CN102020783B - Selection method of fillers for advanced encapsulating material - Google Patents

Selection method of fillers for advanced encapsulating material Download PDF

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Publication number
CN102020783B
CN102020783B CN2010105187317A CN201010518731A CN102020783B CN 102020783 B CN102020783 B CN 102020783B CN 2010105187317 A CN2010105187317 A CN 2010105187317A CN 201010518731 A CN201010518731 A CN 201010518731A CN 102020783 B CN102020783 B CN 102020783B
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China
Prior art keywords
specific surface
encapsulating material
surface area
fillers
ratio
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Expired - Fee Related
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CN2010105187317A
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Chinese (zh)
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CN102020783A (en
Inventor
袁良杰
艾常春
肖勇
冯锦华
文雯
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Wuhan University WHU
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Wuhan University WHU
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Abstract

The invention discloses a selection method of spherical silicon dioxide fillers for an encapsulating material. On the premise of controlling the maximum particle size and the minimum particle size, the method selects different components of silicon dioxide fillers, tests and calculates practical specific surface areas and the theoretical specific surface areas, then, calculates the ratio of each practical specific surface area to each theoretical specific surface area and selects the components with the ratio of 2.0 to 3.0 as fillers for an advanced encapsulating material of an epoxy resin system. When the method is in use, no filler of other specifications is added for graduation, and the epoxy resin composite material can embody the excellent properties. The invention greatly simplifies the preparation process of the advanced encapsulating material and can effectively improve the reliability of the advanced encapsulating material.

Description

A kind of advanced used for packing material filler selection method
Technical field
The invention belongs to the packaged material field, be specifically related to a kind of advanced used for packing material filler selection method.
Technical background
Encapsulation is a necessary important procedure in the production processes such as unicircuit, solar cell, LED, and the quality of packaged material directly influences the effect of encapsulation, and preparing spherical SiO 2 is widely used as the filler in the electronic package material.In order to improve the loading level of preparing spherical SiO 2 in epoxy resin, adopt the method for grating usually, hope to reach effective filling.In order to ensure the safety of grating, every kind of size-grade distribution that is used for the preparing spherical SiO 2 powder of grating all requires highly stable.Obviously the polycomponent grating brings inconvenience can for the production of packaged material, and influences reliability of material.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of used for packing material filler selection method.This method is simple, and is easy to operate, helps the management and control of production process.
The technical measures that the present invention taked are:
Maximum particle diameter at the control preparing spherical SiO 2 is no more than 45 microns; Minimum grain size is not less than under 0.3 micron the prerequisite; Select particle diameter to be the various preparing spherical SiO 2s of normal distribution, calculate its specific surface area and measure its actual specific surface area, and calculate the ratio of test value and calculated value; Selecting ratio is that 2.0~3.0 preparing spherical SiO 2 is as the used for packing material filler; The calculated value of said specific surface area is 2.73/d, and wherein d is median size D50 value, and the mensuration of said actual specific surface-area is taked BET liquid nitrogen absorption method.
With the grating compared with techniques, the beneficial effect that the inventive method reached: method is simple, and is easy to operate, helps the management and control of production process.
Embodiment
Selecting size-grade distribution (D50) is 1.0 ± 0.5 (SS1), 2.5 ± 0.5 (SS2), and 4.0 ± 1 (SS3), 6.0 ± 1 (SS4), the preparing spherical SiO 2 of 10.0 ± 2 (SS5) μ m, maximum particle diameter and minimum grain size are controlled at 45 and 0.5 mu m range respectively.The BET multiple spot specific surface area test value of five kinds of samples is respectively 23.52,2.59, and 2.23,0.65 and 0.30m 2/ g; The specific surface area calculated value of five kinds of samples is respectively 2.73,1.09, and 0.68,0.39 and 0.23m 2/ g.The specific surface area test value of five kinds of samples is respectively 8.62,2.38,3.28,1.67,1.30 with the ratio of calculated value.By 73% weight ratio respectively with SS1, SS2, SS3, SS4 and SS5 and biphenyl epoxy resin, solidifying agent mixed smelting; Flow measurement moving length value in cooling back is respectively: 55,116,61; 83,85,114cm is according to the grating principle; With SS1, after SS3 and the SS5 grating with biphenyl epoxy resin, the solidifying agent mixed smelting, cooling pulverize the moving length value of back flow measurement be the obvious SS2 result of 114cm. preferably and be superior to the grating result.
By 50% weight ratio respectively with SS1, SS2, SS3, SS4 and SS5 and alicyclic liquid epoxies, solidifying agent mixes, evenly mixture viscosity is surveyed in the back, is respectively: 1090,580,730,1120,4200mPas, the resin system viscosity of obvious SS2 filling is minimum.
Relatively the specific surface area test value and the calculated value of five kinds of samples are found respectively: ratio is between 2.0~3.0 the time, and preparing spherical SiO 2 has filling characteristic preferably.

Claims (1)

1. used for packing material filler selection method; It is characterized in that: the maximum particle diameter at the control preparing spherical SiO 2 is no more than 45 microns, and minimum grain size is not less than under 0.3 micron the prerequisite, selects particle diameter to be the various preparing spherical SiO 2s of normal distribution; Calculate its specific surface area and measure its actual specific surface area; And calculate the ratio of test value and calculated value, selection ratio be 2.0 ~ 3.0 preparing spherical SiO 2 as the used for packing material filler, the calculated value of said specific surface area is 2.73/d; Wherein d is median size D50 value, and the mensuration of said actual specific surface-area is taked BET liquid nitrogen absorption method.
CN2010105187317A 2010-10-25 2010-10-25 Selection method of fillers for advanced encapsulating material Expired - Fee Related CN102020783B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010105187317A CN102020783B (en) 2010-10-25 2010-10-25 Selection method of fillers for advanced encapsulating material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010105187317A CN102020783B (en) 2010-10-25 2010-10-25 Selection method of fillers for advanced encapsulating material

Publications (2)

Publication Number Publication Date
CN102020783A CN102020783A (en) 2011-04-20
CN102020783B true CN102020783B (en) 2012-05-30

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103771423B (en) * 2013-12-11 2016-09-14 天津泽希矿产加工有限公司 Ball-type packing used for electronic packaging and manufacture method
CN107099135B (en) * 2017-07-05 2020-01-17 宁波市特尔佳塑料科技有限公司 Reinforced modified flame-retardant PA6 composition
CN107827117B (en) * 2017-11-22 2020-12-22 江苏联瑞新材料股份有限公司 Preparation method of multimodal distribution spherical silicon dioxide micro powder

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0400705A1 (en) * 1989-05-19 1990-12-05 Stamicarbon B.V. Filling material composition
EP0987219A1 (en) * 1998-09-16 2000-03-22 Nippon Aerosil Co., Ltd. Ultrafine particle silicon dioxide and process for producing the same
CN1401727A (en) * 2001-08-02 2003-03-12 日本电气株式会社 Sealing resin, resin sealed semiconductor and packaging assembly system thereof
CN1910122A (en) * 2004-01-08 2007-02-07 昭和电工株式会社 Inorganic powder, resin composition filled with the powder and use thereof
CN101743198A (en) * 2007-08-01 2010-06-16 电气化学工业株式会社 Silica powder, method for production of the same, and composition using the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0400705A1 (en) * 1989-05-19 1990-12-05 Stamicarbon B.V. Filling material composition
EP0987219A1 (en) * 1998-09-16 2000-03-22 Nippon Aerosil Co., Ltd. Ultrafine particle silicon dioxide and process for producing the same
CN1401727A (en) * 2001-08-02 2003-03-12 日本电气株式会社 Sealing resin, resin sealed semiconductor and packaging assembly system thereof
CN1910122A (en) * 2004-01-08 2007-02-07 昭和电工株式会社 Inorganic powder, resin composition filled with the powder and use thereof
CN101743198A (en) * 2007-08-01 2010-06-16 电气化学工业株式会社 Silica powder, method for production of the same, and composition using the same

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