CN102076179B - Electronic element and method for assembling electronic element with circuit board - Google Patents
Electronic element and method for assembling electronic element with circuit board Download PDFInfo
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- CN102076179B CN102076179B CN201010575024.1A CN201010575024A CN102076179B CN 102076179 B CN102076179 B CN 102076179B CN 201010575024 A CN201010575024 A CN 201010575024A CN 102076179 B CN102076179 B CN 102076179B
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Abstract
The invention discloses an electronic element. The electronic element is inserted into the surface of the circuit board along one end, which is provided with solder paste, of the circuit board, is welded on the surface of the circuit board and comprises a main body and a pressing piece, wherein the main body comprises an insulating body and a plurality of terminals which are fixed on the insulating body; each terminal is provided with a welding part which is welded with the circuit board and a butting part; the pressing piece is positioned on one side, which is far away from the circuit board, of each terminal, is movably connected with the main body and can switch the electronic element between an initial state and a final state; in the initial state, the welding part is positioned on the outer side of the corresponding solder paste; and in the final state, the pressing piece presses the butting part of the terminal, so that the welding part is contacted with the corresponding solder paste. The invention also provides a method for assembling the electronic element with the circuit board.
Description
[technical field]
The present invention relates to a kind of electronic component and with the assemble method of circuit board, refer to especially circuit board one end that a kind of edge is provided with tin cream insert and be welded in described circuit board surface electronic component and with the assemble method of circuit board.
[background technology]
Electronic product has generally comprised a circuit board at present, and on described circuit board, a plurality of electronic components is installed, as electric connector chip etc.Described electronic component is be generally positioned over along the vertical direction described circuit board and and then be welded on described circuit board surface.But day by day lightening along with electronic product, the height of described electronic component has become the lightening bottleneck of restriction, and therefore, described in some, electronic component starts to be designed to insert along described circuit board one end.The common way of inserting along one end is, on described circuit board, is coated with tin cream, then described electronic component inserted, and the terminal in described electronic component is contacted with tin cream.
But this mode has a serious defect, when described circuit board inserts, the described terminal on described electronic component can pushing tow described in tin cream on circuit board, tin cream is scraped and causes failure welding, or the contact of adjacent tin cream causes short circuit.
Therefore, be necessary to design a kind of electronic component and with the assemble method of circuit board, to overcome the problems referred to above.
[summary of the invention]
Creation object of the present invention be to provide a kind of not pushing tow tin cream electronic component and with the assemble method of circuit board.
In order to achieve the above object, electronic component of the present invention is in order to insert and to be welded in the surface of described circuit board along the circuit board one end that is provided with tin cream, comprise a main body, a plurality of terminals that it comprises an insulating body and is fixed on described insulating body, described in each, terminal has one in order to the weld part with described welding circuit board and an abutting part; An and rolled-up stock, be positioned at described terminal away from a side of described circuit board, and be movably connected on described main body, can make described electronic component change between initial condition and end-state, in initial condition, described rolled-up stock and described terminal keep in touch, described welding position is in the described tin cream of correspondence outside, in end-state, described rolled-up stock is suppressed described terminal abutting part, make the corresponding described tin cream of described weld part contact, and initial condition is to end-state, the contact area change between described rolled-up stock and described terminal.
The assemble method of electronic component of the present invention and circuit board comprises the steps: to provide a circuit board, and at least one surface of described circuit board is provided with a plurality of tin creams; One electronic component is provided, described electronic component comprises a main body and a rolled-up stock, described main body comprises an insulating body and is fixed on a plurality of terminals of described insulating body, described in each, terminal has one in order to the weld part with described welding circuit board and an abutting part, described rolled-up stock is positioned at described terminal away from a side of described circuit board, and be movably connected on described main body, this initial condition, described rolled-up stock and described terminal keep in touch, and described abutting part is positioned at a side of the fin of corresponding described rolled-up stock; Described circuit board is inserted to described electronic component, and after insertion, described welding position is in the outside of corresponding described tin cream; Operate described rolled-up stock to end-state, at this moment, described rolled-up stock is suppressed described terminal, makes described weld part contact described tin cream, and initial condition is to end-state, and the contact area between described rolled-up stock and described terminal changes; And heating, make described weld part respectively by described tin cream and described welding circuit board.
Compared with prior art, electronic component of the present invention and suppress described terminal by described rolled-up stock with the assemble method of circuit board, make described weld part from the corresponding described tin cream of outer side contacts, thereby without tin cream described in pushing tow, avoid the generation of failure welding and short circuit phenomenon.
[accompanying drawing explanation]
Fig. 1 is the three-dimensional exploded view of first embodiment of the invention electronic component and circuit board;
Fig. 2 is the stereogram after the upset of electronic component rolled-up stock shown in Fig. 1;
Fig. 3 is the three-dimensional combination figure of electronic component shown in Fig. 1 (in initial condition) and circuit board;
Fig. 4 is the vertical view of electronic component shown in Fig. 3 and circuit board;
Fig. 5 is the sectional view that electronic component shown in Fig. 3 and circuit board do not have line A-A;
Fig. 6 is the three-dimensional combination figure of electronic component shown in Fig. 1 (in end-state) and circuit board;
Fig. 7 is the sectional view of electronic component shown in Fig. 6 and circuit board;
Fig. 8 is the cutaway view of second embodiment of the invention electronic component (in initial condition) and circuit board;
Fig. 9 is the cutaway view of electronic component shown in Fig. 8 (in end-state) and circuit board;
Figure 10 is the cutaway view of third embodiment of the invention electronic component (in initial condition) and circuit board;
Figure 11 is the cutaway view of electronic component shown in Figure 10 (in end-state) and circuit board.
The drawing reference numeral explanation of embodiment:
Insulating body 10 hyoplastron 11 terminal containing slot 13 arms 14
Rolled-up stock 30 base portion 31,31 ' fin 33 projections 35
Protuberance 32 '
[embodiment]
For ease of better understanding object of the present invention, structure, feature and effect etc., be now described further to electronic component of the present invention and with the assemble method of circuit board with embodiment by reference to the accompanying drawings.
As Fig. 1 and Fig. 2, described electronic component is an electric connector, in order to connect an external connected electronic element (not shown) to a circuit board 40, it comprises an insulating body 10, is fixed on a plurality of terminals 20 of described insulating body 10, and the rolled-up stock 30 that is movably connected on described insulating body 10.Certainly, described electronic component also can be other type, as LED (light-emitting diode), Bluetooth transmission device etc.
Described rolled-up stock 30 is not necessarily movably connected on described insulating body 10, also can be movably connected on described terminal 20, or be connected with described terminal 20 joint activities by described insulating body 10, that is to say, upper with the main body (not label) that described terminal 20 forms as long as described rolled-up stock 30 is movably connected on described insulating body 10.
Described circuit board 40 is provided with a plurality of tin creams 41 in precalculated position, to provide scolder for welding between described terminal 20 and described circuit board 40, described electronic component inserts along described circuit board 40 one end that are provided with described tin cream 41.
Described insulating body 10 is roughly rectangular-shaped, and its front portion is provided with a hyoplastron 11 extending forward, and extends and be provided with a plurality of terminal containing slots 13 that are through to described hyoplastron 11 from back to front.Its both sides, rear portion extend back to be provided with described in two arms 15, two and form in order to accommodate the spatial accommodation 15 of described rolled-up stock 30 between arm 14.Described in each, arm 14 middle parts are provided with the groove 17 of an open rearward end.
Described in each, terminal 20 comprises that one is fixed on the fixed part 21 on described insulating body 10, by described fixed part 21, extended forward the docking section 23 forming with described external connected electronic element electric connection, and the weld part 25 that extends back and form and be positioned at described fixed part 21 rear ends by described fixed part 21.Described in each, docking section 23 is contained in described hyoplastron 11, and is revealed at least partly outside described hyoplastron 11.Described weld part 25 is in order to be welded on described circuit board 40.Described in each terminal 20 described in it between fixed part 21 and described weld part 25 bending be outwardly formed with an abutting part 27, with rolled-up stock described in butt 30.Meanwhile, between described fixed part 21 and described abutting part 27, be also bent to form a depression 29 inwardly.The described weld part 25 of a plurality of described terminals 20 is arranged in two rows, to weld mutually with the upper and lower surface of described circuit board 40 respectively.Under initial condition, the distance between the described weld part 25 of two rows is more than or equal to the outermost distance of described tin cream 41 (as Fig. 5) of described circuit board 40 upper and lower surfaces.
A plurality of fins 33 that described rolled-up stock 30 is provided with the base portion 31 of a strip and is positioned at described base portion 31 lower surfaces and longitudinally arranges, described fin 33 is corresponding with described terminal 20.Described rolled-up stock 30 is also provided with the projection 35 of a horizontally set, to coordinate with the described depression 29 of described terminal 20, to limit described rolled-up stock 30, moves forward and backward.Described base portion 31 both sides are provided with one in order to be contained in the auxiliary section 37 in described groove 17 toward extension respectively, and a side (being left side in the present embodiment) is further extended and is provided with an operating portion 39 therein, and described operating portion 39 is long can stretch out described main body after being assembled to described main body.Certainly, described operating portion 39 also can directly extend to form from described base portion 31.
Fig. 3 is to Figure 5 shows that described electronic component in initial condition and the schematic diagram of circuit board.Now, described rolled-up stock 30 is positioned at described terminal 20 away from a side (the present embodiment is upside) of described circuit board 40, and described rolled-up stock 30 keeps in touch with described terminal 20.Described auxiliary section 37 is contained in described groove 17, and described operating portion 39 stretches out described main body, for user, presses.Described abutting part 27 is positioned at a side of corresponding described fin 33, be not positioned at the outer surface of described fin 33, at this moment, distance between the described weld part 25 of two rows is more than or equal to the outermost distance of described tin cream 41 of described circuit board 40 upper and lower surfaces, therefore can keep described weld part 25 to be positioned at described tin cream 41 outsides, thereby avoid tin cream 41 described in described terminal 20 pushing tows.
Fig. 6 and the state Figure 7 shows that after the described rolled-up stock 30 of operation, that is the end-state of described electronic component.Now, with respect to initial condition, described rolled-up stock 30 is in vertical described electronic component direction of insertion, and in the plane parallel with described circuit board 40 skew (hereinafter to be referred as transverse shifting) certain distance.Can establish a stop part in the position of described base portion 31 contiguous right-hand members, the medial surface in order to butt to described right side arm 14, is moved further (this part is not shown) to limit described rolled-up stock 30.Simultaneously, during described rolled-up stock 30 transverse shifting, suppress described abutting part 27, and final described abutting part 27 is connected to the respective outside surface (that is respective outside surface of described rolled-up stock 30) of described fin 33, make distance between the described weld part 25 of two rows be less than the outermost distance of described tin cream 41 of described circuit board 40 upper and lower surfaces, thereby make the described tin cream 41 of described weld part 25 contact, and initial condition is to end-state, and the contact area between described rolled-up stock 30 and described terminal 20 changes.
The assemble method of described electronic component and described circuit board 40 comprises the steps:
Described circuit board 40 is provided, and described circuit board 40 upper and lower surfaces are provided with a plurality of described tin creams 41 (as Fig. 1);
As Fig. 1 to Fig. 5, described electronic component is provided, described electronic component comprises described main body and described rolled-up stock 30, described main body comprises described insulating body 10 and is fixed on a plurality of terminals 20 of described insulating body 10, described in each, terminal 20 has described weld part 25 and described abutting part 27, a plurality of described weld parts 25 are arranged in two rows, in order to be welded in respectively the upper and lower surface of described circuit board 40, described rolled-up stock 30 is positioned at wherein one arranges described terminal 20 away from a side of described circuit board 40, and be movably connected on described main body, at this moment, described rolled-up stock 30 keeps in touch with described terminal 20, described abutting part 27 is positioned at a side of corresponding described fin 33, make distance between the described weld part 25 of two rows be more than or equal to the outermost distance of described tin cream 41 of described circuit board 40 upper and lower surfaces,
Described circuit board 40 is inserted to described electronic component, and after insertion, described weld part 25 is positioned at the outside of corresponding described tin cream 40;
As Fig. 6 and Fig. 7, operation (being transverse shifting in the present embodiment) described rolled-up stock 30 is to end-state, at this moment, the described terminal 20 of described rolled-up stock 30 compacting, it is the respective outside surface that described abutting part 27 is positioned at described rolled-up stock 30, make the corresponding described tin cream 41 of weld part 25 contact described in each, and initial condition is to end-state, the contact area change between described rolled-up stock 30 and described terminal 20; And
Heating, makes described weld part 25 respectively by described tin cream 41 and described circuit board 40 welding.
The present embodiment, by this structure of described rolled-up stock 30, while making described rolled-up stock 30 transverse shifting, can be suppressed described terminal 20 and makes the inside deviation of described weld part 25 and contact with corresponding described tin cream 41.Certainly, persons skilled in the art can be associated other structure thus, at this, just no longer enumerate.
Electronic component described above and with the assemble method of described circuit board 40, because of when described circuit board 40 inserts, described terminal 20 can pushing tow described in tin cream 41, therefore can effectively avoid failure welding of the prior art or short circuit.
Fig. 8 with Figure 9 shows that another embodiment of the present invention.Mainly be with above-mentioned the first embodiment difference, the mode of operation of its rolled-up stock 30 ' is for rotating to an angle, but not transverse shifting.By rotating described rolled-up stock 30 ', make described electronic component be converted to end-state by initial condition, thereby also can realize when described circuit board 40 inserts, described terminal 20 is tin cream 41 described in pushing tow not, therefore also can effectively avoid failure welding of the prior art or short circuit.In this structure, described rolled-up stock 30 ' comprises a base portion 31 ', and described base portion 31 ' is provided with the projection 35 of a horizontally set, to match with the described depression 29 of described terminal 20.In addition, described base portion 31 ' is also provided with the protuberance 32 ' of a horizontally set, and with when rotating to end-state, described protuberance 32 ' is suppressed described abutting part 27, makes the inside deviation of described weld part 25 and contacts with corresponding tin cream 41.The structure of described rolled-up stock 30 ' is more simple.
Except transverse shifting and rotation, also can in described electronic component direction of insertion, move (abbreviation vertically moves) (as Figure 10 and Figure 11) by described rolled-up stock 30 realizes, in this embodiment, during initial condition, described projection 35 is arranged in described depression 29, during end-state, described projection 35 shifts out described depression 29 and is connected to described abutting part 27, makes the inside deviation of described weld part 25 and contacts with corresponding tin cream 41.
Above these three kinds of modes can be in concrete condition choice for use, to be applicable to various agent structure and operating space.
In above-described embodiment, described electronic component is the upper and lower surface that is welded in described circuit board, and certainly, the present invention also can be applicable to be welded in a surface of described circuit board, so long as described electronic component inserts along described circuit board one end, can realize the effect of tin cream described in pushing tow not.
Only more than describe the explanation for the present invention's preferred embodiment in detail, non-so limit to the scope of the claims of the present invention, so the equivalence techniques variation that all this creation of utilization specifications and diagramatic content are done, is all contained in the scope of the claims of the present invention.
Claims (16)
1. an electronic component, in order to insert and to be welded in the surface of described circuit board along the circuit board one end that is provided with tin cream, is characterized in that, comprising:
One main body, a plurality of terminals that it comprises an insulating body and is fixed on described insulating body, described in each, terminal has one in order to the weld part with described welding circuit board and an abutting part; And
One rolled-up stock, be positioned at described terminal away from a side of described circuit board, and be movably connected on described main body, can make described electronic component change between initial condition and end-state, in initial condition, described rolled-up stock and described terminal keep in touch, described welding position is in the described tin cream of correspondence outside, in end-state, described rolled-up stock is suppressed described terminal abutting part, make the corresponding described tin cream of described weld part contact, and initial condition is to end-state, the contact area change between described rolled-up stock and described terminal.
2. electronic component as claimed in claim 1, is characterized in that: with respect in initial condition, the described rolled-up stock in end-state is in vertical described electronic component direction of insertion, and is offset certain distance in the plane parallel with described circuit board.
3. electronic component as claimed in claim 2, it is characterized in that: a plurality of fins that described rolled-up stock comprises a base portion and is positioned at described base surface and longitudinally arranges, described fin is corresponding with described terminal, in initial condition, described abutting part is positioned at corresponding described fin one side, in end-state, described abutting part is connected to respectively the outer surface of corresponding described fin.
4. electronic component as claimed in claim 2, is characterized in that: described rolled-up stock is provided with the projection of a horizontally set, and described in each, terminal correspondence is provided with a depression coordinating with described projection.
5. electronic component as claimed in claim 1, is characterized in that: with respect in initial condition, the described rolled-up stock in end-state rotates to an angle.
6. electronic component as claimed in claim 1, is characterized in that: with respect in initial condition, the described rolled-up stock in end-state is in described electronic component direction of insertion skew certain distance.
7. the electronic component as described in claim 5 or 6, is characterized in that: described rolled-up stock is provided with the projection of a horizontally set, and described in each, terminal is provided with a depression coordinating with described projection.
8. electronic component as claimed in claim 1, is characterized in that: described rolled-up stock has an operating portion, and described operating portion stretches out described main body.
9. electronic component as claimed in claim 1, is characterized in that: described terminal is arranged in two rows, welds respectively with the upper and lower surface of described circuit board, and described rolled-up stock is positioned at wherein one arranges described terminal away from a side of described circuit board.
10. an assemble method for electronic component and circuit board, is characterized in that, comprises the steps:
One circuit board is provided, and at least one surface of described circuit board is provided with a plurality of tin creams;
One electronic component is provided, described electronic component comprises a main body and a rolled-up stock, described main body comprises an insulating body and is fixed on a plurality of terminals of described insulating body, described in each, terminal has one in order to the weld part with described welding circuit board and an abutting part, described rolled-up stock is positioned at described terminal away from a side of described circuit board, and be movably connected on described main body, initial condition, described rolled-up stock and described terminal keep in touch, and described abutting part is positioned at a side of the fin of corresponding described rolled-up stock;
Described circuit board is inserted to described electronic component, and after insertion, described welding position is in the outside of corresponding described tin cream;
Operate described rolled-up stock to end-state, at this moment, described rolled-up stock is suppressed described terminal, makes described weld part contact described tin cream, and initial condition is to end-state, and the contact area between described rolled-up stock and described terminal changes; And
Heating, makes described weld part respectively by described tin cream and described welding circuit board.
The assemble method of 11. electronic components as claimed in claim 10 and circuit board, is characterized in that: described rolled-up stock is by vertical described electronic component direction of insertion, and mobilely in the plane parallel with described circuit board makes it to end-state.
The assemble method of 12. electronic components as claimed in claim 11 and circuit board, it is characterized in that: a plurality of fins that described rolled-up stock comprises a base portion and is positioned at described base surface and longitudinally arranges, described fin is corresponding with described terminal, in initial condition, described abutting part is positioned at corresponding described fin one side, in end-state, described abutting part is connected to respectively the outer surface of corresponding described fin.
The assemble method of 13. electronic components as claimed in claim 10 and circuit board, is characterized in that: described rolled-up stock makes it to end-state by rotation.
The assemble method of 14. electronic components as claimed in claim 10 and circuit board, is characterized in that: described rolled-up stock is by moving to make it to end-state in described electronic component direction of insertion.
The assemble method of 15. electronic components as claimed in claim 10 and circuit board, is characterized in that: described rolled-up stock has an operating portion, and described operating portion stretches out described main body, by described operating portion, makes described rolled-up stock be transformed into end-state by initial condition.
The assemble method of 16. electronic components as claimed in claim 10 and circuit board, it is characterized in that: described terminal is arranged in two rows, weld with the upper and lower surface of described circuit board respectively, described rolled-up stock is positioned at wherein one arranges described terminal away from a side of described circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010575024.1A CN102076179B (en) | 2010-12-02 | 2010-12-02 | Electronic element and method for assembling electronic element with circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010575024.1A CN102076179B (en) | 2010-12-02 | 2010-12-02 | Electronic element and method for assembling electronic element with circuit board |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012103847307A Division CN103002669A (en) | 2010-12-02 | 2010-12-02 | Electronic component and method for assembling electronic component with circuit board |
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| Publication Number | Publication Date |
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| CN102076179A CN102076179A (en) | 2011-05-25 |
| CN102076179B true CN102076179B (en) | 2014-04-09 |
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| CN201010575024.1A Active CN102076179B (en) | 2010-12-02 | 2010-12-02 | Electronic element and method for assembling electronic element with circuit board |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103002669A (en) * | 2010-12-02 | 2013-03-27 | 番禺得意精密电子工业有限公司 | Electronic component and method for assembling electronic component with circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2922168Y (en) * | 2006-05-31 | 2007-07-11 | 宏致电子股份有限公司 | Electrical connector used for flexible circuit board |
| CN201112680Y (en) * | 2007-09-07 | 2008-09-10 | 达昌电子科技(苏州)有限公司 | Electric connector structure |
| JP2009037957A (en) * | 2007-08-03 | 2009-02-19 | Hirose Electric Co Ltd | Electrical connector for circuit board |
| CN201266698Y (en) * | 2008-07-02 | 2009-07-01 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
| CN102064402A (en) * | 2010-10-22 | 2011-05-18 | 番禺得意精密电子工业有限公司 | Electronic element and method for assembling electronic element and circuit board |
-
2010
- 2010-12-02 CN CN201010575024.1A patent/CN102076179B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2922168Y (en) * | 2006-05-31 | 2007-07-11 | 宏致电子股份有限公司 | Electrical connector used for flexible circuit board |
| JP2009037957A (en) * | 2007-08-03 | 2009-02-19 | Hirose Electric Co Ltd | Electrical connector for circuit board |
| CN201112680Y (en) * | 2007-09-07 | 2008-09-10 | 达昌电子科技(苏州)有限公司 | Electric connector structure |
| CN201266698Y (en) * | 2008-07-02 | 2009-07-01 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
| CN102064402A (en) * | 2010-10-22 | 2011-05-18 | 番禺得意精密电子工业有限公司 | Electronic element and method for assembling electronic element and circuit board |
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| CN102076179A (en) | 2011-05-25 |
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