CN101957246A - Integrated detector for micro-force micro-displacement measurement system - Google Patents
Integrated detector for micro-force micro-displacement measurement system Download PDFInfo
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Abstract
The invention provides an integrated detector for a micro-force micro-displacement measurement system, which comprises a mounting bracket, an optical fiber sensing module and a micro-detection module, wherein the mounting bracket is U-shaped, and comprises a pedestal, a left arm and a right arm; the left arm is provided with a left V-shaped groove, while the right arm is provided with a right V-shaped groove; the optical fiber sensing module is used for detecting the variations of power of light incident to receiving optical fibers from emitting optical fibers; the emitting optical fibers are arranged in the left V-shaped groove of the mounting bracket, while the receiving optical fibers are arranged in the right V-shaped groove of the mounting bracket; the emitting optical fibers are coaxial with the receiving optical fibers; the micro-detection module comprises a microprobe, a micro-cantilever and a translational plate, and is used for changing the power of light incident to the receiving optical fibers in a way that the micro-cantilever drives the translational plate to produce vertical displacement according to the variations of the position of the microprobe on the surface of a sample; and the mounting bracket and the micro-detection module are machined into integrated firmware by using a micro-electromechanical system (MEMS) process. The integrated detector provided by the invention has the characteristics of simple realization, relatively lower cost and relatively higher detection accuracy.
Description
Technical field
The present invention relates to the precise detection technology field, particularly relate to a kind of integrated detector that is used for little power micro-displacement measuring system.
Background technology
Electronic product high integration and high performance development trend and MEMS (micro electro mechanical system) (Micro Electro Mechanical Systems, MEMS) technology and application development, superfinish and micro-nano structure detection are proposed more and more higher requirement, thereby driven developing rapidly of superfinish micro-nano measuring technique.The object of micron, nanoscale is easily crisp, in its status monitoring and application operating process, want the precision monitor displacement state on the one hand, carry out smoothly for guaranteeing to operate simultaneously, little power Detection ﹠ Controling also have very important and necessary effect, so the integrated measurement of micrometric displacement and little power is very crucial.As not only detecting the displacement of clamping device in the microoperation, to feed back and control holding force simultaneously in real time to operand, avoid damaging operand, therefore the integrated detection technique of little power, micro/nano level displacement has important theoretical and using value.
Present little power, microdisplacement measurement technology can be divided into contact and contactless two classes, and contact detecting method comprises inductance type, piezoelectric type, photo-electric etc., and non-contact detection method comprises optical method, electronic method etc.Measuring method commonly used comprises traditional optical interferometry, scan-probe measurement, capacitive displacement measurement, scanning electron microscope measurement etc.Measuring method detects for roughness can reach the dust class resolution ratio, as laser interferance method, ellipsometry, scattering method etc.But owing to limited by the Rayleigh diffraction limit, the superfinish that the lateral resolution of optical detection system has limited horizontal nanometer scale resolution detects.Scanning tunnel microscope (Scanning Tunneling Microscope, STM) with atomic force microscope (Atomic Force Microscopy, AFM) vertical, the lateral resolution that the surface is detected can both reach nano-precision, but, the composition of its system, structure be very complicated, cost an arm and a leg, measurement range is less, generally has only several microns to tens microns, and very high to requirements such as measurement environment.
Traditional Micro-force sensor generally converts power to other physical quantitys and carries out indirect monitoring, as traditional strain chip, condenser type, pressure resistance type, piezoelectric type, MEMS silicon electric bridge, feed rod rod-type etc.When little power detects, usually metal strain plate is attached to the position that needs detection power, feed back the power or the moment information of 1~6 dimension according to the difference of basal body structure, this kind structural advantages is that rigidity is big, can bear very strong load shock, and shortcoming is because the feedback signal amount of metal strain plate is little, need the very high testing circuit of designing gain and need high quality power supply and operational amplifier, improved cost, and serious potential drifting often takes place, the reduction accuracy of detection in the high-gain testing circuit.Kynoar (Polyvinylidene Fluoride, output charge signal when PVDF) material occurs bending and deformation, can be used for making Micro-force sensor, dynamic sensitive performance is good, but because the PVDF material stiffness is very little, measurement is born a little less than the load capacity, the good piezoelectric charge maintenance of needs technology when being used for tested static power.Piezo crystals chip power Application in Sensing is in the insufficient sensitivity of micro-force measurement.Along with the progress of MEMS technology, can on the silicon beam, process the Wheatstone bridge that is used for the power detection, can produce more large-signal output than pasting foil gauge mode silicon sensor, reduced the testing circuit requirement.Adopt micro-cantilever (Cantilever) and position sensor (Position Sensitive Detector among the AFM, be called for short PSD) detect, utilize the optical lever amplification principle that semi-girder will be produced the variation that flexural deformation converts facula position on the PSD under stressing conditions, thereby realize that the little power of high precision detects, but optical system structure complexity, cost height, be not easy to install and the system integration.Also the someone attempts piezoelectric strain sheet and AFM probe integratedly, though system's relative compact, because the heat and the influence of electrical noise, displacement and little force measurement ratio of precision flash ranging mode are low.
In a word, need the urgent technical matters that solves of those skilled in the art to be exactly: how a kind of integrated Detection Techniques that are used for little power micro-displacement measuring system can be provided, realize that simply cost is lower, and has higher detection accuracy.
Summary of the invention
Technical matters to be solved by this invention provides a kind of integrated detector that is used for little power micro-displacement measuring system, realizes that simply cost is lower, and has higher detection accuracy.
In order to address the above problem, the invention discloses a kind of integrated detector that is used for little power micro-displacement measuring system, comprising: fixed mount, Fibre Optical Sensor module and little detecting module;
Described fixed mount is a U type fixed mount, the left arm and the right arm that comprise pedestal and be positioned at pedestal two ends shape symmetry; Described left arm is provided with left V-type groove, and described right arm is provided with right V grooved;
Described Fibre Optical Sensor module comprises: launching fiber and reception optical fiber are used to detect the variation that launching fiber incides the luminous power that receives optical fiber; Wherein, described launching fiber places in the left V-type groove of fixed mount, and described reception optical fiber places in the right V-type groove of fixed mount; Launching fiber and reception fiber-coaxial;
Described little detecting module comprises microprobe, micro-cantilever and translation plates, is used for according to the change in location of microprobe on sample surfaces, drives translation plates by micro-cantilever and produces perpendicular displacement, changes and incides the luminous power that receives optical fiber; Wherein,
One end of micro-cantilever is fixed on the pedestal, and other end level is stretched out pedestal;
The microprobe vertical fixing is on the lower surface on micro-cantilever top;
Translation plates is in the right side of launching fiber and receive between the left side of optical fiber, and vertical fixing is on the upper surface of micro-cantilever, and its plane, place is vertical with light beam;
Described fixed mount and little detecting module integrated firmware for adopting the MEMS processes to make.
Preferably, the upper surface of described pedestal is equal with the upper surface of left arm, right arm, and the lower surface of pedestal is lower than the lower surface of left arm, right arm.
Preferably, described micro-cantilever is rigidly attached to the center position of pedestal lower surface.
Preferably, described micro-cantilever is a triangular structure, and its thickness is 0.1~25 micron.
Preferably, described microprobe is cone or pyramid structure, and the needle point size of microprobe is a nanometer scale.
Preferably, described micro-cantilever and microprobe are that the silicon base of silver or chromium is made by wet etching by upper surface.
Preferably, align in the initial position of the described translation plates axle center of satisfying its top and launching fiber and receiving optical fiber.
Preferably, described translation plates is become by metallic nickel or copper.
Preferably, described fixed mount is made by photoetching technique by the PMMA photoresist.
Preferably, the mode of operation of described microprobe comprises: contact mode and noncontact mode.
Compared with prior art, the present invention has the following advantages:
Integrated detector provided by the invention comprises fixed mount, Fibre Optical Sensor module and little detecting module three parts, and it is convenient that general structure is simple, installation is used.Wherein, adopt optic fibre light path to carry out sensing, simple in structure, the anti-external interference height of Optical Fiber Transmission; Be easy to miniaturization, portable.
In addition, Fibre Optical Sensor is combined with little detecting module, microprobe and sample interact, and the perpendicular displacement that drives translation plates by micro-cantilever changes the luminous power that incides reception optical fiber, can work in contact, contactless two states; And can realize the integrated detection of micro-nano displacement and little power: the resolution that displacement is surveyed can reach nanometer scale, but the resolution Da Naniu magnitude that loading force is surveyed.
Further, described fixed mount and little detecting module integrated firmware, thereby benchmark and the site error of avoiding assembly to debug and introduce for adopting the MEMS processes to make; And, based on the processing of MEMS technology, avoided circuit design such as traditional electric bridge processing, improve detector sensitivity, reduce system bulk.Wherein, micro-cantilever is designed to V-type (or triangle), has improved lateral stiffness; The thickness of micro-cantilever is micron dimension, has rational power elastic constant, with high sensitivity that realize to survey and to the detection of acting force between atom; The needle point of microprobe is atom size (nanometer) magnitude, thereby can measure the atomic force curve, to obtain better lateral resolution; With microprobe is cone or pyramid, and is made by wet etching by the silicon base that by upper surface is silver or chromium, makes it have higher-strength and wearing quality.
Description of drawings
Fig. 1 is a kind of structural drawing that is used for the integrated detector embodiment of little power micro-displacement measuring system of the present invention;
Fig. 2 is the measuring principle synoptic diagram of the described integrated detector of the embodiment of the invention;
Fig. 3 is the processing synoptic diagram that the described employing of embodiment of the invention MEMS technology prepares integrated fixed mount and little detecting module.
Embodiment
For above-mentioned purpose of the present invention, feature and advantage can be become apparent more, the present invention is further detailed explanation below in conjunction with the drawings and specific embodiments.
With reference to Fig. 1, show a kind of structural drawing that is used for the integrated detector embodiment of little power micro-displacement measuring system of the present invention, described detector comprises: fixed mount 11, Fibre Optical Sensor module and little detecting module 13;
Described fixed mount 11 is a U type fixed mount, the left arm 112 and the right arm 113 that comprise pedestal 111 and be positioned at pedestal two ends shape symmetry; Described left arm is provided with left V-type groove 114, and described right arm is provided with right V grooved 115;
Described Fibre Optical Sensor module comprises: launching fiber 121 and reception optical fiber 122 are used to detect the variation that launching fiber incides the luminous power that receives optical fiber; Wherein, described launching fiber 121 places in the left V-type groove 114 of fixed mount, and described reception optical fiber 122 places in the right V-type groove 115 of fixed mount; Launching fiber and reception fiber-coaxial;
Described little detecting module 13 comprises microprobe 131, micro-cantilever 132 and translation plates 133, is used for according to the change in location of microprobe on sample surfaces, drives translation plates by micro-cantilever and produces perpendicular displacement, changes and incides the luminous power that receives optical fiber; Wherein,
One end of micro-cantilever 132 is fixed on the pedestal 111, and other end level is stretched out pedestal;
Described fixed mount 11 and the integrated firmware of little detecting module 12 for adopting the MEMS processes to make.
Concrete, the launching fiber 121 of Fibre Optical Sensor module is fixedly installed in the left V-type groove 114 of fixed mount 11, and it is used for sending light beam to receiving optical fiber 122; Receive optical fiber 122 and be fixedly installed in the right V-type groove 115 of fixed mount 11, it is used to receive the light beam after translation plates 133 modulation of little detecting module 13; Launching fiber 121 and receive optical fiber 122 guarantee when mounted coaxial so that light beam incides to greatest extent and receives in the optical fiber when initial.
Fixed mount 11 is used for optical fiber is fixed with micro-cantilever and is connected with the interface of little power micro-displacement measuring system of macroscopic view; Left arm 112 and right arm 113 are all perpendicular to pedestal 111, the left V-type groove 114 and the right V-type groove 115 on the right arm 113 that are positioned on the left arm 112 carry fixed transmission optical fiber 121 respectively and receive optical fiber 122, and the fluting direction of described left V-type groove 114 and right V-type groove 115 is parallel to the length direction of pedestal.Further, the upper surface of described pedestal is equal with the upper surface of left arm, right arm, and the lower surface of pedestal is lower than the lower surface of left arm, right arm, and when then carrying out probing surface, sample has enough activity spaces when mobile below left arm and right arm.
Described fixed mount 11 adopts integrated the machining of MEMS technology with the firmware that little detecting module 13 constitutes, thus benchmark and the site error of avoiding each assembly to debug and introduce.Described micro-cantilever adopts the MEMS processes to realize, be rigidly connected with the center of pedestal 111 lower surfaces of fixed mount 11, to guarantee that described translation plates 133 is positioned at the centre position of launching fiber 121 and reception optical fiber 122, the material of translation plates 133 has certain elasticity, can be subjected to displacement beat under external force or with the vibration of a certain frequency and amplitude.Translation plates 133 adopts MEMS technology to be connected with the upper surface of micro-cantilever 132, and its plane is vertical mutually with the micro-cantilever surface; Described translation plates 133 is between launching fiber 121 right sides and reception optical fiber 122 left sides, and its initial position satisfies its top and aligns with the axle center of launching fiber and reception optical fiber.Microprobe 131 is positioned at the lower surface of micro-cantilever 132, and near its top, shape can be structures such as cone or pyramid, can work under contact or contactless two kinds of patterns.
Figure 2 shows that the measuring principle synoptic diagram of the described integrated detector of the embodiment of the invention.The described micro-cantilever of the embodiment of the invention is that a kind of the elasticity coefficient of micro-cantilever is more little to the tetchy elastic beam structure of little power, and the sensitivity of power is high more.Micro-cantilever in the embodiment of the invention can be seen elastomer-forming, and the power that affacts sample surfaces can be obtained by Hooke's law, that is: Δ F=K * Δ H; Wherein, K is an elasticity coefficient, and Δ H is the displacement of micro-cantilever; Utilize optical fiber light intensity sensor-based system again, just can realize the detection of displacement and Li Ke.With reference to Fig. 2, in the measuring process, little power micro-displacement measuring system is coupled to external light source in the launching fiber 121 in advance, and the launching fiber Output optical power is W
OutMicroprobe and sample surfaces are with contact or contactless model function, and then sample is when horizontal in-plane moving, and microprobe produces different change in displacement Δ H or little power Δ F effect with sample surfaces.
Wherein, when contact mode (Contact Mode) is surveyed, microprobe 131 contacts with sample surfaces, produce interactional little power Δ F, little power Δ F size changes with the relative distance Δ H of microprobe and sample surfaces, elastic-restoring force effect according to repulsive force between atom and micro-cantilever, make micro-cantilever 132 swing up and down angle delta θ around the pedestal of fixed mount, and drive translation plates 133 produces displacement Z in vertical plane, make the displacement movement of light beam between cutting launching fiber 121 and the reception optical fiber 122, Δ F and Δ Z are linear.
When contactless (Non-contact Mode) surveys, microprobe 131 keeps certain distance (because microprobe does not contact with sample with sample surfaces, therefore sample surfaces easy damaged not in the measuring process), because long effect between the two apart from attractive force, the different distance changes delta H of microprobe 131 and sample surfaces, make translation plates 133 produce displacement Z in vertical plane, Δ H and Δ Z are nonlinear relationship.
Under contact or contactless any one pattern, the perpendicular displacement change Delta Z of translation plates 133, to cause to receive optical fiber 122 received optical power changes delta W, further, can also optical power change be converted to relevant voltage changes delta U through photodetector in little power micro-displacement measuring system.Approximating methods such as employing least square are surveyed with optical fiber sensing system microprobe and are demarcated, the micro-cantilever distortion and the displacement detecting of different-stiffness have been finished, set up the relation between sample surfaces displacement and little power and the optical fiber output intensity, can realize the integrated detection of micro-nano displacement and little power.
Need to prove, the integrated detector that the embodiment of the invention proposes belongs to the part of little power micro-displacement measuring system, only be used to detect the variation of the luminous power that causes by sample surfaces height difference, further, the data processing according to optical power change acquisition sample table planar structure does not belong to scope involved in the present invention.
The workflow of described integrated detector is as follows:
(a) utilize pedestal 111 that the Fibre Optical Sensor module is gripped, and be connected with the mechanical interface and the electrical apparatus interface of whole little power micro-displacement measuring system, comprising: external light source is connected with launching fiber 121, and the exterior light power meter is connected with reception optical fiber 122;
(b) launching fiber 121 and reception optical fiber 122 are embedded respectively in left V-type groove and the right V-type groove, guarantee that the two is coaxial, and be adhesively fixed;
(c) sample is positioned on the worktable below the microprobe 131, adjusts between sample and the microprobe 131, enter duty at the initial position of vertical direction;
(d) relatively move detector and sample of level, the luminous power information of record optical fiber sensing module feedback is to characterize the displacement of sample in vertical plane.
The luminous power information of then utilizing displacement information and detecting can be calculated the little power of interaction between microprobe and the sample in real time, thereby realizes micrometric displacement, the integrated detection of little power.
At specific embodiment, integrated detector can carry out following configuration:
(1) LASER Light Source is selected green glow, is that the light beam of 500mW is input in the incident ray with output power;
(2) multimode optical fiber of 62.5 μ m fibre cores of launching fiber and reception optical fiber select tape joint and buttock line;
(3) the long 130 μ m of micro-cantilever, the micro-cantilever elasticity coefficient is 50N/m;
According to above configuration, the detector measurement the key technical indexes can reach:
(1) displacement detecting scope<50 μ m, detection sensitivity: 2nm/1nW;
(2) little power detection resolution can reach little ox magnitude.
Further, because the described fixed mount of the embodiment of the invention and little detecting module integrated firmware for adopting the MEMS processes to make.So structure processing technology design of the present invention and realization will directly have influence on the system performance of final detector.Consider detector to little power susceptibility, the structural design of micro-cantilever need satisfy following requirement:
(a) high lateral stiffness to prevent the semi-girder distortion, therefore is designed to triangular structure (V-type) with micro cantilever structure, to improve lateral stiffness;
(b) suitable power elastic constant detect with acting force between the high sensitivity that realizes surveying and atom, so micro-cantilever thickness should be in micron dimension, and design load is between 0.1~25 μ m.
Further, for obtaining higher displacement resolution, the following requirement satisfied in the microprobe design:
(a) the microprobe needle point is in the atom order of magnitude, thereby can measure the atomic force curve, to obtain better lateral resolution;
(b) the microprobe material has higher-strength and wearing quality, avoids the influence to the result, therefore microprobe is designed to cone or pyramid (being generally tetrahedron).
Wherein, the design of carrying out the V-type groove on left arm and right arm is in order when detector encapsulates launching fiber 121 and reception optical fiber 122 directly to be embedded in the fixed mounts, and general, the angle of V-type groove is made as 90 and spends; V-type groove depth reference fiber diameter makes that the top slightly exceeds pedestal 21 upper surfaces, so that install and fix after the optical fiber embedding; The cross section of V-type groove should be parallel to each other with translation plates 33 simultaneously.
On material is selected, because in the MEMS technology, silicon nitride, monox, polysilicon, monocrystalline silicon, photoresist etc. are the materials of using always.Consider the complicacy of the designed detecting structure of the present invention, and has higher depth-to-width ratio, silicon (Si) substrate, polymethylmethacrylate (PMMA, Polymethyl methacrylate) photoresist, metallic nickel or copper three class materials such as (Ni/Cu) that final selected upper surface is argent or chromium (Ag/Cr) are as structured material.
On technology realized, employing LIGA technology obtained the translation plates than high-aspect-ratio, adopts photoetching technique to obtain left V-type groove and left V-type groove, adopts wet etching to obtain micro-cantilever and microprobe.Concrete, described micro-cantilever and microprobe are that the silicon base of silver or chromium is made by wet etching by upper surface.Described translation plates is become by metallic nickel or copper.Described fixed mount is made by photoetching technique by the PMMA photoresist.Structure processing technology of the present invention as shown in Figure 3, prepares the processing synoptic diagram of integrated fixed mount and little detecting module for adopting MEMS technology.Wherein, in Fig. 3 (a)-3 (d), Fig. 3 (h)-(j), last figure is the vertical view of the integrated firmware of different process, and figure below is the cut-open view of the integrated firmware of different process along the A-A line; In Fig. 3 (e)-(g), left side figure is the cut-open view of the integrated firmware of different process along the A-A line, and right figure is the right view of the integrated firmware of different process; In Fig. 3 (k)-(m), last figure is the vertical view of the integrated firmware of different process, and figure below is the front view of the integrated firmware of different process; In Fig. 3 (n)-(t), last figure is the front view of the integrated firmware of different process, and figure below is the upward view of the integrated firmware of different process.
It is as follows to adopt MEMS technology to prepare the work flow of integrated fixed mount and little detecting module:
(a) process materials is selected the rectangular parallelepiped material that is attached with the PMMA photoresist on upper surface is the Si substrate of Ag/Cr for use, upper surface at rectangular-shaped PMMA covers the X ray mask, wherein, the zone of mask film covering is not a stripe region, rectangular length is the length of translation plates, rectangular wide be the wide of translation plates, the orthomorphic transmission or the self-aligned mask plate that adopt the high-aspect-ratio photoetching to use;
(b) adopt the LIGA photoetching technique to obtain height, wide, long rectangular recess, wherein, control resist exposure and development time, guarantee machining precision with certain proportion relation; Described rectangular recess is the mold slots of translation plates.
(c) remove the mask described in (a) by developing; After development is finished, clean this microstructure with ionized water, and dry in vacuum drying oven;
(d) adopt the electroless plating method to plate metal film in groove, can select for use Ni or Cu to carry out plated film, this metal film is translation plates;
(e) on the right side of PMMA, cover the rectangular strip mask; The top of mask is mutually neat with the top of PMMA, and the height of mask is the height of the left arm/right arm of fixed mount, and it is less than the height of PMMA;
(f) adopt photoetching process to remove part PMMA; Then do not remove the pedestal of the left-half of PMMA as fixed mount, the right half part of removing PMMA is used for forming the left arm and the right arm of fixed mount;
(g) second development is removed the mask described in (e);
(h) on the upper surface of PMMA, cover one deck U type mask;
(i) adopt photoetching process to remove part PMMA, then be fixed pedestal, left arm and the right arm of frame;
(j) develop for the third time, remove the mask described in (h);
(k) face drawing and the last mask film covering of backsight drawing (being front end face and rear end face) at PMMA, uncovered area is a del;
(1) adopts photoetching process to remove part PMMA, obtain left V-type groove and right V-type groove;
(m) develop for the 4th time, remove the mask described in (k);
(n) (being the bottom surface of PMMA) mask film covering in the Si substrate, mask is rectangle+V-arrangement (triangle), mask can be selected SiO
2, Si
3N
4Deng;
(o) the isotropy wet etching is carried out in the Si substrate, erode Si and expose the Ag/Cr film;
(p) the Ag/Cr film that exposes in the Si substrate is corroded, obtain the V-type micro-cantilever;
(q) develop for the 5th time, remove the mask described in (n);
(r) in the most advanced and sophisticated mask film covering of V-type micro-cantilever lower surface, this mask size has determined the microprobe size;
(s) wet etching is carried out in the Si substrate, remove the part Si of bottom;
(t) remove the mask described in (r), expose microprobe, processing technology finishes.
Then can make the integrated firmware of fixed mount and little detecting module by above-mentioned technological process.
More than to a kind of integrated detector that is used for little power micro-displacement measuring system provided by the present invention, be described in detail, used specific case herein principle of the present invention and embodiment are set forth, the explanation of above embodiment just is used for helping to understand method of the present invention and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present invention, the part that all can change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention.
Claims (10)
1. an integrated detector that is used for little power micro-displacement measuring system is characterized in that, comprising: fixed mount, Fibre Optical Sensor module and little detecting module;
Described fixed mount is a U type fixed mount, the left arm and the right arm that comprise pedestal and be positioned at pedestal two ends shape symmetry; Described left arm is provided with left V-type groove, and described right arm is provided with right V grooved;
Described Fibre Optical Sensor module comprises: launching fiber and reception optical fiber are used to detect the variation that launching fiber incides the luminous power that receives optical fiber; Wherein, described launching fiber places in the left V-type groove of fixed mount, and described reception optical fiber places in the right V-type groove of fixed mount; Launching fiber and reception fiber-coaxial;
Described little detecting module comprises microprobe, micro-cantilever and translation plates, is used for according to the change in location of microprobe on sample surfaces, drives translation plates by micro-cantilever and produces perpendicular displacement, changes and incides the luminous power that receives optical fiber; Wherein,
One end of micro-cantilever is fixed on the pedestal, and other end level is stretched out pedestal;
The microprobe vertical fixing is on the lower surface on micro-cantilever top;
Translation plates is in the right side of launching fiber and receive between the left side of optical fiber, and vertical fixing is on the upper surface of micro-cantilever, and its plane, place is vertical with light beam;
Described fixed mount and little detecting module integrated firmware for adopting the MEMS processes to make.
2. integrated detector as claimed in claim 1 is characterized in that,
The upper surface of described pedestal is equal with the upper surface of left arm, right arm, and the lower surface of pedestal is lower than the lower surface of left arm, right arm.
3. integrated detector as claimed in claim 2 is characterized in that,
Described micro-cantilever is rigidly attached to the center position of pedestal lower surface.
4. integrated detector as claimed in claim 3 is characterized in that,
Described micro-cantilever is a triangular structure, and its thickness is 0.1~25 micron.
5. integrated detector as claimed in claim 4 is characterized in that,
Described microprobe is cone or pyramid structure, and the needle point size of microprobe is a nanometer scale.
6. integrated detector as claimed in claim 5 is characterized in that,
Described micro-cantilever and microprobe are that the silicon base of silver or chromium is made by wet etching by upper surface.
7. integrated detector as claimed in claim 1 is characterized in that,
The initial position of described translation plates satisfies its top and aligns with the axle center of launching fiber and reception optical fiber.
8. the method for claim 1 is characterized in that,
Described translation plates is become by metallic nickel or copper.
9. the method for claim 1 is characterized in that,
Described fixed mount is made by photoetching technique by the PMMA photoresist.
10. integrated detector as claimed in claim 1 is characterized in that,
The mode of operation of described microprobe comprises: contact mode and noncontact mode.
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000186912A (en) * | 1998-12-22 | 2000-07-04 | Seiko Giken:Kk | Method and device for measuring minute displacements |
US6525307B1 (en) * | 1999-09-16 | 2003-02-25 | Ut-Battelle, Llc | Integrated optical interrogation of micro-structures |
CN101387496A (en) * | 2008-09-25 | 2009-03-18 | 中北大学 | Micro-displacement sensor based on ring micro-chamber and cantilever beam of integration plane |
US7596288B2 (en) * | 2006-12-27 | 2009-09-29 | Tsinghua University | Micro displacement sensor |
CN101696874A (en) * | 2009-10-13 | 2010-04-21 | 北京交通大学 | Method and device for detecting micrometric displacement based on axial grinding polarization-maintaining optical fibre grating |
-
2010
- 2010-07-20 CN CN2010102339977A patent/CN101957246B/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000186912A (en) * | 1998-12-22 | 2000-07-04 | Seiko Giken:Kk | Method and device for measuring minute displacements |
US6525307B1 (en) * | 1999-09-16 | 2003-02-25 | Ut-Battelle, Llc | Integrated optical interrogation of micro-structures |
US7596288B2 (en) * | 2006-12-27 | 2009-09-29 | Tsinghua University | Micro displacement sensor |
CN101387496A (en) * | 2008-09-25 | 2009-03-18 | 中北大学 | Micro-displacement sensor based on ring micro-chamber and cantilever beam of integration plane |
CN101696874A (en) * | 2009-10-13 | 2010-04-21 | 北京交通大学 | Method and device for detecting micrometric displacement based on axial grinding polarization-maintaining optical fibre grating |
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