CN102005918A - Synchronous boost-buck device and synchronous buck-buck method thereof - Google Patents
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Abstract
The invention discloses a synchronous boost-buck device and a synchronous buck-buck method thereof. The synchronous boost-buck device comprises an MCU (Microprogrammed Control Unit), an input voltage sampling module, an output voltage sampling module, an output current sampling module and a synchronous boost-buck conversion module, wherein the MCU is respectively connected with the input voltage sampling module, the output voltage sampling module, the output current sampling module and the synchronous boost-buck conversion module, the input voltage sampling module and the output voltage sampling module are respectively connected with an input port and an output port of the device, and the synchronous boost-buck conversion module is respectively connected with the input port, the output port and the output current sampling module. In the invention, the synchronous boost-buck conversion module is started for boosting or bucking or first boosting and then bucking through an input voltage acquired by the input voltage sampling module, and meanwhile, the synchronous boost-buck conversion module is controlled to output a corresponding voltage value and a corresponding current value according to an output voltage and an output current so as to satisfy the power supply needs of portable equipment.
Description
Technical field
The present invention relates to the buck technology, the method that particularly a kind of synchronization lifting pressure device and realization synchronization lifting thereof are pressed.
Background technology
High-power portable equipment as portable Medical Devices, notebook computer etc., generally all has DC/DC power supply (DC-DC power supply) or charge management module, so need to use a lifting/voltage reducing device in this kind equipment usually.
Generally by software control independent hardware boost module and step-down module, enable to select conducting boost module or conducting step-down module by the lifting/voltage reducing device of software control by control chip.As everyone knows, the electronic component that boost module and step-down module comprise is more, all need on circuit board, to occupy certain area, do not meet the requirement of miniaturization of electronic products, and boost or hardware controls is passed through in step-down, its very flexible is boosted and the magnitude of voltage of step-down can't accurately be controlled, and can not satisfy the real work needs.
And, the price comparison height of the control chip that above-mentioned lifting/voltage reducing device adopts, electronic component is many, makes the cost of product higher, has reduced the competitiveness of product on market, and also inconvenient to the debugging and the maintenance of product.
Thereby prior art is still waiting to improve and improve.
Summary of the invention
In view of above-mentioned the deficiencies in the prior art part, the object of the present invention is to provide a kind of synchronization lifting pressure device and realize the method that synchronization lifting is pressed, can start synchronization lifting automatically according to input voltage value presses conversion module to boost or the step-down or the back step-down of boosting earlier, thereby control the output voltage and the output current of synchronization lifting pressure device, satisfy the power demands of portable equipment.
In order to achieve the above object, the present invention has taked following technical scheme:
A kind of synchronization lifting pressure device, it comprises the MCU microcontroller that is used for output pwm signal; Wherein, also comprise: be used for the real-time input voltage sampling module that input voltage is sampled; Be used for the real-time output voltage sampling module that output voltage is sampled; Be used for the real-time output current sampling module that output current is sampled; Be used for boosting and the synchronization lifting of decompression transformation is pressed conversion module according to input voltage value; Described MCU microcontroller also is used for the output voltage and the output current that obtain according to output voltage sampling module and output current sampling module, controls output voltage and output current that described synchronization lifting is pressed conversion module; Described MCU microcontroller presses conversion module to be connected with input voltage sampling module, output voltage sampling module, output current sampling module and synchronization lifting respectively; Described input voltage sampling module connects the input port of described synchronization lifting pressure device, and the output voltage sampling module connects described synchronization lifting pressure device output port; Described synchronization lifting presses conversion module to be connected with described input port, output port and output current sampling module respectively.
Described synchronization lifting pressure device wherein, comprises also being used for driver module that described pwm signal is amplified that described driver module is connected on the MCU microcontroller and synchronization lifting is pressed between the conversion module.
Described synchronization lifting pressure device, wherein, it is the synchronous translation circuit of full-bridge that is connected and composed by first metal-oxide-semiconductor, second metal-oxide-semiconductor, the 3rd metal-oxide-semiconductor and the 4th metal-oxide-semiconductor that described synchronization lifting is pressed conversion module; Wherein: first metal-oxide-semiconductor and the 3rd metal-oxide-semiconductor constitute the synchronous buck module, and second metal-oxide-semiconductor and the 4th metal-oxide-semiconductor constitute the synchronous boost module.
Described synchronization lifting pressure device, wherein, described driver module comprises first driver module and second driver module; The first input end of described first driver module is connected first output and second output of MCU microcontroller with second input, first output of first driver module connects the grid of first metal-oxide-semiconductor, and second output connects the grid of the 3rd metal-oxide-semiconductor; The first input end of described second driver module is connected the 3rd output and the 4th output of MCU microcontroller with second input, first output of described second driver module connects the grid of described second metal-oxide-semiconductor, and second output connects the grid of described the 4th metal-oxide-semiconductor.
Described synchronization lifting pressure device, wherein, described synchronization lifting presses conversion module to comprise first diode and second diode; The anode of described first diode connects the drain electrode of second metal-oxide-semiconductor, and the negative electrode of first diode connects the source electrode of second metal-oxide-semiconductor; The anode of described second diode connects the drain electrode of the 3rd metal-oxide-semiconductor, and the negative electrode of second diode connects the source electrode of the 3rd metal-oxide-semiconductor.
Described synchronization lifting pressure device, wherein, described synchronization lifting presses conversion module to comprise inductance, and an end of described inductance is connected with the drain electrode of first metal-oxide-semiconductor and the drain electrode of the 3rd metal-oxide-semiconductor respectively, and the other end of inductance is connected with the drain electrode of second metal-oxide-semiconductor and the drain electrode of the 4th metal-oxide-semiconductor respectively.
A kind of synchronization lifting pressure device is realized the method that synchronization lifting is pressed, and wherein, described method may further comprise the steps:
The pwm signal of being exported 4 groups of complementations by the MCU microcontroller sends to synchronization lifting pressure conversion module;
Obtain input voltage, output voltage and output current respectively in real time by input voltage sampling module, output voltage sampling module and output current sampling module, and feed back to the MCU microcontroller;
By the input voltage that described MCU microcontroller obtains according to described input voltage sampling module, start synchronization lifting and press conversion module to boost or the step-down or the back step-down of boosting earlier; Simultaneously, by output voltage and the output current value that described MCU microcontroller obtains according to described output voltage sampling module and output current sampling module, the control synchronization lifting is pressed conversion module output correspondent voltage and electric current.
Described method, wherein, after the described pwm signal of being exported 4 groups of complementations by the MCU microcontroller sent to the step of synchronization lifting pressure conversion module, described method further comprised:
The pwm signal of described MCU microcontroller being exported by driver module carries out the amplification of driving force.
Described method, wherein, described synchronization lifting is pressed the voltage and current of conversion module output, adopts pid algorithm to calculate by described MCU control module.
The method that a kind of synchronization lifting pressure device provided by the invention and realization synchronization lifting thereof are pressed, described synchronization lifting pressure device comprises the MCU microcontroller, the input voltage sampling module, the output voltage sampling module, output current sampling module and synchronization lifting are pressed conversion module, press conversion module to boost or step-down by the input voltage startup synchronization lifting that the input voltage sampling module obtains, or the back step-down of boosting earlier, only need to press conversion module to realize boosting and the synchronous conversion of step-down according to the pwm signal of MCU microcontroller output by synchronization lifting, its reaction speed is fast, output voltage and the output current that obtains respectively by output voltage sampling module and output current sampling module simultaneously, the control synchronization lifting is pressed conversion module output correspondent voltage and current value, satisfies the power demands of portable equipment.
A kind of synchronization lifting pressure device provided by the invention and realize the method that synchronization lifting is pressed has adopted the platform of pure digi-tal, its peripheral components seldom, account for the plate area few, simplified the designing and manufacturing technique flow process; And the ability of the automatic diagnosis of digital platform, adjusting, make debugging and maintenance work become light, extensibility is good with repeatability, simultaneously, intelligently voltage boosting and step-down handoff technique have also been adopted, realized boosting and the step-down seamless switching, but also adopted pid algorithm control output voltage and electric current, dynamic response characteristic is good.
Synchronization lifting pressure device provided by the invention can be widely used in the buck-boost type DC/DC power supply and the battery charging management field of requirement high efficiency, change in voltage wide ranges, big electric current output, for this application provides a kind of reliability height, low cost solution.
Description of drawings
The structured flowchart of the synchronization lifting pressure device that Fig. 1 provides for the embodiment of the invention.
The schematic diagram of the synchronization lifting pressure device that Fig. 2 provides for the embodiment of the invention.
The circuit diagram of an Application Example of the synchronization lifting pressure device that Fig. 3 provides for the embodiment of the invention.
The method flow diagram that Fig. 4 presses for the synchronization lifting that the embodiment of the invention provides.
Embodiment
The invention provides a kind of synchronization lifting pressure device and realize the method that synchronization lifting is pressed, clearer, clear and definite for making purpose of the present invention, technical scheme and effect, below with reference to accompanying drawing and give an actual example that the present invention is described in more detail.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
See also Fig. 1, synchronization lifting pressure device provided by the invention comprises MCU microcontroller 110(Micro Control Unit, micro-control unit), input voltage sampling module 120, output voltage sampling module 130, output current sampling module 140 and synchronization lifting press conversion module 150.
Described MCU microcontroller 110 presses conversion module 150 to be connected with input voltage sampling module 120, output voltage sampling module 130, output current sampling module 140 and synchronization lifting respectively; Described input voltage sampling module 120 connects the input port VIN of described synchronization lifting pressure device, is used for practicality input voltage is carried out sampling feedback to MCU microcontroller 110.
Output voltage sampling module 130 connects the output port VOUT of described synchronization lifting pressure device, is used in real time output voltage being sampled; Described synchronization lifting presses conversion module 150 to be connected with output current sampling module 140 with described input port VIN, output port VOUT respectively.
Described output current sampling module 140 is used in real time output current being sampled, and feeds back to the MCU microcontroller, and synchronization lifting presses conversion module 150 to be used for boosting and the conversion of step-down according to input voltage value.
Described MCU microcontroller 110 is used to export the PWM(Pulse Width Modulation of 4 groups of complementations, pulse-width modulation) signal, pressing conversion module 150 to start according to input voltage value control synchronization lifting boosts or the step-down or the back step-down of boosting earlier, and the output voltage and the output current that obtain according to output voltage sampling module 130 and output current sampling module 140, the operation pid algorithm is controlled the output voltage and the output current of described synchronization lifting pressure device.
Because the pwm signal of MCU microcontroller 110 outputs is more weak, the present invention has adopted the pwm signal of 160 pairs of MCU microcontrollers of driver module, 110 outputs to amplify, and presses conversion module 150 work thereby drive synchronization lifting.Described driver module 160 is connected on MCU microcontroller 110 and synchronization lifting is pressed between the conversion module 150.
See also Fig. 2, it is the synchronous translation circuits of full-bridge that connected and composed by the first metal-oxide-semiconductor Q1, the second metal-oxide-semiconductor Q2, the 3rd metal-oxide-semiconductor Q3 and the 4th metal-oxide-semiconductor Q4 that described synchronization lifting is pressed conversion module 150.These four metal-oxide-semiconductors are the main on-off action that rises in circuit, and the synchronous translation circuit of being made up of metal-oxide-semiconductor of full-bridge, and the pressure drop of its conducting is little, and the reaction speed of its buck is fast, and has reduced the loss of circuit.
Described synchronization lifting presses conversion module 150 to comprise synchronous buck module 151 and synchronous boost module 152, and described synchronous buck module 151 is made of the first metal-oxide-semiconductor Q1 and the 3rd metal-oxide-semiconductor Q3, and synchronous boost module 152 is by the second metal-oxide-semiconductor Q2 and the 4th metal-oxide-semiconductor Q4.
Wherein, described first metal-oxide-semiconductor Q1 and the 3rd metal-oxide-semiconductor Q3 adopt P to link up metal-oxide-semiconductor, and the second metal-oxide-semiconductor Q2 and the 4th metal-oxide-semiconductor Q4 adopt the N-channel MOS pipe.
Please continue to consult Fig. 2, described driver module 160 also comprises first driver module 161 and second driver module 162; The first input end of described first driver module 161 is connected first output and second output of MCU microcontroller 110 with second input, first output of first driver module 161 connects the grid of the first metal-oxide-semiconductor Q1, second output connects the grid of the 3rd metal-oxide-semiconductor Q3, the source electrode of the described first metal-oxide-semiconductor Q1 connects described input port VIN, drain electrode connects the drain electrode of the 3rd metal-oxide-semiconductor Q3, and the source electrode of the 3rd metal-oxide-semiconductor connects output current sampling module 140; This first driver module 161 is used for the pwm signal of MCU microcontroller 110 outputs is amplified, and drives the first metal-oxide-semiconductor Q1 and the 3rd metal-oxide-semiconductor Q3, controls the break-make of these two metal-oxide-semiconductors.
The first input end of described second driver module 162 is connected the 3rd output and the 4th output of MCU microcontroller 110 with second input, first output of described second driver module 162 connects the grid of the described second metal-oxide-semiconductor Q2, second output connects the grid of described the 4th metal-oxide-semiconductor Q4, the source electrode of the described second metal-oxide-semiconductor Q2 connects described output port VOUT, drain electrode connects the drain electrode of the 4th metal-oxide-semiconductor Q4, and the source electrode of the 4th metal-oxide-semiconductor Q4 connects output current sampling module 140; This second driver module 162 is used for the pwm signal of MCU microcontroller 110 outputs is amplified, and drives the second metal-oxide-semiconductor Q2 and the 4th metal-oxide-semiconductor Q4, thus the break-make of control metal-oxide-semiconductor Q2 and Q4.
In order to prevent that metal-oxide-semiconductor from burning out, so the conducting simultaneously of above-mentioned four metal-oxide-semiconductors, in the present embodiment, described synchronization lifting presses conversion module 150 also to comprise the first diode D1 and the second diode D2; The anode of the described first diode D1 connects the drain electrode of the second metal-oxide-semiconductor Q2, and the negative electrode of the first diode D1 connects the source electrode of the second metal-oxide-semiconductor Q2; The anode of the described second diode D2 connects the drain electrode of the 3rd metal-oxide-semiconductor Q3, and the negative electrode of the second diode D2 connects the source electrode of the 3rd metal-oxide-semiconductor Q3.
In the present embodiment, the described first diode D1 and the second diode D2 mainly play shunting and afterflow effect.Prevent the first metal-oxide-semiconductor Q1 and the 3rd metal-oxide-semiconductor Q3, and the second metal-oxide-semiconductor Q2 and the 4th metal-oxide-semiconductor Q4 conducting simultaneously, thereby realize the buck seamless switching.
Wherein, described synchronization lifting is pressed in the conversion module and also is provided with an inductance L 1, this inductance L 1 mainly plays the accumulation of energy effect, one end of described inductance L 1 is connected with the drain electrode of the first metal-oxide-semiconductor Q1 and the drain electrode of the 3rd metal-oxide-semiconductor Q3 respectively, and the other end of inductance L 1 is connected with the drain electrode of the second metal-oxide-semiconductor Q2 and the drain electrode of the 4th metal-oxide-semiconductor Q4 respectively.
When the detection of synchronization lifting pressure device needs step-down, the first metal-oxide-semiconductor Q1 conducting of MCU microprocessor controls, the 3rd metal-oxide-semiconductor turn-off, electric current through inductance L 1, to inductance L 1 charging with loading to, MCU microprocessor controls first metal-oxide-semiconductor Q1 shutoff then, the 3rd metal-oxide-semiconductor conducting, by inductance L 1 discharge, electric current flows to the 3rd metal-oxide-semiconductor Q3 again through loading to ground.
When the detection of synchronization lifting pressure device need be boosted, the first metal-oxide-semiconductor Q1 conducting of MCU microprocessor controls, the 3rd metal-oxide-semiconductor turn-off, electric current passes through inductance L 1, the 4th metal-oxide-semiconductor Q4, gives inductance L 1 charging with loading to, discharge by voltage L1 then, close the 4th metal-oxide-semiconductor, and make the second metal-oxide-semiconductor conducting powering load.
A kind of synchronization lifting pressure device provided by the invention, press conversion module to boost or step-down by the input voltage startup synchronization lifting that the input voltage sampling module obtains, or the back step-down of boosting earlier, press conversion module to realize boosting and the synchronous conversion of step-down by synchronization lifting according to the pwm signal of MCU microcontroller output, its reaction speed is fast, and the output voltage and the output current that obtain respectively according to output voltage sampling module and output current sampling module, the control synchronization lifting is pressed conversion module output correspondent voltage and electric current, satisfies the power demands of portable equipment.
See also Fig. 3, the circuit diagram of an Application Example of the synchronization lifting pressure device that it provides for the embodiment of the invention.As shown in the figure, described MCU microcontroller employing model is integrated chip U4 or other chip with this function of AT90PWM3.The PWM1 signal output pin of this MCU microcontroller is connected first driver module respectively with PWM2 signal output pin, and PWM3 signal output pin is connected second driver module respectively with PWM4 signal output pin.
The amplifying circuit that described first driver module and second driver module are connected and composed by at least two triodes, pwm signal can be put into enough big, thereby can make the quick conducting of metal-oxide-semiconductor Q27, Q28, Q33 and Q34 and end.
The output current sampling module, input voltage sampling module and the output voltage sampling module that adopt because of present embodiment are prior art, give unnecessary details no longer one by one herein.
Substantially above-mentioned synchronization lifting pressure device, the embodiment of the invention are also corresponding to provide a kind of this synchronization lifting pressure device that adopts to realize the method that synchronization lifting is pressed, and sees also Fig. 4, and described method may further comprise the steps:
In step S101: the pwm signal of being exported 4 groups of complementations by the MCU microcontroller sends to synchronization lifting pressure conversion module;
In step S102: the pwm signal of described MCU microcontroller being exported by driver module carries out the amplification of driving force;
In step S103: obtain input voltage, output voltage and output current respectively in real time by input voltage sampling module, output voltage sampling module and output current sampling module, and feed back to the MCU microcontroller;
In step S104:, start synchronization lifting and press conversion module to boost or the step-down or the back step-down of boosting earlier by the input voltage that described MCU microcontroller obtains according to described input voltage sampling module; Simultaneously, press conversion module output correspondent voltage and electric current by described MCU microcontroller according to output voltage and output current value control synchronization lifting that described output voltage sampling module and output current sampling module obtain.
Wherein, described synchronization lifting presses conversion module to be made of synchronous boost conversion module and the series connection of synchronous buck conversion module, in step S101: export first group and second group of pwm signal by the MCU microcontroller and send to the synchronous buck module, export the 3rd group and the 4th group of pwm signal by the MCU microcontroller and send to the synchronous boost module.
Wherein, described MCU control module is according to the output voltage and the output current value of output voltage sampling module and the acquisition of output current sampling module, adopt pid algorithm to calculate the output voltage and the electric current of synchronization lifting pressure device, and control corresponding output correspondent voltage of synchronous converting means and electric current.
In sum, the method that a kind of synchronization lifting pressure device provided by the invention and realization synchronization lifting thereof are pressed, press conversion module to boost or step-down by the input voltage startup synchronization lifting that the input voltage sampling module obtains, or the back step-down of boosting earlier, only need to press conversion module to realize boosting and the synchronous conversion of step-down according to the pwm signal of MCU microcontroller output by synchronization lifting, its reaction speed is fast, output voltage and the output current that obtains respectively by output voltage sampling module and output current sampling module simultaneously, the control synchronization lifting is pressed conversion module output correspondent voltage and current value, satisfies the power demands of portable equipment.
The method that a kind of synchronization lifting pressure device provided by the invention and realization synchronization lifting thereof are pressed, its buck process is sent synchronous pwm signal by the MCU microcontroller fully and is controlled, adopted the platform of pure digi-tal, its peripheral components is (capability of fast response of digital power can also reduce the requirement to output filter capacitor) seldom, it is few to account for the plate area, has simplified to manufacture and design flow process; And the ability of the automatic diagnosis of digital platform, adjusting, make debugging and maintenance work become light, extensibility is good with repeatability, simultaneously, intelligently voltage boosting and step-down handoff technique have also been adopted, realized boosting and the step-down seamless switching, but also adopted pid algorithm control output voltage and electric current, dynamic response characteristic is good.
Synchronization lifting pressure device provided by the invention can be widely used in requirement high efficiency (more than 98%), change in voltage wide ranges (0-60V), the buck-boost type DC/DC power supply and the battery charge field of big electric current output (0-40A), for this application provides a kind of reliability height, low cost solution.
Be understandable that, for those of ordinary skills, can be equal to replacement or change according to technical scheme of the present invention and inventive concept thereof, and all these changes or replacement all should belong to the protection range of the appended claim of the present invention.
Claims (9)
1. synchronization lifting pressure device, it comprises the MCU microcontroller that is used for output pwm signal; It is characterized in that, also comprise:
Be used for the real-time input voltage sampling module that input voltage is sampled;
Be used for the real-time output voltage sampling module that output voltage is sampled;
Be used for the real-time output current sampling module that output current is sampled;
Be used for boosting and the synchronization lifting of decompression transformation is pressed conversion module according to input voltage value;
Described MCU microcontroller also is used for the output voltage and the output current that obtain according to output voltage sampling module and output current sampling module, controls output voltage and output current that described synchronization lifting is pressed conversion module;
Described MCU microcontroller presses conversion module to be connected with input voltage sampling module, output voltage sampling module, output current sampling module and synchronization lifting respectively; Described input voltage sampling module connects the input port of described synchronization lifting pressure device, and the output voltage sampling module connects described synchronization lifting pressure device output port; Described synchronization lifting presses conversion module to be connected with described input port, output port and output current sampling module respectively.
2. synchronization lifting pressure device according to claim 1 is characterized in that, also comprises being used for driver module that described pwm signal is amplified, and described driver module is connected on the MCU microcontroller and synchronization lifting is pressed between the conversion module.
3. synchronization lifting pressure device according to claim 2 is characterized in that, it is the synchronous translation circuit of full-bridge that is connected and composed by first metal-oxide-semiconductor, second metal-oxide-semiconductor, the 3rd metal-oxide-semiconductor and the 4th metal-oxide-semiconductor that described synchronization lifting is pressed conversion module; Wherein: first metal-oxide-semiconductor and the 3rd metal-oxide-semiconductor constitute the synchronous buck module, and second metal-oxide-semiconductor and the 4th metal-oxide-semiconductor constitute the synchronous boost module.
4. synchronization lifting pressure device according to claim 3 is characterized in that, described driver module comprises first driver module and second driver module; The first input end of described first driver module is connected first output and second output of MCU microcontroller with second input, first output of first driver module connects the grid of first metal-oxide-semiconductor, and second output connects the grid of the 3rd metal-oxide-semiconductor; The first input end of described second driver module is connected the 3rd output and the 4th output of MCU microcontroller with second input, first output of described second driver module connects the grid of described second metal-oxide-semiconductor, and second output connects the grid of described the 4th metal-oxide-semiconductor.
5. synchronization lifting pressure device according to claim 4 is characterized in that, described synchronization lifting presses conversion module to comprise first diode and second diode; The anode of described first diode connects the drain electrode of second metal-oxide-semiconductor, and the negative electrode of first diode connects the source electrode of second metal-oxide-semiconductor; The anode of described second diode connects the drain electrode of the 3rd metal-oxide-semiconductor, and the negative electrode of second diode connects the source electrode of the 3rd metal-oxide-semiconductor.
6. synchronization lifting pressure device according to claim 4, it is characterized in that, described synchronization lifting presses conversion module to comprise inductance, one end of described inductance is connected with the drain electrode of first metal-oxide-semiconductor and the drain electrode of the 3rd metal-oxide-semiconductor respectively, and the other end of inductance is connected with the drain electrode of second metal-oxide-semiconductor and the drain electrode of the 4th metal-oxide-semiconductor respectively.
7. one kind is adopted the described synchronization lifting pressure device of claim 1 to realize the method that synchronization lifting is pressed, and it is characterized in that described method may further comprise the steps:
The pwm signal of being exported 4 groups of complementations by the MCU microcontroller sends to synchronization lifting pressure conversion module;
Obtain input voltage, output voltage and output current respectively in real time by input voltage sampling module, output voltage sampling module and output current sampling module, and feed back to the MCU microcontroller;
By the input voltage that described MCU microcontroller obtains according to described input voltage sampling module, start synchronization lifting and press conversion module to boost or the step-down or the back step-down of boosting earlier; Simultaneously, by output voltage and the output current value that described MCU microcontroller obtains according to described output voltage sampling module and output current sampling module, the control synchronization lifting is pressed conversion module output correspondent voltage and electric current.
8. method according to claim 7 is characterized in that, after the described pwm signal of being exported 4 groups of complementations by the MCU microcontroller sent to the step of synchronization lifting pressure conversion module, described method further comprised:
The pwm signal of described MCU microcontroller being exported by driver module carries out the amplification of driving force.
9. method according to claim 7 is characterized in that, described synchronization lifting is pressed the voltage and current of conversion module output, adopts pid algorithm to calculate by described MCU control module.
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| CN102404920A (en) * | 2011-12-03 | 2012-04-04 | 南京普天大唐信息电子有限公司 | Intelligent constant-current power supply device capable of adjusting output current |
| CN102404921A (en) * | 2011-12-03 | 2012-04-04 | 南京普天大唐信息电子有限公司 | Output current adjustable intelligent constant current power supply device |
| CN102999072A (en) * | 2012-11-27 | 2013-03-27 | 南京普天大唐信息电子有限公司 | Intelligent power supply system capable of quickly adjusting output current/voltage in wide range |
| CN106452054A (en) * | 2016-12-26 | 2017-02-22 | 上海展枭新能源科技有限公司 | Buck-boost DC/DC converter and buck-boost control method thereof for circuit system |
| CN106899205A (en) * | 2015-12-18 | 2017-06-27 | 英飞凌科技美国公司 | Current sense in power supply |
| CN107769550A (en) * | 2016-08-19 | 2018-03-06 | 北京计算机技术及应用研究所 | A kind of two-way redundant parallel synchro switch buck DC D/C powers |
| CN112467983A (en) * | 2020-12-16 | 2021-03-09 | 上海空间电源研究所 | Control circuit based on buck-boost synchronous regulator |
| WO2022141551A1 (en) * | 2020-12-30 | 2022-07-07 | Tcl华星光电技术有限公司 | Voltage stabilizing circuit, voltage stabilizing method, charging circuit, and electronic device |
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| CN102404920A (en) * | 2011-12-03 | 2012-04-04 | 南京普天大唐信息电子有限公司 | Intelligent constant-current power supply device capable of adjusting output current |
| CN102404921A (en) * | 2011-12-03 | 2012-04-04 | 南京普天大唐信息电子有限公司 | Output current adjustable intelligent constant current power supply device |
| CN102404921B (en) * | 2011-12-03 | 2014-01-01 | 南京普天大唐信息电子有限公司 | Output current adjustable intelligent constant current power supply device |
| CN102999072A (en) * | 2012-11-27 | 2013-03-27 | 南京普天大唐信息电子有限公司 | Intelligent power supply system capable of quickly adjusting output current/voltage in wide range |
| CN106899205A (en) * | 2015-12-18 | 2017-06-27 | 英飞凌科技美国公司 | Current sense in power supply |
| CN106899205B (en) * | 2015-12-18 | 2020-07-03 | 英飞凌科技美国公司 | Current sensing in a power supply |
| CN107769550A (en) * | 2016-08-19 | 2018-03-06 | 北京计算机技术及应用研究所 | A kind of two-way redundant parallel synchro switch buck DC D/C powers |
| CN106452054A (en) * | 2016-12-26 | 2017-02-22 | 上海展枭新能源科技有限公司 | Buck-boost DC/DC converter and buck-boost control method thereof for circuit system |
| CN112467983A (en) * | 2020-12-16 | 2021-03-09 | 上海空间电源研究所 | Control circuit based on buck-boost synchronous regulator |
| CN112467983B (en) * | 2020-12-16 | 2022-04-22 | 上海空间电源研究所 | Control circuit based on buck-boost synchronous regulator |
| WO2022141551A1 (en) * | 2020-12-30 | 2022-07-07 | Tcl华星光电技术有限公司 | Voltage stabilizing circuit, voltage stabilizing method, charging circuit, and electronic device |
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