CN102105981B - 集成的干扰屏蔽体的半导体封装体及其制造方法 - Google Patents
集成的干扰屏蔽体的半导体封装体及其制造方法 Download PDFInfo
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- CN102105981B CN102105981B CN2008801304971A CN200880130497A CN102105981B CN 102105981 B CN102105981 B CN 102105981B CN 2008801304971 A CN2008801304971 A CN 2008801304971A CN 200880130497 A CN200880130497 A CN 200880130497A CN 102105981 B CN102105981 B CN 102105981B
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- Wire Bonding (AREA)
Abstract
半导体模块封装体的集成的电磁干扰屏蔽体。该集成的EMI屏蔽体包括电连接在封装体的基板的接地面和印在封装体的模制化合物的顶部上的导电层之间的多个引线键合弹簧。该引线键合弹簧具有界定的形状,其导致弹簧效应以在引线键合弹簧的顶部和导电层之间提供电连接。该引线键合弹簧可以被置于模块封装体的任何位置,在所有或者一些包括在封装体中的装置周围,并在这些装置的周围创建一个完整的EMI屏蔽体。
Description
背景
发明领域
该发明是关于半导体装置的封装体,具体的说,是指用于半导体装置的电磁和/或射频信号干扰屏蔽体。
背景技术
在射频(RF)通讯***中普遍需要将RF装置与由其他RF装置所生成的电磁(射频)干扰(EMI)隔离开,以保持合适的装置性能。同样,RF装置也普遍需要与从周围环境中所接收到的,或者传递到环境中的,电磁干扰隔离开。
将RF装置与这种电磁干抗隔离开的传统方法是用接地的金属外壳(通常称为″罐″)将RF装置覆盖。然而,这种解决方案费用很高,而且缺乏设计的灵活性。此外,金属罐大大增加了在印刷电路板上装置足印的尺寸,还增加了印刷电路板的重量。
发明内容
本发明的各个方面和实施方案是关于采用引线键合工艺技术将电磁干扰屏蔽体集成到装置封装体上的半导体装置封装体以及制造方法。在一个实施方案中,采用引线键合工艺形成引线键合弹簧,该引线键合弹簧围绕装置的周围被定位并被耦合到装置上方和下方的导电层上,借此在装置周围形成电磁干扰的屏蔽。在接下来的描述中将提到,由引线键合弹簧的形状以及其所产生的弹性效果造成了鲁棒性(robust)的制造工艺以在模塑封装体的顶部的导电层和封装体的基板中的接地面之间建立可靠的电连接。这些引线键合弹簧的使用,为可以被应用在任何模塑上覆的装置的集成的电磁干扰屏蔽提供了一种灵活的解决方案。
本发明的一方面是指具有集成的电磁干扰屏蔽体的封装的半导体模块。在一个实施方案中,封装的半导体模块包括具有接地面的基板、安装在基板表面上的电子装置、多个被置于电子装置周围并且与接地面电耦合的引线键合弹簧、覆盖电子装置的以及至少部分覆盖引线键合弹簧的模制化合物,和置于模制化合物顶表面上并且与至少一些多个引线键合弹簧电耦合的导电层,其中所述的多个引线键合弹簧、导电层和接地面一起构成了集成的电磁干扰屏蔽体。
在一个示例中,导电层包括银填充环氧树脂。引线键合弹簧可以由各种导电材料制成,如金线或铜线。多个引线键合弹簧的每一个均可包括连续引线环,其被成形以提供弹簧效应,该弹簧效应允许导电层与引线键合弹簧接触,从而在导电层和引线键合弹簧之间提供电耦合。在一个示例中,电子装置指的是RF装置。
根据另一个实施方案,由连续的引线环形成的引线键合弹簧包括球形键合体、变形区域、顶部、在变形区域和顶部之间延伸的凸形区域、倾斜的尾部区域、以及在顶部和倾斜的尾部区域之间延伸的大致平坦的区域,其中变形区域位于凸形区域和球形键合体之间。在一个示例中,顶部实质上垂直的在变形区域上方。如上所述,引线键合弹簧可以由各种导电材料制成,包括金线或铜线。在一个示例中,具有这种结构的引线键合弹簧将被应用于前文提到的半导体模块中。
另一方面是关于具有集成的电磁干扰屏蔽体的半导体模块封装体。在一个实施方案中,该半导体模块封装体包括基板、安置在基板的第一个表面上的第一和第二金属化的连接点、以及引线键合弹簧,所述的引线键合弹簧包括在第一和第二金属化的连接点之间延伸的连续的引线。引线键合弹簧包括与第一金属化的连接点电连接的球形键合体、变形区域、顶部、在变形区域和顶部之间延伸的凸形区域、在顶部附近的大致平坦的区域、以及在大致平坦的区域与第二金属化的连接点之间延伸的倾斜的尾部区域。在一个示例中,半导体模块封装体还包括置于基板上并与第一和第二金属化的连接点中的至少一个电耦合的接地面。在另一个实施倒中,半导体模块封装体还包括电子装置、多个附加的与引线键合弹簧实质上相同的引线键合弹簧,其中所述的多个引线键合弹簧被安置在电子装置周边的基板上。在另一个示例中,半导体模块封装体还包含覆盖电子装置以及至少部分覆盖多个引线键合弹簧的模制化合物、和置于模制化合物的表面上并且与多个引线键合弹簧的至少一些电连接的导电层,其中接地面、导电层和多个引线键合弹簧的至少一些一起形成了集成的电磁干扰屏蔽体。
另一方面是关于具有集成的电磁干扰屏蔽体的模块的制造方法。根据一个实施方案,该方法包括将电子装置与基板相连,在基板上的提供金属化物,形成与金属化物相连的多个引线键合弹簧,进行转移模制工艺将电子装置封装在模制化合物之中,并用模制化合物至少部分覆盖多个引线键合弹簧,并且将导电层置于模制化合物的表面上,所述的导电层与多个引线键合弹簧的至少一些电连接。在一个示例中,该方法还包括在将导电层置于模制化合物的表面上之前,烧蚀模制化合物的表面,以将多个引线键合弹簧的至少一些的区域暴露出来。在另一个示例中,提供金属化物包括提供接地面和至少一个与接地面电连接的引线键合接触区域。在另一个示例中,形成所述的多个引线键合弹簧包括将线球置于金属化物上,自引线球拉引线以形成环,形成的所述环具有第一端和第二端,第一端与线球相连并将第二端与金属化物相连。在另一个示例中,将导电层置于模制化合物表面上包括将银填充的环氧树脂层涂在模制化合物表面上。
根据另一个实施方案,电子模块包括基板、安置在基板之上的电子装置,以及由大致围绕电子装置周围的多个分散结构形成的集成的电磁干抗屏蔽体,所述的结构具有由集成的电磁干扰屏蔽体所要屏蔽的信号的波长的一部分所限定的最小间隔。在一个示例中,所述的波长的该部分是1/20。在另一个示例中,多个分散的结构包括多个引线键合弹簧,如下面所述的那样。
本发明其他方面、实施方案,以及这些示范性的各个方面和实施方案的优势将在下面进行详细论述。此外,可以理解的是前边的信息以及接下来的详细描述都仅仅是各种不同方面和实施方案的示意性的示例,旨在为了理解所保护的各个方面和实施方案的性质和特性提供一个概述和框架。此处提到的任何实施方案都可能与任何其他的实施方案以与在此所公开的目标、目的和需求相一致的方式结合起来,所提到的″实施方案″、″某些实施方案″、″替代的实施方案″、″各种不同的实施方案″、″一个实施方案″以及类似的说法,它们之间并不是必须相互排除的,而是旨在说明与该实施方案相关联的描述的特定的特征、结构或者特性可以包括在至少一个实施方案中。本篇中出现的术语也并不一定仅限于同一个实施方案之中。附图是用来对各个方面和实施方案提供说明和以便更好的理解,且并入到说明书中构成说明书的一部分。附图和说明书的剩余部分,将一起用来解释所描述的、请求保护的各个方面和实施方案中的原则和操作方法。
附图说明
至少一个实施方案的各个方面在下面将结合附图进行讨论,附图并不旨在依照比例绘制的。在附图、详细描述和权利要求中的技术特性,后面会有附图标记,这些标记的唯一的目的在于增加附图、详细描述和权利要求可理解性。但是,有或是没有引用附图标记都不会对任何权利要求元素的保护范围有任何限制作用。在附图中,在各个不同附图中出现的每一个相同或几乎相同的部分,会用相同的数字来表示。为了清楚起见,并不是每一个部件都会标注在每一张附图中。附图是用来为提供说明和解释,而不是起到定义本发明的限制的作用。在附图中:
图1根据本发明的多个方面示出作为封装工艺的一部分的提供集成EMI屏蔽体的方法的一个示例的流程图;
图2是包括基板和一个或多个安装在其上的裸芯的电子模块的一个示例的图解;
图3是根据本发明的多个方面结合了集成的EMI屏蔽体的装置封装体的一个示例的图解;
图4A是根据本发明的多个方面的结合了集成的EMI屏蔽体的装置封装体的另一个示例的图解;
图4B是根据本发明的多个方面的部分装置封装体的平面图,表明连续引线键合轨迹;
图5是根据本发明的多个方面的引线键合弹簧的一个示例的图示;
图6是根据本发明的多个方面示出形成引线键合弹簧的方法的示例的流程图;
图7是根据本发明的多个方面的引线键合弹簧的一个示例的图解;
图8是根据本发明的多个方面示出引线键合弹簧在转移成型工艺中的变形;
图9是根据本发明的多个方面的并入装置封装体的引线键合弹簧的一个示例的图像;
图10是根据本发明的多个方面的引线键合弹簧的一个示例的平面图像。
具体实施方式
在很多现代应用中,包括移动手机电话、个人数字助理(PDAs)、媒体播放器,以及其他使用射频(RF)元件的移动装置,这些最终产品的尺寸(长度,宽度和厚度)和重量经常被视为关键的设计参数。比如,尤其是对移动电话,一个持续的趋势是装置变得更小而轻,同时具有增加的功能性和特征。相应地,这些装置上元件的尺寸和重量也就变得重要起来。正如上文所讨论的那样,射频装置屏蔽电磁干扰传统的方法包括,在需要屏蔽的射频装置上放置一个接地的金属罐。这种方法增加了设计的尺寸、重量及成本,因此在很多应用中并不受欢迎。
本发明的各个方面和实施方案设计提供干扰屏蔽的方法和设备,在封装工艺中该屏蔽被集成到单独装置或模块,在装置或模块的尺寸和/或重量上增加很少。本文所用到的″EMI屏蔽体″,既用作电磁干扰的屏蔽,也用作射频干扰的屏蔽。在一个实施方案中,集成的EMI屏蔽体可以使用引线键合制造工艺形成,且因此可以采用常规的用来电连接到模块中的电子装置的引线,应用已有的工具制造,以及在普通的生产线上进行组装,如下面的进一步讨论的。该方法可以提供高的设计灵活性,以及更为简单、便宜的制造EMI屏蔽体的方法。此外,根据本发明的方面的集成的“引线键合笼”屏蔽体提供一种方法,以实现在模块内/之间的隔离以及低的封装轮廓,这是常规已有技术所不能达到的。下文将讨论到,引线笼可以使用在设计和形状上很特别且易于控制的多个“引线键合弹簧”连接器形成,以在对于各种封装和工艺情况下提供牢固实用的EMI屏蔽体。
可以理解的是,此处讨论的实施方案和设备,不限于在接下来的描述或者附图说明中的构造和构件的安排的细节的应用。这些方法和设备能够在其他实施方案中应用,也可以通过各种方法实施或实现。这里提出特定的示例只是出于阐述的目的,而并不是为了做出限制。具体而言,任何一个或多个实施方案中提到的动作、元件和特性不旨在排除其在任何其他的实施方案中的起到类似的作用。同样,这里所使用的措辞和术语是出于描述的目的,不应作为限制。在***和方法的实施方案、元件或动作的对于单数的表达,也可适用于那些包括多个这些元素的实施方案;同时,任何对于任何实施方案、元件或动作中对于复数的表达,也适用于包持单个元素的实施方案。这里所使用的″包括″、″包含″、″含有″、″拥有″、″涉及″以及其他用语,意思是包含列在之后的项目和其等同物以及附加的项目。所涉及到的″或者″可被解释为包括性的,从而任何使用″或者″的任何术语,可以表示单个、多于一个和所有所描述的术语。任何前和后,左和右,顶部和底部,上部和下部的表达,是为了描述的方便,而非将本发明的***和方法或它们的部分限制为任何一个位置或空间取向。
参照图1,它说明的是依据本发明的示例方面的将引入集成的电磁干扰屏蔽体的电子装置或者模块的封装方法。该方法的方面和实施方式将在下面继续参照图1进行探讨。
第一步骤100包括制备将并入电子模块中的基板。如下面进一步探讨的,该步骤100可包括在基板上形成金属化物,其可以被用于互连电子模块的各构件以及可能会成为部分的集成的EMI屏蔽体的至少一些构件。在步骤102中,电子模块可以根据在本领域技术人员熟知的方法和技术来装配。步骤102可能包括比如在基板上安装一个或多个裸芯,形成任何必要的内部或外部的连接或连接点(包括沉积金属化物和/或电介质)等动作。因此可以理解是,尽管模块的装配仅仅示出为图1中的单独的步骤102,然而它可以包括在同时、在不同时间和/或在不同位置的几个步骤。此外,可以理解的是,步骤100可以认为是步骤102的一部分。
图2说明了这样的模块的一个示例。模块200包含一个或多个裸芯202,安装在基板204上。模块200的一些示例包括但不仅限于,功率放大器、收发器、线性装置,滤波器和其他可能需要EMI屏蔽或从能够中受益的其他装置。根据前面的探讨,EMI屏蔽是射频装置普遍需要的,因此裸芯202中的至少一个为射频装置,模块200也可以是射频模块;然而,可以理解的是,本发明并不被如此限制,裸芯202可包括任何类型的数字或模拟装置或元件。在一个示例中,裸芯202被安装在基板204上,使用引线206连接到焊盘208上,如图2所示。或者,可采用倒装片键合方法或者本领域技术人员所知的任何其他合适的技术来将裸芯202安装在基板204上。
根据一个示例方式,在封装过程中,通过在基板204的边缘建立一个引线键合笼,将集成的EMI屏蔽体并入到模块200之中。与用于形成引线键合206的常规工艺相似的引线键合工艺且使用相同的设备,如下文将提到,可以被应用来构建引线键合弹簧。多个这些引线键合弹簧可以安置在基板204上裸芯202的周围,并且在封装体中与接地面连接,以提供引线键合笼,其形成集成的EMI屏蔽体,这将在下面进行探讨。为了在模塑的模块中形成集成的屏蔽体,制造的困难在于找到将基板中的接地面与顶部的导电屏蔽层相连的方法。使用引线键合弹簧连接器形成集成的屏蔽体的方法的的实施方案中提供了解决该困难的鲁棒性的制造工艺,这将在下文中提到。
再一次参照图1,正如上面所讨论的,步骤100可以包括在基板204上形成金属化物,其成为集成EMI屏蔽体的一个部分。参照图3,这些金属化物可包括引线键合焊盘210,接地面212,以及连接引线键合焊盘到接地面的通路214。引线键合弹簧216则可被连接到引线键合焊盘210(步骤104),这将在下文有进一步的讨论。可以理解的是,在图3阐释的示例中,两个分离的引线键合焊盘210以及相关的通路214是为每个引线键合弹簧216提供的,本发明并不仅限于此,许多其它的构造也可以考虑。例如,正如在图4A和4B中所阐释的那样,单独的引线键合焊盘210可用一个金属化轨道或者环218替换,其可至少部分环绕裸芯202。在这个示例中,一个或者多个通路214可以设于沿轨道218的多个接触点处以连接该轨道,并因此连接引线键合弹簧216和接地面212。此外,在一个示例中,轨道218在两个或更多引线键合弹簧216之间是连续的,且因此,每个引线键合弹簧并不需要都具有单独的相关的通路214。另外,尽管在图3中,引线键合弹簧216被阐释为两个连接点(位于引线键合焊盘210)都通过通路214连接到接地面212上,其实不需如此,引线键合弹簧的端部之一可以为浮置(即不与接地面电连接)。
根据一个示例方式,形成集成的EMI屏蔽体的方法包括转移成型工艺(步骤106)来将裸芯202封装在模制化合物220之中。下面将探讨的是,在转移成型加工过程中,基板204被放置于下模具中,上模具被降低到下模具上,以在装置周围形成密封腔。并且模制化合物220流入该空腔,以将裸芯202封装在基板上。转移成型工艺对于本领域的技术人员是已知的。
仍然参照图1和3,在转移成型工艺(步骤106)之后,还要应用一个烧蚀工艺(步骤108)来使引线键合弹簧216的顶部穿过模制化合物220暴露出来。烧蚀工艺可例如包括激光烧蚀工艺,研磨并/或抛光模制化合物220以去除一层模制化合物且使引线键合弹簧216的顶部暴露出来。在一个示例中,烧蚀工艺可去除的模制化合物的层厚度小于约40微米。在另一个示例中,烧蚀加工可去除的模制化合物的层厚度为约10微米。在引线键合弹簧216的顶部被露出之后,薄的导电的涂层或者层222可将被形成于模制化合物220的顶端(步骤110)与引线键合弹簧216的露出顶部接触。可应用本领域的技术人员已知的各种技术将导电层222沉积在模制化合物220的顶部上,所述技术比如印制、沉积、溅镀等。在一个示例中,导电层222包括金属填充的环氧树脂,如银填充环氧树脂,其被喷涂在模制化合物220的顶部上。导电层222与引线键合弹簧216的露出顶部接触,且于是与暴露的引线键合弹簧电连接。
如上所述,在一个实施方案中,模块200包括沿基板204底面设置的接地面212,如图3所示,并通过通路214与引线键合弹簧216连接。通过引线键合弹簧216的顶部与导电层222之间的接触,接地面212与导电层之间形成电连接,由此在模块200中形成了完整的EMI屏蔽体。在基板204中的接地面212与顶部的导电屏蔽层222之间,引线键合弹簧216提供了灵活(因为它们可能被置于基板上任意合适的位置)和完整的集成的连接。在一个实施方案中,引线键合弹簧216具有界定好的形状,如下进一步讨论的,其被控制来产生一个弹簧效应,其有助于在引线键合弹簧与导电层222之间产生可靠的电连接。因此,一个或多个裸芯202可大致包封在接地的EMI屏蔽体中,该接地的EMI屏蔽体由导电层222、引线键合弹簧216(以及它们相关的金属化物,如通路214和焊盘210等)和接地面212形成。对于模块200来说,与常规的EMI屏蔽方式的大体积的金属罐不同,根据本发明的实施方案中的EMI屏蔽体可增加最小的尺寸和重量。
根据一个实施方式,引线键合弹簧216具有特定的形状和高度,与传统的引线键合206不同,被被良好地控制。如图2和图3所示,众所周知,如对于本领域的技术人员所知的,使用引线键合机,形成常规的引线键合206,通过将键合引线的一端与裸芯202连接且控制引线键合机的移动以拉键合引线离开裸芯以形成环,如图2和图3所示,且然后将键合引线的另一端与基板上的焊盘相连。根据本发明的实施方式的引线键合弹簧216也是以相似的技术来形成的,但是通过操纵引线键合机在X轴和Y轴方向的运动来加工引线环,形成了独特的形状,其提供了想要的弹簧效应和下面将要继续讨论的其他属性。
参考图5,其示出了根据本发明的方面的此引线键合弹簧216的一个实施方式。该引线键合弹簧216包含球形键合体224和引线环226,球性键合体224提供了引线键合弹簧和基板204之间的第一连接点,环226从球形键合体224一直延伸到基板上的第二个连接点228。参考图5和图6,形成引线键合弹簧216的工艺(步骤104)从形成球形键合体224的第一步骤112开始。此步骤可包括在基板204上的引线键合焊盘210(见图3)上放置一个金属球(步骤114),将金属球与引线键合焊盘键合(步骤116),以形成球形键合体224。引线键合弹簧可以使用各种金属形成,,包括金(如对于常规的引线键合通常使用的)和铜。在一个示例中,引线键合弹簧由金制成引线键合焊盘210可以相似地是金或者是镀金的,球形键合体224被超声键合到基板204。类似的热声工艺可以被用于被在金、铜或者镀锡的引线焊盘210上形成铜引线键合体224。
根据一个实施方式,引线环226通过由球形键合体224一端拉引线,通过操纵引线键合机的X轴和Y轴的运动来成形引线(步骤118),且最终键合引线环的尾端到引线键合焊盘210(步骤120)来形成。在一个实施方式中,引线环226被成形为如图5所示的形状,或者与之类似的形状。
参考图7,其示出了了引线键合弹簧216键合到设置于基板204上引线键合焊盘210(或者轨道218)的实施方式。在一个实施方式中,引线键合弹簧216包括靠近球形键合体224的变形区域230。该引线从变形区域230向上延伸达到引线键合弹簧216的顶部232。凸形区域234在变形区域230和顶部232之间延伸。引线键合弹簧216还包括紧邻顶部232的上部区域236以及在上部区域236和第二连接点228之间延伸的向下倾斜尾部区域238。在一个示例中,上部区域236大致平坦,以提供与上导电层222的大的接触面积(见图4),由此有助于与电动车的良好的电连接。变形区域230被用于使得引线键合弹簧216与传统引线相比更加富有弹性,贡献于引线键合弹簧的弹簧效应以及引线键合弹簧的承受由模具自身和模制化合物施加的压力的能力,且在转移成型过程中保持引线键合弹簧的形状,如下面将要讨论的。在一个示例中,如虚线240所示,引线键合弹簧的顶部232被基本放置在变形区域236之上,这可以进一步贡献于引线键合弹簧216的弹性,如下面讨论的。
如本领域的技术人员所知和以上的讨论,在转移成型工艺过程中,装置被放置于一个下模具中,将上模具降低到下模具之上,以使在装置周围形成密封腔,模制化合物220流入该腔内。由引线键合焊盘210到了顶部232的测量的引线键合弹簧216的高度,可以比模制化合物220的预期或设计厚度稍微高一些。在转移成型工艺过程(步骤106)中,通过下降上模具242,引线键合弹簧216被压缩,如图8中所示。在一个示例中,上模具242首先接触到引线键合弹簧216的顶部232,因为顶部是引线键合弹簧的最高点。由于引线键合弹簧216的弹簧常数,因为变形区域230和实质上在变形区域上方的顶部232的位置,引线键合弹簧保持与上模具242的表面接触,如图8所示。这种由引线键合弹簧216的形状提供的弹簧效应使集成的EMI屏蔽体的制造更鲁棒,原因在于使得引线键合弹簧的顶部保持与模具的表面接触,只有模制化合物的薄层可以覆盖引线键合弹簧的顶部,从而使引线键合弹簧的顶部可以很容易并且可靠的在烧蚀工艺之后被暴露(步骤108)。在一个示例中,引线键合弹簧216在垂直方向有一个较大的弹簧行程并且能够吸收由于模制化合物厚度、基板厚度的变化和在转移成型工艺中可能发生的翘曲引起的最终高度的变化。引线键合弹簧的高度可以被选择为充分高,从而使引线键合弹簧当上模具242下降时被压缩,但是又不能太高从而使下降的上模具压坏引线键合弹簧。因此,引线键合弹簧不应如此高,使得适应该下降的上模具242所需的变形量超过引线键合弹簧的弹性能力。类似的,如果引线键合弹簧不够高,引线键合弹簧的顶部可以不接触或者在转移成型工艺之后不充分接近模制化合物的上表面,且由此不可以被烧蚀工艺暴露(步骤108),或可以不表现出充分的弹性变形(弹簧效应)来保持引线键合弹簧的顶部与模制化合物的上表面接触。在一个示例中,引线键合弹簧216的高度比模制化合物的设计厚度高了约90微米。然后,可以理解的是,引线键合弹簧根据比如用来形成该引线键合弹簧的金属或者模制材料等等因素而具有不同的高度。
在一个实施方式中,引线键合弹簧216的形状进行了优化,以提供与导电层222大的接触面积,从而促进与导电层222的良好的电接触。如上所述,在一个示例中,引线键合弹簧216的上区域236基本上是平的。因此,当受到上模具242挤压时,上部区域236可以提供与模具(或者模制化合物的表面)接触的大的平的面积(长度)。这是将通过烧蚀步骤(步骤108)暴露在封装体的顶部并与导电层222接触而形成与导电层222电连接并最终形成完整的EMI屏蔽体的面积。参看图9,示出了引入到装置封装体的引线键合弹簧的一个示例的图像。如图9所示,引线键合弹簧的上部区域236在模制化合物220的顶部上形成了一个大的平面积,并且与导电层222相接触。图10是图9的引线键合弹簧的的平面视图。参看图10,暴露主要是,但不一定完全是相应于引线键合弹簧的上部区域236与顶部232的暴露的引线的一长段224,可以在模制化合物的顶部上看到。包括引线键合弹簧的封装体的制作和模拟的示例被产生,其约暴露400微米的平均暴露长度244,和约200微米的最小暴露长度。相对于传统引线环(图4A中的206),这些示例示出了约10被的引线暴露长度的改善暴露。该增大的接触面积为电磁干扰屏蔽体提供了牢固和低电阻的电连接。此外,如对于引线键合弹簧采用了比如铜的材料,而不是金来例如减小成本,则由于铜的导电性低于金,这时这个大的接触面就显得尤为重要。另外,由于没有使用焊料来形成导电层222与引线键合弹簧暴露的部分之间的电连接(两个导体之间仅仅是靠接触相连),所以接触面积越大,连接越可靠。
除了提供弹簧效应和大的接触面积来促进与导电层222的良好和牢固的电连接之外,引线键合弹簧216的形状也提供了转移成型工艺过程中的适应力。申请人已经经过试验证明,引线键合弹簧在转移成型工艺过程中保持直立是重要的,从而上部区域位于模制化合物的顶部或接近该顶部且可以容易地用最小的烧蚀暴露出来。测试以及模拟证明,传统成形的引线键合环由于其形状的稳定性小或没有稳定性,在转移成型工艺过程中会折叠甚至倒塌,因此,该环在上模具242以及模制化合物流动产生的压力作用下可以向任意方向移动。相比之下,引线键合弹簧216的形状将引线键合弹簧的移动控制为主要是在垂直方向(图3中的y向)的压缩,造成上述讨论的弹簧效应。在一个示例中,引线键合弹簧在面内方向(即图3中的x-z方向)是刚性的,且对于模制流及引线拖曳缺陷具有良好的抵抗力,这些缺陷可能是非常高的环的的主要担忧点。
总之,任何转移成型加工模块中,仅使用典型的在模块基板中出现的接地面,沉积在模制化合物的顶部上的导电材料的薄层,在此讨论的多个引线键合弹簧来连接导电层到接地面,由此对于模块中的一些或所有装置形成完整的屏蔽体,就可以提供有效的、低成本的且牢固的集成的电磁干扰屏蔽体。引线键合弹簧可以放置在封装体中的任何位置,其具有可选的冗余连接以确保与导电层222的接触符合所有电要求,允许非常灵活的电磁干扰的屏蔽设计,其可以很容易地修改,以适应不同的模块布局和装置。相似的,根据之前参看图4A和4B的讨论,连接引线键合焊盘210(或轨道218)到接地面的通路214不需要与每个焊盘重合,或者与接地面的特定位置重合,允许在模块中灵活安置焊盘210和通路214。提供足够的电磁干扰屏蔽的所需的引线键合弹簧的数量取决于被屏蔽装置的工作频率和所需要屏蔽的等级。例如,线密度(即在任意指定的方向下,紧相邻的引线键合弹簧216之间的间距)可以随着信号频率的增加而增加。在一个示例中,约λ/20(其中λ是被屏蔽的信号的波长)的引线间距可以被使用。可以理解的是,引线间距不需要是均匀的,只要保持在给定频率的情况下达到预期的屏蔽效果的最小间距就可以了。引线键合弹簧EMI笼的示例被测试并得知提供大约20分贝的屏蔽,这已经可以满足大多数手机射频应用的要求。因此,这里讨论的引线键合弹簧可用于提供一个完全的集成的电磁干扰屏蔽体,其不仅非常灵活,还对于模块增加了最小得成本、重量以及尺寸。利用传统加工技术,可以加工引线键合弹簧,其成本低,牢固而且不需要采购任何额外的或者专门配备的组装设备。
根据以上对至少一个实施方式的的几个方面的描述,可以理解的是,对于本领域的技术人员而言各种变更、修改和改进是容易的。这样的变更、修改和改进旨在作为本公开的一部分并旨在包括在本发明的范围内。相应地,上述的描述和图示只是用于举例,本发明的范围应从所附的权利要求和它们的等同物的适当的解释来确定。
Claims (19)
1.一种封装的半导体模块,具有集成的电磁干扰屏蔽体,该封装的半导体模块包括:
具有接地面的基板;
安装在该基板的表面上的电子装置;
设置于该电子装置周围并与该接地面电耦合的多个引线键合弹簧,该多个引线键合弹簧的每个包含连续的引线环,所述连续的引线环具有设置于该基板的该表面上的球形键合体、变形区域、顶部、该变形区域和该顶部之间延伸的凸形区域、倾斜的尾部区域和该顶部和该倾斜的尾部区域之间延伸的平坦的区域;
覆盖该电子装置以及至少部分覆盖该多个引线键合弹簧的模制化合物;
设置在模制化合物的顶表面上并且与该多个引线键合弹簧的至少一些电耦合的导电层;
该多个引线键合弹簧、该导电层和该接地面共同构成了集成的电磁干扰屏蔽体。
2.权利要求1所述的封装的半导体模块,其中该多个引线键合弹簧的每个由金线制成。
3.权利要求1所述的封装的半导体模块,其中该多个引线键合弹簧的每个由铜线制成。
4.权利要求1所述的封装的半导体模块,其中该导电层包含银填充的环氧树脂。
5.权利要求1所述的封装的半导体模块,其中该电子装置是射频装置。
6.权利要求1-5中的任一所述的封装的半导体模块,其中该多个引线键合弹簧的每个包含的连续的引线环被成形以提供弹簧效应,其允许该导电层和该引线键合弹簧之间的接触,来提供该导电层和该引线键合弹簧之间的电耦合。
7.权利要求1所述的封装的半导体模块,还包含:
安置在该基板的该表面上的第一和第二金属化的连接点;
该球形键合体与该第一金属化的连接点相连;
该倾斜尾部区域的一端与该第二金属化的连接点相连。
8.一种引线键合弹簧,其由连续的引线环形成,包括:
球形键合体;
变形区域;
顶部;
该变形区域和该顶部之间延伸的凸形区域,该变形区域在该凸形区域和该球形键合体之间;
倾斜的尾部区域;和
该顶部和该倾斜的尾部区域之间延伸的平坦的区域。
9.权利要求8所述的引线键合弹簧,其中该顶部位于该变形区域的垂直上方。
10.权利要求8所述的引线键合弹簧,其中该引线键合弹簧由金线或铜线形成。
11.一种具有集成的电磁干扰屏蔽体的半导体模块封装体,该半导体模块封装体包括:
基板;
设置于该基板的第一表面上的第一和第二金属化的连接点;
引线键合弹簧,由在该第一金属化的连接点和第二金属化的连接点之间延伸的连续的环形成;
其中该引线键合弹簧包含:
与该第一金属化的连接点相连的球形键合体;
变形区域;
顶部;
该变形区域和该顶部之间延伸的凸形区域;
邻接该顶部的平坦的区域;
在该平坦的区域和该第二金属化的连接点之间延伸的倾斜尾部区域。
12.如权利要求11所述的半导体模块封装体,还包含设置在该基板上,并且与第一和第二金属化的连接点的至少一个电耦合的接地面。
13.如权利要求12所述的半导体模块封装体,还包含:
电子装置;和
多个附加的引线键合弹簧,每个附加的引线键合弹簧与该引线键合弹簧相同且安置在沿该电子装置周围的该基板上。
14.如权利要求13所述的半导体模块封装体,还包含:
覆盖该电子装置以及至少部分覆盖该引线键合弹簧的模制化合物;
设置在该模制化合物的表面上并且与该多个引线键合弹簧中的至少一些电耦合的导电层;
其中该接地面、该导电层、该引线键合弹簧和该多个附加的引线键合弹簧的中的至少一些共同形成了集成的电磁干扰屏蔽体。
15.一种具有集成的电磁干扰屏蔽体的模块的制造方法,该方法包括:
将电子装置与基板相连;
在该基板上设置金属化物;
形成与该金属化物相连的多个引线键合弹簧;
进行转移成型工艺将该电子装置包封在模制化合物之中,且用该模制化合物至少部分覆盖该多个引线键合弹簧;并且
将与该多个引线键合弹簧的至少一些电连接的导电层设置在该模制化合物表面上。
16.权利要求15所述的方法,还包含:在该模制化合物的该表面上设置该导电层以前,烧蚀该模制化合物的该表面,以暴露该多个引线键合弹簧的至少一些的区域。
17.权利要求15所述的方法,其中设置金属化物包含提供接地面,以及至少一个与该接地面相连的引线键合接触区域。
18.权利要求15所述的方法,其中形成该多个引线键合弹簧包含:
在该金属化物上沉积引线球;
形成引线环,通过自该引线球拉线来形成该引线环,该引线环具有第一端和第二端,该第一端连接到该引线球,
连接该第二端部到金属化物。
19.权利要求15所述的方法,其中在该模制化合物的该表面上设置该导电层包含在该模制化合物的该表面上喷涂银填充的环氧树脂层。
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PCT/US2008/071832 WO2010014103A1 (en) | 2008-07-31 | 2008-07-31 | Semiconductor package with integrated interference shielding and method of manufacture therof |
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EP2308085A1 (en) | 2011-04-13 |
JP5276169B2 (ja) | 2013-08-28 |
EP2752872B1 (en) | 2018-06-27 |
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CN102105981A (zh) | 2011-06-22 |
WO2010014103A1 (en) | 2010-02-04 |
KR101533866B1 (ko) | 2015-07-03 |
JP2011529638A (ja) | 2011-12-08 |
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