CN101976662B - Output-end fan-out type flip-chip packaging structure without baseplate - Google Patents
Output-end fan-out type flip-chip packaging structure without baseplate Download PDFInfo
- Publication number
- CN101976662B CN101976662B CN 201010293878 CN201010293878A CN101976662B CN 101976662 B CN101976662 B CN 101976662B CN 201010293878 CN201010293878 CN 201010293878 CN 201010293878 A CN201010293878 A CN 201010293878A CN 101976662 B CN101976662 B CN 101976662B
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- China
- Prior art keywords
- pad
- packaging structure
- chip
- out type
- type flip
- Prior art date
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 13
- 239000000758 substrate Substances 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 9
- 239000000206 moulding compound Substances 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000011347 resin Substances 0.000 abstract description 13
- 229920005989 resin Polymers 0.000 abstract description 13
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000008901 benefit Effects 0.000 abstract description 3
- 238000000465 moulding Methods 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000003466 welding Methods 0.000 abstract 2
- 239000000945 filler Substances 0.000 abstract 1
- 239000011888 foil Substances 0.000 abstract 1
- 239000004033 plastic Substances 0.000 abstract 1
- 229920003023 plastic Polymers 0.000 abstract 1
- 229920002120 photoresistant polymer Polymers 0.000 description 8
- 238000005538 encapsulation Methods 0.000 description 5
- 229940126214 compound 3 Drugs 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000001259 photo etching Methods 0.000 description 2
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
Landscapes
- Wire Bonding (AREA)
Abstract
The invention relates to an output-end fan-out type flip-chip packaging structure without a baseplate, which belongs to the field of semiconductor packaging and is characterized by comprising a flip chip (1), a flip-chip salient point (2), molding plastics (3), a bottom filler (4), a Cu welding pad (5) and a welding ball (6). In the invention, a Cu plate (foil) is mainly adopted for replacing a traditional general BT resin (Bismaleimide-Triazine Resin) baseplate to realize rewiring and internal and external interconnection, and the packaging structure saves the manufacture of the baseplate, lowers the production cost and has remarkable production and social benefit.
Description
Technical field
The present invention relates to the semiconductor packages field, especially a kind of output fan-out type flip chip packaging structure that does not have substrate.
Background technology
Welded ball array (BGA) or pad array (LGA) encapsulation are relatively more novel at present packaged types, and its main characteristic is that the element after the encapsulation is accomplished assembling through soldered ball on the substrate or pad.The flip chip interconnects technology is a kind of present advanced person's a interconnection technique, adopts welded ball array (perhaps pad array) encapsulation becoming the usually FC-BGA (perhaps FC-LGA) of flip chip interconnects.Output fan-in type (Fan-in) structure that traditional FC-BGA (perhaps FC-LGA) adopts; Along with the fan-out of packaged chip is more and more; The pitch of the output of BGA (perhaps LGA) encapsulation is more and more littler; Brought the difficulty of element assembling, simultaneously because the dimension shrinks of soldered ball has also been brought the integrity problem of postorder; Traditional FC-BGA (perhaps FC-LGA) encapsulation all is to adopt the interconnection with the inside and outside that realizes connecting up again of bismaleimide-triazine resin (BT Resin) substrate, yet substrate accounts for a big chunk of packaging cost.
Summary of the invention
The invention reside in provides a kind of chip scale package structure that does not have output fan-out type (Fan-out) flip-chip of substrate, adopts Cu plate (paper tinsel) to replace the interconnection with the inside and outside that realizes connecting up again of bismaleimide-triazine resin (BT Resin) substrate of traditional common.
In order to achieve the above object, technology of the present invention comprises:
Flip-chip 1, flipchip-bumped 2, moulding compound 3 and underfill material 4; It is characterized in that, also comprise Cu pad 5, the upper surface of said a part of Cu pad 5 links to each other with the salient point 2 at corresponding two ends, flip-chip bottom surface; The upper surface of the Cu pad 5 between the two ends, bottom surface links to each other with the bottom surface of said underfill material 4; All the other are positioned at the Cu pad 5 of the fan out in the flip-chip outside, and its upper surface links to each other with the bottom surface of said moulding compound 3, all is implanted with soldered ball 6 on the bottom surface of all said Cu pads 5.
The main advantage of output fan-out type flip-chip welded ball array (pad array) encapsulating structure of this no substrate is: adopt Cu plate (paper tinsel) to replace the interconnection with the inside and outside that realizes connecting up again of bismaleimide-triazine resin (BT Resin) substrate of traditional common; At first saved the manufacturing of substrate layer; Greatly reduce production cost, the production obvious social benefit; Next adopts fan-out type structure to make the size of soldered ball (perhaps pad) and pitch become big, for the assembling at next step is provided convenience.
Description of drawings
Accompanying drawing is used to provide further understanding of the present invention, and constitutes the part of specification, is used to explain the present invention with embodiments of the invention, is not construed as limiting the invention.In the accompanying drawings:
Fig. 1 is the schematic cross-section of the output fan-out type flip-chip LGA encapsulating structure of no substrate.
Fig. 2 is the schematic cross-section of the output fan-out type flip-chip bga structure of no substrate.Wherein:
The 1-flip-chip; The 2-flipchip-bumped; The 3-moulding compound; The 4-underfill material;
The 5-Cu pad; The 6-soldered ball.
Embodiment
The output fan-out type flip chip packaging structure of no substrate of the present invention; Comprise flip-chip 1, flipchip-bumped 2, moulding compound 3 and underfill material 4; It is characterized in that, also comprise Cu pad 5, the upper surface of said a part of Cu pad 5 links to each other with the salient point 2 at corresponding two ends, flip-chip bottom surface; The upper surface of the Cu pad 5 between the two ends, bottom surface links to each other with the bottom surface of said underfill material 4; All the other are positioned at the Cu pad 5 of the fan out in the flip-chip outside, and its upper surface links to each other with the bottom surface of said moulding compound 3, all is implanted with soldered ball 6 on the bottom surface of all said Cu pads 5.
The present invention further improves and is that said Cu pad (5) adopts Cu paper tinsel or the etching of Cu plate to process.
The present invention further improves and is that said flipchip-bumped is any in solder bump, Au stud bump, Ni salient point, Cu salient point, In salient point and the Ag salient point.
The present invention further improves and is that said soldered ball is unleaded.
Embodiment one:
S101: apply photosensitive resin or photoresist at Cu plate (paper tinsel) upper surface;
S102: carry out photoetching then, at the pad (Pad) that the upper surface acquisition needs and flipchip-bumped is assembled;
S103: on the pad that S102 obtained, make the corresponding metal layer, remove photosensitive resin or photoresist according to the salient point type;
S104: the chipset that will have flipchip bump installs on the Cu plate (paper tinsel);
S105: carry out underfill material and fill (Underfilling) and molded (Molding);
S106: apply photosensitive resin or photoresist at Cu plate (paper tinsel) lower surface, distribute according to the pad (Pad) of wiring and lower surface and carry out the etching of Cu plate (paper tinsel);
S107: making corresponding metal layer on wiring that S106 obtains and Pad;
S108: remove photosensitive resin or photoresist.
So just obtained the output fan-out type flip-chip LGA encapsulating structure of no substrate.
Embodiment two:
S201: apply photosensitive resin or photoresist at Cu plate (paper tinsel) upper surface;
S202: carry out photoetching then, at the pad (Pad) that the upper surface acquisition needs and flipchip-bumped is assembled;
S203: on the pad that S202 obtains, make the corresponding metal layer, remove photosensitive resin or photoresist according to the salient point type;
S204: the chipset that will have flipchip bump installs on the Cu plate (paper tinsel);
S205: carry out underfill material and fill (Underfilling) and molded (Molding);
S206: apply photosensitive resin or photoresist at Cu plate (paper tinsel) lower surface, distribute according to the pad (Pad) of wiring and lower surface and carry out the etching of Cu plate (paper tinsel);
S207: making corresponding metal layer on wiring that S106 obtains and Pad;
S208: remove photosensitive resin or photoresist;
S209: on the Pad of Cu plate (paper tinsel) lower surface, plant ball technology, accomplish soldered ball.
So just obtained the output fan-out type flip-chip bga structure of no substrate.
Claims (5)
1. output fan-out type flip chip packaging structure that does not have substrate; Comprise flip-chip (1), flipchip-bumped (2), moulding compound (3) and underfill material (4); It is characterized in that, also comprise Cu pad (5), the upper surface of said a part of Cu pad (5) links to each other with the salient point (2) at corresponding two ends, flip-chip bottom surface; The upper surface of the Cu pad (5) between the two ends, bottom surface links to each other with the bottom surface of said underfill material (4); All the other are positioned at the Cu pad (5) of the fan out in the flip-chip outside, and its upper surface links to each other with the bottom surface of said moulding compound (3), all is implanted with soldered ball (6) on the bottom surface of all said Cu pads (5).
2. the output fan-out type flip chip packaging structure of no substrate according to claim 1 is characterized in that, said Cu pad (5) adopts Cu paper tinsel or the etching of Cu plate to process.
3. the output fan-out type flip chip packaging structure of no substrate according to claim 1 is characterized in that said flipchip-bumped is a solder bump.
4. the output fan-out type flip chip packaging structure of no substrate according to claim 1 is characterized in that, said flipchip-bumped is any in Au stud bump, Ni salient point, Cu salient point, In salient point and the Ag salient point.
5. the output fan-out type flip chip packaging structure of no substrate according to claim 1 is characterized in that said soldered ball is unleaded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010293878 CN101976662B (en) | 2010-09-27 | 2010-09-27 | Output-end fan-out type flip-chip packaging structure without baseplate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010293878 CN101976662B (en) | 2010-09-27 | 2010-09-27 | Output-end fan-out type flip-chip packaging structure without baseplate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101976662A CN101976662A (en) | 2011-02-16 |
| CN101976662B true CN101976662B (en) | 2012-07-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010293878 Active CN101976662B (en) | 2010-09-27 | 2010-09-27 | Output-end fan-out type flip-chip packaging structure without baseplate |
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| Country | Link |
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| CN (1) | CN101976662B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102751204B (en) * | 2012-07-16 | 2014-10-15 | 江阴长电先进封装有限公司 | Fanout type wafer level chip packaging method |
| CN104241499A (en) * | 2014-06-25 | 2014-12-24 | 中国科学院微电子研究所 | Flip chip plastic package structure and manufacturing method |
| CN108242404A (en) * | 2016-12-27 | 2018-07-03 | 冠宝科技股份有限公司 | A kind of no substrate semiconductor encapsulation making method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1326225A (en) * | 2000-05-26 | 2001-12-12 | 日本电气株式会社 | Semiconductor device with downward installed chip and manufacture thereof |
| CN201829481U (en) * | 2010-09-27 | 2011-05-11 | 清华大学 | Fan-out-type output end flip chip packaging structure without base plate |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050029675A1 (en) * | 2003-03-31 | 2005-02-10 | Fay Hua | Tin/indium lead-free solders for low stress chip attachment |
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- 2010-09-27 CN CN 201010293878 patent/CN101976662B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1326225A (en) * | 2000-05-26 | 2001-12-12 | 日本电气株式会社 | Semiconductor device with downward installed chip and manufacture thereof |
| CN201829481U (en) * | 2010-09-27 | 2011-05-11 | 清华大学 | Fan-out-type output end flip chip packaging structure without base plate |
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| Publication number | Publication date |
|---|---|
| CN101976662A (en) | 2011-02-16 |
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