CN102086356B - Sticking film for wood composition floor - Google Patents
Sticking film for wood composition floor Download PDFInfo
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- CN102086356B CN102086356B CN201010567106A CN201010567106A CN102086356B CN 102086356 B CN102086356 B CN 102086356B CN 201010567106 A CN201010567106 A CN 201010567106A CN 201010567106 A CN201010567106 A CN 201010567106A CN 102086356 B CN102086356 B CN 102086356B
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- Prior art keywords
- floor
- sticking film
- solid wooden
- bonding film
- wooden compound
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- Floor Finish (AREA)
Abstract
The invention discloses a sticking film for wood composition floor, and the sticking film is prepared from the following raw materials, by weight, 35-45 parts of HDPE 6098; 35-45 parts of high density polyethylane 5000S; 1-2 parts of anti-aging agent UV; 10-20 parts of LLDPE 7042; and 5-20 parts of EVA260 resin. The sticking film for wood composition floor in the invention possesses strong bonding force, and the obtained wood composition floor possesses high shearing intensity, good temperature resistance and waterproof property; because raw materials used to produce the sticking film contain no formaldehyde, the obtained finished product sticking film contains no formaldehyde, the wood composition floor made by using the sticking film contains no formaldehyde, is environment-friendly floor, generates no pollution to indoor environment, is good for health, and is suitable to be applied and popularized in decoration wood floor industry.
Description
Technical field
The present invention relates to the plastics film technical field, specifically, relate to and a kind ofly be used for adjacent plank layer is carried out bonding bonding film when producing solid wooden compound floor.
Background technology
Solid wooden compound floor is mainly used in the flooring finishing, is the important wooden finishing materials of occasion such as family, hotel, hotel.At present, the production of solid wooden compound floor mostly adopts wood single-plate to form substrate through the urea formaldehyde resin adhesive gummed, and on substrate, covering with high-grade decorative veneer again is plane materiel, and hot-press gluing forms the finished product floor.Because employed urea formaldehyde resin adhesive is by urea and the formaldehyde linear urea aldehyde oligopolymer that polycondensation makes under the catalysis of acid or alkali in the production process; The floor is in production and use; The formaldehyde that has a large amount of unbound states discharges; According to test, the volatilization of formaldehyde is for up to 3-15, and serious environment pollution, harm people's is healthy.
Based on above present situation, press for a kind of formaldehydeless environmental-friendly adhesion material of development and substitute urea formaldehyde resin adhesive, be used for the production of solid wooden compound floor, make the solid wooden compound floor of production formaldehydeless, environmental protection, be of value to the healthy of people.
Summary of the invention
Technical problem to be solved by this invention is: provide a kind of solid wooden compound floor that does not contain formaldehyde, environmental protection to use bonding film, be used for carrying out adjacent plank layer bonding.
For solving the problems of the technologies described above, technical scheme of the present invention is: solid wooden compound floor is used bonding film, and said solid wooden compound floor is to be processed by the raw material of following weight part with bonding film
HDPE?6098 35～45
High density polyethylene(HDPE) 5000S 35～45
Inhibitor UV 1～2
LLDPE?7042 10～20
EVA260 resin 5～20.
As optimized technical scheme, said solid wooden compound floor is to be processed by the raw material of following weight part with bonding film
HDPE?6098 40
High density polyethylene(HDPE) 5000S 40
Inhibitor UV 2
LLDPE?7042 15
EVA260 resin 13.
As optimized technical scheme, described solid wooden compound floor is processed with blow moulding with bonding film, and it is 170 ℃～195 ℃ that prepared solid wooden compound floor uses the melt temperature of bonding film.
Owing to adopted technique scheme; The invention has the beneficial effects as follows: because solid wooden compound floor of the present invention uses bonding film is to be processed with blow moulding as raw material by HDPE 6098, high density polyethylene(HDPE) 5000S, inhibitor UV, LLDPE 7042, EVA260 resin 5-19; Do not contain formaldehyde in the raw material of production usefulness, the finished product solid wooden compound floor that therefore makes does not contain formaldehyde with bonding film yet; When using the bonding film that does not contain formaldehyde of the present invention to produce solid wooden compound floor, lay one deck solid wooden compound floor between the adjacent two layers wood single-plate and use bonding film, utilize pressing machine; Under HTHP, under the condition, the wood single-plate that lays is exerted pressure, when temperature reaches 170 ℃～195 ℃; Bonding film is in molten state; Adjacent wood single-plate is bonded together, and behind the naturally cooling, bonding film is condensed into solid-state; Adjacent wood single-plate is bonded together tightly, promptly make solid wooden compound floor.Solid wooden compound floor of the present invention is strong with bonding film bonding force, and the shearing resistance of the solid wooden compound floor that makes is high, and the test proof even wood single-plate is destroyed, also is difficult to the two-layer wood single-plate that bonds together through this bonding film is separated; Solid wooden compound floor of the present invention owing to have higher melt temperature, makes the solid wooden compound floor of production have good high temperature resistant and water resistance with bonding film; Because solid wooden compound floor of the present invention does not contain formaldehyde with bonding film; Being a kind of bonding film of environmental protection environment-friendly type, utilizing the solid wooden compound floor of this bonding film production that does not contain formaldehyde also not contain formaldehyde, is a kind of environmental protection floor; Can not pollute indoor environment, be of value to the healthy of people.
Embodiment
Solid wooden compound floor of the present invention is to be processed by the raw material of following weight part with bonding film
HDPE?6098 35～45
High density polyethylene(HDPE) 5000S 35～45
Inhibitor UV 1～2
LLDPE?7042 10～20
EVA260 resin 5～20.
Described inhibitor UV can select inhibitor UV-531, inhibitor UV-328 or inhibitor UV-329 for use.
Embodiment one: solid wooden compound floor of the present invention selects for use the raw material of following weight part to process with bonding film
HDPE?6098 40
High density polyethylene(HDPE) 5000S 40
Inhibitor UV-531 2
LLDPE?7042 15
EVA260 resin 13.
Embodiment two: solid wooden compound floor of the present invention selects for use the raw material of following weight part to process with bonding film
HDPE?6098 35
High density polyethylene(HDPE) 5000S 35
Inhibitor UV-328 1
LLDPE?7042 10
EVA260 resin 5.
Embodiment three: solid wooden compound floor of the present invention selects for use the raw material of following weight part to process with bonding film
HDPE?6098 45
High density polyethylene(HDPE) 5000S 45
Inhibitor UV-329 1.5
LLDPE?7042 20
EVA260 resin 20.
This composite floor board of reality of the present invention adopts blow moulding commonly used in the plastics-production field with the raw material of bonding film according to above-mentioned weight part, and for example the stretch-blow method is processed, and it is 170 ℃～195 ℃ that prepared solid wooden compound floor uses the melt temperature of bonding film.
Because it is to be processed with blow moulding as raw material by HDPE 6098, high density polyethylene(HDPE) 5000S, UV, LLDPE 7042, EVA260 resin 5-19 that solid wooden compound floor of the present invention uses bonding film; Do not contain formaldehyde in the raw material of production usefulness, the finished product solid wooden compound floor that therefore makes does not contain formaldehyde with bonding film yet; When using the bonding film that does not contain formaldehyde of the present invention to produce solid wooden compound floor, lay one deck solid wooden compound floor between the adjacent two layers wood single-plate and use bonding film, utilize pressing machine; Under HTHP, under the condition, the wood single-plate that lays is exerted pressure, when temperature reaches 170 ℃～195 ℃; Bonding film is in molten state; Adjacent wood single-plate is bonded together, and behind the naturally cooling, solid wooden compound floor is condensed into solid-state with bonding film; Adjacent wood single-plate is bonded together tightly, promptly make solid wooden compound floor.Solid wooden compound floor of the present invention is strong with the bonding force of bonding film; The shearing resistance of the solid wooden compound floor that makes is high, is 7.5MPa through detecting shearing resistance, the test proof; Even wood single-plate is destroyed, also be difficult to the two-layer wood single-plate that bonds together through this bonding film is separated; Solid wooden compound floor of the present invention with bonding film owing to have a higher melt temperature; Make the solid wooden compound floor of production have good high temperature resistant and water resistance; Under following condition, do the dipping stripping test; The solid wooden compound floor that makes was soaked 6 hours in 10 ℃～25 ℃ cold water, again in 40 ± 3 ℃ baking oven the baking at least 18 hours, arbitrary termination on floor, or arbitrary limit all do not occur peeling off or ftractureing; Because solid wooden compound floor does not contain formaldehyde with bonding film, is a kind of environmental-friendly adhesion film, utilizes the solid wooden compound floor of this bonding film production that does not contain formaldehyde not contain formaldehyde yet, is a kind of environmental protection floor, can not pollute indoor environment, is of value to the healthy of people.
Claims (3)
1. solid wooden compound floor is used bonding film, it is characterized in that: said solid wooden compound floor is to be processed by the raw material of following weight part with bonding film
2. solid wooden compound floor as claimed in claim 1 is used bonding film, it is characterized in that: said solid wooden compound floor is to be processed by the raw material of following weight part with bonding film
3. according to claim 1 or claim 2 solid wooden compound floor is used bonding film, and it is characterized in that: described solid wooden compound floor is processed with blow moulding with bonding film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010567106A CN102086356B (en) | 2010-11-18 | 2010-11-18 | Sticking film for wood composition floor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010567106A CN102086356B (en) | 2010-11-18 | 2010-11-18 | Sticking film for wood composition floor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102086356A CN102086356A (en) | 2011-06-08 |
| CN102086356B true CN102086356B (en) | 2012-09-05 |
Family
ID=44098362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010567106A Expired - Fee Related CN102086356B (en) | 2010-11-18 | 2010-11-18 | Sticking film for wood composition floor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102086356B (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103965806A (en) * | 2013-01-31 | 2014-08-06 | 戴武兵 | Adhesive composition and application thereof |
| CN103963117A (en) * | 2013-01-31 | 2014-08-06 | 戴武兵 | Plywood and manufacturing method for same |
| CN103963112A (en) * | 2013-01-31 | 2014-08-06 | 戴武兵 | Man-made board and manufacturing method thereof |
| CN103963119A (en) * | 2013-01-31 | 2014-08-06 | 戴武兵 | Plywood and manufacturing method for same |
| CN103963137A (en) * | 2013-01-31 | 2014-08-06 | 戴武兵 | Formaldehyde-free fiber material and formation method thereof, as well as fiber decorative material and manufacturing method thereof |
| CN103963115A (en) * | 2013-01-31 | 2014-08-06 | 戴武兵 | Man-made board and manufacturing method thereof |
| CN103963111A (en) * | 2013-01-31 | 2014-08-06 | 戴武兵 | Man-made board and manufacturing method thereof |
| CN103963134A (en) * | 2013-01-31 | 2014-08-06 | 戴武兵 | Formaldehyde-free fiber material and formation method thereof, as well as fiber decorative material and manufacturing method thereof |
| CN103963114A (en) * | 2013-01-31 | 2014-08-06 | 戴武兵 | Plywood and manufacturing method for same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101004100A (en) * | 2006-01-20 | 2007-07-25 | 栾建冬 | Composite face veneer, preparation method, and composite floor containing the face veneer |
| CN101028720A (en) * | 2006-03-03 | 2007-09-05 | 吴云生 | Wooden floor and its production |
| WO2009142525A2 (en) * | 2008-05-22 | 2009-11-26 | Universidade De Coimbra | Capsulating system binding to nucleolin |
-
2010
- 2010-11-18 CN CN201010567106A patent/CN102086356B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101004100A (en) * | 2006-01-20 | 2007-07-25 | 栾建冬 | Composite face veneer, preparation method, and composite floor containing the face veneer |
| CN101028720A (en) * | 2006-03-03 | 2007-09-05 | 吴云生 | Wooden floor and its production |
| WO2009142525A2 (en) * | 2008-05-22 | 2009-11-26 | Universidade De Coimbra | Capsulating system binding to nucleolin |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102086356A (en) | 2011-06-08 |
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Granted publication date: 20120905 Termination date: 20191118 |