CN102120213B - 一种led荧光粉喷涂工艺 - Google Patents
一种led荧光粉喷涂工艺 Download PDFInfo
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- CN102120213B CN102120213B CN 201110003999 CN201110003999A CN102120213B CN 102120213 B CN102120213 B CN 102120213B CN 201110003999 CN201110003999 CN 201110003999 CN 201110003999 A CN201110003999 A CN 201110003999A CN 102120213 B CN102120213 B CN 102120213B
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN 201110003999 CN102120213B (zh) | 2011-01-10 | 2011-01-10 | 一种led荧光粉喷涂工艺 |
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CN 201110003999 CN102120213B (zh) | 2011-01-10 | 2011-01-10 | 一种led荧光粉喷涂工艺 |
Publications (2)
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CN102120213A CN102120213A (zh) | 2011-07-13 |
CN102120213B true CN102120213B (zh) | 2013-07-17 |
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CN 201110003999 Expired - Fee Related CN102120213B (zh) | 2011-01-10 | 2011-01-10 | 一种led荧光粉喷涂工艺 |
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Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN104241457B (zh) * | 2013-06-19 | 2017-10-31 | 深圳市瑞丰光电子股份有限公司 | 一种精确控制涂覆面积的荧光粉涂覆方法 |
CN107088511A (zh) * | 2017-04-17 | 2017-08-25 | 安徽路明光电科技有限公司 | 一种led灯灯丝的荧光粉涂抹工艺 |
CN108807221A (zh) * | 2018-04-25 | 2018-11-13 | 四川省欧玛科技有限公司 | Led荧光粉喷涂方法 |
CN109256454A (zh) * | 2018-10-16 | 2019-01-22 | 江苏稳润光电科技有限公司 | 一种led荧光粉涂覆方法 |
CN113937203B (zh) * | 2021-10-13 | 2023-07-18 | 厦门华联电子股份有限公司 | 一种led芯片的封装覆膜方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101515623A (zh) * | 2009-03-26 | 2009-08-26 | 徐春云 | 发光led之点胶方法 |
CN101694864A (zh) * | 2009-09-28 | 2010-04-14 | 深圳市众明半导体照明有限公司 | 一种led荧光粉的点胶方法 |
CN101783384A (zh) * | 2010-02-04 | 2010-07-21 | 九江联辉光电有限公司 | 一种大功率led封装方法 |
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- 2011-01-10 CN CN 201110003999 patent/CN102120213B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101515623A (zh) * | 2009-03-26 | 2009-08-26 | 徐春云 | 发光led之点胶方法 |
CN101694864A (zh) * | 2009-09-28 | 2010-04-14 | 深圳市众明半导体照明有限公司 | 一种led荧光粉的点胶方法 |
CN101783384A (zh) * | 2010-02-04 | 2010-07-21 | 九江联辉光电有限公司 | 一种大功率led封装方法 |
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CN102120213A (zh) | 2011-07-13 |
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Owner name: HUIZHOU HUAYANG OPTOELECTRONIC TECHNOLOGY CO., LTD Free format text: FORMER OWNER: FORYOU MULTIMEDIA ELECTRONICS CO., LTD. Effective date: 20130605 |
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Effective date of registration: 20130605 Address after: 516006, No. 1, Xia Bei Road, Dongjiang hi tech Development Zone, Huizhou, Guangdong Applicant after: Huizhou Foryou Optoelectronics Technology Co., Ltd. Address before: 516006, No. 1, Xia Bei Road, Dongjiang hi tech Development Zone, Huizhou, Guangdong Applicant before: Foryou Multimedia Electronics Co., Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130717 Termination date: 20150110 |
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