CN102130286A - 发光二极管芯片、制法及封装方法 - Google Patents
发光二极管芯片、制法及封装方法 Download PDFInfo
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- CN102130286A CN102130286A CN2011100352492A CN201110035249A CN102130286A CN 102130286 A CN102130286 A CN 102130286A CN 2011100352492 A CN2011100352492 A CN 2011100352492A CN 201110035249 A CN201110035249 A CN 201110035249A CN 102130286 A CN102130286 A CN 102130286A
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (14)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011100352492A CN102130286B (zh) | 2009-02-19 | 2009-02-19 | 发光二极管的封装结构及封装方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011100352492A CN102130286B (zh) | 2009-02-19 | 2009-02-19 | 发光二极管的封装结构及封装方法 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200910037346.8A Division CN101515621B (zh) | 2009-02-19 | 2009-02-19 | 发光二极管芯片、制法及封装方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102130286A true CN102130286A (zh) | 2011-07-20 |
CN102130286B CN102130286B (zh) | 2013-03-20 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2011100352492A Expired - Fee Related CN102130286B (zh) | 2009-02-19 | 2009-02-19 | 发光二极管的封装结构及封装方法 |
Country Status (1)
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CN (1) | CN102130286B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106058000A (zh) * | 2011-09-16 | 2016-10-26 | 首尔伟傲世有限公司 | 发光二极管及制造该发光二极管的方法 |
CN106299072A (zh) * | 2016-09-30 | 2017-01-04 | 映瑞光电科技(上海)有限公司 | 发光二极管芯片 |
CN109638141A (zh) * | 2018-12-20 | 2019-04-16 | 周伯平 | 一种贴片类led灯珠发光面表面处理工艺 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006269703A (ja) * | 2005-03-24 | 2006-10-05 | Ngk Spark Plug Co Ltd | 発光素子用セラミックパッケージ及びその製造方法 |
JP2006295018A (ja) * | 2005-04-14 | 2006-10-26 | Ngk Spark Plug Co Ltd | 配線基板 |
EP1890342A1 (en) * | 2005-06-07 | 2008-02-20 | Fujikura Ltd. | Substrate for light-emitting device mounting and light-emitting device module |
-
2009
- 2009-02-19 CN CN2011100352492A patent/CN102130286B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006269703A (ja) * | 2005-03-24 | 2006-10-05 | Ngk Spark Plug Co Ltd | 発光素子用セラミックパッケージ及びその製造方法 |
JP2006295018A (ja) * | 2005-04-14 | 2006-10-26 | Ngk Spark Plug Co Ltd | 配線基板 |
EP1890342A1 (en) * | 2005-06-07 | 2008-02-20 | Fujikura Ltd. | Substrate for light-emitting device mounting and light-emitting device module |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106058000A (zh) * | 2011-09-16 | 2016-10-26 | 首尔伟傲世有限公司 | 发光二极管及制造该发光二极管的方法 |
CN106299072A (zh) * | 2016-09-30 | 2017-01-04 | 映瑞光电科技(上海)有限公司 | 发光二极管芯片 |
US10490701B2 (en) | 2016-09-30 | 2019-11-26 | Enraytek Optoelectronics Co., Ltd. | Light emitting diode chip |
CN109638141A (zh) * | 2018-12-20 | 2019-04-16 | 周伯平 | 一种贴片类led灯珠发光面表面处理工艺 |
Also Published As
Publication number | Publication date |
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CN102130286B (zh) | 2013-03-20 |
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Address after: 510663 Guangzhou science and Technology Development Zone, Guangdong high tech Industrial Zone, No. 25 West spectrum Applicant after: LITE-ON ELECTRONICS (GUANGZHOU) Ltd. Applicant after: Lite-On Technology Co.,Ltd. Address before: 510663 Guangzhou science and Technology Development Zone, Guangdong high tech Industrial Zone, No. 25 West spectrum Applicant before: Lite-On Electronics (Guangzhou) Limited Applicant before: Lite-On Technology Co.,Ltd. |
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Owner name: GUANGBAO ELECTRIC UANGZHOU) CO., LTD. GUANGBAO SC Free format text: FORMER OWNER: GUANGBAO SCIENCE + TECHNOLOGY CO., LTD. Effective date: 20131107 Owner name: LITE-ON TECHNOLOGY (CHANGZHOU) CO., LTD. Free format text: FORMER OWNER: GUANGBAO ELECTRIC UANGZHOU) CO., LTD. Effective date: 20131107 |
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Effective date of registration: 20131107 Address after: 213166 Wujin high tech Industrial Development Zone, Jiangsu Province, Yang Lake Road, No. 88 Patentee after: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) Co.,Ltd. Patentee after: LITE-ON ELECTRONICS (GUANGZHOU) Ltd. Patentee after: Lite-On Technology Co.,Ltd. Address before: 510663 Guangzhou science and Technology Development Zone, Guangdong high tech Industrial Zone, No. 25 West spectrum Patentee before: LITE-ON ELECTRONICS (GUANGZHOU) Ltd. Patentee before: Lite-On Technology Co.,Ltd. |
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Granted publication date: 20130320 Termination date: 20220219 |
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