CN101988648B - 背光单元及使用该背光单元的液晶显示器 - Google Patents
背光单元及使用该背光单元的液晶显示器 Download PDFInfo
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Abstract
本发明公开一种背光单元及使用该背光单元的液晶显示器。该背光单元包括:包括一个或多个发光二极管(LED)芯片的LED封装;光源PCB,其安装LED封装的底部的一侧或者LED封装的底部的两侧;底盖,其在光源PCB的下方支撑光源PCB,并且具有压纹部分,所述压纹部分朝向LED封装凸起并具有与LED封装的未安装在光源PCB上的底部对应的尺寸;以及散热材料,其填充在LED封装的底部和压纹部分之间。
Description
本申请要求2009年8月3日提交的韩国专利申请No.10-2009-0071188的优先权,在此援引该专利申请作为参考,就好像在本文中完全阐述一样。
技术领域
本发明涉及一种能够改善散热性能的背光单元及使用该背光单元的液晶显示器。
背景技术
液晶显示器(LCD)由于它的轻重量、薄外形、低功耗驱动等优势已经得到了广泛地应用。这样的LCD已经被用作诸如笔记本式个人电脑的便携式计算机、办公自动化设备、音频/视频设备、室内/室外广告显示设备等。占据大部分LCD市场的透射式LCD通过根据数据电压控制施加到LC层的电场来调节来自背光单元的光,由此显示图像。
作为背光单元的光源,人们已经提出用具有低功耗、轻重量和高亮度的优点的发光二极管(LED)替代诸如冷阴极荧光灯(CCFL)的荧光灯。
LED具有诸如小尺寸、清晰发光、良好初始驱动、防震以及在经常发生的开灯/关灯状态下的强稳定性能等的良好特性。近些年来,随着发射白光的白色LED的出现,LED的应用领域从电子产品的指示器扩展到了家用电器、广告面板等。此外,因为LED封装的高效率,LED替代荧光灯被应用于街灯、汽车的照明灯和全面照明光源。
对于施加给LED封装的能量,大约15%的能量转换成光,而大约85%的能量作为热量被消耗。随着PN结产生的热变多,LED封装的效率和寿命降低。因此,高效率和高亮度的LED封装需要对LED芯片产生的热进行驱散的散热设计。
如图1中所示,LED封装1焊接在一般比较昂贵的金属PCB(印刷电路板)2上来进行散热。金属PCB 2具有这样一种结构,在该结构中,树脂层2B、铜层2C和防焊层堆叠在铝金属基板2A上。树脂层2B起到将存在电流流动的铜层2C与下方的金属基板2A电性隔离的作用,并且还起到在铜层2C和下方的金属基板2A之间形成传热路径的作用。LED封装1产生的热首先传递到铜层2C,接着通过树脂层2B传递到下方的金属基板2A。传递到金属基板2A的热通过与背光单元附接的散热垫3传递到背光单元的底盖4。底盖4占据相当大的面积,从而能够有效地起到主散热板的作用。
但是,如从前述传热过程中可以看到的,在现有技术中,传热路径是复杂的,并且特别的是,因为树脂层和散热垫具有比金属低的热导率,传热效率非常低。这样,在现有技术中,存在对改善LED封装的散热特性的限制。
发明内容
本发明的实施方式提供了一种能够改善发光二极管(LED)封装的散热特性的背光单元及使用该背光单元的液晶显示器。
根据本发明的示例性实施方式,提供了一种背光单元,其包括:包括一个或多个发光二极管LED芯片的LED封装;光源PCB,其安装LED封装的底部的一侧或者LED封装的底部的两侧;底盖,其在光源PCB的下方支撑光源PCB,并且具有压纹部分,所述压纹部分朝向LED封装凸起并具有与LED封装的未安装在光源PCB上的底部对应的尺寸;以及散热材料,其填充在LED封装的底部和压纹部分之间。
压纹部分的厚度可以与光源PCB的厚度成比例。
当LED封装的底部的两侧都安装在光源PCB上时,在光源PCB中形成孔,以待填充散热材料。
当LED封装的底部的一侧安装在光源PCB上时,LED封装的未被安装的另一侧由散热材料支撑。
散热材料通过焊接或粘贴的方式填充。
LED封装还包括与LED芯片连接的齐纳二极管。
此外,根据本发明的示例性实施方式,提供了一种液晶显示器,其包括:液晶显示面板;以及给液晶显示面板提供光的背光单元,其中所述背光单元包括:包括一个或多个发光二极管(LED)芯片的LED封装;光源PCB,其安装LED封装的底部的一侧或者LED封装的底部的两侧;底盖,其在光源PCB的下方支撑光源PCB,并且具有压纹部分,所述压纹部分朝向LED封装凸起并与LED封装的未安装在光源PCB上的底部对应的尺寸;以及散热材料,其填充在LED封装的底部和压纹部分之间。
附图说明
所包含的附图用于提供对本发明的进一步理解,其并入本申请中组成本申请的一部分,附图图示了本发明的实施方式,并与说明书一起用于解释本发明的原理。
在附图中:
图1是示出根据现有技术的从LED封装到底盖的传热路径的截面图;
图2和图3是示出根据本发明第一实施方式的背光单元的散热结构的视图;
图4和图5是示出根据本发明第二实施方式的背光单元的散热结构的视图;
图6是包括根据本发明第一实施方式的背光单元的液晶显示器的截面图;以及
图7是包括根据本发明第二实施方式的背光单元的液晶显示器的截面图。
具体实施方式
在下文中,将参照图2到图7对本发明的示例性实施方式进行描述。
图2和图3是示出根据本发明第一实施方式的背光单元的散热结构的视图。
参照图2和图3,根据第一实施方式的背光单元60包括LED封装10、光源PCB 20和底盖30。
LED封装10产生光。LED封装10包括封装体14、一个或多个LED芯片11和齐纳二极管17、阴极引线框15和阳极引线框16。LED芯片11和齐纳二极管17安装在封装体14的上表面的凹陷部分中。LED芯片11的阴极电极通过导线12与阴极引线框15连接,而LED芯片11的阳极电极通过导线12与阳极引线框16连接。齐纳二极管17通过导线12与LED芯片11连接,并阻止静电进入LED芯片11,以保护LED芯片11免受静电的影响。
阴极引线框15和阳极引线框16作为彼此分开的金属图案形成在封装体14的下表面上。可用相同的金属对阴极引线框15和阳极引线框16图案化。
LED封装的上表面的凹陷部分填充有树脂13。树脂13透射LED芯片11所产生的可见光,并保护LED芯片11、齐纳二极管17和导线12免受湿气和氧气的影响。树脂13可以包括荧光材料。
此LED封装10可以利用表面贴装技术(SMT)直接地安装在光源PCB 20上。
光源PCB 20具有这样一种结构,在该结构中,树脂层22、铜层23和防焊层堆叠在基础基板21上。基础基板21可以由FR4(阻燃剂合成物4)或者CEM 3构成。另外,基础基板21可以由包含铝的金属材料构成。基础基板21还可以包括金属条。树脂层22起到将存在电流流动的铜层与下方的基础基板21电性隔离的作用,并且还起到在铜层23和下方的基础基板21之间形成传热路径的作用。树脂层22具有大约0.4到2.2W/mk的热导率,它与金属相比相当的低。为了使散热结构有效,需要减小树脂层22的厚度。但是,因为树脂层22起到牢固地结合基础基板21和铜层23以及减小两个层21和23中的应力的作用,所以把树脂层22的厚度减小到顺利传热的程度是困难的。因此,本发明的实施方式通过在与LED封装10的底部对应的部分区域上形成孔而使底盖30暴露。此外,利用焊接或粘贴的方式将散热材料40填充在LED封装10的底部与底盖30之间。因此,简化了通往底盖30的传热路径,因而大幅提高了传热效率。
给LED封装10供电的电路图案设置在光源PCB 20上,并且防焊剂涂覆在这些电路图案上。多个连接器(未示出)可以安装在光源PCB 20上。安装在光源PCB 20上的连接器通过FPC(柔性印刷电路板)或FFC(柔性扁平线缆)与安装有LED驱动电路的PCB的连接器连接,并通过电路图案把来自驱动电路的电力提供给LED封装10。光源PCB 20可以附接到底盖30,使它的下表面面对底盖30。光源PCB 20可以通过已知的散热垫附接到底盖,或者可以通过诸如焊接、粘合剂、螺钉、吊钩等的各种连接方法附接到底盖30。在光源PCB 20和底盖30之间不需要额外的散热器。
底盖30可以利用铝或铝合金制造。底盖30包括压纹部分32,该压纹部分32朝向LED封装10凸起,且压纹部分具有与光源PCB 20的孔形成区域对应的尺寸X1。压纹部分32的凸起高度D1可以根据光源PCB 20的厚度变化。当光源PCB 20变厚时,填充孔的散热材料40的量增加。因此,填充孔的散热材料40的量可以通过增加凸起高度D1而减小。散热材料40的热导率比树脂层22的好,但是比金属的差。因此,在使用厚的光源PCB 20来防止弯曲和方便SMT工艺时,通过利用压纹部分32来减小散热材料40所填充的间距D2是很重要的。同时,底盖30可以接地。
图4和图5示出了根据本发明第二实施方式的背光单元的散热结构。
参照图4和图5,根据第二实施方式的背光单元160包括LED封装110、光源PCB 120和底盖130。
LED封装110与图2中的安装在如图3中所示的光源PCB 20中部的LED封装10的区别在于,LED封装110的仅仅一部分安装在光源PCB 120的一侧上,如图5中所示。LED封装110的没有安装在光源PCB 120上的剩余部分由散热材料140支撑,散热材料通过焊接等形成在底盖130的压纹部分132上。LED封装110的结构和功能基本上与图2中的LED封装10的相同。
光源PCB 120与图2和3中的光源PCB 20的区别在于宽度比光源PCB 20的小。换句话说,因为LED封装110的底部的一部分安装在光源PCB 120上,所以与图3中的光源PCB 20的宽度Y1相比,图5中的光源PCB 120的宽度Y2减小了一半或者更多。以这种方式减小光源PCB 120的尺寸能够节约制造成本。光源PCB 120的结构和功能基本上与光源PCB 20的相同。
底盖130与图2中的底盖30的区别在于形成压纹部分132时的大的设计余量。压纹部分132的尺寸X2比图2中的压纹部分32的X1大。与图2中的取决于孔尺寸的压纹部分32相比,该压纹部分132可以自由地扩展为更大的尺寸。压纹部分132的凸起高度可以根据光源PCB 120的厚度按照与图2中的压纹部分32相同的方式变化。
散热材料140不通过树脂层和散热垫而直接地向底盖130传热。因此,传热路径简单,且传热效率大幅提高。
图6示出了包括根据本发明第一实施方式的背光单元的LCD。
参照图6,LCD包括LC显示面板80、向LC显示面板80提供光的边缘型背光单元60、以及集成支撑LC显示面板80和背光单元60的引导和外壳构件。
LC显示面板80具有夹在两个玻璃基板之间的LC层。多条数据线和多条栅极线设置成在LC显示面板80的下玻璃基板上互相交叉。LC单元以矩阵形式布置在LC显示面板80上的数据线和栅极线的交叉处。LC显示面板80的下玻璃基板设置有数据线、栅极线、TFT(薄膜晶体管)、与TFT连接的LC单元的像素电极以及存储电容器。LC显示面板80的上玻璃基板设置有黑矩阵和滤色器。在诸如TN(扭曲向列)模式和VA(垂直取向)模式的垂直电场驱动类型中,公共电极设置在上玻璃基板上;在诸如IPS(面内切换)模式和FFS(边缘场切换)模式的水平电场类型中,公共电极与像素电极一起设置在下玻璃基板上。偏振器分别附接到LC显示面板80的下玻璃基板和上玻璃基板的外表面。另外,取向层形成在与LC层接触的内表面上以设置LC层的预倾角。
除了图2中的结构之外,背光单元60还包括侧面面对LED封装10的导光板54、设置在导光板54和底盖30之间的反射膜52、以及设置在导光板54和LC显示面板80之间的多个光学片56。
导光板54将LED封装10发出的光转换成面光源,以导入LC显示面板80。导光板54的上表面、下表面或者这两个表面形成有微小的凹刻图案(或者压纹图案),这些图案使光的传播路径朝向LC显示面板80。微小的凹刻/压纹图案越远离LED封装10,越密集地布置,从而对低亮度进行补偿以使表面的亮度均匀。
反射膜52附接在导光板54的背面。反射膜52通过使朝向导光板54传播的光束朝向LC液晶面板80反射而起到降低光损耗的作用。
光学片56包括一个或多个棱镜片和一个或多个散射片,光学片对来自导光板54的光束进行散射,并使光束的传播路径以基本上与LC显示面板80的光入射平面垂直的角度折射。光学片56可以包括DBEF(双增亮膜)。
引导和外壳构件包括导板70和顶壳90。
导板70被制造成四角形框架,其由包含玻璃纤维的诸如碳酸聚酯的合成树脂构成,并且导板70围绕LC显示面板80和边缘型背光单元。凸起的阶梯部分设置在导板70的内壁上,LC显示面板80布置在阶梯部分上,而导光板54和光学片56布置在该阶梯部分的下方。
顶壳90被制造成四角形框架,其由金属构成,并且顶壳90围绕LC显示面板80的上边缘(或边框区域)和导板70的边缘。顶壳90的侧壁、导板70的侧壁和底盖30的侧壁互相重叠,并且能够通过在重叠部分处贯通90、70和30的螺钉而互相连接。
图7示出了包括根据本发明第二实施方式的背光单元的LCD。
参照图7,LCD包括LC显示面板180、向LC显示面板180提供光的边缘型背光单元160、以及集成支撑LC显示面板180和背光单元160的引导和外壳构件。
LC显示面板180基本上与图6中的LC显示面板80相同,且引导和外壳构件基本上与图6中的相同。除了参照图4和5描述了的那些区别之外,背光单元160基本上与图6中的背光单元60相同。
如上所述,根据本发明实施方式的背光单元及使用该背光单元的LCD能够使LED封装与底盖之间的传热路径简单,从而改善LED封装的散热特性。
前述实施方式和优点仅是示例性的,并不能认为是对本发明的限制。本说明书的教导能够容易地应用到其他类型的装置。对前述实施方式的描述是示例性的,并不是对权利要求书保护范围的限制。对所属领域的技术人员而言,很多变型、修改和变化将是显而易见的。
Claims (10)
1.一种背光单元,包括:
包括一个或多个发光二极管(LED)芯片的LED封装;
光源PCB,其中所述LED封装的底部的一侧或者所述LED封装的底部的两侧安装在所述光源PCB上;
底盖,其在所述光源PCB的下方支撑所述光源PCB,并且具有压纹部分,所述压纹部分朝向所述LED封装凸起并且具有与所述LED封装的未安装在所述光源PCB上的底部对应的尺寸;以及
散热材料,其填充在所述LED封装的底部和所述压纹部分之间。
2.根据权利要求1所述的背光单元,其中,在所述LED封装的底部的两侧都安装在所述光源PCB上时,在所述光源PCB中形成有孔,以待填充所述散热材料。
3.根据权利要求2所述的背光单元,其中,填充所述孔的散热材料的量通过增加所述压纹部分的凸起高度而减小。
4.根据权利要求1所述的背光单元,其中,在所述LED封装的底部的一侧安装在所述光源PCB上时,所述LED封装的未被安装的另一侧由所述散热材料支撑。
5.根据权利要求1所述的背光单元,其中,所述散热材料通过焊接或粘贴的方式填充。
6.根据权利要求1所述的背光单元,其中,所述LED封装还包括与所述LED芯片连接的齐纳二极管。
7.一种液晶显示器,包括:
液晶显示面板;以及
给所述液晶显示面板提供光的背光单元,
其中,所述背光单元包括:
包括一个或多个发光二极管(LED)芯片的LED封装;
光源PCB,其中所述LED封装的底部的一侧或者所述LED封装的底部的两侧安装在所述光源PCB上;
底盖,其在所述光源PCB的下方支撑所述光源PCB,并且具有压纹部分,所述压纹部分朝向所述LED封装凸起并具有与所述LED封装的未安装在所述光源PCB上的底部对应的尺寸;以及
散热材料,其填充在所述LED封装的底部和所述压纹部分之间。
8.根据权利要求7所述的液晶显示器,其中,在所述LED封装的底部的两侧都安装在所述光源PCB上时,在所述光源PCB中形成有孔,以待填充所述散热材料。
9.根据权利要求8所述的液晶显示器,其中,填充所述孔的散热材料的量通过增加所述压纹部分的凸起高度而减小。
10.根据权利要求7所述的液晶显示器,其中,在所述LED封装的底部的一侧安装在所述光源PCB上时,所述LED封装的未被安装的另一侧由所述散热材料支撑。
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KR20110013640A (ko) | 2011-02-10 |
KR101301317B1 (ko) | 2013-08-29 |
CN101988648A (zh) | 2011-03-23 |
US8687142B2 (en) | 2014-04-01 |
US20110025944A1 (en) | 2011-02-03 |
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