CN110172713A - A kind of tin plating copper foil processing method of high shielding properties - Google Patents
A kind of tin plating copper foil processing method of high shielding properties Download PDFInfo
- Publication number
- CN110172713A CN110172713A CN201910559963.8A CN201910559963A CN110172713A CN 110172713 A CN110172713 A CN 110172713A CN 201910559963 A CN201910559963 A CN 201910559963A CN 110172713 A CN110172713 A CN 110172713A
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- China
- Prior art keywords
- copper foil
- slot
- copper
- added
- shielding properties
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
Abstract
The invention discloses a kind of tin plating copper foil processing methods of high shielding properties, include the following steps: that (A) is put into tungsten silk screen, open molten copper slot, are put into tungsten silk screen in Xiang Rongtong slot；(B) copper solution is made, the copper material handled well is added in molten copper slot, and then, a certain proportion of pure water and sulfuric acid is added into slot, then, compressed air is passed through into slot；(C) electrolyte filtering purifies, and multiplicating is filtered purification to electrolyte；(D) electrolytically generated copper foil is passed through direct current in slot, and cation shifts to cathode, and anion shifts to anode, and crystallization forms copper foil on cathode roll；(E) plating tin-nickel alloy processing, slot is interior to be added nickel sulfate and STANNOUS SULPHATE CRYSTALLINE, and copper foil surface generates Sn-Ni alloy layer；(F) anti-oxidation processing, chromate is added into slot and zinc salt carries out surface passivation, forms the complicated film layer based on chromium zinc in copper foil surface.The present invention uses kinds of processes, improves the shielding of copper foil, practical performance is good.
Description
Technical field
The present invention relates to copper foil technical field, the tin plating copper foil processing method of specially a kind of high shielding properties.
Background technique
Copper foil is a kind of negative matter electrolysis material, and one layer be deposited on circuit board substrate layer is thin, continuous metal foil,
Its electric conductor as PCB, it is easy to be bonded in insulating layer, receives printing protective layer, and circuit patterns, copper foil tool are formed after corrosion
Have low surface oxygen characteristic, can adhere to various different substrate materials, such as metal, insulating materials etc., possess wider temperature and use
Range is mainly used in electromagnetic shielding and antistatic, copper-foil conducting electricity is placed in substrate surface, metal substrate combining has excellent
Conduction, and provide the effect of electromagnetic shielding, can be divided into: self-adhesion copper foil, it is double lead copper foil, singly lead copper foil etc., electron level copper foil is (pure
99.7% or more degree, thickness 5um-105um) it is that one of basic material of electronics industry electronics and information industry is fast-developing, electron level
The usage amount of copper foil is increasing, and product is widely used in industrial calculator, communication apparatus, QA equipment, lithium-ions battery,
Commercial television machine, video recorder, CD player, duplicator, phone, air conditioner, automobile electrical subassembly, game machine etc..It is domestic
Outer market increasingly increases electron level copper foil, the demand of especially high-performance electronic grade copper foil.
But existing copper foils for shielding performance is bad, practicability is to be improved；Therefore, it is unsatisfactory for existing demand, to this
We have proposed a kind of tin plating copper foil processing methods of high shielding properties.
Summary of the invention
The purpose of the present invention is to provide a kind of tin plating copper foil processing methods of high shielding properties, to solve above-mentioned background skill
The problems such as existing copper foils for shielding performance proposed in art is bad, and practicability is to be improved.
To achieve the above object, the invention provides the following technical scheme: a kind of tin plating copper foil processing side of high shielding properties
Method includes the following steps:
(A) it is put into tungsten silk screen, molten copper slot is opened, is put into tungsten silk screen in Xiang Rongtong slot；
(B) copper solution is made, the copper material handled well is added in molten copper slot, and then, a certain proportion of pure water is added into slot
And sulfuric acid is then passed through compressed air into slot；
(C) electrolyte filtering purifies, and multiplicating is filtered purification to electrolyte；
(D) electrolytically generated copper foil is passed through direct current in slot, and cation shifts to cathode, and anion shifts to anode, ties on cathode roll
Crystalline substance forms copper foil；
(E) plating tin-nickel alloy processing, slot is interior to be added nickel sulfate and STANNOUS SULPHATE CRYSTALLINE, and copper foil surface generates Sn-Ni alloy layer；
(F) anti-oxidation processing, chromate is added into slot and zinc salt carries out surface passivation, is formed based on chromium zinc in copper foil surface
The complicated film layer of body；
(G) silane coupling agent is handled, and the copper foil surface after oxidation processes sprays silane；
(H) it dries, copper foil is put into dryer and is dried, in W, the processing time is T for temperature control.
Preferably, the ratio of pure water and sulfuric acid in described (B) step is 10:1.
Preferably, oxygen content is 21% in compressed air in described (B) step.
Preferably, chemical reaction involved in described (B) step are as follows: 2Cu+2H2SO4+O2=2CuSO4+2H2O.
Preferably, the chemical reaction that cathode is related in described (D) step are as follows: Cu2++ 2e=Cu, (D) the step Anodic
The chemical reaction being related to are as follows: 4OH--4e=2H2O+02。
Preferably, W involved in described (H) step is 120 DEG C, and T involved in (H) step is 2h.
The present invention has the advantages that the tin plating copper foil processing method of this kind high shielding properties, forms in the inside of tungsten silk screen
The shielding of copper foil can be improved using tungsten silk screen for copper foil, the processing of plating tin-nickel alloy be carried out to electrolytically generated copper foil, into one
Step improves the shielding of copper foil, using anti-oxidation processing, silane coupling agent processing and drying and processing, ultimately forms a kind of Gao Ping
Cover the copper foil of performance.
Detailed description of the invention
Fig. 1 is the whole flow diagram of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.
Referring to Fig. 1, a kind of embodiment provided by the invention: a kind of tin plating copper foil processing method of high shielding properties, packet
Include following steps:
(A) it is put into tungsten silk screen, molten copper slot is opened, is put into tungsten silk screen in Xiang Rongtong slot；
(B) copper solution is made, the copper material handled well is added in molten copper slot, and then, a certain proportion of pure water is added into slot
And sulfuric acid is then passed through compressed air into slot；
(C) electrolyte filtering purifies, and multiplicating is filtered purification to electrolyte；
(D) electrolytically generated copper foil is passed through direct current in slot, and cation shifts to cathode, and anion shifts to anode, ties on cathode roll
Crystalline substance forms copper foil；
(E) plating tin-nickel alloy processing, slot is interior to be added nickel sulfate and STANNOUS SULPHATE CRYSTALLINE, and copper foil surface generates Sn-Ni alloy layer, improves copper
The shielding of foil；
(F) anti-oxidation processing, chromate is added into slot and zinc salt carries out surface passivation, is formed based on chromium zinc in copper foil surface
The complicated film layer of body makes copper foil not improve the heat resistance of copper foil because directly contacting due to oxidation stain with air；
(G) silane coupling agent is handled, and the copper foil surface after oxidation processes sprays silane, improves the peel strength of copper foil；
(H) it dries, copper foil is put into dryer and is dried, in W, the processing time is T for temperature control.
In this embodiment, the ratio of the pure water in (B) step and sulfuric acid is 10:1.
In this embodiment, oxygen content is 21% in compressed air in (B) step.
In this embodiment, chemical reaction involved in (B) step are as follows: 2Cu+2H2SO4+O2=2CuSO4+2H2O.
In this embodiment, the chemical reaction that cathode is related in (D) step are as follows: Cu2++ 2e=Cu, (D) the step Anodic
The chemical reaction being related to are as follows: 4OH--4e=2H2O+02。
In this embodiment, W involved in (H) step is 120 DEG C, and T involved in (H) step is 2h, prevents from remaining
Water causes damages to copper foil.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims
Variation is included within the present invention.Any reference signs in the claims should not be construed as limiting the involved claims.
Claims (6)
1. a kind of tin plating copper foil processing method of high shielding properties, it is characterised in that: the following steps are included:
(A) it is put into tungsten silk screen, molten copper slot is opened, is put into tungsten silk screen in Xiang Rongtong slot；
(B) copper solution is made, the copper material handled well is added in molten copper slot, and then, a certain proportion of pure water is added into slot
And sulfuric acid is then passed through compressed air into slot；
(C) electrolyte filtering purifies, and multiplicating is filtered purification to electrolyte；
(D) electrolytically generated copper foil is passed through direct current in slot, and cation shifts to cathode, and anion shifts to anode, ties on cathode roll
Crystalline substance forms copper foil；
(E) plating tin-nickel alloy processing, slot is interior to be added nickel sulfate and STANNOUS SULPHATE CRYSTALLINE, and copper foil surface generates Sn-Ni alloy layer；
(F) anti-oxidation processing, chromate is added into slot and zinc salt carries out surface passivation, is formed based on chromium zinc in copper foil surface
The complicated film layer of body；
(G) silane coupling agent is handled, and the copper foil surface after oxidation processes sprays silane；
(H) it dries, copper foil is put into dryer and is dried, in W, the processing time is T for temperature control.
2. a kind of tin plating copper foil processing method of high shielding properties according to claim 1, it is characterised in that: (B)
The ratio of pure water and sulfuric acid in step is 10:1.
3. a kind of tin plating copper foil processing method of high shielding properties according to claim 1, it is characterised in that: (B)
Oxygen content is 21% in compressed air in step.
4. a kind of tin plating copper foil processing method of high shielding properties according to claim 1, it is characterised in that: (B)
Chemical reaction involved in step are as follows: 2Cu+2H2SO4+O2=2CuSO4+2H2O.
5. a kind of tin plating copper foil processing method of high shielding properties according to claim 1, it is characterised in that: (D)
The chemical reaction that cathode is related in step are as follows: Cu2++ 2e=Cu, the chemical reaction that (D) the step Anodic is related to are as follows: 4OH--
4e=2H2O+02。
6. a kind of tin plating copper foil processing method of high shielding properties according to claim 1, it is characterised in that: (H)
W involved in step is 120 DEG C, and T involved in (H) step is 2h.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910559963.8A CN110172713A (en) | 2019-06-26 | 2019-06-26 | A kind of tin plating copper foil processing method of high shielding properties |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910559963.8A CN110172713A (en) | 2019-06-26 | 2019-06-26 | A kind of tin plating copper foil processing method of high shielding properties |
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| CN110172713A true CN110172713A (en) | 2019-08-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910559963.8A Pending CN110172713A (en) | 2019-06-26 | 2019-06-26 | A kind of tin plating copper foil processing method of high shielding properties |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111575746A (en) * | 2020-06-10 | 2020-08-25 | 诸暨企周企业管理有限公司 | Copper foil electrolysis production facility of anti-oxidant effect |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63171890A (en) * | 1987-01-09 | 1988-07-15 | Nisshin Steel Co Ltd | Production of alloy foil |
| CN106460219A (en) * | 2014-05-30 | 2017-02-22 | Ｊｘ金属株式会社 | Metal foil for electromagnetic wave shielding, electromagnetic wave shielding member, and shielded cable |
-
2019
- 2019-06-26 CN CN201910559963.8A patent/CN110172713A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63171890A (en) * | 1987-01-09 | 1988-07-15 | Nisshin Steel Co Ltd | Production of alloy foil |
| CN106460219A (en) * | 2014-05-30 | 2017-02-22 | Ｊｘ金属株式会社 | Metal foil for electromagnetic wave shielding, electromagnetic wave shielding member, and shielded cable |
Non-Patent Citations (2)
| Title |
|---|
| 杨邦朝: "《多芯片组件（MCM）技术及其应用》", 30 June 2001, 成都：电子科技大学出版社 * |
| 金荣涛: "《电解铜箔生产》", 31 December 2010, 长沙：中南大学出版出版社 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111575746A (en) * | 2020-06-10 | 2020-08-25 | 诸暨企周企业管理有限公司 | Copper foil electrolysis production facility of anti-oxidant effect |
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Application publication date: 20190827 |