ltd., C District, Dongsheng Industrial Park, Meizhou, Guangdong Patentee before: Guanfeng Electronic Science and Tech (Meizhou) Co., Ltd. |
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