CN102009517A - Method for making metal mother board - Google Patents
Method for making metal mother board Download PDFInfo
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- CN102009517A CN102009517A CN 201010287422 CN201010287422A CN102009517A CN 102009517 A CN102009517 A CN 102009517A CN 201010287422 CN201010287422 CN 201010287422 CN 201010287422 A CN201010287422 A CN 201010287422A CN 102009517 A CN102009517 A CN 102009517A
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Abstract
The invention relates to a method for making a metal mother board. The metal mother board is made by splicing at least two metal daughter boards together, and each metal daughter board has lines of a laser image. In the method, an abutted seam between the at least two metal daughter boards is stuffed mainly in an electroforming manner, wherein a concave-convex structure is arranged on the abutted edge of each metal daughter board, and the concave-convex structures of adjacent daughter boards are matched with each other. By adopting the concave-convex structures, the electroforming strength among metal daughter boards is increased, simple and accurate counterpoint is also realized, and the quality of the finished product of the metal mother board is improved.
Description
Technical field
The present invention relates to a kind of preparation method of metal motherboard, especially relate to a kind of preparation method that adopts the metal motherboard of electroforming layout formula.
Background technology
Radium-shine light variation image is big because of its manufacture difficulty, the high anti-fake mark that is used as of access threshold, is widely used in above packing, certificate, stamp, the card coin etc.A kind of high efficiency laser light becomes image formation method, is the mode by impression, and the grain pattern that will have an a certain given shape is transferred to from the metal motherboard and waited to impress on the product.Therefore make the key that the metal motherboard becomes this technical method.
Along with the development in market, people are also more and more higher to the requirement of the laser pattern on the metal motherboard, often need design the laser pattern with multiple visual effect on a metal motherboard.And the laser pattern of different visual effects has the different micro-structurals that has a close grain, and its preparation method is all different with manufacture craft, therefore is difficult to accomplish that one-shot forming is on a metal motherboard.A kind of feasible solution is to be produced on the different metal daughter boards by the laser pattern with different texture structures, then each metal daughter board layout is become large-sized metal motherboard.
The keyline layout method of main flow mainly comprises hot pressing layout and silica gel layout at present, but these two kinds of methods are owing to be subjected to technologic separately restriction, often in the layout process, the micro-structural that has a close grain on the virgin metal daughter board is destroyed, made the radium-shine image of seam crossing not reach the visual effect of expection.In Chinese patent CN101618628, a kind of keyline layout method of electroforming mode has been proposed.Seam is filled and led up and eliminated to this method because of using electroforming, therefore kept the texture structure of each metal daughter board preferably.But still there are two problems in the method, the one, because the metal daughter board is all thinner, and because seam all is a very thin straight line, so electroforming intensity is little, is easy to fracture in later stage impression utilization; The 2nd, in the time of daughter board and daughter board splicing, need the eye-observation contraposition, both lowered efficiency, precision is not high again.
Summary of the invention
In view of this, the present invention proposes a kind of preparation method of metal motherboard, and the keyline layout method of above-mentioned electroforming mode is improved, and has both strengthened the bond strength between daughter board and daughter board, can realize again simple and accurate contraposition.
The preparation method of a kind of metal motherboard that proposes according to purpose of the present invention comprises at least two metal daughter boards splicings, and makes progress with lines, at the seam crossing applying adhesive tape of those daughter boards, makes this each sheet metal sublayer synthetic apertured metal motherboard that hardens; Downward with lines, on the slit at this metal motherboard back side, be coated with conducting liquid, this conducting liquid is inserted in this slit; Electroforming makes the slit of this metal motherboard fill up disappearance; Wherein, the splicing limit of this each sheet metal daughter board is provided with concaveconvex structure, and the concaveconvex structure between the adjacent metal daughter board cooperatively interacts.
The preparation method of a kind of metal motherboard that proposes according to purpose of the present invention, wherein said concaveconvex structure are a kind of in waveform, zigzag or the square waveform.
The preparation method of a kind of metal motherboard that proposes according to purpose of the present invention, wherein said concaveconvex structure cuts by cutting die.
The preparation method of a kind of metal motherboard that proposes according to purpose of the present invention, the lines of wherein said metal daughter board is dark line structure or shallow line structure.
The preparation method of a kind of metal motherboard that proposes according to purpose of the present invention, wherein said metal daughter board is by a kind of being made in laser direct-write photoetching technology, mask exposure photoetching technique or the immersion interference photoetching technology.
The preparation method of a kind of metal motherboard that proposes according to purpose of the present invention, the wherein said respectively thickness difference between this metal daughter board is less than 10um.
The preparation method of a kind of metal motherboard that proposes according to purpose of the present invention wherein before carrying out electroforming, also is included in the diaphragm of applying one deck insulated enclosure on the textured one side of metal motherboard.
The preparation method of a kind of metal motherboard that proposes according to purpose of the present invention wherein after carrying out electroforming, also comprises and removes diaphragm and adhesive tape, and with solvent cleaned motherboard surface.
The preparation method of a kind of metal motherboard that proposes according to purpose of the present invention, wherein said adhesive tape is an adhesive tape acidproof, alkaline-resisting, heat-resisting quantity.
The preparation method of a kind of metal motherboard that proposes according to purpose of the present invention, wherein said conducting liquid be that silver is starched.
By the metal motherboard that technique scheme is made, owing to adopt the concaveconvex structure of working in coordination on the splicing limit of each daughter board, the contact-making surface of the seam that makes increases, and the stress on the seam length direction is not easy to rupture by the concaveconvex structure counteracting.Simultaneously, concaveconvex structure is when splicing, and outer being with that only needs to observe daughter board do not have dislocation can know whether accurate contraposition, improved production efficiency greatly.
The present invention is elaborated with specific embodiment below in conjunction with accompanying drawing.
Description of drawings
Fig. 1 is that the metal motherboard of first embodiment of the invention is made flow chart;
Fig. 2 uses 2 schematic diagrames that the metal daughter board splices in the metal motherboard preparation method of the present invention;
Fig. 3 A and 3B use 4 schematic diagrames that the metal daughter board splices in the metal motherboard preparation method of the present invention;
Fig. 4 A and 4B are the schematic diagrames of the other forms of concaveconvex structure of the present invention;
Fig. 5 is that the metal motherboard of second embodiment of the present invention is made flow chart.
The specific embodiment
Please refer to Fig. 1, Fig. 1 is that the metal motherboard of first embodiment of the invention is made flow chart.As shown in the figure, at first be step S11: the metal daughter board that will make in advance, splice by the motherboard space of a whole page figure of required making.This splicing action preferably is placed on the smooth table top to be carried out, because for the metal daughter board, its thickness often has only tens microns, and the thickness difference between the different metal daughter boards is also less than 10um, and the requirement of flatness is very high during therefore for splicing.
Then step S12: after splicing was finished, towards last, it was fixing to utilize adhesive tape on this lines face seam to be fitted with lines, made between the metal daughter board not easily separatedly, formed the metal motherboard of a large-sized band gap.Employed adhesive tape is preferably acidproof, alkaline-resisting, the adhesive tape of heat-resisting quantity, avoids being corroded by electroforming solution in the electroforming process.
Be step S13 then: with the motherboard upset, make lines downward, be coated with conducting liquid on the slit overleaf, allow conducting liquid fill up in this slit, the conducting liquid that remains in the surface can be removed with solvent wiping.Selected conducting liquid can be the silver slurry.
Final step S14 inserts motherboard and carries out electroforming in the electroforming solution, makes the piece of this metal motherboard fill up disappearance, forms a complete motherboard.In the electroforming process, can utilize suspension member that motherboard is suspended in the liquid, inside with lines, electroforming is carried out at the back side.The electroforming time is approximately 15 hours.
It should be noted that in the present invention each metal daughter board is provided with concaveconvex structure at the edge that it need splice, as shown in Figure 2, Fig. 2 uses two schematic diagrames that the metal daughter board splices in the metal motherboard preparation method of the present invention.Wherein, the edge 111 of metal daughter board 11 and the edge 121 of metal daughter board 12 splice, and are respectively equipped with jagged concaveconvex structure 112,122 on edge 111 and edge 121, and two concaveconvex structures are designed to just in time can work in coordination, and splice with this.Thus, two metal daughter boards have not only increased in the contact area of splicing place, and on the length direction of seam, owing to its stress is just in time offset by concaveconvex structure, feasible linear relatively seam, it increases greatly in conjunction with fastness.
Refer again to Fig. 3 A and 3B, Fig. 3 A and 3B use 4 schematic diagrames that the metal daughter board splices in the metal motherboard preparation method of the present invention.As shown in the figure, in Fig. 3 A since 4 metal daughter boards separately the edge concaveconvex structure of splicing place be designed to the cooperation of each artoregistration, so personnel are in splicing, a peripheral edge that only needs to observe 4 metal daughter boards just can know to have do not have correct contraposition.Shown in Fig. 3 B, if not to good position, outstanding situation clearly can appear in the metal daughter board 21 that then occurs misplacing, and personnel are easy to just can be adjusted, is spliced into complete metal motherboard again.
Because cutting all of each metal daughter board realizes that by cutting die therefore as long as in advance various cutting dies are designed on demand, its precision also can be controlled at micron level, has not only guaranteed the precision in the layout process, has also improved formation efficiency greatly.
Please refer to Fig. 4 A and 4B, Fig. 4 A and 4B are the schematic diagrames of the other forms of concaveconvex structure of the present invention.As shown in the figure, except zigzag concaveconvex structure, the splicing edge of metal daughter board also can be designed to the concaveconvex structure of corrugated concaveconvex structure and square waveform.In addition, other structures that have with same concept of the present invention also will be the scopes that institute of the present invention desire discloses.
Please refer to Fig. 5, Fig. 5 is the metal motherboard preparation method of second embodiment of the present invention.Compare with first embodiment, in the present embodiment, increase step S15 and step S16.Wherein step S15 is: before electroforming, also need stick the diaphragm of one deck insulated enclosure to motherboard on the lines face, prevent the metal motherboard in the process of electroforming, the lines face is destroyed by electroforming material.Step S16 is: after electroforming is finished, remove said protection film and adhesive tape, and with solvent cleaned motherboard surface.
In above-mentioned several embodiments, the metal daughter board surface of being adopted has the fine texture structure that produces radium-shine variable color image, and according to different demands, this texture structure can be designed to dark line structure and shallow line structure.In addition, can also be designed to the periodic structure of raster-like periodic structure or dot matrix, add the different of angle and cycle yardstick, make that the shown visual effect of coming out of different metal daughter board is all different, thereby make whole motherboard show changeable visual effect, thereby the anti-fake mark that realization is difficult to imitate.Wherein, manufacture craft for the metal daughter board of different texture structures is also inequality, can make the shallow line structure of nanometer such as adopting the laser direct-write photoetching technology, use the mask exposure photoetching technique can make dark line structure, use the immersion interference lithography can produce the short fine structure of period ratio, certainly above-mentioned various manufacture crafts are not all to be unique, can use mutually by improvement.
In sum, the present invention makes the metal motherboard by the mode of electroforming layout, uses concaveconvex structure on the edge of splicing, has both increased the electroforming intensity between the metal daughter board, can realize contraposition simply accurately again, has increased the end product quality of metal motherboard.
By the above detailed description of preferred embodiments, hope can be known description feature of the present invention and spirit more, and is not to come claim scope of the present invention is limited with above-mentioned disclosed preferred embodiment.On the contrary, its objective is that hope can contain in the scope of claim of being arranged in of various changes and tool equality institute of the present invention desire application.
Claims (10)
1. the preparation method of a metal motherboard, this metal motherboard is spliced by at least two metal daughter boards, respectively has the lines of radium-shine image on this metal daughter board, it is characterized in that, comprises the steps:
Press space of a whole page figure at least two metal daughter boards are spliced, and with adhesive tape the seam of those daughter boards is fitted, this each sheet metal sublayer is hardened synthesize an apertured metal motherboard in textured one side;
Downward with lines, on the slit at this metal motherboard back side, be coated with conducting liquid, this conducting liquid is inserted in this slit; And
Electroforming makes the slit of this metal motherboard fill up disappearance;
Wherein, the splicing limit of this each sheet daughter board is provided with concaveconvex structure, and the concaveconvex structure between adjacent daughter board cooperatively interacts.
2. the preparation method of metal motherboard as claimed in claim 1 is characterized in that: described concaveconvex structure is a kind of in waveform, zigzag or the square waveform.
3. the preparation method of metal motherboard as claimed in claim 1 is characterized in that: described concaveconvex structure cuts by cutting die.
4. the preparation method of metal motherboard as claimed in claim 1 is characterized in that: the lines of described metal daughter board is dark line structure or shallow line structure.
5. the preparation method of metal motherboard as claimed in claim 1 is characterized in that: described metal daughter board is by a kind of being made in laser direct-write photoetching technology, mask exposure photoetching technique or the immersion interference photoetching technology.
6. the preparation method of metal motherboard as claimed in claim 1 is characterized in that: the described respectively thickness difference between this metal daughter board is less than 10um.
7. the preparation method of metal motherboard as claimed in claim 1 is characterized in that: before carrying out electroforming, also be included in the diaphragm of applying one deck insulated enclosure on the textured one side of metal motherboard.
8. the preparation method of metal motherboard as claimed in claim 7 is characterized in that: after carrying out electroforming, also comprises and removes diaphragm and adhesive tape, and with solvent cleaned motherboard surface.
9. the preparation method of metal motherboard as claimed in claim 1 is characterized in that: described adhesive tape is an adhesive tape acidproof, alkaline-resisting, heat-resisting quantity.
10. the preparation method of metal motherboard as claimed in claim 1 is characterized in that: described conducting liquid is the silver slurry.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN 201010287422 CN102009517B (en) | 2010-09-20 | 2010-09-20 | Method for making metal mother board |
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| CN 201010287422 CN102009517B (en) | 2010-09-20 | 2010-09-20 | Method for making metal mother board |
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| CN102009517A true CN102009517A (en) | 2011-04-13 |
| CN102009517B CN102009517B (en) | 2013-04-03 |
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| CN 201010287422 Active CN102009517B (en) | 2010-09-20 | 2010-09-20 | Method for making metal mother board |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102677106A (en) * | 2012-06-05 | 2012-09-19 | 湖北联合天诚防伪技术股份有限公司 | Electrotype splicing method |
| CN102677107A (en) * | 2012-06-05 | 2012-09-19 | 湖北联合天诚防伪技术股份有限公司 | Electrotype splicing method |
| CN102736404A (en) * | 2011-04-13 | 2012-10-17 | 山东泰宝包装制品有限公司 | Lithographic platemaking imposition process |
| CN106494111A (en) * | 2016-10-25 | 2017-03-15 | 福建泰兴特纸有限公司 | Seamless cylindrical metallic working version and its processing technology |
| CN107139574A (en) * | 2017-04-02 | 2017-09-08 | 广东壮丽彩印股份有限公司 | A kind of three-dimensional opals of 3D directly print the preparation method of material |
| CN108123222A (en) * | 2017-12-08 | 2018-06-05 | 中国船舶重工集团公司第七二四研究所 | The joining method of printed board in a kind of frequency selection antenna house processing technology |
| CN110760896A (en) * | 2018-07-26 | 2020-02-07 | 苏州苏大维格科技集团股份有限公司 | Crease-resistant electroforming process for working plate |
| CN110756993A (en) * | 2018-07-26 | 2020-02-07 | 苏州苏大维格科技集团股份有限公司 | Laser spot welding makeup method |
| CN112323103A (en) * | 2020-11-04 | 2021-02-05 | 江苏兴广包装科技有限公司 | Hot-pressing type makeup method for holographic anti-counterfeiting plate |
| CN112644194A (en) * | 2020-12-25 | 2021-04-13 | 浙江亚欣包装材料有限公司 | Thin film plate making process |
Citations (3)
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| CN1530947A (en) * | 2003-03-14 | 2004-09-22 | 光群雷射科技股份有限公司 | Impression mother set with lines pattern, producing method and forming page method |
| CN101274576A (en) * | 2008-04-29 | 2008-10-01 | 汕头市东风印刷厂有限公司 | Laser holograph mould pressing method |
| CN101618628A (en) * | 2009-08-11 | 2010-01-06 | 湖北兴龙包装材料有限责任公司 | Method for manufacturing holographic mother board by using electroforming imposition |
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2010
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1530947A (en) * | 2003-03-14 | 2004-09-22 | 光群雷射科技股份有限公司 | Impression mother set with lines pattern, producing method and forming page method |
| CN101274576A (en) * | 2008-04-29 | 2008-10-01 | 汕头市东风印刷厂有限公司 | Laser holograph mould pressing method |
| CN101618628A (en) * | 2009-08-11 | 2010-01-06 | 湖北兴龙包装材料有限责任公司 | Method for manufacturing holographic mother board by using electroforming imposition |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102736404A (en) * | 2011-04-13 | 2012-10-17 | 山东泰宝包装制品有限公司 | Lithographic platemaking imposition process |
| CN102677106A (en) * | 2012-06-05 | 2012-09-19 | 湖北联合天诚防伪技术股份有限公司 | Electrotype splicing method |
| CN102677107A (en) * | 2012-06-05 | 2012-09-19 | 湖北联合天诚防伪技术股份有限公司 | Electrotype splicing method |
| CN102677106B (en) * | 2012-06-05 | 2014-08-27 | 湖北联合天诚防伪技术股份有限公司 | Electrotype splicing method |
| CN102677107B (en) * | 2012-06-05 | 2015-03-11 | 湖北联合天诚防伪技术股份有限公司 | Electrotype splicing method |
| CN106494111A (en) * | 2016-10-25 | 2017-03-15 | 福建泰兴特纸有限公司 | Seamless cylindrical metallic working version and its processing technology |
| CN107139574A (en) * | 2017-04-02 | 2017-09-08 | 广东壮丽彩印股份有限公司 | A kind of three-dimensional opals of 3D directly print the preparation method of material |
| CN108123222A (en) * | 2017-12-08 | 2018-06-05 | 中国船舶重工集团公司第七二四研究所 | The joining method of printed board in a kind of frequency selection antenna house processing technology |
| CN110760896A (en) * | 2018-07-26 | 2020-02-07 | 苏州苏大维格科技集团股份有限公司 | Crease-resistant electroforming process for working plate |
| CN110756993A (en) * | 2018-07-26 | 2020-02-07 | 苏州苏大维格科技集团股份有限公司 | Laser spot welding makeup method |
| CN110756993B (en) * | 2018-07-26 | 2021-06-29 | 苏州苏大维格科技集团股份有限公司 | Laser spot welding makeup method |
| CN112323103A (en) * | 2020-11-04 | 2021-02-05 | 江苏兴广包装科技有限公司 | Hot-pressing type makeup method for holographic anti-counterfeiting plate |
| CN112644194A (en) * | 2020-12-25 | 2021-04-13 | 浙江亚欣包装材料有限公司 | Thin film plate making process |
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|---|---|
| CN102009517B (en) | 2013-04-03 |
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Address after: 215026 No. 478 South Street, Suzhou Industrial Park, Jiangsu, China Co-patentee after: Suzhou University Patentee after: SUZHOU SUDAVIG SCIENCE AND TECHNOLOGY GROUP Co.,Ltd. Address before: 215026 No. 478 South Street, Suzhou Industrial Park, Jiangsu, China Co-patentee before: Suzhou University Patentee before: SVG OPTRONICS, Co.,Ltd. |