CN103917050A - PCB special device manual printing method - Google Patents
PCB special device manual printing method Download PDFInfo
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- CN103917050A CN103917050A CN201410164374.7A CN201410164374A CN103917050A CN 103917050 A CN103917050 A CN 103917050A CN 201410164374 A CN201410164374 A CN 201410164374A CN 103917050 A CN103917050 A CN 103917050A
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- pcb board
- steel disc
- particular device
- pcb
- printing method
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Abstract
The invention discloses a PCB special device manual printing method which comprises the following steps that firstly, a steel sheet is manufactured, and the steel sheet is provided with at least one through hole array corresponding to a pin of a special device on a PCB; the steel sheet is placed, the through hole arrays on the steel sheet correspond to the pins of the special device on the PCB and are placed on the PCB; thirdly, the steel sheet is fixed, a fixing part is used for fixing the periphery of the steel sheet and the PCB; fourthly, solder paste is printed, a small scraper is used for evenly printing the solder paste above the through hole arrays on the steel sheet, and the solder paste falls down through through holes due to the self weight and is stuck to the corresponding pins; fifthly, the fixing part is detached, and the steel sheet is completely separated from the PCB. According to the PCB special device manual printing method, the steel sheet is used for performing manual printing, the time period of production is reduced, the production cost is reduced, meanwhile, good welding spots are ensured, and the reject ratio of the welding spots of a product is low.
Description
Technical field
The invention belongs to pcb board manufacturing technology, relate in particular to a kind of pcb board particular device hand-printing method.
Background technology
Along with developing rapidly of electron trade, day by day smart littleization of electronic device, integrated, densification, such as BGA device uses day-to-day gradually, for many kinds, the PCB product of small lot, and at the design initial stage, while not meeting SMT production, just need to print the particular device on pcb board by manual, traditional hand-printing method is: laser steel mesh print process, the steel mesh that is about to make is fixed on Semi-automatic printer, carry out the paste solder printing of PCB, its shortcoming be for different size PCB paste solder printing, need to make corresponding laser template, its cost and technique are comparatively complicated, production cost is higher, and be difficult for storing for more template, needing to make specific steel mesh storage shelf places.
Summary of the invention
The object of the present invention is to provide a kind of pcb board particular device hand-printing method, it has feature with short production cycle, that cost is low and product poor welding spots rate is low, to solve the problem that in prior art, pcb board particular device hand-printing exists.
For reaching this object, the present invention by the following technical solutions:
A kind of pcb board particular device hand-printing method, it comprises the following steps:
1) make steel disc, described steel disc coordinates the particular device on pcb board to make, and offers the via-hole array of particular device pin at least one corresponding pcb board on it;
2) place steel disc, the pin of the particular device on corresponding the via-hole array on steel disc pcb board is positioned on pcb board;
3) fixing steel disc, uses fixed part that the surrounding of steel disc and pcb board are fixed;
4) print solder paste, is used little scraper tin cream to be evenly printed in to the top of via-hole array on described steel disc, and tin cream is declined and is attached on corresponding pin by through hole because conducting oneself with dignity;
5) remove fixed part, after using tweezers that steel disc is separated completely with pcb board.
Especially, take off after steel disc, also tackle the inspection of particular device pin and have or not and take tin and few tin.
Especially, described steel disc is square structure, and its four limit is fixed by fixed part and pcb board.
Especially, in described step 5, the method for dismounting of fixed part is: first remove the fixed part on three limits, stay fixed part on one side; Then, after using tweezers that steel disc is separated completely with pcb board, remove one side fixed part staying.
Especially, described fixed part adopts high temperature gummed tape.
Beneficial effect of the present invention is that compared with prior art described pcb board particular device hand-printing method adopts steel disc to carry out hand-printing, not only reduces cycle production time, has reduced production cost; Guaranteed that solder joint is good, product poor welding spots rate is low simultaneously.
Accompanying drawing explanation
Fig. 1 is that the steel disc of the pcb board particular device hand-printing method that provides of the specific embodiment of the invention 1 is fixed on the view on pcb board.
In figure:
1, steel disc; 2, pcb board; 3, via-hole array; 4, high temperature gummed tape.
Embodiment
Further illustrate technical scheme of the present invention below in conjunction with accompanying drawing and by embodiment.
Refer to shown in Fig. 1, Fig. 1 is that the steel disc of the pcb board particular device hand-printing method that provides of the specific embodiment of the invention 1 is fixed on the view on pcb board.
In the present embodiment, a kind of pcb board particular device hand-printing method, it comprises the following steps:
1) make steel disc 1, described steel disc 1 is for square structure and coordinate the particular device on pcb board 2 to make, and offers the via-hole array 3 of particular device pin on two corresponding pcb boards 2 on it;
2) place steel disc 1, the pin of the particular device on corresponding the via-hole array on steel disc 13 pcb board 2 is positioned on pcb board 2;
3) fixing steel disc 1, uses two high temperature gummed tapes 4 by fixing to the upper and lower limit of steel disc 1 and pcb board 2;
4) print solder paste, is used little scraper tin cream to be evenly printed in to the top of via-hole array 3 on described steel disc 1, and tin cream is declined and is attached on corresponding pin by through hole because conducting oneself with dignity;
5) remove high temperature gummed tape 4, remove high temperature gummed tape 4 on one side, stay one side of high temperature gummed tape 4 fixing steel discs 1 on one side;
6) take off steel disc 1, after using tweezers that steel disc 1 is separated completely with pcb board 2, remove one side high temperature gummed tape 4 staying.
7) take off after steel disc 1, also tackle the inspection of particular device pin and have or not and take tin and few tin.
In the present embodiment, because the surface area of steel disc 1 is larger, therefore adopt two high temperature gummed tapes 4 steel disc 1 and pcb board 2 can be fixedly secured, when the surface area of steel disc 1 hour, can adopt four high temperature gummed tapes, four limits of steel disc 1 are fixed with pcb board 2 respectively.
Above-mentioned pcb board particular device hand-printing method not only reduces cycle production time, has reduced production cost; Guaranteed that solder joint is good, product poor welding spots rate is low simultaneously.
Above embodiment has just set forth basic principle of the present invention and characteristic; the present invention is not limited by above-mentioned example; without departing from the spirit and scope of the present invention, the present invention also has various variations and change, and these variations and change all fall in the claimed scope of the invention.The claimed scope of the present invention is defined by appending claims and equivalent thereof.
Claims (5)
1. a pcb board particular device hand-printing method, is characterized in that, it comprises the following steps:
1) make steel disc, described steel disc coordinates the particular device on pcb board to make, and offers the via-hole array of particular device pin at least one corresponding pcb board on it;
2) place steel disc, the pin of the particular device on corresponding the via-hole array on steel disc pcb board is positioned on pcb board;
3) fixing steel disc, uses fixed part that the surrounding of steel disc and pcb board are fixed;
4) print solder paste, is used little scraper tin cream to be evenly printed in to the top of via-hole array on described steel disc, and tin cream is declined and is attached on corresponding pin by through hole because conducting oneself with dignity;
5) remove fixed part, use tweezers that steel disc is separated completely with pcb board.
2. pcb board particular device hand-printing method according to claim 1, is characterized in that, takes off after steel disc, also tackles the inspection of particular device pin and has or not and take tin and few tin.
3. pcb board particular device hand-printing method according to claim 1, is characterized in that, described steel disc is square structure, and its four limit is fixed by fixed part and pcb board.
4. pcb board particular device hand-printing method according to claim 3, is characterized in that, in described step 5, the method for dismounting of fixed part is: first remove the fixed part on three limits, stay fixed part on one side; Then, after using tweezers that steel disc is separated completely with pcb board, remove one side fixed part staying.
5. according to the pcb board particular device hand-printing method described in claim 1 to 4 any one, it is characterized in that, described fixed part adopts high temperature gummed tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410164374.7A CN103917050A (en) | 2014-04-22 | 2014-04-22 | PCB special device manual printing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410164374.7A CN103917050A (en) | 2014-04-22 | 2014-04-22 | PCB special device manual printing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103917050A true CN103917050A (en) | 2014-07-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410164374.7A Pending CN103917050A (en) | 2014-04-22 | 2014-04-22 | PCB special device manual printing method |
Country Status (1)
| Country | Link |
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| CN (1) | CN103917050A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105667107A (en) * | 2016-01-01 | 2016-06-15 | 广州兴森快捷电路科技有限公司 | Method for preventing golden fingers from being stained by tin |
| CN107567205A (en) * | 2017-10-23 | 2018-01-09 | 伟创力电子技术(苏州)有限公司 | Connector brush tin tool |
| CN109109444A (en) * | 2018-08-17 | 2019-01-01 | 北方电子研究院安徽有限公司 | A kind of metal plate press back adhesive dispenser |
| CN112040669A (en) * | 2020-09-15 | 2020-12-04 | 扬州海科电子科技有限公司 | SMT (surface mount technology) welding process for PCB (printed circuit board) in shell |
| CN113260167A (en) * | 2018-08-17 | 2021-08-13 | 神讯电脑(昆山)有限公司 | Device and method for preventing screw hole and copper foil on PCB from being oxidized |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101132668A (en) * | 2006-08-23 | 2008-02-27 | 英业达股份有限公司 | Solder-paste coating method and instrument thereof |
| CN201846534U (en) * | 2010-05-21 | 2011-05-25 | 名硕电脑(苏州)有限公司 | Solder paste coating aid |
| CN102711391A (en) * | 2012-06-12 | 2012-10-03 | 东莞市海拓伟电子科技有限公司 | High-efficiency soldering process of circuit board connector |
| CN202799421U (en) * | 2012-08-22 | 2013-03-13 | 弘益泰克自动化设备（惠州）有限公司 | Improved structure of steel mesh and scraper sheet for thickening solder paste of part of PCB pad |
| CN203151883U (en) * | 2013-04-08 | 2013-08-21 | 京东方科技集团股份有限公司 | Welding material printing template and welding material printing template assembly |
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2014
- 2014-04-22 CN CN201410164374.7A patent/CN103917050A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101132668A (en) * | 2006-08-23 | 2008-02-27 | 英业达股份有限公司 | Solder-paste coating method and instrument thereof |
| CN201846534U (en) * | 2010-05-21 | 2011-05-25 | 名硕电脑(苏州)有限公司 | Solder paste coating aid |
| CN102711391A (en) * | 2012-06-12 | 2012-10-03 | 东莞市海拓伟电子科技有限公司 | High-efficiency soldering process of circuit board connector |
| CN202799421U (en) * | 2012-08-22 | 2013-03-13 | 弘益泰克自动化设备（惠州）有限公司 | Improved structure of steel mesh and scraper sheet for thickening solder paste of part of PCB pad |
| CN203151883U (en) * | 2013-04-08 | 2013-08-21 | 京东方科技集团股份有限公司 | Welding material printing template and welding material printing template assembly |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105667107A (en) * | 2016-01-01 | 2016-06-15 | 广州兴森快捷电路科技有限公司 | Method for preventing golden fingers from being stained by tin |
| CN107567205A (en) * | 2017-10-23 | 2018-01-09 | 伟创力电子技术(苏州)有限公司 | Connector brush tin tool |
| CN109109444A (en) * | 2018-08-17 | 2019-01-01 | 北方电子研究院安徽有限公司 | A kind of metal plate press back adhesive dispenser |
| CN113260167A (en) * | 2018-08-17 | 2021-08-13 | 神讯电脑(昆山)有限公司 | Device and method for preventing screw hole and copper foil on PCB from being oxidized |
| CN112040669A (en) * | 2020-09-15 | 2020-12-04 | 扬州海科电子科技有限公司 | SMT (surface mount technology) welding process for PCB (printed circuit board) in shell |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140709 |