CN102131952B - 沉积材料的方法 - Google Patents

沉积材料的方法 Download PDF

Info

Publication number
CN102131952B
CN102131952B CN2009801336214A CN200980133621A CN102131952B CN 102131952 B CN102131952 B CN 102131952B CN 2009801336214 A CN2009801336214 A CN 2009801336214A CN 200980133621 A CN200980133621 A CN 200980133621A CN 102131952 B CN102131952 B CN 102131952B
Authority
CN
China
Prior art keywords
sample
target
laser beam
target material
electron beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN2009801336214A
Other languages
English (en)
Other versions
CN102131952A (zh
Inventor
J·A·扬森斯
G·范德艾克尔
J·M·德克斯
J·J·布鲁克玛特
P·特里勒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
SOLMATES BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SOLMATES BV filed Critical SOLMATES BV
Publication of CN102131952A publication Critical patent/CN102131952A/zh
Application granted granted Critical
Publication of CN102131952B publication Critical patent/CN102131952B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/28Vacuum evaporation by wave energy or particle radiation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50Substrate holders
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50Substrate holders
    • C23C14/505Substrate holders for rotation of the substrates
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process
    • C23C14/542Controlling the film thickness or evaporation rate
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Physical Vapour Deposition (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

本发明涉及一种沉积靶材料(3)至样品(2)的表面的方法,该方法包括以下步骤:通过用激光束或电子束(7)照射靶表面来生成靶材料粒子的羽焰(9);放置样品(2)至羽焰附近,以使得靶材料粒子沉积到样品的表面上;绕着垂直于沉积粒子的样品表面的旋转轴线(1)旋转样品;沿着靶表面移动激光束,以使得羽焰相对于旋转轴线沿径向移动;以可变的频率来脉冲调制激光束。

Description

沉积材料的方法
技术领域
本发明涉及一种沉积靶材料至样品表面的方法,该方法包括以下步骤:
-通过用激光束或电子束照射靶表面来生成靶材料粒子的羽焰(plume);
-放置样品至羽焰附近,以使得靶材料粒子沉积到样品表面。
背景技术
通过所谓的脉冲激光沉积(PLD)可将靶材料沉积至样品表面。这种PLD技术使人们能选择非常高质量的材料、用非常薄的涂层来涂覆物体。这种脉冲激光沉积技术通常应用于研究环境。
然而,最好能将FLD技术的优点应用于工业领域。然而困难在于FLO技术仅适合于小尺寸应用。通过当前的技术,典型的是在约10mm×10mm的表面上覆盖均质层。该面积受限于FLD技术产生的等离子羽焰。该羽焰仅在典型的10mm×10mm的小面积内保持均匀。
发明内容
本发明当前的一个目的就是解决上述问题。
该目的通过本发明所述的方法来实现,该方法的特征在于:
-绕着垂直于沉积粒子的样品表面的旋转轴线旋转样品;
-沿着靶表面移动激光束,以使得羽焰相对于旋转轴线沿径向移动;
-以可变的频率来脉冲调制激光束。
通过绕着旋转轴线旋转样品,可使羽焰在样品的环形区域上沉积材料。通过沿靶表面在径向方向上移动激光束,可覆盖圆盘形样品表面的整个表面。因此,虽然PLD的有效羽焰典型地仅为10mm×10mm,但是仍然可覆盖大得多的样品表面。
然而,为了维持靶材料均质沉积到样品上并且在整个基材表面维持均质脉冲速率以实现均质的薄膜性能,有必要进一步以可变的频率来脉冲调制激光束。例如,如果维持样品的恒定角速度,与远离旋转轴线的环形表面相比,靠近旋转中心的环形表面将需要较少的靶材料。通过变化脉冲激光束的频率,容易在样品的整个表面上提供靶材料粒子的均质分布。
根据本发明所述方法的一个实施例,样品表面为圆盘状,并且优选地,靶表面基本上平行于样品表面。
根据本发明所述方法的一个优选实施例,靶材料为棒,其可沿着纵轴旋转。当靶材料经激光束照射时,小部分的材料被烧蚀,这些粒子将形成羽焰。如果激光束仅照射靶的一小部分,材料被烧蚀的数量将很大,将干扰PLD工艺。尤其在采用本发明所述的PLD方法进行大面积的涂覆时,大量材料将被烧蚀,这将会影响到靶料进而影响工艺。现在通过提供可围绕其纵轴旋转的棒状靶材料,就可能转换材料被烧蚀的靶材料区域。通过结合激光束的移动与靶的旋转,就可能实现靶材料的均匀材料烧蚀。
根据本发明所述方法的另一个优选实施例,样品的角速度依赖于旋转轴线与靶表面上的激光束的接触区域之间的距离。
通过改变样品的角速度,提供了在样品上均质地沉积材料的又一控制参数。
根据本发明所述方法的又一实施例,激光束的脉冲频率依赖于旋转轴线与靶表面上的激光束的接触区域之间的距离。正如已经述及的,当具有恒定的角速度时,靠近样品中心沉积时的脉冲频率要比在样品外部边缘区域沉积时的频率要低。然而,如果角速度也是变化的,最优值也能容易地计算出。
优选地,激光束脉冲频率的范围为1Hz至500Hz。
附图说明
本发明的这些及其它的特征将结合附图来阐述。
图1示意性地示出了根据本发明所述的方法。
图2示出了示意性示出位置的样品的俯视图。
图3显示了本发明的第二实施例。
具体实施方式
图1示出了可旋转的样品夹持器1。在可旋转的样品夹持器1上面设置有样品2。该样品2通常是需涂覆的合适材料的薄圆盘。
在样品夹持器1和样品2的下面设置有靶材料3。该靶材料为棒状并具有两个轴颈4、5,靶材料3通过该轴颈4、5可沿着纵轴6旋转。
激光设备(未示出)发射的激光束7被引导到镜8上。镜8是可倾斜的。
激光束7经镜8反射,投射到靶材料3上以生成羽焰9。该羽焰9由被烧蚀的靶材料3构成。
通过使镜8倾斜,固定的激光束7可在靶材料3的表面上沿纵轴6的方向移动。结果羽焰9可沿着样品圆盘2的径向移动。
图2中示出了样品圆盘2和若干沉积物10。这些沉积物10源自羽焰9。通过使镜8倾斜而使得羽焰沿圆盘2的径向移动,其具有的结果示出于图2中。
现在,通过旋转样品圆盘,这些沉积物能散布到盘片2的整个表面。正如从图2中所清楚看到的,当角速度ω保持恒定,并且通过保持激光频率恒定使沉积速率恒定时,这将会导致材料在样品圆盘的中心11附近比边缘附近有更高的沉积。因此,作为本发明的结果,通过改变激光束的频率来改变沉积速率,以使得在样品圆盘的中心11附近沉积较少的材料而在边缘附近沉积较多的材料。通过至少变化脉冲频率,并且优选地还变化角速度,可获得尺寸远大于常规尺寸的均匀涂覆沉积区域10的样品表面。
图3示出本发明第二实施例的示意图。可旋转的样品夹持器20上设置有样品21。在该可旋转的样品夹持器上方设有可旋转的靶材料夹持器22。在该靶夹持器22上放置有靶23,在该实施例中靶23为圆盘状。
进一步地,图3示出了激光束或者电子束24,其被导向聚焦镜25,聚焦镜将激光束导到可平移的平面镜26上。该平面镜26将激光束导到靶材料23上,产生靶材料粒子的羽焰27,随后其将沉积到样品材料21上。
平面镜26被沿着导向装置28导向,以使得平面镜26可被平移。通过平移平面镜26,激光束24可在靶材料23的表面上移动,从而羽焰27可在样品材料21的表面上移动。

Claims (7)

1.一种沉积靶材料至样品的表面上的方法,所述方法包括以下步骤:
-通过用激光束或电子束照射靶表面以生成靶材料粒子的羽焰;
-放置所述样品至所述羽焰附近,以使得所述靶材料粒子沉积到所述样品的表面上;
其特征在于:
-绕着垂直于沉积粒子的所述样品的表面的旋转轴线旋转所述样品;
-沿着所述靶表面移动所述激光束或电子束,以使得所述羽焰相对于所述旋转轴线沿径向移动;
-以可变的频率来脉冲调制所述激光束或电子束。
2.如权利要求1所述的方法,其中所述样品的表面为圆盘状。
3.如权利要求1或2所述的方法,其中所述靶表面基本上平行于所述样品的表面。
4.如权利要求1或2所述的方法,其中靶材料为棒,该棒能围绕其纵轴旋转。
5.如权利要求1或2所述的方法,其中所述样品的角速度依赖于所述旋转轴线与所述靶表面上所述激光束或电子束的接触区域之间的距离。
6.如权利要求1或2所述的方法,其中所述激光束或电子束的脉冲频率依赖于所述旋转轴线与所述靶表面上所述激光束或电子束的接触区域之间的距离。
7.如权利要求1或2所述的方法,其中用于脉冲调制的所述频率在1Hz到500Hz范围内。
CN2009801336214A 2008-08-25 2009-08-24 沉积材料的方法 Active CN102131952B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP08014970.1 2008-08-25
EP08014970A EP2159300B1 (en) 2008-08-25 2008-08-25 Method for depositing a material
PCT/EP2009/060859 WO2010023174A1 (en) 2008-08-25 2009-08-24 Method for depositing a material

Publications (2)

Publication Number Publication Date
CN102131952A CN102131952A (zh) 2011-07-20
CN102131952B true CN102131952B (zh) 2013-04-17

Family

ID=40251818

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009801336214A Active CN102131952B (zh) 2008-08-25 2009-08-24 沉积材料的方法

Country Status (13)

Country Link
US (1) US9074282B2 (zh)
EP (1) EP2159300B1 (zh)
JP (1) JP5193368B2 (zh)
KR (2) KR101307592B1 (zh)
CN (1) CN102131952B (zh)
AT (1) ATE537277T1 (zh)
DK (1) DK2159300T3 (zh)
ES (1) ES2378906T3 (zh)
HR (1) HRP20120120T1 (zh)
PL (1) PL2159300T3 (zh)
PT (1) PT2159300E (zh)
SI (1) SI2159300T1 (zh)
WO (1) WO2010023174A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2722412B1 (en) * 2012-10-17 2018-04-25 Solmates B.V. Method for depositing a target material onto a sensitive material
EP2910664B1 (en) * 2014-02-21 2019-04-03 Solmates B.V. Device for depositing a material by pulsed laser deposition and a method for depositing a material with the device
EP3540090A1 (en) * 2018-03-12 2019-09-18 Solmates B.V. Method for pulsed laser deposition

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1649794A (zh) * 2002-04-26 2005-08-03 住友电气工业株式会社 制造氧化物超导薄膜的方法

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4740386A (en) * 1987-03-30 1988-04-26 Rockwell International Corporation Method for depositing a ternary compound having a compositional profile
JPH01319673A (ja) * 1988-06-21 1989-12-25 Furukawa Electric Co Ltd:The レーザビームスパッタ法
DE3914476C1 (zh) * 1989-05-02 1990-06-21 Forschungszentrum Juelich Gmbh, 5170 Juelich, De
JPH03104861A (ja) * 1989-05-26 1991-05-01 Rockwell Internatl Corp レーザアブレーションに使用するための装置
JP3110473B2 (ja) * 1990-03-01 2000-11-20 住友電気工業株式会社 酸化物超電導薄膜の製造方法
US5578350A (en) * 1990-07-03 1996-11-26 Fraunhofer-Gesellschaft Method for depositing a thin layer on a substrate by laser pulse vapor deposition
JP3255469B2 (ja) * 1992-11-30 2002-02-12 三菱電機株式会社 レーザ薄膜形成装置
US5733609A (en) * 1993-06-01 1998-03-31 Wang; Liang Ceramic coatings synthesized by chemical reactions energized by laser plasmas
JPH0770740A (ja) * 1993-09-01 1995-03-14 Hitachi Zosen Corp 導電性薄膜の形成方法
US5411772A (en) * 1994-01-25 1995-05-02 Rockwell International Corporation Method of laser ablation for uniform thin film deposition
KR0153568B1 (ko) * 1994-12-31 1998-12-01 임효빈 펄스레이저를 이용한 대면적 박막의 제조 장치 및 방법
AUPO912797A0 (en) * 1997-09-11 1997-10-02 Australian National University, The Ultrafast laser deposition method
US6297138B1 (en) * 1998-01-12 2001-10-02 Ford Global Technologies, Inc. Method of depositing a metal film onto MOS sensors
US6090207A (en) * 1998-04-02 2000-07-18 Neocera, Inc. Translational target assembly for thin film deposition system
WO2000022184A1 (en) * 1998-10-12 2000-04-20 The Regents Of The University Of California Laser deposition of thin films
JP4621333B2 (ja) * 2000-06-01 2011-01-26 ホーチキ株式会社 薄膜形成方法
AUPR026100A0 (en) * 2000-09-20 2000-10-12 Tamanyan, Astghik Deposition of thin films by laser ablation
US6761986B2 (en) * 2001-04-06 2004-07-13 Rockwell Scientific Licensing, Llc Thin film infrared transparent conductor
US20030129324A1 (en) * 2001-09-07 2003-07-10 The Regents Of The University Of California Synthesis of films and particles of organic molecules by laser ablation
JP2004068100A (ja) * 2002-08-07 2004-03-04 Shimadzu Corp イオンビーム成膜装置
JP4464650B2 (ja) * 2003-10-01 2010-05-19 富士通株式会社 レーザ蒸着装置
US7557511B2 (en) * 2005-08-01 2009-07-07 Neocera, Llc Apparatus and method utilizing high power density electron beam for generating pulsed stream of ablation plasma
EP2137336B1 (en) * 2007-02-23 2014-04-02 Picodeon Ltd Oy Method for photon ablation of a target and coating method
US7869112B2 (en) * 2008-07-25 2011-01-11 Prysm, Inc. Beam scanning based on two-dimensional polygon scanner for display and other applications
EP2204468B1 (en) * 2009-01-06 2012-10-17 Solmates B.V. Device for projecting an image on a surface and device for moving said image
EP2243855B1 (en) * 2009-04-22 2021-03-03 Solmates B.V. Pulsed laser deposition with exchangeable shadow masks

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1649794A (zh) * 2002-04-26 2005-08-03 住友电气工业株式会社 制造氧化物超导薄膜的方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP平1-319673A 1989.12.25

Also Published As

Publication number Publication date
JP5193368B2 (ja) 2013-05-08
EP2159300B1 (en) 2011-12-14
KR20110047249A (ko) 2011-05-06
HRP20120120T1 (hr) 2012-05-31
CN102131952A (zh) 2011-07-20
US9074282B2 (en) 2015-07-07
EP2159300A1 (en) 2010-03-03
DK2159300T3 (da) 2012-02-27
ES2378906T3 (es) 2012-04-19
SI2159300T1 (sl) 2012-05-31
JP2012500901A (ja) 2012-01-12
KR101307592B1 (ko) 2013-09-12
WO2010023174A1 (en) 2010-03-04
US20110236601A1 (en) 2011-09-29
ATE537277T1 (de) 2011-12-15
PT2159300E (pt) 2012-03-08
KR20130054465A (ko) 2013-05-24
PL2159300T3 (pl) 2012-06-29

Similar Documents

Publication Publication Date Title
Panjan et al. Review of growth defects in thin films prepared by PVD techniques
BE1022358B1 (nl) Sputterinrichting met bewegend doelwit
CN102131952B (zh) 沉积材料的方法
US20110211676A1 (en) Method and apparatus for applying material to a surface of an anode of an x-ray source, anode and x-ray source
CN104148804B (zh) 用于机器元件的表面结构化的方法和设备
JP6518868B2 (ja) サンプルの準備及びコーティングのためのイオンビーム装置
JPH03130359A (ja) 均一な厚さの層で平坦な表面を被覆する装置
CN106661721B (zh) 用于制造涂层的方法以及具有涂层的光电子半导体部件
US3752691A (en) Method of vacuum evaporation
Assaf et al. Wettability modification of porous PET by atmospheric femtosecond PLD
FR2971261A1 (fr) Dispositif et procede de pulverisation ionique
EP3566854B1 (en) Apparatus for additively manufacturing three-dimensional objects
US20160083850A1 (en) Laser assisted interstitial alloying for improved wear resistance
FR3140888A1 (fr) Procede de depot de revetement
FR3083474A1 (fr) Dispositif et procédé pour la fabrication additive
JPH05271925A (ja) イオンビームスパッタ装置
JP2003328110A (ja) 成膜装置
JPH06192821A (ja) レーザpvd装置
TW202342790A (zh) 使用熱雷射蒸鍍之方法及熱雷射蒸鍍系統
Jehn et al. PHYSICAL VAPOUR DEPOSITION OF MULTI-COMPONENT COATINGS BY MULTI-SOURCE SYSTEMS WITH SUBSTRATE ROTATION: HOMOGENEITY OF THE ELEMENTAL COMPOSITION
CN110257778A (zh) 用于脉冲激光沉积的方法
JPH04128373A (ja) 試料ホルダ
FR2830538A1 (fr) Procede et dispositif pour fabriquer une couche galvanique sur une surface de substrat
Chmelíčková et al. Optical and contact non-destructive measurement of the laser re-melting layers
JPH07157877A (ja) スパッタ装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20221229

Address after: California, USA

Patentee after: LAM RESEARCH Corp.

Address before: Enschede

Patentee before: SOLMATES B.V.