CN102076179A - Electronic element and method for assembling electronic element with circuit board - Google Patents
Electronic element and method for assembling electronic element with circuit board Download PDFInfo
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- CN102076179A CN102076179A CN2010105750241A CN201010575024A CN102076179A CN 102076179 A CN102076179 A CN 102076179A CN 2010105750241 A CN2010105750241 A CN 2010105750241A CN 201010575024 A CN201010575024 A CN 201010575024A CN 102076179 A CN102076179 A CN 102076179A
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- circuit board
- stock
- electronic component
- rolled
- terminal
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention discloses an electronic element. The electronic element is inserted into the surface of the circuit board along one end, which is provided with solder paste, of the circuit board, is welded on the surface of the circuit board and comprises a main body and a pressing piece, wherein the main body comprises an insulating body and a plurality of terminals which are fixed on the insulating body; each terminal is provided with a welding part which is welded with the circuit board and a butting part; the pressing piece is positioned on one side, which is far away from the circuit board, of each terminal, is movably connected with the main body and can switch the electronic element between an initial state and a final state; in the initial state, the welding part is positioned on the outer side of the corresponding solder paste; and in the final state, the pressing piece presses the butting part of the terminal, so that the welding part is contacted with the corresponding solder paste. The invention also provides a method for assembling the electronic element with the circuit board.
Description
[technical field]
The present invention relates to a kind of electronic component and with the assemble method of circuit board, be meant especially circuit board one end that a kind of edge is provided with tin cream insert and be welded in described circuit board surface electronic component and with the assemble method of circuit board.
[background technology]
Electronic product has generally comprised a circuit board at present, and on described circuit board a plurality of electronic components is installed, as electric connector, and chip or the like.Described electronic component generally be positioned over along the vertical direction described circuit board and and then be welded on the described circuit board surface.But lightening day by day along with electronic product, the height of described electronic component has become the lightening bottleneck of restriction, and therefore, some described electronic component begins to be designed to insert along described circuit board one end.The common way of inserting along an end is, is coated with tin cream on described circuit board, then described electronic component inserted, and the terminal in the described electronic component is contacted with tin cream.
But this mode has a serious defective, and promptly when described circuit board inserted, the tin cream on the described circuit board of described terminal meeting pushing tow on the described electronic component tin cream is wiped off caused failure welding, or the contact of adjacent tin cream caused short circuit.
Therefore, be necessary to design a kind of electronic component and with the assemble method of circuit board, to overcome the problems referred to above.
[summary of the invention]
Creation purpose of the present invention be to provide a kind of not pushing tow tin cream electronic component and with the assemble method of circuit board.
In order to achieve the above object, electronic component of the present invention is in order to insert and to be welded in the surface of described circuit board along circuit board one end that is provided with tin cream, comprise a main body, a plurality of terminals that it comprises an insulating body and is fixed in described insulating body, each described terminal have one in order to the weld part and an abutting part of described circuit board welding; An and rolled-up stock, be positioned at the side of described terminal away from described circuit board, and be movably connected on described main body, described electronic component is changed between initial condition and end-state, in initial condition, described welding position is in the described tin cream of the correspondence outside, in end-state, described rolled-up stock is suppressed described terminal abutting part, makes described weld part contact corresponding described tin cream.
The assemble method of electronic component of the present invention and circuit board comprises the steps: to provide a circuit board, and at least one surface of described circuit board is provided with a plurality of tin creams; One electronic component is provided, described electronic component comprises a main body and a rolled-up stock, described main body comprises an insulating body and is fixed in a plurality of terminals of described insulating body, each described terminal have one in order to the weld part and an abutting part of described circuit board welding, described rolled-up stock is positioned at a side of the contiguous described circuit board of described terminal, and be movably connected on described main body, at this moment, described abutting part is positioned at a side of corresponding described fin; Described circuit board is inserted described electronic component, and after the insertion, described welding position is in the outside of corresponding described tin cream; Operate described rolled-up stock to end-state, at this moment, described rolled-up stock is suppressed described terminal, makes described weld part contact described tin cream; And heating, make described weld part respectively by described tin cream and the welding of described circuit board.
Compared with prior art, electronic component of the present invention and suppress described terminal by described rolled-up stock with the assemble method of circuit board, make described weld part from the corresponding described tin cream of outer side contacts, thereby, avoid the generation of failure welding and short circuit phenomenon without the described tin cream of pushing tow.
[description of drawings]
Fig. 1 is the three-dimensional exploded view of first embodiment of the invention electronic component and circuit board;
Fig. 2 is the stereogram after the electronic component rolled-up stock upset shown in Figure 1;
Fig. 3 is the three-dimensional combination figure of electronic component shown in Figure 1 (being in initial condition) with circuit board;
Fig. 4 is the vertical view of electronic component shown in Figure 3 and circuit board;
Fig. 5 does not have the sectional view of line A-A for electronic component shown in Figure 3 and circuit board;
Fig. 6 is the three-dimensional combination figure of electronic component shown in Figure 1 (being in end-state) with circuit board;
Fig. 7 is the sectional view of electronic component shown in Figure 6 and circuit board;
Fig. 8 is the cutaway view of second embodiment of the invention electronic component (being in initial condition) with circuit board;
Fig. 9 is the cutaway view of electronic component shown in Figure 8 (being in end-state) with circuit board;
Figure 10 is the cutaway view of third embodiment of the invention electronic component (being in initial condition) with circuit board;
Figure 11 is the cutaway view of electronic component shown in Figure 10 (being in end-state) with circuit board.
The drawing reference numeral explanation of embodiment:
Insulating body 10 hyoplastrons 11 terminal containing slots 13 arms 14
Rolled-up stock 30 base portions 31,31 ' fin 33 projections 35
Protuberance 32 '
[embodiment]
For ease of better understanding purpose of the present invention, structure, feature and effect etc., now be described further to electronic component of the present invention and with the assemble method of circuit board with embodiment in conjunction with the accompanying drawings.
As Fig. 1 and Fig. 2, described electronic component is an electric connector, to a circuit board 40, it comprises an insulating body 10, is fixed in a plurality of terminals 20 of described insulating body 10, and the rolled-up stock 30 that is movably connected on described insulating body 10 in order to connect an external connected electronic element (figure does not show).Certainly, described electronic component also can be other type, as LED (light-emitting diode), Bluetooth transmission device or the like.
Described rolled-up stock 30 not necessarily is movably connected on the described insulating body 10, also can be movably connected on the described terminal 20, or be connected with described terminal 20 joint activities by described insulating body 10, that is to say, go up as long as described rolled-up stock 30 is movably connected on the main body (not label) of described insulating body 10 and described terminal 20 compositions.
Described circuit board 40 is provided with a plurality of tin creams 41 in the precalculated position, to provide scolder for welding between described terminal 20 and the described circuit board 40.
Described insulating body 10 roughly is rectangular-shaped, and its front portion is provided with a hyoplastron 11 that extends forward, and from after extend forward and be provided with a plurality of terminal containing slots 13 that are through to described hyoplastron 11.Its both sides, rear portion extend back and are provided with the spatial accommodation 15 that forms between two arms, 15, the two described arms 14 in order to accommodate described rolled-up stock 30.Each described arm 14 middle part is provided with the groove 17 of an open rearward end.
Each described terminal 20 comprises that one is fixed in the fixed part 21 on the described insulating body 10, extend the docking section 23 that forms to electrically connect with described external connected electronic element forward by described fixed part 21, and the weld part 25 that extends back and form and be positioned at described fixed part 21 rear ends by described fixed part 21.Each described docking section 23 is contained in the described hyoplastron 11, and outside small part is revealed in described hyoplastron 11.Described weld part 25 is in order to be welded on the described circuit board 40.The bending outwardly between its described fixed part 21 and described weld part 25 of each described terminal 20 is formed with an abutting part 27, with the described rolled-up stock 30 of butt.Simultaneously, between described fixed part 21 and described abutting part 27, also be bent to form a depression 29 inwardly.The described weld part 25 of a plurality of described terminals 20 is arranged in two rows, to weld mutually with the upper and lower surface of described circuit board 40 respectively.Under initial condition, the distance between the described weld part 25 of two rows is more than or equal to the described tin cream 41 outermost distances (as Fig. 5) of described circuit board 40 upper and lower surfaces.
A plurality of fins 33 that described rolled-up stock 30 is provided with the base portion 31 of a strip and is positioned at described base portion 31 lower surfaces and vertically is provided with, described fin 33 is corresponding with described terminal 20.Described rolled-up stock 30 also is provided with the projection 35 of a horizontally set, to cooperate with the described depression 29 of described terminal 20, moves forward and backward to limit described rolled-up stock 30.Described base portion 31 both sides extension outward respectively are provided with one in order to be contained in the auxiliary section 37 in the described groove 17, and further extension of a side (being the left side in the present embodiment) is provided with an operating portion 39 therein, and described operating portion 39 is long can stretch out described main body after being assembled to described main body.Certainly, described operating portion 39 also can directly extend to form from described base portion 31.
Fig. 3 is to Figure 5 shows that the described electronic component that is in initial condition and the schematic diagram of circuit board.At this moment, described rolled-up stock 30 is positioned at the side (present embodiment be upside) of described terminal 20 away from described circuit board 40.Described auxiliary section 37 is contained in the described groove 17, and described operating portion 39 stretches out described main body, pushes for the user.Described abutting part 27 is positioned at a side of corresponding described fin 33, promptly be not positioned at the outer surface of described fin 33, at this moment, distance between the described weld part 25 of two rows is more than or equal to the described tin cream 41 outermost distances of described circuit board 40 upper and lower surfaces, so can keep described weld part 25 to be positioned at described tin cream 41 outsides, thereby avoid the described tin cream 41 of described terminal 20 pushing tows.
Fig. 6 and the state that Figure 7 shows that behind the described rolled-up stock 30 of operation (laterally mobile), that is the end-state of described electronic component.At this moment, with respect to initial condition, the described relatively main body lateral shift of described rolled-up stock 30 certain distance.Can establish a stop part in the position of described base portion 31 contiguous right-hand members,, be moved further (this part is not shown) to limit described rolled-up stock 30 in order to the medial surface of butt to described right side arm 14.Simultaneously, described rolled-up stock 30 is horizontal suppresses described abutting part 27 when mobile, and final described abutting part 27 is connected to the respective outside surface (that is respective outside surface of described rolled-up stock 30) of described fin 33, make the described tin cream 41 outermost distances of the distance of two rows between the described weld part 25, thereby make the described tin cream 41 of described weld part 25 contacts less than described circuit board 40 upper and lower surfaces.
The assemble method of described electronic component and described circuit board 40 comprises the steps:
Described circuit board 40 is provided, and described circuit board 40 upper and lower surfaces are provided with a plurality of described tin creams 41 (as Fig. 1);
As Fig. 1 to Fig. 5, described electronic component is provided, described electronic component comprises described main body and described rolled-up stock 30, described main body comprises described insulating body 10 and is fixed in a plurality of terminals 20 of described insulating body 10, each described terminal 20 has described weld part 25 and described abutting part 27, a plurality of described weld parts 25 are arranged in two rows, in order to be welded in the upper and lower surface of described circuit board 40 respectively, described rolled-up stock 30 is positioned at wherein one arranges the side of described terminal 20 away from described circuit board 40, and be movably connected on described main body, at this moment, described abutting part 27 is positioned at a side of corresponding described fin 33, makes the described tin cream 41 outermost distances of the distance of two rows between the described weld part 25 more than or equal to described circuit board 40 upper and lower surfaces;
Described circuit board 40 is inserted described electronic component, and after the insertion, described weld part 25 is positioned at the outside of corresponding described tin cream 40;
As Fig. 6 and Fig. 7, the described rolled-up stock of operation (in the present embodiment be laterally move) 30 is to end-state, and at this moment, described rolled-up stock 30 is suppressed described terminal 20, be the respective outside surface that described abutting part 27 is positioned at described rolled-up stock 30, make the corresponding described tin cream 41 of each described weld part 25 contact; And
Heating makes described weld part 25 respectively by described tin cream 41 and described circuit board 40 welding.
Present embodiment is by this structure of described rolled-up stock 30, makes described rolled-up stock 30 horizontal when mobile, can suppress described terminal 20 and make described weld part 25 inside deviations and contact with corresponding described tin cream 41.Certainly, persons skilled in the art can be associated other structure thus, just no longer enumerate at this.
Above-mentioned described electronic component and with the assemble method of described circuit board 40, because of when described circuit board 40 inserts, described terminal 20 can the described tin cream 41 of pushing tow, so can effectively avoid failure welding of the prior art or short circuit.
Fig. 8 with Figure 9 shows that another embodiment of the present invention.Be mainly that with the above-mentioned first embodiment difference mode of operation of its rolled-up stock 30 ' is for rotating to an angle, but not laterally move.By rotating described rolled-up stock 30 ', make described electronic component be converted to end-state by initial condition, thereby in the time of also can being implemented in described circuit board 40 and inserting, described terminal 20 is the described tin cream 41 of pushing tow not, so also can effectively avoid failure welding of the prior art or short circuit.In this structure, described rolled-up stock 30 ' comprises a base portion 31 ', and described base portion 31 ' is provided with the projection 35 of a horizontally set, to match with the described depression 29 of described terminal 20.In addition, described base portion 31 ' also is provided with the protuberance 32 ' of a horizontally set, and with when rotating to end-state, the described abutting part 27 of described protuberance 32 ' compacting makes described weld part 25 inside deviations and contacts with corresponding tin cream 41.The structure of described rolled-up stock 30 ' is more simple.
Except that laterally moving and rotating, also can realize by vertically moving (as Figure 10 and Figure 11), among this embodiment, during initial condition, described projection 35 is arranged in described depression 29, during end-state, described projection 35 shifts out described depression 29 and is connected to described abutting part 27, makes described weld part 25 inside deviations and contacts with corresponding tin cream 41.
More than these three kinds of modes can in concrete condition, select to use, to be applicable to various agent structure and operating space.
In the foregoing description, described electronic component is the upper and lower surface that is welded in described circuit board, and certainly, the present invention also can be applicable to be welded in a surface of described circuit board, so long as described electronic component inserts along described circuit board one end, can realize the not effect of the described tin cream of pushing tow.
Only more than describe explanation in detail for the present invention's preferred embodiment, non-so limit to claim of the present invention, so the equivalence techniques variation that all this creation of utilization specifications and diagramatic content are done all is contained in the claim of the present invention.
Claims (16)
1. electronic component, the surface in order to insert and to be welded in described circuit board along circuit board one end that is provided with tin cream is characterized in that, comprising:
One main body, a plurality of terminals that it comprises an insulating body and is fixed in described insulating body, each described terminal have one in order to the weld part and an abutting part of described circuit board welding; And
One rolled-up stock, be positioned at the side of described terminal away from described circuit board, and be movably connected on described main body, described electronic component is changed between initial condition and end-state, in initial condition, described welding position is in the described tin cream of the correspondence outside, in end-state, described rolled-up stock is suppressed described terminal abutting part, makes described weld part contact corresponding described tin cream.
2. electronic component as claimed in claim 1 is characterized in that: with respect to being in initial condition, be in the described relatively main body lateral shift of the described rolled-up stock certain distance of end-state.
3. electronic component as claimed in claim 2, it is characterized in that: a plurality of fins that described rolled-up stock comprises a base portion and is positioned at described base surface and vertically is provided with, described fin is corresponding with described terminal, in initial condition, described abutting part is positioned at corresponding described fin one side, in end-state, described abutting part is connected to the outer surface of corresponding described fin respectively.
4. electronic component as claimed in claim 2 is characterized in that: described rolled-up stock is provided with the projection of a horizontally set, and each described terminal correspondence is provided with a depression that cooperates with described projection.
5. electronic component as claimed in claim 1 is characterized in that: with respect to being in initial condition, the described relatively main body of described rolled-up stock that is in end-state rotates to an angle.
6. electronic component as claimed in claim 1 is characterized in that: with respect to being in initial condition, be in the described relatively main body vertical misalignment of the described rolled-up stock certain distance of end-state.
7. as claim 5 or 6 described electronic components, it is characterized in that: described rolled-up stock is provided with the projection of a horizontally set, and each described terminal is provided with a depression that cooperates with described projection.
8. electronic component as claimed in claim 1 is characterized in that: described rolled-up stock has an operating portion, and described operating portion stretches out described main body.
9. electronic component as claimed in claim 1 is characterized in that: described terminal is arranged in two rows, welds with the upper and lower surface of described circuit board respectively, and described rolled-up stock is positioned at wherein one arranges the side of described terminal away from described circuit board.
10. the assemble method of electronic component and circuit board is characterized in that, comprises the steps:
One circuit board is provided, and at least one surface of described circuit board is provided with a plurality of tin creams;
One electronic component is provided, described electronic component comprises a main body and a rolled-up stock, described main body comprises an insulating body and is fixed in a plurality of terminals of described insulating body, each described terminal have one in order to the weld part and an abutting part of described circuit board welding, described rolled-up stock is positioned at a side of the contiguous described circuit board of described terminal, and be movably connected on described main body, at this moment, described abutting part is positioned at a side of corresponding described fin;
Described circuit board is inserted described electronic component, and after the insertion, described welding position is in the outside of corresponding described tin cream;
Operate described rolled-up stock to end-state, at this moment, described rolled-up stock is suppressed described terminal, makes described weld part contact described tin cream; And
Heating makes described weld part respectively by described tin cream and the welding of described circuit board.
11. the assemble method of electronic component as claimed in claim 10 and circuit board is characterized in that: described rolled-up stock makes it to end-state by laterally moving.
12. the assemble method of electronic component as claimed in claim 11 and circuit board, it is characterized in that: a plurality of fins that described rolled-up stock comprises a base portion and is positioned at described base surface and vertically is provided with, described fin is corresponding with described terminal, in initial condition, described abutting part is positioned at corresponding described fin one side, in end-state, described abutting part is connected to the outer surface of corresponding described fin respectively.
13. the assemble method of electronic component as claimed in claim 10 and circuit board is characterized in that: described rolled-up stock makes it to end-state by rotation.
14. the assemble method of electronic component as claimed in claim 10 and circuit board is characterized in that: described rolled-up stock makes it to end-state by vertically moving.
15. the assemble method of electronic component as claimed in claim 10 and circuit board is characterized in that: described rolled-up stock has an operating portion, and described operating portion stretches out described main body, makes described rolled-up stock be transformed into end-state by initial condition by described operating portion.
16. the assemble method of electronic component as claimed in claim 10 and circuit board, it is characterized in that: described terminal is arranged in two rows, weld with the upper and lower surface of described circuit board respectively, described rolled-up stock is positioned at wherein one arranges the side of described terminal away from described circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010575024.1A CN102076179B (en) | 2010-12-02 | 2010-12-02 | Electronic element and method for assembling electronic element with circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010575024.1A CN102076179B (en) | 2010-12-02 | 2010-12-02 | Electronic element and method for assembling electronic element with circuit board |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012103847307A Division CN103002669A (en) | 2010-12-02 | 2010-12-02 | Electronic component and method for assembling electronic component with circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102076179A true CN102076179A (en) | 2011-05-25 |
| CN102076179B CN102076179B (en) | 2014-04-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201010575024.1A Active CN102076179B (en) | 2010-12-02 | 2010-12-02 | Electronic element and method for assembling electronic element with circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103002669A (en) * | 2010-12-02 | 2013-03-27 | 番禺得意精密电子工业有限公司 | Electronic component and method for assembling electronic component with circuit board |
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| CN2922168Y (en) * | 2006-05-31 | 2007-07-11 | 宏致电子股份有限公司 | Electrical connector used for flexible circuit board |
| CN201112680Y (en) * | 2007-09-07 | 2008-09-10 | 达昌电子科技(苏州)有限公司 | Electric connector structure |
| JP2009037957A (en) * | 2007-08-03 | 2009-02-19 | Hirose Electric Co Ltd | Electrical connector for circuit board |
| CN201266698Y (en) * | 2008-07-02 | 2009-07-01 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
| CN102064402A (en) * | 2010-10-22 | 2011-05-18 | 番禺得意精密电子工业有限公司 | Electronic element and method for assembling electronic element and circuit board |
-
2010
- 2010-12-02 CN CN201010575024.1A patent/CN102076179B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2922168Y (en) * | 2006-05-31 | 2007-07-11 | 宏致电子股份有限公司 | Electrical connector used for flexible circuit board |
| JP2009037957A (en) * | 2007-08-03 | 2009-02-19 | Hirose Electric Co Ltd | Electrical connector for circuit board |
| CN201112680Y (en) * | 2007-09-07 | 2008-09-10 | 达昌电子科技(苏州)有限公司 | Electric connector structure |
| CN201266698Y (en) * | 2008-07-02 | 2009-07-01 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
| CN102064402A (en) * | 2010-10-22 | 2011-05-18 | 番禺得意精密电子工业有限公司 | Electronic element and method for assembling electronic element and circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103002669A (en) * | 2010-12-02 | 2013-03-27 | 番禺得意精密电子工业有限公司 | Electronic component and method for assembling electronic component with circuit board |
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| Publication number | Publication date |
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| CN102076179B (en) | 2014-04-09 |
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