CN102032885B - Printed circuit board, method and device for detecting layer-to-layer registration of circuit graphs at two surfaces thereof - Google Patents
Printed circuit board, method and device for detecting layer-to-layer registration of circuit graphs at two surfaces thereof Download PDFInfo
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Abstract
The invention discloses a method for detecting layer-to-layer registration of circuit graphs at the two surfaces of a core board, which is used for improving the detecting precision of layer-to-layer registration of the circuit graphs at the two surfaces of the core board of the existing printed circuit board. The method comprises the following steps: graphic data is respectively drawn on a first surface and a second surface of the core board of the printed circuit board, wherein the same positions of the graphic data of the first surface and the second surface are respectively drawn with a detecting graph, the core board is manufactured according to the graphic data of the first surface and the second surface on which the detecting graphs are drawn, wherein the manufactured core board comprises a detected object corresponding to the position of each detecting graph, a positioning structure is formed on a set position of the manufactured core board; and the layer-to-layer offset of the circuit graphs at the two surfaces of the core board is determined according to the measured distance from the detected objects on the first surface and the second surface of the core board to the positioning structure. The invention also discloses a printed circuit board and a device for detecting layer-to-layer registration of circuit graphs at the two surfaces of the core board.
Description
Technical field
The present invention relates to the printed wiring board technical field, particularly a kind of method, device and printed wiring board that detects the level to level alignment degree of central layer two sides line pattern in printed wiring board.
Background technology
The making of printed wiring board is normally from the central layer graphic making, and the level to level alignment degree of central layer two sides line pattern is most important to follow-up processing and fabricating, particularly in the making of the multilayer printed wiring board that is formed by many central layers combination compacting, require strict especially to the level to level alignment degree of central layer two sides line pattern.If the interlayer side-play amount of central layer two-side graph exceeds to a certain degree, the electrical property that connects the electro-coppering of two-layer figure circuit will be subject to great impact, even loses efficacy.
At present, general printed wiring board manufacturer can produce dislocation and check ring when the central layer two-side graph is made, like this, and in to central layer manufacturing process, after the central layer etching, whether two rings that check the central layer two sides are tangent judges whether the level to level alignment degree on central layer two sides meets the requirements.Specifically comprise: produce dislocation in the same position at four angles of central layer two-side graph data and check ring, center distance between dislocation loop on the same face is certain value, then, two dislocation on the central layer that inspection goes out according to the two-side graph data make on same position check whether ring is tangent, tangent when it, show that the level to level alignment degree of the two sides line pattern of this chip meets the requirements.
Development along with the printed wiring board industry, printed wiring board is made towards high multilayer, high-accuracy, miniaturization development, level to level alignment degree to central layer two sides line pattern requires more and more higher, need simultaneously to measure the concrete numerical value of interlayer side-play amount between the two-layer line pattern of the central layer of making, this detects by dislocation loop is to satisfy.In addition, when core material was thicker, the central layer that completes just was difficult to see clearly the dislocation inspection ring at its back side, and can not check that encircling the level to level alignment degree detect central layer two sides line pattern is to meet the requirements this moment by dislocation.
Summary of the invention
The embodiment of the present invention provides a kind of level to level alignment degree method that detects central layer two sides line pattern, in order to improve the accuracy of detection of the level to level alignment degree of central layer two sides line pattern in existing printed wiring board.
The embodiment of the present invention provides a kind of method that detects the level to level alignment degree of central layer two sides line pattern, comprising:
In the first surface of the central layer of printed wiring board and second graphing data respectively, wherein, draw respectively test pattern on the same position of first surface and second 's graphic documentation;
According to the first surface of drawing test pattern and second 's graphic documentation, carry out the making of central layer, wherein, the central layer that has completed comprises the detection thing corresponding with the position of each test pattern;
Form location structure on the desired location of the central layer that has completed;
Determine the interlayer side-play amount of described central layer two sides line pattern according to the detection thing on the first surface of described central layer and second respectively and the measuring distance between described location structure.
The embodiment of the present invention provides a kind of printed wiring board, comprise: the central layer that the two sides line pattern is arranged, the detection thing is arranged respectively on every of described central layer, wherein, the position of the test pattern on the detection thing on every and this face graphic documentation is corresponding, and, identical test pattern is arranged on the same position of every graphic documentation;
On the desired location of described central layer, location structure is arranged, be used for according to described location structure respectively and the first surface of described central layer and second upper measuring distance that detects between thing, determine the interlayer side-play amount of described central layer two sides line pattern.
The embodiment of the present invention provides a kind of device that detects the level to level alignment degree of central layer two sides line pattern, comprising:
Rendering apparatus is used for the graphing data respectively the first surface of the central layer of printed wiring board and second, wherein, draws respectively test pattern on the same position of first surface and second 's graphic documentation;
Making apparatus is used for carrying out the making of central layer according to drawing the first surface of test pattern and the graphic documentation of second, and wherein, the central layer that has completed comprises the detection thing corresponding with the position of each test pattern;
The location structure forming device is used for forming location structure on the desired location of the central layer that has completed;
Checkout equipment is used for according to the detection thing on the first surface of described central layer and second respectively and the measuring distance between described location structure, determines the interlayer side-play amount of described central layer two sides line pattern.
In the embodiment of the present invention, increase test pattern on the graphic documentation on each upper thread road of the central layer of the printed-wiring board (PWB) of designing, like this, the central layer that has completed comprises the detection thing corresponding with the position of each test pattern, and form location structure on the desired location of the central layer that has completed, then, according to the detection thing on every of central layer and the distance between location structure, determine the interlayer side-play amount of central layer two sides line pattern.Thereby, can judge not only whether the level to level alignment degree of central layer two sides line pattern meets the requirements, the interlayer side-play amount that can also obtain to determine has greatly improved the accuracy of detection of the level to level alignment degree of central layer two sides line pattern in the printed wiring board.
Description of drawings
Fig. 1 is the process flow diagram of the level to level alignment degree of detection central layer two sides line pattern in the embodiment of the present invention;
Fig. 2 is the schematic diagram of a kind of graphic documentation of central layer in the embodiment of the present invention;
Fig. 3 is the schematic diagram of the another kind of graphic documentation of central layer in the embodiment of the present invention;
Fig. 4 is the process flow diagram of the level to level alignment degree of detection central layer two sides line pattern in the embodiment of the present invention one;
Fig. 5 is the schematic diagram of the graphic documentation of central layer in the embodiment of the present invention one;
Fig. 6 is the schematic diagram of the central layer that completed in the embodiment of the present invention one;
Fig. 7 is the process flow diagram of the level to level alignment degree of detection central layer two sides line pattern in the embodiment of the present invention two;
Fig. 8 is the schematic diagram of the graphic documentation of central layer in the embodiment of the present invention two;
Fig. 9 is the schematic diagram of the central layer that completed in the embodiment of the present invention two;
Figure 10 is the schematic diagram that detects thing A and corresponding through hole in the embodiment of the present invention two on the central layer first surface;
Figure 11 is the upper schematic diagram that detects thing A ' and corresponding through hole of second of central layer in the embodiment of the present invention two;
Figure 12 is the structural drawing of the device of the level to level alignment degree of detection central layer two sides line pattern in the embodiment of the present invention.
Embodiment
In the embodiment of the present invention, printed wiring board comprises one or more layers central layer, the making of printed wiring board is also from every layer of central layer graphic making, for the central layer that comprises the Double-side line figure, first design the graphic documentation on each upper thread of central layer road, then according to the graphic documentation of designing, carry out the making of central layer.For improving the accuracy of detection of the level to level alignment degree of central layer two sides line pattern in existing printed wiring board, in the embodiment of the present invention, increase test pattern on the graphic documentation on each upper thread road of the central layer of designing, like this, the central layer that has completed comprises the detection thing corresponding with each test pattern, and form location structure on the desired location of the central layer that has completed, then, according to the detection thing on every of central layer and the distance of location structure, obtain the interlayer side-play amount of central layer two sides line pattern in printed wiring board.
Referring to Fig. 1, in the embodiment of the present invention, the process that detects the level to level alignment degree of central layer two sides line pattern in printed wiring board comprises:
Step 101: draw respectively the first surface of central layer of printed wiring board and the graphic documentation of second, wherein, identical test pattern is arranged on the same position of two-side graph data.
Printed wiring board comprises one or more layers central layer, and for every layer of central layer of this printed wiring board, the process of its detection is all consistent.
Here, in the graphic documentation while on the design every upper thread of central layer road, draw out test pattern on every graphic documentation.Generally can complete by the CASE(Computer Aided Software Engineering) of specialty the drafting of the graphic documentation of every.
After drawing out test pattern on the graphic documentation of the first surface of central layer, must the same position on the graphic documentation of second of this central layer draw out corresponding test pattern, namely have identical inspection figure on the same position of the graphic documentation of first surface and second 's graphic documentation.
In the embodiment of the present invention, being equipped with identical test pattern in identical bits and comprising following implication of two-side graph data: test pattern is the same in the position on the first surface graphic documentation with the position of test pattern on second graphic documentation.For example: referring to Fig. 2, central layer is of a size of 40 * 30mm, and test pattern is circular, is respectively circle 1, and the size of circular 2, two, and shape is identical, and namely circle 1 and circle 2 are identical, and its diameter is 4mm.Circular 1 is positioned at the lower left corner of first surface graphic documentation, figure 2 also is positioned at the lower left corner of second graphic documentation, if take summit, first surface graphic documentation lower-left as coordinate system initial point, the coordinate of the round dot of the test pattern circle 1 on this first surface graphic documentation can be (5,5); So, same take summit, second graphic documentation lower-left as coordinate system initial point, the coordinate of the round dot of the test pattern circle 2 on this second graphic documentation must be also (5,5).After this two-side graph data make central layer, this two-side graph data on the two sides of central layer each other back to, the detection thing corresponding with circular 1 and with circular 2 corresponding detection things on the two sides of central layer each other back to, but deviation may appear, various embodiments of the present invention can be by detecting these two side-play amounts that detect between things, obtains the interlayer side-play amount of central layer two sides line pattern.
In one embodiment, when the profile of central layer is regular, for example: polygon (for example square, rectangle) or circular, can only draw out a test pattern so on the graphic documentation of every one side, certainly, if think further to improve the measuring accuracy of level to level alignment degree, so also can draw out two or more test pattern on the graphic documentation of every one side.
In another embodiment, when the profile of central layer is irregular, draw out possibly so two or more test pattern on the graphic documentation of every one side.
Test pattern can be multiple, comprising: circular, square, annular or target disc shape, wherein, target disc shape comprises: a disk, and four rectangles symmetrical centered by the center of circle of this disk.For example: the graphic documentation of the central layer of designing as shown in Figure 3, produce respectively test pattern on four angles of every one side graphic documentation, this test pattern is target disc shape, test pattern on the first surface graphic documentation is respectively target disc A, target disc B, target disc C and target disc D, and the test pattern on second graphic documentation is respectively target disc A ', target disc B ', target disc C ' and target disc D '.Wherein, target disc A is position consistency on the second graph data in position on the first surface graphic documentation and target disc A ', and namely target disc A is corresponding with target disc A ', and similarly, target disc B is corresponding with target disc B ', and target disc C is corresponding with target disc C ', and target disc C is corresponding with target disc C '.
Certainly in embodiments of the present invention, test pattern can also be other some figures, will not enumerate.
Step 102: according to the two-side graph data of drawing test pattern, carry out the making of central layer.
According to the manufacture craft of central layer, carry out the making of central layer, such as by these operations such as transfer printing, boring, activation, acceleration, heavy copper, plating, secondary transfer printing, corrosion, carry out the making of central layer.Like this, every face of the central layer after corrosion has the wiring diagram layer, and, the detection thing corresponding with the position of each test pattern arranged on every of this central layer.The central layer that has namely completed comprises the detection thing corresponding with the position of each test pattern.
The material that detects thing can be metal material, and preferably, the material that detects thing is consistent with the material of central layer.
Preferably, detect the thing test pattern corresponding with the position and have same or analogous shape.For example, when test pattern was circle, detection thing corresponding to its position was disk; When being square, detection thing corresponding to its position is square plate when test pattern; When test pattern was target disc shape, detection thing corresponding to its position comprised: four centrosymmetric panes, and a concentric nahlock.Other concrete shapes just exemplify no longer one by one.
Preferably, shape and the size of test pattern and detection thing are identical.But test pattern and detection thing also can be incomplete same, and for example: both sizes are also incomplete same, have certain scaling, but the central point of test pattern is corresponding with detection thing central point, and at this moment, it is also corresponding with test pattern that this detects thing.
Step 103: form location structure on the desired location of the central layer that has completed.
In the embodiment of the present invention, location structure can be through hole or other centrosymmetric structures, for example, and protuberance and/or recess.In one embodiment, exist on the one side of central layer on salient point and another side and have concave point, vice versa; In another embodiment, all there is concave point in the same position on the two sides of central layer.The below is described take location structure as through hole as example.
One or more detection things are arranged on every one side of the central layer that no matter has completed, can only form a through hole on the central layer that has completed; Perhaps,
When on the graphic documentation of every, at least two test pattern being arranged, when having at least two to detect thing on every one side of the central layer that has namely completed, can detect the through hole that thing forms respectively a correspondence for each on one side wherein.For example: the through hole that forms respectively a correspondence for each the detection thing on first surface; Perhaps, form respectively the through hole of a correspondence for each detection thing of second.
The through hole that forms can be in the inside of detecting thing, also can be in other positions of central layer.For example: when test pattern is target disc shape, the detection thing of its correspondence comprises: four centrosymmetric panes, and during a concentric nahlock take the center of circle of the nahlock of the detection thing of central layer one side as reference point, form through hole.When test pattern is circular, when the detection thing of its correspondence is disk, can form through hole in other positions of central layer.Perhaps, when test pattern is square, and when being positioned at a jiao of central layer, can form a through hole at the middle position of this central layer.
The embodiment of the present invention can form through hole by modes such as board punching, laser boring or chemical corrosions on central layer.The shape of through hole can be circular, polygon (for example square), perhaps other centrosymmetric images.
Step 104: obtain detection thing on the first surface of central layer and the first measuring distance of location structure.
Equally, be described take location structure as through hole, only have one to detect thing on first surface, during a through hole, obtain the measuring distance of this detection thing and this through hole.A plurality of detection things are arranged on first surface, during a through hole, can obtain the measuring distance that one of them detects thing and this through hole, perhaps, obtain respectively the wherein measuring distance of a plurality of detection things and this through hole.A plurality of detection things are arranged, and each is when detecting the corresponding through hole of thing on first surface, can obtains the measuring distance that one of them detects thing and corresponding through hole, perhaps, obtain respectively the wherein measuring distance of a plurality of detection things and corresponding through hole.
In the embodiment of the present invention, can be by laser ranging, the methods such as infrared distance measurement obtain to detect the measuring distance between thing and through hole, in concrete measuring process, can be take the center of through hole as reference point, perhaps, take the edge of through hole as reference point, measuring distance is the distance that detects between thing and through hole central point, perhaps, is the distance between detection thing and through hole edge.
Step 105: go up corresponding detection thing and the second measuring distance of location structure for second that obtains central layer.
Here, be described take location structure as through hole, process and the step 104 of obtaining distance are similar, wherein, the first measuring distance that has obtained when step 104 is measuring distance that detects thing and through hole on first surface, so, here, the second measuring distance that obtains is second upper corresponding detection thing and the measuring distance of same through hole.
Obtain first measuring distance in step 104, obtained corresponding second measuring distance in this step; Obtain a plurality of the first measuring distances in step 104, obtained corresponding a plurality of the second measuring distances in this step.
Step 106: according to the first measuring distance, and the second corresponding measuring distance, determine the interlayer side-play amount of central layer two sides line pattern.
The first measuring distance is the measuring distance that detects on first surface between thing and through hole, the second measuring distance is second upper corresponding detection thing and the measuring distance between same through hole, therefore, relatively the first measuring distance and the second measuring distance can obtain the interlayer side-play amount of central layer two sides line pattern.
When step 104 and step 105 have only obtained respectively a measuring distance that detects thing and same through hole, so, comparison the first measuring distance and the second measuring distance can obtain the interlayer side-play amount of central layer two sides line pattern.
Obtained respectively the measuring distance of a plurality of detection things and corresponding through hole when step 104 and step 105, so, the first measuring distance of more a plurality of correspondences and the second measuring distance can obtain the interlayer side-play amount of the two sides line pattern in central layer zone.
for example: when test pattern is target disc shape, corresponding detection thing comprises four centrosymmetric panes and a concentric nahlock corresponding with target disc shape, can according to the pane that detects two horizontal directions in thing on first surface respectively and the difference between the measuring distance of through hole determine the first horizontal survey distance, and according to second upper corresponding pane that detects two horizontal directions in thing respectively and the difference between the measuring distance of same through hole determine the second horizontal survey distance, then according to the first horizontal survey distance, and the second horizontal survey distance, the interlayer side-play amount of determining central layer two sides line pattern horizontal direction is: the difference between the first horizontal survey distance and the second horizontal survey distance.in like manner, according to the pane that detects two vertical directions in thing on first surface respectively with the measuring distance of described through hole, determine that the first vertical measuring distance is: the difference between two measuring distances, and according to second upper corresponding pane that detects two vertical directions in thing respectively with the measuring distance of same through hole, determine that the second vertical measuring distance is: the difference between two measuring distances, then according to the first vertical measuring distance, and second vertical measuring distance determine that the interlayer side-play amount of central layer two sides line pattern vertical direction is: the difference between the first vertical measuring distance and the second vertical measuring distance.
Adopt said method, can detect the level to level alignment degree of central layer two sides line pattern in printed wiring board, like this, whether the level to level alignment degree that not only can judge central layer two sides line pattern in printed wiring board meets the requirements, the interlayer side-play amount that can also obtain to determine has greatly improved the accuracy of detection of the level to level alignment degree of central layer two sides line pattern in the printed wiring board.
Below in conjunction with Figure of description, the embodiment of the present invention is described in further detail.
Embodiment one, in the present embodiment, the central layer of printed wiring board comprises the Double-side line figure, the profile of central layer is the rectangle of a rule, only have a test pattern on the graphic documentation that central layer is every, and this test pattern is circular, in the present embodiment, the process of the level to level alignment degree of detection printed wiring board two sides line pattern comprises as shown in Figure 4:
Step 401: draw a circle of setting size respectively on the same position in the upper left corner on the graphic documentation on the central layer two sides of printed wiring board.
In the present embodiment, the graphic documentation of the central layer of designing as shown in Figure 5, it is the circle 1 of 4.0mm that there is a diameter in the upper left corner on the graphic documentation of first surface, circular 1 center origin is respectively 6.0mm, 4.0mm from the left side and the top margin of first surface.Equally, it is the circle 2 of 4.0mm that there is a diameter in the upper left corner on the graphic documentation of second, and circular 2 center origin is respectively 6.0mm, 4.0mm from the left side and the top margin of second.Like this, figure 1 is corresponding with circular 2.
Generally determine the size of test pattern according to the size of central layer, test pattern is unsuitable excessive, otherwise taken the space of a large amount of line patterns, certainly, making for convenient follow-up central layer, test pattern can not be too small, and the scope that the size of general test pattern accounts for the size of central layer is: 1%-30%, preferably scope is: 5%-10%.In the present embodiment, test pattern, namely circular 1 diameter is 4.0mm, and the size of central layer is 40 * 30mm, and like this, figure 1 accounts for the area of central layer 10% left and right, in other embodiments, can reasonably design according to above-mentioned scope the size of test pattern.
Step 402: according to drawing circular two-side graph data, carry out the making of central layer.
Like this, the schematic diagram of the central layer that has completed as shown in Figure 6, wherein, the first surface of central layer comprises the detection thing copper coin dish A corresponding with circular 1 position, the size of this copper coin dish A is consistent with circular 1, diameter is 4.0mm.The second face of the central layer that has completed comprises the copper coin dish B corresponding with circular 2 positions, and the size of this copper coin dish B is consistent with circular 2, and diameter is 4.0mm.
Here, detecting thing is the copper coin dish, certainly, the invention is not restricted to this, can be the detection thing of other metal materials, detects also disk not necessarily of thing, it can be also oval plate, or other rules (being for example polygon) or erose detection thing, certainly, this center of detecting thing is corresponding with the center of test pattern.
Step 403: the clear position in the vertical axis of the central layer that has completed forms a manhole.
As shown in Figure 6, adopt the clear position punching of X-RAY board in the vertical axis of central layer to go out a datum hole C, this datum hole be manhole, diameter is 3.175mm.
Step 404: the copper coin dish A on the first surface of measurement central layer and the first measuring distance of manhole.
Here, between the center of measuring copper coin dish A and manhole C center, horizontal range is a, and vertically apart from being b, namely the first measuring distance is the centre distance of A and C.
Step 405: the copper coin dish B on second of the measurement central layer and the second measuring distance of manhole C.
Here, between the center of measuring copper coin dish B and manhole C center, horizontal range is c, and vertically distance is d, and equally, the second measuring distance is the centre distance of B and C.
Step 406: the interlayer side-play amount that obtains central layer two sides line pattern.
The interlayer side-play amount of two sides line pattern horizontal direction is D
x=a-c; The interlayer side-play amount of two sides line pattern vertical direction is D
y=b-d.
According to said method, can obtain the interlayer side-play amount of the two sides line pattern of this rectangle central layer.
In embodiment two, the present embodiment, central layer comprises the Double-side line figure, the profile of central layer is an irregular quadrilateral, four test pattern are arranged on the graphic documentation of every, and each test pattern is target disc shape, in the present embodiment, detect central layer two sides line pattern the level to level alignment degree process as shown in Figure 7, comprising:
Step 701: draw respectively a target disc shape of setting size on the same position of four corners on the graphic documentation on central layer two sides.Certainly, the invention is not restricted to this, what set size drawn in other positions that also can be on the graphic documentation on two sides is for example the detection thing of target disc shape.
In the present embodiment, the graphic documentation of the central layer of designing as shown in Figure 8, a target disc shape is arranged on each corner on the graphic documentation of first surface, be respectively target disc shape 1,2,3 and 4, wherein, in each target disc shape, each rectangular size is 1.0 * 4.0mm, four rectangular formation Central Symmetries, and the rectangular center distance of every two symmetries is 8.0mm, the diameter of concentric disk is 2.0mm.Equally, a target disc shape is arranged on each corner on the graphic documentation of second, be respectively target disc shape 1 ', 2 ', 3 ' and 4 ', wherein, in each target disc shape, each rectangular size is 1.0 * 4.0mm, four rectangular formation Central Symmetries, and the rectangular center distance of every two symmetries is 8.0mm, concentric disk be directly 2.0mm.When the alignment of two-side graph data is overlapping, the center superposition of target disc shape 1 and target disc shape 1 ', the center superposition of target disc shape 2 and target disc shape 2 ', the center superposition of target disc shape 3 and target disc shape 3 ', and the center superposition of target disc shape 4 and target disc shape 4 ', i.e. target disc shape 1 and target disc shape 1 ' correspondence, target disc shape 2 and target disc shape 2 ' correspondence, target disc shape 3 and target disc shape 3 ' correspondence, target disc shape 4 and target disc shape 4 ' correspondence.
In the present embodiment, the bottom of central layer is 90mm, upper base is 70mm, height is 60mm, and test pattern is target disc shape, and in each target disc shape, each rectangular size is 1.0 * 4.0mm, and the rectangular center distance of every two symmetries is 8.0mm, therefore, this target disc shape accounts for the area of central layer 6% left and right.Certainly, in other embodiments of the invention, can carry out convergent-divergent to target disc shape according to the size of central layer, make the scope of its size that accounts for central layer between 1%-30%.
Step 702: according to the two-side graph data of drawing target disc shape, carry out the making of central layer.
Like this, the schematic diagram of the central layer that has completed as shown in Figure 9, wherein, the first surface of central layer comprises the detection thing A corresponding with target disc shape 1 position, detecting thing A comprises: four centrosymmetric rectangle copper billets, its size is all 1.0 * 4.0mm, and a concentric copper coin piece, and diameter is 2.0mm.Equally, first surface also comprises the detection thing B corresponding with target disc shape 2 positions, the detection thing C corresponding with target disc shape 3 positions, and detection thing D corresponding to target disc shape 4 positions.
Certainly, the second face of the central layer that has completed also comprises: the detection thing A ' corresponding with target disc shape 1 ' position, the detection thing B ' corresponding with target disc shape 2 ' position, the detection thing C ' corresponding with target disc shape 3 ' position, and detection thing D ' corresponding to target disc shape 4 ' position.
Step 703: each center of circle of copper coin piece of detecting thing (A, B, C, D) as reference point, forms corresponding manhole on the first surface.
Here, form the manhole of a correspondence for each the detection thing on first surface, the center of circle of general copper coin piece in the detection thing forms a datum hole (for example adopting the punching of X-RAY board) as reference point, this datum hole be manhole, diameter is 3.175mm.
Certainly, in the present embodiment, also can take second upper each center of circle of copper coin piece of detecting thing (A ', B ', C ', D ') as reference point, form the manhole of a correspondence.
Step 704: measure respectively on first surface the first measuring distance that each detects rectangle copper billet in thing and corresponding through hole.
Here, measure to detect respectively the first measuring distance of thing A, B, C, through hole that D is corresponding with it, here, the first measuring distance is non-central distance, specifically is described as an example of the first measuring distance of measuring the detection thing A through hole corresponding with it example.Referring to Figure 10, detect in thing A, the horizontal survey at two rectangular copper block edges of horizontal direction and corresponding through hole edge is apart from being respectively a, c, like this, the first horizontal survey distance B of detection thing A and corresponding through hole
Ax=a-c.Detect in thing A, two rectangular copper block edges of vertical direction are respectively b with the vertical measuring distance at corresponding through hole edge, d, like this, the first vertical measuring distance D of detection thing A and corresponding through hole
Ay=a-c.
In like manner, to detect the first horizontal survey distance B of thing B and corresponding through hole
Bx, detect the first horizontal survey distance B of thing C and corresponding through hole
Cx, and the first horizontal survey distance B that detects thing D and corresponding through hole
DxAnd to detect the first vertical measuring distance D of thing B and corresponding through hole
By, detect the first vertical measuring distance D of thing C and corresponding through hole
Cy, and the first vertical measuring distance D that detects thing D and corresponding through hole
Dy
Step 705: measure respectively second upper each detect the second measuring distance of rectangle copper billet in thing and corresponding through hole.
Here, measure to detect respectively the second measuring distance of thing A ', B ', C ', through hole that D ' is corresponding with it, here, the second measuring distance is non-central distance, specifically is described as an example of the second measuring distance of measuring the detection thing A ' through hole corresponding with it example.Referring to Figure 11, detect in thing A ', two rectangular copper block edges of horizontal direction are respectively e with the horizontal survey distance at corresponding through hole edge, g, like this, the setting horizontal survey distance B of detection thing A ' and corresponding through hole
A ' x=e-g.Detect in thing A ', two rectangular copper block edges of vertical direction are respectively f with the vertical measuring distance at corresponding through hole edge, h, like this, the second vertical measuring distance D of detection thing A ' and corresponding through hole
A ' y=a-c.
In like manner, to detect the second horizontal survey distance B of thing B ' and corresponding through hole
B ' x, detect the second horizontal survey distance B of thing C ' and corresponding through hole
C ' x, and the second horizontal survey distance B that detects thing D ' and corresponding through hole
D ' xAnd to detect the second vertical measuring distance D of thing B ' and corresponding through hole
B ' y, detect the second vertical measuring distance D of thing C ' and corresponding through hole
C ' y, and the second vertical measuring distance D that detects thing D ' and corresponding through hole
D ' y
Step 706: the interlayer side-play amount that obtains two sides line pattern on the central layer regional.
The central layer upper left corner, the interlayer side-play amount of two sides line pattern horizontal direction is D
x=D
Ax-D
A ' xThe interlayer side-play amount of two sides line pattern vertical direction is D
y=D
Ay-D
A ' y
The central layer upper right corner, the interlayer side-play amount of two sides line pattern horizontal direction is D
x=D
Bx-D
B ' xThe interlayer side-play amount of two sides line pattern vertical direction is D
y=D
By-D
B ' y
The central layer lower right corner, the interlayer side-play amount of two sides line pattern horizontal direction is D
x=D
Cx-D
C ' xThe interlayer side-play amount of two sides line pattern vertical direction is D
y=D
Cy-D
C ' y
The central layer lower left corner, the interlayer side-play amount of two sides line pattern horizontal direction is D
x=D
Dx-D
D ' xThe interlayer side-play amount of two sides line pattern vertical direction is D
y=D
Dy-D
D ' y
By said method, can obtain each part of this central layer, and the interlayer side-play amount of the two sides line pattern of each direction.
In the various embodiments described above, it is circular that test pattern is respectively, and target disc shape, but the embodiment of the present invention is not limited to this, and test pattern can also comprise: polygon (for example square) or, annular.In addition, in above-described embodiment, test pattern is identical with the shape that detects thing and size.When but the embodiment of the present invention is not limited to this, for example: in above-mentioned enforcement one, copper coin dish A can be incomplete same with circular 1 size, but copper coin dish A is consistent with the center position of circle 1, and copper coin dish A is also corresponding with circular 1 position so.Equally, copper coin dish B is also incomplete same with circular 2 size, but copper coin dish B is consistent with the center position of circle 2, and copper coin dish B is also corresponding with circular 2 positions so.Then, measure respectively the centre distance of copper coin dish A and copper coin dish B and through hole, can obtain the interlayer side-play amount of two sides line pattern.
Equally, in the various embodiments described above, through hole is circular, but the embodiment of the present invention is not limited to this, and through hole can also be other centrosymmetric figures, and is for example, square.In addition, the mode that forms through hole is the punching of X-RAY board, certainly, can also adopt other mode to form through hole, for example: and laser boring, perhaps, chemical corrosion.
In above-described embodiment two, measured the distance that each detects thing and corresponding through hole, can certainly one only measure the distance of a detection thing and corresponding through hole on face, only obtain the interlayer side-play amount of two sides line pattern in a zone.In addition, in above-described embodiment two, on one side, each detects the corresponding through hole of thing, but the embodiment of the present invention is not limited to this, also can only form a through hole on printed circuit board, then measures the distance that each detects thing and this through hole.
In the various embodiments described above, location structure is through hole, certainly, the invention is not restricted to this, and location structure can also be protuberance and/or recess, perhaps, and other centrosymmetric structures.
In the embodiment of the present invention, when printed wiring board only had one deck central layer, the level to level alignment degree of the two sides line pattern by detecting this layer central layer was determined the level to level alignment degree of the two sides line pattern of this printed wiring board; When printed wiring board comprises: two-layer, or during multi-layer coreboard, the level to level alignment degree of the two sides line pattern by detecting every layer of central layer is determined the level to level alignment degree of the two sides line pattern of this printed wiring board.
Produce a kind of printed wiring board according to the method for the level to level alignment degree of above-mentioned detection central layer two sides line pattern, the central layer that the two sides line pattern is arranged, the detection thing is arranged respectively on every of this central layer, wherein, the position of the test pattern on the detection thing on every and this face graphic documentation is corresponding, and, identical test pattern is arranged on the same position of every graphic documentation;
On the desired location of this central layer, location structure is arranged, be used for according to this location structure respectively and the first surface of this central layer and second upper measuring distance that detects between thing, determine the interlayer side-play amount of this central layer two sides line pattern.
Referring to Figure 12, comprise with the corresponding device of the method for the level to level alignment degree of above-mentioned detection central layer two sides line pattern: rendering apparatus 100, making apparatus 200, location structure forming device 300 and checkout equipment 400.Wherein,
Making apparatus 200 is used for carrying out the making of central layer according to drawing the first surface of test pattern and the graphic documentation of second, and wherein, the central layer that has completed comprises the detection thing corresponding with the position of each test pattern.
Location structure forming device 300 is used for forming location structure on the desired location of the central layer that has completed.
In the embodiment of the present invention, the graphic documentation that generally designs and draw circuit by CASE(Computer Aided Software Engineering), therefore, rendering apparatus 100 is generally Intelligent I/O equipment, for example: computing machine.
The making of central layer is consistent with prior art, is all to make according to graphic documentation, and therefore, making apparatus 200 is also consistent with existing equipment.
In the embodiment of the present invention, can form location structure on the desired location of central layer by modes such as board punching, laser boring or chemical corrosions, therefore, location structure forming device 300 comprises: punching board, laser-beam drilling machine or etching machine.
Certainly, in the embodiment of the present invention, can be by laser ranging, infrared distance measurement, or these modes such as machinery range finding etc. are determined the interlayer side-play amount of central layer two sides line pattern, therefore, checkout equipment 400 is the equipment corresponding with aforesaid way namely, for example: laser range finder, infrared range-measurement system, perhaps, electronic caliper.
In the embodiment of the present invention, increase test pattern on the graphic documentation on each upper thread of central layer road in the printed wiring board of designing, like this, the central layer that has completed comprises the detection thing corresponding with the position of each test pattern, and form location structure on the desired location of the central layer that has completed, then, according to the detection thing on every of central layer and the distance between location structure, determine the interlayer side-play amount of central layer two sides line pattern.Thereby, can judge not only whether the level to level alignment degree of two sides line pattern meets the requirements, the interlayer side-play amount that can also obtain to determine has greatly improved the accuracy of detection of the level to level alignment degree of central layer two sides line pattern in the printed wiring board.
Obviously, those skilled in the art can carry out various changes and modification and not break away from the spirit and scope of the present invention the present invention.Like this, if within of the present invention these are revised and modification belongs to the scope of claim of the present invention and equivalent technologies thereof, the present invention also is intended to comprise these changes and modification interior.
Claims (12)
1. a method that detects the level to level alignment degree of central layer two sides line pattern, is characterized in that, comprising:
In the first surface of the central layer of printed wiring board and second graphing data respectively, wherein, draw respectively test pattern on the same position of first surface and second 's graphic documentation;
According to the first surface of drawing test pattern and second 's graphic documentation, carry out the making of central layer, wherein, the central layer that has completed comprises the detection thing corresponding with the position of each test pattern;
Form location structure on the desired location of the central layer that has completed;
Determine the interlayer side-play amount of described central layer two sides line pattern according to the detection thing on the first surface of described central layer and second respectively and the measuring distance between described location structure.
2. the method for claim 1, is characterized in that, described test pattern comprises: circle, polygon, annular or target disc shape; Described target disc shape comprises: a disk, and four rectangles symmetrical centered by the center of circle of described disk.
3. method as claimed in claim 2, it is characterized in that, when described test pattern was target disc shape, the detection thing on the described central layer that has completed comprised: a nahlock and four by the center of circle of described nahlock centered by the symmetrical panes corresponding with target disc shape;
The location structure of described formation comprises:
Take the center of circle of the nahlock of the detection thing of the one side of described central layer as reference point, form through hole.
4. method as claimed in claim 3, is characterized in that, describedly determines that the interlayer side-play amount of described central layer two sides line pattern comprises:
According to the pane that detects two horizontal directions in thing on the first surface of described central layer respectively and the difference between the measuring distance of described through hole determine the first horizontal survey distance, and the corresponding pane that detect in thing two horizontal directions upper according to second of described central layer respectively and the difference between the measuring distance of described through hole determine the second horizontal survey distance;
According to described the first horizontal survey distance, and the second horizontal survey distance determines that the interlayer side-play amount of described central layer two sides line pattern horizontal direction is: the difference between the first horizontal survey distance and the second horizontal survey distance;
According to the pane that detects two vertical directions in thing on the first surface of described central layer respectively with the measuring distance of described through hole, determine that the first vertical measuring distance is: the difference between two measuring distances, and according to second of the described central layer upper corresponding pane that detects two vertical directions in thing respectively with the measuring distance of described through hole, determine that the second vertical measuring distance is: the difference between two measuring distances;
According to the described first vertical measuring distance, and the second vertical measuring distance determines that the interlayer side-play amount of described central layer two sides line pattern vertical direction is: the difference between the first vertical measuring distance and the second vertical measuring distance.
5. method as claimed in claim 1 or 2, is characterized in that, when on the graphic documentation of every of described central layer, at least two test pattern being arranged, described formation location structure comprises:
On the central layer that has completed, form respectively a corresponding location structure for each the detection thing on one side; Or,
On the central layer that has completed, form a described location structure for all the detection things on one side.
6. method as claimed in claim 5, is characterized in that, when each on one side detects the respectively corresponding location structure of thing, describedly determines that the interlayer side-play amount of described central layer two sides line pattern comprises:
Measure the first measuring distance of detection thing on the first surface location structure corresponding with it, and the second measuring distance of the detection thing of second upper correspondence and identical location structure;
According to the first measuring distance and the second corresponding measuring distance, obtain the interlayer side-play amount of described central layer two sides line pattern.
7. method as described in claim 1 or 6, is characterized in that, symmetrical structure centered by described location structure, described location structure are through hole, protuberance and/or recess.
8. as claim 1,3 or 6 described methods, it is characterized in that, the mode that forms location structure comprises with lower at least a: punching, laser boring or chemical corrosion.
9. as claim 1,3 or 6 described methods, it is characterized in that, the material of described detection thing is metal material.
10. as claim 1,3 or 6 described methods, it is characterized in that, the material of described detection thing is consistent with the material of described central layer.
11. printed wiring board, comprise: the central layer that the two sides line pattern is arranged, it is characterized in that, the detection thing is arranged respectively on every of described central layer, wherein, the position of the test pattern on the detection thing on every and this face graphic documentation is corresponding, and, identical test pattern is arranged on the same position of every graphic documentation;
On the desired location of described central layer, location structure is arranged, be used for according to described location structure respectively and the first surface of described central layer and second upper measuring distance that detects between thing, determine the interlayer side-play amount of described central layer two sides line pattern.
12. a device that detects the level to level alignment degree of central layer two sides line pattern is characterized in that, comprising:
Rendering apparatus is used for the graphing data respectively the first surface of the central layer of printed wiring board and second, wherein, draws respectively test pattern on the same position of first surface and second 's graphic documentation;
Making apparatus is used for carrying out the making of central layer according to drawing the first surface of test pattern and the graphic documentation of second, and wherein, the central layer that has completed comprises the detection thing corresponding with the position of each test pattern;
The location structure forming device is used for forming location structure on the desired location of the central layer that has completed;
Checkout equipment is used for according to the detection thing on the first surface of described central layer and second respectively and the measuring distance between described location structure, determines the interlayer side-play amount of described central layer two sides line pattern.
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| CN103175456B (en) * | 2011-12-21 | 2016-03-30 | 北大方正集团有限公司 | The method of detection contraposition skew and PCB are in making sheet |
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| CN103438813B (en) * | 2013-06-28 | 2016-04-20 | 东莞美维电路有限公司 | The measuring method of multilayer printed circuit board inter-layer position skew and surveyors' staff |
| CN105277110A (en) * | 2015-11-06 | 2016-01-27 | 高德（江苏）电子科技有限公司 | Test piece for monitoring offset between inner layers of multi-layer printed circuit board |
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| TWI630383B (en) * | 2017-10-17 | 2018-07-21 | 亞亞科技股份有限公司 | Positioning method for detecting perforated steel plate |
| CN108845480A (en) * | 2018-08-08 | 2018-11-20 | 中山新诺科技股份有限公司 | A kind of position alignment of inner layer plates accuracy measurement method |
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