CN102118674A - 一种mems麦克风及其封装方法 - Google Patents
一种mems麦克风及其封装方法 Download PDFInfo
- Publication number
- CN102118674A CN102118674A CN201010000135XA CN201010000135A CN102118674A CN 102118674 A CN102118674 A CN 102118674A CN 201010000135X A CN201010000135X A CN 201010000135XA CN 201010000135 A CN201010000135 A CN 201010000135A CN 102118674 A CN102118674 A CN 102118674A
- Authority
- CN
- China
- Prior art keywords
- shell
- openend
- wiring board
- mems microphone
- line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000005538 encapsulation Methods 0.000 title abstract description 5
- 230000001070 adhesive effect Effects 0.000 claims abstract description 32
- 239000000853 adhesive Substances 0.000 claims abstract description 29
- 238000009413 insulation Methods 0.000 claims abstract description 29
- 239000003990 capacitor Substances 0.000 claims abstract description 22
- 239000003292 glue Substances 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 15
- 238000012856 packing Methods 0.000 claims description 10
- 238000005452 bending Methods 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000012790 adhesive layer Substances 0.000 abstract 3
- 239000000047 product Substances 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000009931 harmful effect Effects 0.000 description 4
- 230000008054 signal transmission Effects 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 230000003321 amplification Effects 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 239000012774 insulation material Substances 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000006263 metalation reaction Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
Images
Landscapes
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
Abstract
Description
Claims (12)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010000135.XA CN102118674B (zh) | 2010-01-05 | 2010-01-05 | 一种mems麦克风及其封装方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010000135.XA CN102118674B (zh) | 2010-01-05 | 2010-01-05 | 一种mems麦克风及其封装方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102118674A true CN102118674A (zh) | 2011-07-06 |
CN102118674B CN102118674B (zh) | 2016-02-10 |
Family
ID=44217236
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201010000135.XA Active CN102118674B (zh) | 2010-01-05 | 2010-01-05 | 一种mems麦克风及其封装方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN102118674B (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103313160A (zh) * | 2012-03-16 | 2013-09-18 | 美律电子(深圳)有限公司 | 薄形化微机电麦克风模块 |
CN103943610A (zh) * | 2014-04-16 | 2014-07-23 | 华为技术有限公司 | 一种电子元件封装结构及电子设备 |
CN104769963A (zh) * | 2012-10-09 | 2015-07-08 | 美商楼氏电子有限公司 | 声学设备和制造方法 |
CN107404807A (zh) * | 2016-05-19 | 2017-11-28 | 中兴通讯股份有限公司 | 改善电容器发声的装置及具有该装置的终端 |
US10116555B2 (en) | 2014-06-30 | 2018-10-30 | Huawei Technologies Co., Ltd. | Switch mode switching method, device, and system |
CN110662148A (zh) * | 2019-09-06 | 2020-01-07 | 歌尔股份有限公司 | Mems麦克风 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109752604B (zh) * | 2019-01-30 | 2021-07-27 | 中国科学院电子学研究所 | 一种电场传感器的封装组件、封装方法及电场传感器 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0147856A2 (en) * | 1983-12-27 | 1985-07-10 | Sony Corporation | Electrically conductive adhesive sheet |
CN1299226A (zh) * | 1999-12-09 | 2001-06-13 | 元一通讯株式会社 | 电容式麦克风的绝缘环及其固定方法 |
CN1933680A (zh) * | 2005-09-14 | 2007-03-21 | 宝星电子株式会社 | 电容传声器及其封装方法 |
CN101047067A (zh) * | 2006-03-30 | 2007-10-03 | Tdk株式会社 | 薄膜电容器及其制造方法 |
US20070295456A1 (en) * | 2006-03-28 | 2007-12-27 | Innovative Micro Technology | Wafer bonding material with embedded conductive particles |
CN101237719A (zh) * | 2007-12-28 | 2008-08-06 | 深圳市豪恩电声科技有限公司 | 一种硅电容式麦克风及其制作方法 |
TWM361835U (en) * | 2008-10-16 | 2009-07-21 | Lingsen Precision Ind Ltd | Packaging and joining structure for MEMS microphone |
CN201590897U (zh) * | 2010-01-05 | 2010-09-22 | 歌尔声学股份有限公司 | 一种mems麦克风 |
-
2010
- 2010-01-05 CN CN201010000135.XA patent/CN102118674B/zh active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0147856A2 (en) * | 1983-12-27 | 1985-07-10 | Sony Corporation | Electrically conductive adhesive sheet |
CN1299226A (zh) * | 1999-12-09 | 2001-06-13 | 元一通讯株式会社 | 电容式麦克风的绝缘环及其固定方法 |
CN1933680A (zh) * | 2005-09-14 | 2007-03-21 | 宝星电子株式会社 | 电容传声器及其封装方法 |
US20070295456A1 (en) * | 2006-03-28 | 2007-12-27 | Innovative Micro Technology | Wafer bonding material with embedded conductive particles |
CN101047067A (zh) * | 2006-03-30 | 2007-10-03 | Tdk株式会社 | 薄膜电容器及其制造方法 |
CN101237719A (zh) * | 2007-12-28 | 2008-08-06 | 深圳市豪恩电声科技有限公司 | 一种硅电容式麦克风及其制作方法 |
TWM361835U (en) * | 2008-10-16 | 2009-07-21 | Lingsen Precision Ind Ltd | Packaging and joining structure for MEMS microphone |
CN201590897U (zh) * | 2010-01-05 | 2010-09-22 | 歌尔声学股份有限公司 | 一种mems麦克风 |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103313160A (zh) * | 2012-03-16 | 2013-09-18 | 美律电子(深圳)有限公司 | 薄形化微机电麦克风模块 |
CN103313160B (zh) * | 2012-03-16 | 2017-11-21 | 美律电子(深圳)有限公司 | 薄形化微机电麦克风模块 |
CN104769963A (zh) * | 2012-10-09 | 2015-07-08 | 美商楼氏电子有限公司 | 声学设备和制造方法 |
CN103943610A (zh) * | 2014-04-16 | 2014-07-23 | 华为技术有限公司 | 一种电子元件封装结构及电子设备 |
CN103943610B (zh) * | 2014-04-16 | 2016-12-07 | 华为技术有限公司 | 一种电子元件封装结构及电子设备 |
US9839167B2 (en) | 2014-04-16 | 2017-12-05 | Huawei Technologies Co., Ltd. | Electronic component package structure and electronic device |
US10091915B2 (en) | 2014-04-16 | 2018-10-02 | Huawei Technologies Co., Ltd. | Electronic component package structure and electronic device |
US10116555B2 (en) | 2014-06-30 | 2018-10-30 | Huawei Technologies Co., Ltd. | Switch mode switching method, device, and system |
CN107404807A (zh) * | 2016-05-19 | 2017-11-28 | 中兴通讯股份有限公司 | 改善电容器发声的装置及具有该装置的终端 |
CN107404807B (zh) * | 2016-05-19 | 2022-05-13 | 中兴通讯股份有限公司 | 改善电容器发声的装置及具有该装置的终端 |
CN110662148A (zh) * | 2019-09-06 | 2020-01-07 | 歌尔股份有限公司 | Mems麦克风 |
CN110662148B (zh) * | 2019-09-06 | 2021-11-26 | 潍坊歌尔微电子有限公司 | Mems麦克风 |
Also Published As
Publication number | Publication date |
---|---|
CN102118674B (zh) | 2016-02-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102118674B (zh) | 一种mems麦克风及其封装方法 | |
CN103548361B (zh) | 半导体装置及麦克风 | |
CN201182009Y (zh) | 具有附加背音室和在pcb中的声孔的硅电容传声器 | |
CN104030233B (zh) | 顶部端口微机电***腔体封装 | |
KR101748344B1 (ko) | 스피커 모듈 | |
US20150117681A1 (en) | Acoustic Assembly and Method of Manufacturing The Same | |
CN100553370C (zh) | 驻极体电容传声器 | |
CN104618842A (zh) | 封装及用于封装传声器设备的方法 | |
CN103069838A (zh) | 麦克风单元 | |
CN101129087A (zh) | 电容麦克风及其封装方法 | |
CN205542769U (zh) | 电子装置和电子设备 | |
CN104394496B (zh) | 一种小尺寸高灵敏度高信噪比的mems硅麦克风 | |
CN101132655A (zh) | 微机电麦克风封装结构与封装方法 | |
CN101150888B (zh) | 微机电麦克风封装结构及其封装方法 | |
CN201138866Y (zh) | 改进结构的硅麦克风 | |
CN201590897U (zh) | 一种mems麦克风 | |
CN101764591B (zh) | 表面安装用晶体振荡器 | |
CN201995128U (zh) | Mems麦克风以及包含它的mems麦克风模组 | |
CN102595293A (zh) | 一种mems麦克风及其封装方法 | |
CN201450592U (zh) | 线路板框架结构的微型麦克风 | |
CN201846473U (zh) | 硅麦克风 | |
CN103663352A (zh) | 一种mems麦克风封装结构及封装方法 | |
CN110769357A (zh) | 一种采用引线框架塑料壳的麦克风封装结构 | |
CN201846474U (zh) | 硅麦克风 | |
CN201947418U (zh) | 一种mems麦克风 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
TR01 | Transfer of patent right |
Effective date of registration: 20200610 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
|
TR01 | Transfer of patent right |